www.fairchildsemi.com ML6554 3A Bus Termination Regulator Features Description • Can source and sink up to 3A, no heat sink required • Integrated Power MOSFETs • Generates termination voltages for DDR SDRAM, SSTL-2 SDRAM, SGRAM, or equivalent memories • Generates termination voltages for active termination schemes for DDR SDRAM, GTL+, Rambus, VME, LV-TTL, HSTL, PECL and other high speed logic • VREF input available for external voltage divider • Separate voltages for VCCQ and PVDD • Buffered VREF output • VOUT of ±3% or less at 3A • Minimum external components • Shutdown for standby or suspend mode operation • 0° to +70°C and -40° to +85°C temperature ranges available • Thermal Shutdown ≈ 130ºC The ML6554 switching regulator is designed to convert voltage supplies ranging from 2.3V to 4V into a desired output voltage or termination voltage for various applications. The ML6554 can be implemented to produce regulated output voltages in two different modes. In the default mode, when the VREF pin is open, the ML6554 output voltage is 50% of the voltage applied to VCCQ. The ML6554 can also be used to produce various user-defined voltages by forcing a voltage on the VREFIN pin. In this case, the output voltage follows the input VREFIN voltage. The switching regulator is capable of sourcing or sinking up to 3A of current while regulating an output VTT voltage to within 3% or less. The ML6554, used in conjunction with series termination resisitors, provides an excellent voltage source for active termination schemes of high speed transmission lines as those seen in high speed memory buses and distributed backplane designs. The voltage output of the regulator can be used as a termination voltage for other bus interface standards such as DDR SDRAM, SSTL, CMOS, Rambus™, GTL+, VME, LV-CMOS, LV-TTL, HSTL and PECL. Block Diagram 15 VCCQ 16 AVCC 14 1 VREFOUT 9 VDD 12 VDD SHDN 2 PVDD1 7 PVDD2 VL1 (VOUT) OSCILLATOR/ RAMP GENERATOR 3 – 200kΩ S + VREF BUFFER Q 6 VL2 (VOUT) – R Q + VREFIN 11 + 200kΩ AGND – ERROR AMP RAMP COMPARATOR 13 VFB 10 DGND 8 PGND2 PGND1 4 5 REV. 1.1.3 3/8/02 ML6554 PRODUCT SPECIFICATION Pin Configuration ML6554 16-Pin PSOP (U16) VDD 1 16 AVCC PVDD1 2 15 VCCQ VL1 3 14 VREFOUT PGND1 4 13 AGND PGND2 5 12 SHDN VL2 6 11 VREFIN PVDD2 7 10 VFB DGND 8 9 VDD TOP VIEW Pin Description 2 Pin Name Function 1 VDD 2 PVDD1 3 VL1 Output voltage/ inductor connection 4 PGND1 Ground for output power transistors 5 PGND2 Ground for output power transistors 6 VL2 Output voltage/inductor connection 7 PVDD2 Voltage supply for internal power transistors 8 DGND Digital ground Digital supply voltage Voltage supply for internal power transistors 9 VDD Digital supply voltage 10 VFB Input for external compensation feedback 11 VREFIN 12 SHDN Shutdown active low. CMOS input level 13 AGND Ground for internal reference voltage divider Input for external reference voltage 14 VREFOUT 15 VCCQ Voltage reference for internal voltage divider 16 AVCC Analog voltage supply Reference voltage output REV. 1.1.3 3/8/02 PRODUCT SPECIFICATION ML6554 Absolute Maximum Ratings Absolute maximum ratings are those values beyond which the device could be permanently damaged. Absolute maximum ratings are stress ratings only and functional device operation is not implied. Parameter PVDD Voltage on Any Other Pin Average Switch Current (IAVG) Junction Temperature Storage Temperature Range Lead Temperature (Soldering, 10 sec) Thermal Resistance (θJC)(Note 2) Output Current, Source or Sink Min. GND – 0.3 -65 Max. 4.5 VIN + 0.3 3.0 150 150 150 2 3.0 Units V V A °C °C °C °C/W A Max. 70 +85 4.0 4.0 Units °C °C V V Operating Conditions Parameter Temperature Range, CU suffix Temperature Range, IU suffix PVDD Operating Range VCCQ Operating Range Min. 0 -40 2.0 1.4 Electrical Characteristics Unless otherwise specified, AVCC = VDD = PVDD = 3.3V ±10%, TA = Operating Temperature Range (Note 1) Symbol Parameter Switching Regulator VTT Output Voltage, SSTL_2 (See Figure 1) Conditions IOUT = 0, VREF = open IOUT = ±3A, VREF = open Internal Resistor Divider IOUT = 0 ZIN VREF Reference Pin Input Impedance Switching Frequency Offset Voltage VTT – VREFOUT AVCC = 2.5V No Load VCCQ = 2.5 Buffer IREF Output Load Current Typ. Max. Units VCCQ = 2.3V 1.12 1.15 1.18 VCCQ = 2.5V 1.22 1.25 1.28 VCCQ = 2.7V 1.32 1.35 1.38 VCCQ = 2.3V 1.09 1.15 1.21 VCCQ = 2.5V 1.19 1.25 1.31 VCCQ = 2.7V 1.28 1.35 1.42 VCCQ = 2.3V 1.139 1.15 1.162 VCCQ = 2.5V 1.238 1.25 1.263 VCCQ = 2.7V 1.337 1.35 1.364 VCCQ = 0 100 VREFOUT ∆VOFFSET Supply IQ Quiescent Current Min. 650 IOUT = 0, no load VCCQ = 2.5V –20 IVCCQ IAVCC IAVCC SD IVDD IVDD SD IPVDD 6 0.5 0.2 0.25 0.2 100 3 V V V V V V V V V kΩ 20 kHz mV 10 1.0 0.5 1.0 1.0 250 µA mA mA mA mA µA mA Notes 1. Limits are guaranteed by 100% testing, sampling, or correlation with worst-case test conditions. 2. Infinite heat sink REV. 1.1.3 3/8/02 3 ML6554 PRODUCT SPECIFICATION Functional Description This switching regulator is capable of sinking and sourcing 3A of current without an external heatsink. The ML6554 uses a power surface mount package (PSOP) that includes an integrated heat slug. The heat can be piped through the bottom of the device and onto the PCB (Figure 1). The ML6554 integrates two power MOSFETs that can be used to source and sink 3A of current while maintaining a tight voltage regulation. Using the external feedback, the output can be regulated well within 3% or less, depending on the external components chosen. Separate voltage supply inputs have been added to accommodate applications with various power supplies for the databus and power buses, see Figure 2. Output voltage can also be selected by forcing a voltage at the VREFIN pin. In this case, the output voltage follows the voltage at the VREFIN input. Simple voltage dividers can be used this case to produce a wide variety of output voltages between 0.7V and VDD–0.7V. VREF Input and Output The VREFIN input can be used to force a voltage at the outputs (Inputs section, above). The VREFOUT pin is an output pin that is driven by a small output buffer to provide the VREF signal to other devices in the system. The output buffer is capable of driving several output loads. The output buffer can handle 3mA. Other Supply Voltages Several inputs are provide for the supply voltages: PVDD1, PVDD2, AVCC, and VDD. Outputs The output voltage pins (VL1, VL2) are tied to the databus, address, or clock lines via an external inductor. See the Applications section for recommendations. Output voltage is determined by the VCCQ or VREFIN inputs. Inputs The input voltage pins (VCCQ or VREFIN) determine the output voltages (VL1 or VL2) . In the default mode, where the VREFIN pin is floating, the output voltage is 50% of the VCCQ input. VCCQ can be the reference voltage for the databus. The PVDD1 and PVDD2 provide the power supply to the power MOSFETs. VDD provides the voltage supply to the digital sections, while AVCC supplies the voltage for the analog sections. Again, see the Applications section for recommendations. Feedback Input The VFB pin is an input that can be used for closed loop compensation. This input is derived from the voltage output. See application section for recommendation. HEAT SLUG Figure 1. Cutaway view of PSOP Package 4 REV. 1.1.3 3/8/02 PRODUCT SPECIFICATION ML6554 Applications Power Handling Capability of the PSOP Package Using the ML6554 for SSTL Bus Termination Using the board layout shown in Figures 6, 7, and 8; soldering the ML6554 to the board at zero LFPM the temperature around the package measured 55ºC for 3A loads. Note that a 1 ounce copper plane was used in the board construction. The circuit schematic in Figure 2 shows a recommended approach for constructing a bus terminating solution for an SSTL-2 bus. This circuit can be used in PC memory and Graphics memory applications as shown in Figures 4 and 5. Note that the ML6554 can provide the voltage reference (VREF) and terminating voltages (VTT). Using the layout as shown in Figures 6, 7, and 8, and measuring the VTT performance using the test setup as described in Figure 9, the ML6554 delivered a VTT ± 20mV for 1A to 3A loads (see Figure 10). Table 1 provides a recommended parts list for the circuit in Figure 2. Airflow is not likely to be needed in the operation of this device (assuming a board layout similar to that described above). The power handling performance of the PSOP package is shown by a study of the package manufacturer for various airflow vs. θJA conditions in Figure 11. Bus Termination Solutions for Others Buses Table 3 provides a summary of various bus termination VREF & VTT requirements. The ML6554 can be used for those applications. 2.5V TO 4V C8 0.1µF R2 100Ω C9 0.1µF R1 100Ω C5 330µF R3 100kΩ C6 330µF U1 ML6554 1 TPI 2 L1 3.3µH C3 0.1µF VTT C1 820µF F2V OS-CON 4 5 C2 0.1µF C4 0.1µF TO SDRAMS 3 6 7 8 VDD AVCC PVDD1 VCCQ VL1 VREFOUT PGND1 AGND PGND2 SHDN VL2 VREFIN PVDD2 VFB DGND VDD 16 15 14 VCCQ VREFOUT 13 12 11 SHDN VREFIN 10 9 R4 100kΩ R5 1kΩ GND C7 1nF GND Figure 2. REV. 1.1.3 3/8/02 5 ML6554 PRODUCT SPECIFICATION 2.5V TO 4V C5 330µF R3 100kΩ U1 ML6554 1 C3 10µF 2 L1 3.3µH VTT C1 820µF F2V OS-CON 3 4 5 C2 0.1µF 6 TO SDRAMS 7 8 VDD AVCC PVDD1 VCCQ VL1 VREFOUT PGND1 AGND PGND2 SHDN VL2 C6 330µF VREFIN PVDD2 VFB DGND VDD 16 15 14 VCCQ VREFOUT 13 12 11 SHDN VREFIN 10 9 R1 100kΩ R2 1kΩ C4 1nF GND GND Figure 3. Alternate Application Circuit An alternate application circuit for the ML6554 is shown in Figure 3. The number of external components is reduced compared to the circuit in Figure 2. This is achieved by replacing four, 0.1µF bypass capacitors with one, low ESR, 10µF ceramic capacitor placed right next to U1. Two 100Ω resistors are also eliminated. High value, surface-mount 6 MLC capacitors were not available when the original application circuit (Figure 2) was developed. Both application circuits offer the same electrical performance but that shown in Figure 2 has a reduced bill-of-materials. Table 2 shows the recommended parts list for the circuit of Figure 3. REV. 1.1.3 3/8/02 PRODUCT SPECIFICATION ML6554 168/184/208-PIN DIMM CONNECTORS AND SDRAM/SGRAM MODULES TERMINATION RESISTORS PC CHIP SET NORTHBRIDGE DATA LINE, CLOCK LINES, ADDRESS LINES, CONTROL LINES TERMINATION RESISTORS VTT ML6554 VREF Figure 4. Complete Termination Solution PC Main Memory (PC Motherboard) SO DIMM AND MODULES 3D GRAPHIC CHIP TERMINATION RESISTORS SGRAM DATA LINE, CLOCK LINES, ADDRESS LINES, CONTROL LINES TERMINATION RESISTORS VREF ML6554 2.5V VOLTAGE REGULATOR VTT 5V OR 3.3V AGP/PCI BUS Figure 5. Complete Termination Solution Graphics Memory Bus – AGP Graphics Cards REV. 1.1.3 3/8/02 7 ML6554 PRODUCT SPECIFICATION Figure 6. Top Silk Figure 7. Top Layer 8 Figure 8. Bottom Layer REV. 1.1.3 3/8/02 PRODUCT SPECIFICATION ML6554 3.3V POWER SUPPLY V A ACTIVE CLAMP VDD VCCQ VCCQ SUPPLY ML6554 EVAL VTT CURRENT SOURCE/SINK POWER SUPPLY GND V ITT A Figure 9. Test Circuit Setup VTT VARIANCE WITH VDD@ITT (VCCQ 2.5V) TESTED WITH EVAL PCB ITT 1.29 3A SINKING 2A SINKING 1.28 VTT (V) 1A SINKING 0A SINKING 1.27 3A SOURCING 2A SOURCING 1.26 2.0 2.5 3.0 3.5 4.0 1A SOURCING VDD (V) Figure 10. VTT Performance for SSTL-2 Bus REV. 1.1.3 3/8/02 9 ML6554 PRODUCT SPECIFICATION Table 1. Recommend Parts List for SSTL-2 Termination Circuit in Figure 2. Item Resistors 1 2 3 Capacitors 4 Qty Description Manufacturer / Part Number Designator 2 1 2 100Ω1210 SMD 1kΩ 1210 SMD 100kΩ1210 SMD Panasonic/ERJ-8ENF1000V Panasonic/ERJ-8ENF1001V Panasonic/ERJ-8ENF1003V R1, R2 R5 R3, R4 3 0.1µF 1210 Film SMD C2, C8, C9 5 6 7 8 1 2 1 2 820µF 2V Solid Elect. SMD 330µF Tant 6.3V 100mΩ 1nF 1210 Film SMD 0.1µF 0805 Film Panasonic/ECV3VB1E104K Panasonic/ECU-V1H104KBW Sanyo/2SV820M Os Con AVX/TPSE337M006R0100 Panasonic/ECU-V1H102KBM Panasonic/ECJ-2VF1C104Z 9 1 ML6554 Bus Terminator Power SOP Package ML6554CU or ML6554IU U1 Magnetics 10 1 3.3µH 5A inductor SMD Coilcraft/D03316P-332HC Pulse Eng./ P0751.332T Gowanda/SMP3316-331M XFMRS inc./XF0046-S4 L1 Other 11 12 1 1 Scope probe socket 12 Pin breakaway strip Tektronics/131-4353-00 Sullins/PTC36SAAN (36 PINS) TP1 I/O, standoffs C1 C5, C6 C7 C3, C4 ICS Table 2. Recommend Parts List for Figure 3. Item Resistors 1 2 Capacitors 3 Qty Description Manufacturer / Part Number Designator 2 1 100kΩ 0805 SMD 1kΩ 0805 SMD Panasonic/ERJ-8ENF1000V Panasonic/ERJ-8ENF1000V R1, R3 R2 1 0.1µF, 1210 Film SMD C2 4 5 6 7 1 2 1 1 820µF 2V Solid Elect. SMD 330µF Tant 6.3V 100mΩ 1nF 1210 Film SMD 10µF 6.3V Ceramic Panasonic/ECV3VB1E104K Panasonic/ECU-V1H104KBW Sanyo/2SV820M Os Con AVX/TPSE337M006R0100 Panasonic/ECU-V1H102KBM TDK/C2012X5R0J106M 8 1 ML6554 Bus Terminator Power SOP Package ML6554CU or ML6554IU U1 Magnetics 9 1 3.3µH 5A inductor SMD Coilcraft/D03316P-332HC Pulse Eng./ P0751.332T Gowanda/SMP3316-331M XFMRS inc./XF0046-S4 L1 Other 10 11 1 1 Scope probe socket 12 Pin breakaway strip Tektronics/131-4353-00 Sullins/PTC36SAAN (36 PINS) TP1 I/O, standoffs C1 C5, C6 C4 C3 ICS 10 REV. 1.1.3 3/8/02 PRODUCT SPECIFICATION ML6554 Vendor List 1. AVX (207) 282-5111 2. Sanyo (619) 661-6835 3. Tektronix (408) 496-0800 4. Coilcraft (847) 639-6400 5. Pulse (800) 797-8573 6. Gowanda (716) 532-2234 7. Xfmrs Inc. (317) 834-1066 8. Panasonic (714) 373-7366 9. Digikey (800) 344-4539 60 40 40 θJA (ºC/W) ΘJA (ºC/W) 60 20 20 16Ld PSOP2 2.3x3.1mm PAD 1.9mm DIE 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 16Ld PSOP2 2.3x3.1mm PAD 1.9mm DIE @ 0.8 WATTS 0 0 100 200 300 400 POWER (W) AIR VELOCITY (LFPM) NATURAL CONVECTION ΘJA TEST RESULTS 1.27mm PITCH PowerSOP™ 2 SLUG SOLDERED FORCED CONVECTION ΘJA TEST RESULTS 1.27mm PITCH PowerSOP™ 2 SLUG SOLDERED 500 Figure 11. Graphical Results Summary – 1S2P Test Board REV. 1.1.3 3/8/02 11 ML6554 PRODUCT SPECIFICATION DRAWING NUMBER ENG-CB-1007 REV A Applicable Jedec Spec JC 51-X (Note 1) (Proposed Spec) Substrate Material FR-4 Dimensions (LxW) (Overall) 114.3 x 76.2mm Dimensions (LxW) (Metallization) 55 x 65mm Dimensions (LxW) (Inner Planes) 73 x 73mm Thickness 1.6 mm Pitch 1.27mm Stackup (# Signal Layers, # Cu Planes) 1S2P Cu Trace Coverage (Signal Layer) 12% Cu Coverage (Internal Layer) 100% Trace Width (Spec/Measured) 235.5±25.5/288µm Trace Cu Thickness (Spec/Measured) 70±14/67µm Inner Cu Thickness (Spec/Measured) 35±3.5/31µm Build # C1797 Note 1: Proposed Spec "Thermal Test Board with Two Internal Solid Copper Planes for leaded Surface Mount Packages". Figure 12. Test Board Layout for ΘJA vs. Airflow Table 3. Termination Solutions Summary By Buss Type Bus Description Driving Method VDDQ VTT GTL+ Gunning Transceiver Bus Plus Open Drain 5v or 3.3V 1.5V±10% Note 10 Note12 SSTL_2 Series Stub Terminated Logic for 2V Symmetric Drive, Series Resistance 2.5V±10% 0.5x (VDDQ) ±3% RAMBUS RAMBUS Signaling Logic Open Drain None Specified LV-TTL Low Voltage TTL Logic or PECL or 3.3V VME Symmetric Drive 3.3±10% 12 VREF 1.0V±2% Note 11 Fairchild Solutions Industry System Components ML6554CU; Mode: VREF Input = 1.5V, VCC = 5V 300 to 500MHz Processor; PC Chipsets; GTLP 16xxx Buffers; Fairchild, Texas Instr. 2.5V ML6554CU or ML6553CS; Mode: VREF Input = Floating or Forced, VCC = 3.3V SSTL SDRAM; Hitachi, Fujitsu, NEC, Micro, Mitsubishi 2.5V 2.0V ML6553CS; Mode: VREF Input = Open, VCC = VDDQ nDRAM, RAMBUS, Intel, Toshiba VDDQ/2 3.3V ML6553CS; Mode: VREF Input = Open, VCC = VDDQ Processors or backplanes; LV-TTL SDRAM, EDO RAM REV. 1.1.3 3/8/02 PRODUCT SPECIFICATION ML6554 Mechanical Dimensions 16-Pin PSOP 9.90 ± 0.10 A 0.60 8.89 1.95 16 9 B 3.90 ± 0.10 6.00 7.50 1.75 2.50 3.70 1 PIN ONE INDICATOR 7.40 3.50 8 0.51 0.35 1.27 1.27 8.89 0.25 M C B A (0.30) LAND PATTERN RECOMMENDATION 1.75 MAX SEE DETAIL A +0.05 1.45 –0.20 C 0.25 0.19 0.10 C +0.10 0.15 –0.05 (R0.10) 0.50 0.25 X 45° GAGE PLANE (R0.10) 8° 0° 0.36 0.70 ± 0.20 NOTES: UNLESS OTHERWISE SPECIFIED A) THIS PACKAGE CONFORMS TO JEDEC MS–012, VARIATION AC, ISSUE C, DATED MAY 1990. B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS DO NOT INCLUDE MOLD FLASH OR BURRS. SEATING PLANE (1.04) DETAIL A SCALE: 2:1 REV. 1.1.3 3/8/02 13 ML6554 PRODUCT SPECIFICATION Ordering Information Part Number Temperature Range Package ML6554CU 0°C to 70°C 16-Pin PSOP (U16) ML6554IU -40°C to +85°C 16-Pin PSOP (U16) DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury of the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 3/8/02 0.0m 002 Stock#DS30006554 2001 Fairchild Semiconductor Corporation