Dynex DCR780G42 Phase control thyristor Datasheet

DCR780G42
Phase Control Thyristor
DS5829-5 February 2014 (LN31341)
FEATURES
KEY PARAMETERS

Double Side Cooling

High Surge Capability
VDRM
IT(AV)
ITSM
dV/dt*
dI/dt
APPLICATIONS
4200V
780A
10500A
1500V/µs
400A/us
* Higher dV/dt selections available

High Power Drives

High Voltage Power Supplies

Static Switches
VOLTAGE RATINGS
Part and
Ordering
Number
DCR780G42
DCR780G40
DCR780G38
Repetitive Peak
Voltages
VDRM and VRRM
V
4200
4000
3800
Conditions
Tvj = -40°C to 125°C,
IDRM = IRRM = 100mA,
VDRM, VRRM tp = 10ms,
VDSM & VRSM =
VDRM & VRRM + 100V
respectively
Lower voltage grades available.
ORDERING INFORMATION
Outline type code: G
(See Package Details for further information)
Fig. 1 Package outline
When ordering, select the required part number
shown in the Voltage Ratings selection table.
For example:
DCR780G42
Note: Please use the complete part number when ordering
and quote this number in any future correspondence
relating to your order.
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DCR780G42
SEMICONDUCTOR
CURRENT RATINGS
Tcase = 60°C unless stated otherwise
Symbol
Parameter
Test Conditions
Max.
Units
780
A
Double Side Cooled
IT(AV)
Mean on-state current
IT(RMS)
RMS value
-
1225
A
Continuous (direct) on-state current
-
1173
A
IT
Half wave resistive load
SURGE RATINGS
Symbol
ITSM
2
It
Parameter
Surge (non-repetitive) on-state current
Test Conditions
Max.
Units
10ms half sine, Tcase = 125°C
10.5
kA
VR = 0
0.55
MA s
Min.
Max.
Units
2
I t for fusing
2
THERMAL AND MECHANICAL RATINGS
Symbol
Rth(j-c)
Rth(c-h)
Parameter
Thermal resistance – junction to case
Thermal resistance – case to heatsink
Test Conditions
Double side cooled
DC
-
0.0268
°C/W
Single side cooled
Anode DC
-
0.0527
°C/W
Cathode DC
-
0.0652
°C/W
Double side
-
0.0072
°C/W
-
.0144
°C/W
-
125
°C
Clamping force 11.5kN
(with mounting compound)
Blocking VDRM / VRRM
Single side
Tvj
Virtual junction temperature
Tstg
Storage temperature range
-55
125
°C
Fm
Clamping force
10
13
kN
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DCR780G42
SEMICONDUCTOR
DYNAMIC CHARACTERISTICS
Symbol
IRRM/IDRM
Parameter
Test Conditions
Min.
Max.
Units
Peak reverse and off-state current
At VRRM/VDRM, Tcase = 125°C
-
100
mA
dV/dt
Max. linear rate of rise of off-state voltage
To 67% VDRM, Tj = 125°C, gate open
-
1500
V/µs
dI/dt
Rate of rise of on-state current
From 67% VDRM to 2x IT(AV)
Repetitive 50Hz
-
200
A/µs
Gate source 30V, 10,
Non-repetitive
-
400
A/µs
tr < 0.5µs, Tj = 125°C
VT(TO)
rT
tgd
Threshold voltage – Low level
100A to 500A at Tcase = 125°C
-
.87
V
Threshold voltage – High level
500A to 3000A at Tcase = 125°C
-
1.053
V
On-state slope resistance – Low level
100A to 500A at Tcase = 125°C
-
1.2244
m
On-state slope resistance – High level
500A to 3000A at Tcase = 125°C
-
0.8443
m
TBD
TBD
µs
300
600
µs
1100
2200
µC
Delay time
VD = 67% VDRM, gate source 30V, 10
tr = 0.5µs, Tj = 25°C
tq
Turn-off time
Tj = 125°C, VR = 200V, dI/dt = 5A/µs,
dVDR/dt = 20V/µs linear
QS
Stored charge
IT = 2000A, Tj = 125°C, dI/dt = 5A/µs,
IL
Latching current
Tj = 25°C, VD = 5V
-
3
A
IH
Holding current
Tj = 25°C, RG-K = , ITM = 500A, IT = 5A
-
300
mA
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DCR780G42
SEMICONDUCTOR
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol
Parameter
Test Conditions
Max.
Units
VGT
Gate trigger voltage
VDRM = 5V, Tcase = 25°C
1.5
V
VGD
Gate non-trigger voltage
At 50% VDRM, Tcase = 125°C
0.4
V
IGT
Gate trigger current
VDRM = 5V, Tcase = 25°C
350
mA
IGD
Gate non-trigger current
At 50% VDRM, Tcase = 125°C
10
mA
CURVES
Instantaneous on-state current TI - (A)
3000
25°C min
25°C max
125°C min
125°C max
2000
1000
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Instantaneous on-state voltage VT - (V)
Fig.2 Maximum & minimum on-state characteristics
VTM EQUATION
VTM = A + Bln (IT) + C.IT+D.IT
Where
A = 0.251561
B = 0.154175
C = 0.000839
D = -0.007548
these values are valid for Tj = 125°C for IT 50A to 3000A
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DCR780G42
SEMICONDUCTOR
o
180
120
90
60
30
o
180
120
90
60
30
120
110
100
90
80
70
60
50
40
30
20
10
0
0
Maximum heatsink temperature, THeatsink - ( C )
Maximum case temperature, Tcase ( C )
130
500
1000
1500 2000
2500 3000
0
500
1000
Mean on-state current, IT(AV) - (A)
Mean on-state current, IT(AV) - (A)
Fig.3 On-state power dissipation – sine wave
Fig.4 Maximum permissible case temperature,
double side cooled – sine wave
130
180
120
90
60
30
120
110
100
90
80
70
60
50
40
30
20
10
12
11
Mean power dissipation - (kW)
Mean power dissipation - (kW)
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
10
9
8
7
6
5
d.c.
180
120
90
60
30
4
3
2
1
0
0
0
500
1000
Mean on-state current, IT(AV) - (A)
Fig.5 Maximum permissible heatsink temperature,
double side cooled – sine wave
0
1000
2000
3000
Mean on-state current, IT(AV) - (A)
Fig.6 On-state power dissipation – rectangular wave
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DCR780G42
130
130
Maximum heatsik temperature Theatsink - (oC)
, T - (°C)
Maximum permissible case temperature case
SEMICONDUCTOR
d.c.
180
120
90
60
30
120
110
100
90
80
70
60
50
40
30
20
10
d.c.
180
120
90
60
30
120
110
100
90
80
70
60
50
40
30
20
10
0
0
0
500
1000
1500
0
2000
Mean on-state current, I T(AV) - (A)
500
Fig.7 Maximum permissible case temperature,
double side cooled – rectangular wave
Anode side cooled
Double Side Cooled
Anode Cooled
3
16.9074
0.0066401
0.0457025
0.4962482
1.8248
2.3214
5.2661
10.2686
34.8031
0.0066948
0.045528
0.3484209
4.582
2.4895
5.9105
7.4256
49.3432
0.0070404
0.052895
0.3933903
4.2295
Ri (°C/kW)
Ti (s)
Cathode Cooled
2
5.4226
Ri (°C/kW)
Ti (s)
Cathode side cooled
1
2.2995
Ri (°C/kW)
Ti (s)
70
Themal impedance Z th(j-c) ( °C /kW )
1500
Fig.8 Maximum permissible heatsink temperature,
double side cooled – rectangular wave
Double side cooled
60
1000
Mean on-state current, IT(AV) - (A)
Zth =  [Ri xi(1-exp.
(t/ti))]
4
4
2.1488
Zth  [Ri  (1  exp(T / Ti )]
50
[1]
i 1
40
Rth(j-c) Conduction
30
Tables show the increments of thermal resistance R th(j-c) when the device
operates at conduction angles other than d.c.
20
Double side cooling
Zth (z)
10
0
0.001
0.01
0.1
1
10
100
°
180
120
90
60
30
15
sine.
4.15
4.90
5.74
6.53
7.16
7.46
rect.
2.72
4.02
4.79
5.65
6.64
7.18
Anode Side Cooling
Zth (z)
°
180
120
90
60
30
15
sine.
4.15
4.89
5.73
6.52
7.15
7.44
rect.
2.72
4.02
4.78
5.65
6.62
7.16
Cathode Sided Cooling
Zth (z)
°
180
120
90
60
30
15
sine.
4.13
4.87
5.69
6.46
7.07
7.36
rect.
2.71
4.00
4.76
5.60
6.56
7.09
Time ( s )
Fig.9 Maximum (limit) transient thermal impedance – junction to case (°C/kW)
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DCR780G42
SEMICONDUCTOR
Fig.10 Multi-cycle surge current
Fig.12 Stored Charge vs di/dt
Fig.11 Single-cycle surge current
Fig.13 Reverse Recorvery Current vs di/dt
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DCR780G42
SEMICONDUCTOR
10
9
Gate trigger voltage, V GT - (V)
8
Upper Limit
7
6
Preferred gate drive area
5
4
3
Tj = -40oC
2
Lower Limit
Tj = 25oC
Tj = 125oC
1
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Gate trigger current IGT, - (A)
Fig14 Gate Characteristics
30
Lower Limit
Upper Limit
5W
25
10W
20W
Gate trigger voltage, VGT - (V)
50W
100W
20
150W
-40C
15
10
5
0
0
1
2
3
4
5
6
7
8
9
10
Gate trigger current, IGT - (A)
Fig. 15 Gate characteristics
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DCR780G42
SEMICONDUCTOR
PACKAGE DETAILS
For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Device
DCR803SG18
DCR806SG28
DCR818SG48
DCR820SG65
DCR1080G22
DCR960G28
DCR780G42
DCR690G52
DCR590G65
DCR470G85
Maximum Minimum
Thickness Thickness
(mm)
(mm)
26.415
25.865
26.49
25.94
26.84
26.17
27.1
26.55
26.415
25.865
26.49
25.94
26.72
26.17
26.84
26.29
27.1
26.55
27.46
26.91
Clamping force: 11.5 kN ±10%
Lead length: 420mm
Lead terminal connector: M4 ring
Package outline type code: G
Fig.16 Package outline
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DCR780G42
SEMICONDUCTOR
IMPORTANT INFORMATION:
This publication is provided for information only and not for resale.
The products and information in this publication are intended for use by appropriately trained technical personnel.
Due to the diversity of product applications, the information contained herein is provided as a general guide only and does not constitute
any guarantee of suitability for use in a specific application.The user must evaluate the suitability of the product and the completeness of
the product data for the application. The user is responsible for product selection and ensuring all safety and any warning requirements
are met. Should additional product information be needed please contact Customer Service.
Although we have endeavoured to carefully compile the information in this publication it may contain inaccuracies or typographical
errors. The information is provided without any warranty or guarantee of any kind.
This publication is an uncontrolled document and is subject to change without notice. When referring to it please ensure that it is the
most up to date version and has not been superseded.
The products are not intended for use in applications where a failure or malfunction may cause loss of life, injury or damage to property.
The user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a product failure or
malfunction.
The products must not be touched when operating because there is a danger of electrocution or severe burning. Always use
protective safety equipment such as appropriate shields for the product and wear safety glasses. Even when disconnected any
electric charge remaining in the product must be discharged and allowed to cool before safe handling using protective gloves.
Extended exposure to conditions outside the product ratings may affect reliability leading to premature product failure. Use outside the
product ratings is likely to cause permanent damage to the product. In extreme conditions, as with all semiconductors, this may include
potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or explosion. Appropriate application design
and safety precautions should always be followed to protect persons and property.
Product Status & Product Ordering:
We annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet fully approved for
production. The annotations are as follows:Target Information:
Preliminary Information:
No Annotation:
This is the most tentative form of information and represents a very preliminary specification.
No actual design work on the product has been started.
The product design is complete and final characterisation for volume production is in
progress.The datasheet represents the product as it is now understood but details may change.
The product has been approved for production and unless otherwise notified by Dynex any
product ordered will be supplied to the current version of the data sheet prevailing at the
time of our order acknowledgement.
All products and materials are sold and services provided subject to Dynex’s conditions of sale, which are available on request.
Any brand names and product names used in this publication are trademarks, registered trademarks or trade names of their
respective owners.
HEADQUARTERS OPERATIONS
CUSTOMER SERVICE
DYNEX SEMICONDUCTOR LIMITED
Doddington Road, Lincoln, Lincolnshire, LN6 3LF
United Kingdom.
Phone: +44 (0) 1522 500500
Fax:
+44 (0) 1522 500550
Web: http://www.dynexsemi.com
Phone: +44 (0) 1522 502753 / 502901
Fax:
+44 (0) 1522 500020
e-mail: [email protected]
 Dynex Semiconductor Ltd.
Technical Documentation – Not for resale.
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