Material Content Data Sheet Sales Product Name IPD075N03L G MA# MA000598096 Package PG-TO252-3-311 Issued 29. August 2013 Weight* 316.57 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus tin silver lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-31-5 7440-22-4 7439-92-1 0.899 0.28 0.162 0.05 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.28 2840 2840 513 0.049 0.02 162.275 51.25 51.32 512604 154 513271 4.204 1.33 1.33 13280 13280 0.318 0.10 1003 19.168 6.05 124.849 39.44 45.59 394380 455931 3.740 1.18 1.18 11814 11814 0.086 0.03 0.000 0.00 0.016 0.01 0.020 0.01 0.783 0.25 60548 273 0.03 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 274 65 0.27 Important Remarks: 1. 1 52 2473 2590 1000000