STMicroelectronics LIS3L02AL Mems inertial sensor: 3-axis - /-2g ultracompact linear accelerometer Datasheet

LIS3L02AL
MEMS INERTIAL SENSOR:
3-axis - +/-2g ultracompact linear accelerometer
Features
■
2.4V to 3.6V single supply operation
■
Low power consumption
■
±2g full-scale
■
0.5mg resolution over 100hz bandwidth
■
Embedded self test
■
Output voltage, offset and sensitivity
ratiometric to the supply voltage
■
High shock survivability
■
ECOPACK® Lead-free compliant
(see Section 6)
LGA-8
Description
The LIS3L02AL is a low-power 3-axis linear
capacitive accelerometer that includes a sensing
element and an IC interface able to take the
information from the sensing element and to
provide an analog signal to the external world.
The sensing element, capable of detecting the
acceleration, is manufactured using a dedicated
process developed by ST to produce inertial
sensors and actuators in silicon.
The IC interface is manufactured using a standard
CMOS process that allows high level of
integration
to design a dedicated circuit which is trimmed to
better match the sensing element characteristics.
The LIS3L02AL has a full scale of ±2g and it is
capable of measuring accelerations over a
bandwidth of 1.5 kHz for all axes. The device
bandwidth may be reduced by using external
capacitances. A self-test capability allows to
check the mechanical and electrical signal path of
the sensor.
The LIS3L02AL is available in plastic SMD
package and it is guaranteed to operate over an
extended temperature range of -40°C to +85°C.
The LIS3L02AL belongs to a family of products
suitable for a variety of applications:
– Mobile terminals
– Gaming and Virtual Reality input devices
– Free-fall detection for data protection
– Antitheft systems and Inertial Navigation
– Appliance and Robotics.
Order codes
Part number
Temp range, °C
Package
Packing
LIS3L02AL
-40°C to +85°C
LGA-8
Tray
LIS3L02ALTR
-40°C to +85°C
LGA-8
Tape & Reel
May 2006
Rev 2
1/17
www.st.com
17
Contents
LIS3L02AL
Contents
1
2
3
4
5
Block diagram & pins description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1
Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.3
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.4
Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1
Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.2
IC Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.3
Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1
Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.2
Output response vs. orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.1
Mechanical Characteristics at 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.2
Mechanical Characteristics derived from measurement in the
-40°C to +85°C temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.3
Electrical characteristics at 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2/17
LIS3L02AL
Block diagram & pins description
1
Block diagram & pins description
1.1
Block diagram
Figure 1.
Block diagram
X+
Routx Voutx
CHARGE
AMPLIFIER
Y+
Z+
a
MUX
S/H
Routy Vouty
DEMUX
S/H
ZYX-
Routz Voutz
S/H
REFERENCE
SELF TEST
1.2
CLOCK
TRIMMING CIRCUIT
Pin Description
Figure 2.
Pin Connection
LIS3L02AL
Z
Vdd
X
1
Voutx
ST
Vouty
Voutz
Reserved
GND
Y
DIRECTION OF THE
DETECTABLE
ACCELERATIONS
Reserved
BOTTOM VIEW
3/17
Block diagram & pins description
Table 1.
4/17
LIS3L02AL
Pin description
Pin #
Pin Name
Function
1
ST
2
Voutz
Output Voltage Z channel
3
GND
0V supply
4
Reserved
Leave unconnected
5
Reserved
Leave unconnected
6
Vouty
Output Voltage Y channel
7
Voutx
Output Voltage X channel
8
Vdd
Self Test (Logic 0: normal mode; Logic 1: Self-test)
Power supply
LIS3L02AL
Mechanical and electrical specifications
2
Mechanical and electrical specifications
2.1
Mechanical characteristics
Table 2.
Mechanical characteristics(1)
(Temperature range -40°C to +85°C) All the parameters are specified @ Vdd =3.3V,
T = 25°C unless otherwise noted
Symbol
Parameter
Ar
Acceleration Range(3)
So
(4)
Sensitivity
Test Condition
Full-scale = 2g
Min.
Typ.(2)
±1.8
±2.0
Vdd/5–10%
Vdd/5
Max.
Unit
g
Vdd/5+10%
V/g
SoDr
Sensitivity Change Vs
Temperature
Delta from +25°C
Voff
Zero-g Level(4)
T = 25°C
Zero-g level Change Vs
Temperature
Delta from +25°C
±0.5
Best fit straight line
Full-scale = 2g
X, Y axis
±0.3
±1.5
%
Best fit straight line
Full-scale = 2g
Z axis
±0.5
±1.5
%
±2
±4
%
OffDr
NL
Non Linearity(5)
±0.01
Vdd/2-6%
CrossAx Cross-Axis(6)
An
Vt
Acceleration Noise
Density
Self test Output Voltage
Change(7),(8)
Vdd=3.3V;
Full-scale = 2g
Vdd/2
%/°C
Vdd/2+6%
V
mg/°C
µg/
50
Hz
T = 25°C
Vdd=3.3V
Full-scale = 2g
X axis
-20
-50
-100
mV
T = 25°C
Vdd=3.3V
Full-scale = 2g
Y axis
20
50
100
mV
T = 25°C
Vdd=3.3V
Full-scale = 2g
Z axis
20
50
100
mV
Fres
Sensing Element
all axes
Resonance Frequency(9)
1.5
Top
Operating Temperature
Range
-40
Wh
Product Weight
kHz
+85
0.08
°C
gram
1. The product is factory calibrated at 3.3V. The device can be powered from 2.4V to 3.6V. Voff, So and Vt parameters will
vary with supply voltage.
5/17
Mechanical and electrical specifications
LIS3L02AL
2. Typical specifications are not guaranteed
3. Guaranteed by wafer level test and measurement of initial offset and sensitivity
4. Zero-g level and sensitivity are essentially ratiometric to supply voltage
5. Guaranteed by design
6. Contribution to the measuring output of the inclination/acceleration along any perpendicular axis
7. Self test “output voltage change” is defined as Vout(Vst=Logic1)-Vout(Vst=Logic0)
8. Self test “output voltage change” varies cubically with supply voltage
9. Minimum resonance frequency Fres=1.5kHz. Sensor bandwidth=1/(2*π*110kΩ*Cload) with Cload>1nF.
2.2
Electrical Characteristics
Table 3.
Electrical Characteristics(1)
(Temperature range -40°C to +85°C) All the parameters are specified @ Vdd =3.3V, T=25°C
unless otherwise noted
Symbol
Parameter
Vdd
Supply Voltage
Idd
Supply Current
Vst
Self Test Input
Rout
Cload
Top
Min.
Typ.(2)
Max.
Unit
2.4
3.3
3.6
V
0.85
1.5
mA
mean value
Output Impedance
Capacitive Load
Test Condition
Drive(3)
Operating Temperature
Range
Logic 0 level
0
0.3*Vdd
V
Logic 1 level
0.7*Vdd
Vdd
V
140
kΩ
80
110
1
-40
1. The product is factory calibrated at 3.3V
2. Typical specifications are not guaranteed
3. Minimum resonance frequency Fres=1.5kHz. Sensor bandwidth=1/(2*π*110kΩ*Cload) with Cload>1nF
6/17
nF
+85
°C
LIS3L02AL
2.3
Mechanical and electrical specifications
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 4.
Absolute maximum ratings
Symbol
Ratings
Vdd
Supply voltage
Vin
Input Voltage on Any Control pin (ST)
Maximum Value
Unit
-0.3 to 7
V
-0.3 to Vdd +0.3
V
3000g for 0.5 ms
APOW
Acceleration (Any axis, Powered, Vdd=3.3V)
AUNP
Acceleration (Any axis, Not powered)
TSTG
Storage Temperature Range
10000g for 0.1 ms
3000g for 0.5 ms
10000g for 0.1 ms
-40 to +125
°C
2kV HBM
ESD
Electrostatic Discharge Protection
200V MM
1500V CDM
This is a Mechanical Shock sensitive device, improper handling can cause permanent
damages to the part
This is an ESD sensitive device, improper handling can cause permanent damages to
the part
2.4
Terminology
Sensitivity describes the gain of the sensor and can be determined by applying 1g
acceleration to it. As the sensor can measure DC accelerations this can be done easily by
pointing the axis of interest towards the center of the earth, note the output value, rotate the
sensor by 180 degrees (point to the sky) and note the output value again thus applying ±1g
acceleration to the sensor. Subtracting the larger output value from the smaller one and
dividing the result by 2 will give the actual sensitivity of the sensor. This value changes very
little over temperature (see sensitivity change vs. temperature) and also very little over time.
The Sensitivity Tolerance describes the range of Sensitivities of a large population of
sensors.
Zero-g level describes the actual output signal if there is no acceleration present. A sensor
in a steady state on a horizontal surface will measure 0g in X axis and 0g in Y axis. The
output is ideally for a 3.3V powered sensor Vdd/2 = 1650mV. A deviation from ideal 0-g level
(1650mV in this case) is called Zero-g offset. Offset of precise MEMS sensors is to some
extend a result of stress to the sensor and therefore the offset can slightly change after
mounting the sensor onto a printed circuit board or exposing it to extensive mechanical
stress. Offset changes little over temperature - see “Zero-g level change vs. temperature” the Zero-g level of an individual sensor is very stable over lifetime. The Zero-g level
tolerance describes the range of Zero-g levels of a population of sensors.
7/17
Mechanical and electrical specifications
LIS3L02AL
Self Test allows to test the mechanical and electric part of the sensor, allowing the seismic
mass to be moved by means of an electrostatic test-force. The Self Test function is off when
the ST pin is connected to GND. When the ST pin is tied at Vdd an actuation force is applied
to the sensor, simulating a definite input acceleration. In this case the sensor outputs will
exhibit a voltage change in their DC levels which is related to the selected full scale and
depending on the Supply Voltage through the device sensitivity. When ST is activated, the
device output level is given by the algebraic sum of the signals produced by the acceleration
acting on the sensor and by the electrostatic test-force. If the output signals change within
the amplitude specified inside Table 2, than the sensor is working properly and the
parameters of the interface chip are within the defined specification.
Output impedance describes the resistor inside the output stage of each channel. This
resistor is part of a filter consisting of an external capacitor of at least 1nF and the internal
resistor. Due to the high resistor level only small, inexpensive external capacitors are
needed to generate low corner frequencies. When interfacing with an ADC it is important to
use high input impedance input circuitries to avoid measurement errors. Note that the
minimum load capacitance forms a corner frequency beyond the resonance frequency of
the sensor. For a flat frequency response a corner frequency well below the resonance
frequency is recommended. In general the smallest possible bandwidth for an particular
application should be chosen to get the best results.
8/17
LIS3L02AL
3
Functionality
Functionality
The LIS3L02AL is a high performance, low-power, analog output 3-axis linear
accelerometer packaged in a LGA package. The complete device includes a sensing
element and an IC interface able to take the information from the sensing element and to
provide an analog signal to the external world.
3.1
Sensing element
A proprietary process is used to create a surface micro-machined accelerometer. The
technology allows to carry out suspended silicon structures which are attached to the
substrate in a few points called anchors and are free to move in the direction of the sensed
acceleration. To be compatible with the traditional packaging techniques a cap is placed on
top of the sensing element to avoid blocking the moving parts during the moulding phase of
the plastic encapsulation.
When an acceleration is applied to the sensor the proof mass displaces from its nominal
position, causing an imbalance in the capacitive half-bridge. This imbalance is measured
using charge integration in response to a voltage pulse applied to the sense capacitor.
At steady state the nominal value of the capacitors are few pF and when an acceleration is
applied the maximum variation of the capacitive load is up to 100fF.
3.2
IC Interface
In order to increase robustness and immunity against external disturbances the complete
signal processing chain uses a fully differential structure. The final stage converts the
differential signal into a single-ended one to be compatible with the external world.
The signals of the sensing element are multiplexed and fed into a low-noise capacitive
charge amplifier that implements a Correlated Double Sampling system (CDS) at its output
to cancel the offset and the 1/f noise. The output signal is de-multiplexed and transferred to
three different S&Hs, one for each channel and made available to the outside.
The low noise input amplifier operates at 200 kHz while the three S&Hs operate at a
sampling frequency of 66 kHz. This allows a large oversampling ratio, which leads to inband noise reduction and to an accurate output waveform.
All the analog parameters (Zero-g level, sensitivity and self-test) are ratiometric to the
supply voltage. Increasing or decreasing the supply voltage, the sensitivity and the offset will
increase or decrease almost linearly. The self test voltage change varies cubically with the
supply voltage.
3.3
Factory calibration
The IC interface is factory calibrated for sensitivity (So) and Zero-g level (Voff).
The trimming values are stored inside the device by a non volatile structure. Any time the
device is turned on, the trimming parameters are downloaded into the registers to be
employed during the normal operation. This allows the user to employ the device without
further calibration.
9/17
Application hints
4
LIS3L02AL
Application hints
Figure 3.
LIS3L02AL electrical connection
Vdd
10µF
GND
100nF
Z
GND
ST
X
Optional
1
Vout X
LIS3L02AL
Cload x
(top view)
GND
Optional
Vout Y
Y
Cload y
DIRECTION OF THE
DETECTABLE
ACCELERATIONS
Optional
Vout Z
Cload z
Digital signals
Power supply decoupling capacitors (100nF ceramic or polyester + 10µF Aluminum) should
be placed as near as possible to the device (common design practice).
The LIS3L02AL allows to band limit Voutx, Vouty and Voutz through the use of external
capacitors. The re-commended frequency range spans from DC up to 1.5 KHz. In particular,
capacitors must be added at output pins to implement low-pass filtering for antialiasing and
noise reduction. The equation for the cut-off frequency (ft) of the external filters is:
1
f t = -------------------------------------------------------------------2π ⋅ R out ⋅ C load ( x, y, z )
Taking in account that the internal filtering resistor (Rout) has a nominal value equal to
110kΩ, the equation for the external filter cut-off frequency may be simplified as follows:
1.45µF
f t = ------------------------------------- [ Hz ]
C load ( x, y, z )
The tolerance of the internal resistor can vary typically of ±20% within its nominal value of
110kΩ; thus the cut-off frequency will vary accordingly. A minimum capacitance of 1nF for
Cload(x, y, z) is required in any case.
.
Table 5.
10/17
Filter capacitor selection, Cload (x,y,z)
Cut-off frequency
Capacitor value
1 Hz
1500 nF
10 Hz
150 nF
20 Hz
68 nF
50 Hz
30 nF
100 Hz
15 nF
200 Hz
6.8 nF
500 Hz
3 nF
LIS3L02AL
4.1
Application hints
Soldering information
The LGA-8 package is compliant with the ECOPACK, RoHs and “Green” standard.It is
qualified for soldering heat resistance according to JEDEC J-STD-020C.
Pin 1 indicator is electrically connected to ST pin. Leave pin 1 indicator unconnected during
soldering.
Land pattern and soldering recommendations are available upon request.
4.2
Output response vs. orientation
Figure 4.
Output response vs. orientation
X=1.65V(0g)
Y=0.99V (-1g)
Z=1.65V (0g)
Bottom
Top
X=1.65V (0g)
Y=1.65V (0g)
Z=0.99V (-1g)
Top
X=1.65V (0g)
Y=1.65V (0g)
Bottom Z=2.31V (+1g)
X=0.99V (-1g)
Y=1.65V (0g)
Z=1.65V (0g)
TOP VIEW
X=1.65V(0g)
Y=2.31V (+1g)
Z=1.65V (0g)
X=2.31V (+1g)
Y=1.65V (0g)
Z=1.65V (0g)
Earth’s Surface
Figure 4 refers to LIS3L02AL device powered at 3.3V.
11/17
Typical performance characteristics
LIS3L02AL
5
Typical performance characteristics
5.1
Mechanical Characteristics at 25°C
Figure 5.
x-axis Zero-g level at 3.3V
Figure 6.
20
x-axis sensitivity at 3.3V
30
18
25
14
Percent of parts (%)
Percent of parts (%)
16
12
10
8
6
4
20
15
10
5
2
0
1.55
1.65
Zero−g Level (V)
1.7
0
0.62
1.75
y-axis Zero-g level at 3.3V
Figure 8.
25
25
20
20
Percent of parts (%)
Percent of parts (%)
Figure 7.
1.6
15
10
5
0
1.55
Figure 9.
0.63
0.64
0.65
0.66
0.67
Sensitivity (V/g)
0.68
0.69
0.7
0.69
0.7
0.69
0.7
y-axis sensitivity at 3.3V
15
10
5
1.6
1.65
Zero−g Level (V)
1.7
0
0.62
1.75
z-axis Zero-g level at 3.3V
0.63
0.64
0.65
0.66
0.67
Sensitivity (V/g)
0.68
Figure 10. z-axis sensitivity at 3.3V
20
25
18
20
14
Percent of parts (%)
Percent of parts (%)
16
12
10
8
6
4
15
10
5
2
0
1.55
12/17
1.6
1.65
Zero−g Level (V)
1.7
1.75
0
0.62
0.63
0.64
0.65
0.66
0.67
Sensitivity (V/g)
0.68
LIS3L02AL
5.2
Typical performance characteristics
Mechanical Characteristics derived from measurement in the
-40°C to +85°C temperature range
Figure 11. x-axis Zero-g level change Vs
temperature
Figure 12. x-axis sensitivity change Vs
temperature
35
30
25
25
Percent of parts (%)
Percent of parts (%)
30
20
15
10
15
10
5
5
0
−1
20
−0.5
0
0.5
Zero−g level change (mg/deg. C)
1
Figure 13. y-axis Zero-g level change Vs
temperature
0
−0.05 −0.04 −0.03 −0.02 −0.01
0
0.01
Sensitivity Change(%/deg. C)
0.02
0.03
Figure 14. y-axis sensitivity change Vs
temperature
30
40
35
25
Percent of parts (%)
Percent of parts (%)
30
20
15
10
25
20
15
10
5
0
−1
5
−0.5
0
0.5
Zero−g level change (mg/deg. C)
1
Figure 15. z-axis Zero-g level change Vs
temperature
0
−0.05 −0.04 −0.03 −0.02 −0.01
0
0.01
Sensitivity Change (%/deg. C)
0.02
0.03
Figure 16. z-axis sensitivity change Vs
temperature
30
40
35
25
Percent of parts (%)
Percent of parts (%)
30
20
15
10
25
20
15
10
5
0
−2
5
−1.5
−1
−0.5
Zero−g level change (mg/deg. C)
0
0
−0.05 −0.04 −0.03 −0.02 −0.01
0
0.01
Sensitivity Change (%/deg. C)
0.02
0.03
13/17
Typical performance characteristics
5.3
LIS3L02AL
Electrical characteristics at 25°C
Figure 17. Noise density at 3.3V (x,y axis)
Figure 18. Noise density at 3.3V (z axis)
35
25
30
Percent of parts (%)
Percent of parts (%)
20
25
20
15
10
15
10
5
5
0
18
20
22
24
26
28
Noise density (ug/sqrt(Hz))
30
32
Figure 19. Current Consumption at 3.3V
20
18
Percent of parts (%)
16
14
12
10
8
6
4
2
0
0.4
14/17
0.6
0.8
1
current consumption (mA)
1.2
1.4
0
20
30
40
50
60
Noise density (ug/sqrt(Hz))
70
80
LIS3L02AL
Package Information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 20. LGA-8 Mechanical Data & Package Dimensions
DIM.
A1
mm
TYP.
MAX.
1.460
1.520
1.600 0.0574 0.0598 0.0629
0.180
0.220
A2
A3
inch
MIN.
MIN.
TYP.
1.330
0.0523
0.260
0.007 0.0086 0.0102
D1
4.850
5.000
5.150
0.190 0.1968 0.2027
E1
4.850
5.000
5.150
0.190 0.1968 0.2027
L
1.270
L1
2.540
0.1
M
1.225
0.0482
M1
0.875
0.900
0.05
0.925 0.0344 0.0354 0.0364
N
2.000
0.0787
N1
1.225
0.0482
N2
1.170
P1
1.300
P2
0.740
T1
0.046
1.350
1.400 0.0511 0.0531 0.0551
0.790
0.840 0.0291 0.0311 0.033
1.170
T2
0.615
R
1.200
0.640
OUTLINE AND
MECHANICAL DATA
MAX.
0.046
0.665 0.0242 0.0251 0.0261
1.600 0.0472
0.0629
h
0.150
0.0059
k
0.050
0.0019
j
0.100
0.0039
LGA8 (5x5x1.6mm)
Land Grid Array Package
E1
A3
E
A
M
K
M1
C
T1
K
(4x)
8
1
6
2
D
N1
T2
= =
L1
D1
L
7
N
R
D
3
5
K D
4
E
B
N2
K E
A2
A1
P1
h
Detail A
CA B
seating plane
K
P2
DETAIL A
METAL PAD
C A B
C A B
SOLDER MASK
OPENING
h
j
6
Package Information
j
C A B
7669231 C
15/17
Revision history
7
LIS3L02AL
Revision history
Table 6.
16/17
Document revision history
Date
Revision
Changes
28-Sep-2005
1
Initial release.
03-May-2006
2
Corrected typo errors. Applied new corporate template layout.
LIS3L02AL
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED,
AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS,
NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR
SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
17/17