ON MT9P031I12STM-DP 5 mp cmos digital image sensor Datasheet

‡
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
1/2.5-Inch 5 Mp CMOS Digital Image Sensor
MT9P031 Datasheet, Rev. J
For the latest datasheet, please visit www.onsemi.com
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
Table 1:
High frame rate
Superior low-light performance
Low dark current
Global reset release, which starts the exposure of all
rows simultaneously
Bulb exposure mode, for arbitrary exposure times
Snapshot mode to take frames on demand
Horizontal and vertical mirror image
Column and row skip modes to reduce image size
without reducing field-of-view (FOV)
Column and row binning modes to improve image
quality when resizing
Simple two-wire serial interface
Programmable controls: gain, frame rate, frame size,
exposure
Automatic black level calibration
On-chip phase-locked loop (PLL)
Parameter
Optical format
Active imager size
Active pixels
Pixel size
Color filter array
Shutter type
Maximum data rate/
master clock
Full resolution
Frame VGA
rate
(640 x 480, with
binning)
ADC resolution
Responsivity
Pixel dynamic range
SNRMAX
Supply I/O
Voltage Digital
Analog
Power consumption
Operating temperature
Packaging
Applications
•
•
•
•
•
•
Key Performance Parameters
High resolution network cameras
Wide FOV cameras
720P–60 fps cameras
Dome cameras with electronic pan, tile, and zoom
Hybrid video cameras with high resolution stills
Detailed feature extraction for smart cameras
General Description
Value
1/2.5-inch (4:3)
5.70mm(H) x 4.28mm(V)
7.13mm diagonal
2592H x 1944V
2.2 x 2.2m
RGB Bayer pattern
Global reset release (GRR),
Snapshot only
Electronic rolling shutter (ERS)
96 Mp/s at 96 MHz (2.8V I/O)
48 Mp/s at 48 MHz (1.8V I/O)
Programmable up to 14 fps
Programmable up to 53 fps
12-bit, on-chip
1.4 V/lux-sec (550nm)
70.1dB
38.1dB
1.73.1V
1.71.9V (1.8V nominal)
2.63.1V (2.8V nominal)
381mW at 14 fps full resolution
–30°C to +70°C
48-pin iLCC, die
The ON Semiconductor MT9P031 is a 1/2.5-inch
CMOS active-pixel digital image sensor with an active
imaging pixel array of 2592H x 1944V. It incorporates
sophisticated camera functions on-chip such as windowing, column and row skip mode, and snapshot
mode. It is programmable through a simple two-wire
serial interface.
The 5Mp CMOS image sensor features ON Semiconductor’s breakthrough low-noise CMOS imaging technology that achieves CCD image quality (based on
signal-to-noise ratio and low-light sensitivity) while
maintaining the inherent size, cost, and integration
advantages of CMOS.
MT9P031_DS Rev. J 5/15 EN
1
©Semiconductor Components Industries, LLC 2015,
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Ordering Information
Ordering Information
Table 2:
Available Part Numbers
Part Number
Product Description
Orderable Product Attribute Description
MT9P031D00STCC18BC1-200
5 MP 1/3" CIS
Die Sales, 200m Thickness
MT9P031D00STMC18BC1-200
5 MP 1/3" CIS
Die Sales, 200m Thickness
MT9P031I12STC-DP
5 MP 1/3" CIS
Dry Pack with Protective Film
MT9P031I12STC-DR
5 MP 1/3" CIS
Dry Pack without Protective Film
MT9P031I12STC-DR1
5 MP 1/3" CIS
Dry Pack Single Tray without Protective Film
MT9P031I12STC-TP
5 MP 1/3" CIS
Tape & Reel with Protective Film
MT9P031I12STM-DP
5 MP 1/3" CIS
Dry Pack with Protective Film
MT9P031I12STM-DP1
5 MP 1/3" CIS
Dry Pack Single Tray with Protective Film
MT9P031I12STM-DR
5 MP 1/3" CIS
Dry Pack without Protective Film
MT9P031I12STM-DR1
5 MP 1/3" CIS
Dry Pack Single Tray without Protective Film
MT9P031_DS Rev. J 5/15 EN
2
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Table of Contents
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Functional Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Pixel Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Output Data Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Serial Bus Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Two-Wire Serial Interface Sample Write and Read Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Spectral Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
MT9P031_DS Rev. J 5/15 EN
3
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
List of Figures
List of Figures
Figure 1:
Figure 2:
Figure 3:
Figure 4:
Figure 5:
Figure 6:
Figure 7:
Figure 8:
Figure 9:
Figure 10:
Figure 11:
Figure 12:
Figure 13:
Figure 14:
Figure 15:
Figure 16:
Figure 17:
Figure 18:
Figure 19:
Figure 20:
Figure 21:
Figure 22:
Figure 23:
Figure 24:
Figure 25:
Figure 26:
Figure 27:
Figure 28:
Figure 29:
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Typical Configuration (Connection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
48-Pin iLCC 10 x 10 Package Pinout Diagram (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Pixel Array Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Pixel Color Pattern Detail (Top Right Corner) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Imaging a Scene . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Spatial Illustration of Image Readout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Default Pixel Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
LV Format Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Frame Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Timing Diagram Showing a WRITE to Reg0x09 with the Value 0x0284 . . . . . . . . . . . . . . . . . . . . . . . . .19
Timing Diagram Showing a READ from Reg0x09; Returned Value 0x0284 . . . . . . . . . . . . . . . . . . . . . .19
PLL-Generated Master Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Eight Pixels in Normal and Column Skip 2X Readout Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Pixel Readout (no skipping) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Pixel Readout (Column Skip 2X) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Pixel Readout (Row Skip 2X). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Pixel Readout (Column Skip 2X, Row Skip 2X) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Pixel Readout (Column Bin 2X) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Pixel Readout (Column Bin 2X, Row Bin 2X) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Six Pixels in Normal and Column Mirror Readout Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Six Rows in Normal and Row Mirror Readout Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
ERS Snapshot Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
GRR Snapshot Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Signal Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Typical Spectral Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
CRA vs. Image Height (7 deg) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Two-Wire Serial Bus Timing Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
I/O Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
MT9P031_DS Rev. J 5/15 EN
4
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
List of Tables
List of Tables
Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:
Table 13:
Table 14:
Table 15:
Table 16:
Table 17:
Table 18:
Table 19:
Table 20:
Table 21:
Key Performance Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Available Part Numbers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Pixel Type by Column . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Pixel Type by Row . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Dark Rows Sampled as a Function of Row_Bin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Dark Columns Sampled as a Function of Column_Bin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Frame Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
HBmin Values for Row_bin vs. Column_bin Settings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Standard Resolutions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Wide Screen (16:9) Resolutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Legal Values for Column_Skip Based on Column_Bin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
STROBE Timepoints. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Gain Increment Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Test Pattern Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Two-Wire Serial Bus Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
I/O Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
MT9P031_DS Rev. J 5/15 EN
5
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
General Description
General Description
The MT9P031 sensor can be operated in its default mode or programmed by the user for
frame size, exposure, gain setting, and other parameters. The default mode outputs a full
resolution image at 14 frames per second (fps).
An on-chip analog-to-digital converter (ADC) provides 12 bits per pixel. FRAME_VALID
(FV) and LINE_VALID (LV) signals are output on dedicated pins, along with a pixel clock
that is synchronous with valid data.
The MT9P031produces extraordinarily clear, sharp digital pictures, and its ability to
capture both continuous video and single frames makes it the perfect choice for a wide
range of consumer and industrial applications, including cell phones, digital still
cameras, digital video cameras, and PC cameras.
Functional Overview
The MT9P031 is a progressive-scan sensor that generates a stream of pixel data at a
constant frame rate. It uses an on-chip, phase-locked loop (PLL) to generate all internal
clocks from a single master input clock running between 6 and 27 MHz. The maximum
pixel rate is 96 Mp/s, corresponding to a clock rate of 96 MHz. Figure 1 illustrates a block
diagram of the sensor.
Figure 1:
Block Diagram
Pixel Array
EXTCLK
RESET_BAR
STANDBY_BAR
OE
SCLK
SDATA
SADDR
Serial
Interface
Output
2752H x 2004V
Array Control
TRIGGER
Analog Signal Chain
Data Path
PIXCLK
DOUT[11:0]
LV
FV
STROBE
User interaction with the sensor is through the two-wire serial bus, which communicates with the array control, analog signal chain, and digital signal chain. The core of the
sensor is a 5Mp active-pixel array. The timing and control circuitry sequences through
the rows of the array, resetting and then reading each row in turn. In the time interval
between resetting a row and reading that row, the pixels in the row integrate incident
light. The exposure is controlled by varying the time interval between reset and readout.
Once a row has been read, the data from the columns is sequenced through an analog
signal chain (providing offset correction and gain), and then through an ADC. The
output from the ADC is a 12-bit value for each pixel in the array. The ADC output passes
through a digital processing signal chain (which provides further data path corrections
and applies digital gain). The pixel data are output at a rate of up to 96 Mp/s, in addition
to frame and line synchronization signals.
MT9P031_DS Rev. J 5/15 EN
6
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Functional Overview
Figure 2:
Typical Configuration (Connection)
VDD_PLL
VAA_PIX
VAA
VDD
VDD_IO
10kW
1.5kW1
1.5kW1
VDD_IO2,3 VDD2,3 VAA2,3
SADDR
RESET_BAR
STANDBY_BAR
DOUT[11:0]
PIXCLK
FV
LV
STROBE
1μF
SCLK
SDATA
TRIGGER
From
controller
Master
clock
EXTCLK
TEST
1. A resistor value of 1.5k is recommended, but may be greater for slower two-wire speed.
2. All power supplies should be adequately decoupled.
3. All DGND pins must be tied together, as must all AGND pins, all VDD_IO pins, and all VDD pins.
MT9P031_DS Rev. J 5/15 EN
DOUT9
1
DOUT10
2
DOUT11
AGND
3
DGND
TEST
4
VDD
SCLK
5
VAA_PIX
SDATA
6
VAA_PIX
RSVD
48-Pin iLCC 10 x 10 Package Pinout Diagram (Top View)
48
47
46
45
44
43
10
39
VDD_IO
VDD_IO
11
38
DOUT5
VDD
12
37
DOUT4
SADDR
13
36
DOUT3
STANDBY_BAR
14
35
DOUT2
TRIGGER
15
34
DOUT1
RESET_BAR
16
33
DOUT0
OE
17
32
PIXCLK
NC
18
31
EXTCLK
19
20
21
22
23
24
25
26
27
28
29
30
NC
DGND
NC
DOUT6
NC
40
NC
9
DGND
STROBE
VDD_PLL
DOUT7
VAA
LINE_VALID
VAA
DOUT8
41
TEST
42
8
AGND
7
TEST
FRAME_VALID
NC
Figure 3:
AGND3
DGND3
OE
RSVD
Notes:
To
controller
7
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Pixel Data Format
Table 3:
Pin Description
Name
Type
Description
RESET_BAR
Input
When LOW, the MT9P031 asynchronously resets. When driven HIGH, it resumes normal
operation with all configuration registers set to factory defaults.
EXTCLK
Input
External input clock.
SCLK
Input
Serial clock. Pull to VDD_IO with a 1.5k resistor.
OE
Input
When HIGH, the PIXCLK, DOUT, FV, LV, and STROBE outputs enter a High-Z. When driven
LOW, normal operation resumes.
STANDBY_BAR
Input
Standby. When LOW, the chip enters a low-power standby mode. It resumes normal
operation when the pin is driven HIGH.
TRIGGER
Input
Snapshot trigger. Used to trigger one frame of output in snapshot modes, and to
indicate the end of exposure in bulb exposure modes.
SADDR
Input
Serial address. When HIGH, the MT9P031 responds to device ID (BA)H. When LOW, it
responds to serial device ID (90)H.
Serial data. Pull to VDD_IO with a 1.5k resistor.
SDATA
I/O
PIXCLK
Output
Pixel clock. The DOUT, FV, LV, and STROBE outputs should be captured on the falling edge
of this signal.
DOUT[11:0]
Output
Pixel data. Pixel data is 12-bit. MSB (DOUT11) through LSB (DOUT0) of each pixel, to be
captured on the falling edge of PIXCLK.
FRAME_VALID
Output
Frame valid. Driven HIGH during active pixels and horizontal blanking of each frame and
LOW during vertical blanking.
LINE_VALID
Output
Line valid. Driven HIGH with active pixels of each line and LOW during blanking periods.
STROBE
Output
Snapshot strobe. Driven HIGH when all pixels are exposing in snapshot modes.
VDD
Supply
Digital supply voltage. Nominally 1.8V.
VDD_IO
Supply
IO supply voltage. Nominally 1.8 or 2.8V.
DGND
Supply
Digital ground.
Analog supply voltage. Nominally 2.8V.
VAA
Supply
VAA_PIX
Supply
Pixel supply voltage. Nominally 2.8V, connected externally to VAA.
AGND
Supply
Analog ground.
VDD_PLL
Supply
PLL supply voltage. Nominally 2.8V, connected externally to VAA.
TEST
—
Tie to AGND for normal device operation (factory use only).
RSVD
—
Tie to DGND for normal device operation (factory use only).
NC
—
No connect.
Pixel Data Format
Pixel Array Structure
The MT9P031 pixel array consists of a 2752-column by 2004-row matrix of pixels
addressed by column and row. The address (column 0, row 0) represents the upper-right
corner of the entire array, looking at the sensor, as shown in Figure 4 on page 9.
The array consists of a 2592-column by 1944-row active region in the center representing
the default output image, surrounded by a boundary region (also active), surrounded by
a border of dark pixels (see Table 4 and Table 5). The boundary region can be used to
avoid edge effects when doing color processing to achieve a 2592 x 1944 result image,
while the optically black column and rows can be used to monitor the black level.
MT9P031_DS Rev. J 5/15 EN
8
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Pixel Data Format
Pixels are output in a Bayer pattern format consisting of four “colors”—GreenR, GreenB,
Red, and Blue (Gr, Gb, R, B)—representing three filter colors. When no mirror modes are
enabled, the first row output alternates between Gr and R pixels, and the second row
output alternates between B and Gb pixels. The Gr and Gb pixels have the same color
filter, but they are treated as separate colors by the data path and analog signal chain.
Table 4:
Table 5:
Figure 4:
Pixel Type by Column
Column
Pixel Type
0–9
10–15
16–2607
2608–2617
2618–2751
Dark (10)
Active boundary (6)
Active image (2592)
Active boundary (10)
Dark (134)
Row
Pixel Type
0– 49
50–53
54–1997
1998–2001
2002–2003
Dark (50)
Active boundary (4)
Active image (1944)
Active boundary (3)
Dark (2)
Pixel Type by Row
Pixel Array Description
(0,0)
50 black rows
4
(16,54)
Active Image
134 black columns
10
2592 x 1944
active pixels
6
10 black columns
4
2 black rows
(2751, 2003)
MT9P031_DS Rev. J 5/15 EN
9
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Pixel Data Format
Figure 5:
Pixel Color Pattern Detail (Top Right Corner)
column readout direction
..
.
black pixels
FIrst clear
pixel (10,50)
Gr
row
readout
direction
R
Gr
R
Gr
R
Gr
B Gb B Gb B Gb B
...
Gr
R
Gr
R
Gr
R
Gr
B Gb B Gb B Gb B
Gr
R
Gr
R
Gr
R
Gr
B Gb B Gb B Gb B
..
.
Default Readout Order
By convention, the sensor core pixel array is shown with pixel (0,0) in the top right
corner (see Figure 4). This reflects the actual layout of the array on the die. Also, the first
pixel data read out of the sensor in default condition is that of pixel (16, 54).
When the sensor is imaging, the active surface of the sensor faces the scene as shown in
Figure 5. When the image is read out of the sensor, it is read one row at a time, with the
rows and columns sequenced as shown in Figure 6 on page 10.
Figure 6:
Imaging a Scene
Lens
Scene
Sensor (rear view)
Row
Readout
Order
Column Readout Order
MT9P031_DS Rev. J 5/15 EN
Pixel (0,0)
10
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Pixel Data Format
Output Data Format (Default Mode)
The MT9P031 image data is read out in a progressive scan. Valid image data is
surrounded by horizontal blanking and vertical blanking, as shown in Figure 7. LV is
HIGH during the shaded region of the figure. FV timing is described in “Output Data
Timing” on page 13.
Figure 7:
Spatial Illustration of Image Readout
P0,0 P0,1 P0,2.....................................P0,n-1 P0,n
P1,0 P1,1 P1,2.....................................P1,n-1 P1,n
HORIZONTAL
BLANKING
VALID IMAGE
Pm-1,0 Pm-1,1.....................................Pm-1,n-1 Pm-1,n
Pm,0 Pm,1.....................................Pm,n-1 Pm,n
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
00 00 00 ..................................... 00 00 00
00 00 00 ..................................... 00 00 00
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
VERTICAL/HORIZONTAL
BLANKING
VERTICAL BLANKING
00 00 00 ..................................... 00 00 00
00 00 00 ..................................... 00 00 00
MT9P031_DS Rev. J 5/15 EN
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
11
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Pixel Data Format
Readout Sequence
Typically, the readout window is set to a region including only active pixels. The user has
the option of reading out dark regions of the array, but if this is done, consideration must
be given to how the sensor reads the dark regions for its own purposes.
Rows are read from the array in the following order:
1. Dark rows:
If Show_Dark_Rows is set, or if Manual_BLC is clear, dark rows on the top of the array
are read out. The set of rows sampled are adjusted based on the Row_Bin setting such
that there are 8 rows after binning, as shown in the Table 6.
The Row_Skip setting is ignored for the dark row region.
If Show_Dark_Rows is clear and Manual_BLC is set, no dark rows are read from the
array as part of this step, allowing all rows to be part of the active image. This does not
change the frame time, as HDR is included in the vertical blank period.
2. Active image:
The rows defined by the row start, row size, bin, skip, and row mirror settings are read
out. If this set of rows includes rows read out above, those rows are resampled, meaning that the data is invalid.
Table 6:
Dark Rows Sampled as a Function of Row_Bin
Row_Bin
HDR (Dark Rows After Binning)
0
1
3
8
8
8
Columns are read out in the following order:
1. Dark columns:
If either Show_Dark_Columns or Row_BLC is set, dark columns on the left side of the
image are read out followed by those on the right side. The set of columns read is
shown in Table 7.
The Column_Skip setting is ignored for the dark columns.
If neither Show_Dark_Columns nor Row_BLC is set, no dark columns are read, allowing all columns to be part of the active image. This does not change the row time, as
WDC is included in the vertical blank period.
2. Active image:
The columns defined by column start, column size, bin, skip, and column mirror settings are read out. If this set of columns includes the columns read out above, these
columns are resampled, meaning the data is invalid.
Table 7:
Dark Columns Sampled as a Function of Column_Bin
MT9P031_DS Rev. J 5/15 EN
Column_Bin
WDC (Dark Columns After Binning)
0
1
3
80
40
20
12
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Output Data Timing
Output Data Timing
The output images are divided into frames, which are further divided into lines. By
default, the sensor produces 1944 rows of 2592 columns each. The FV and LV signals
indicate the boundaries between frames and lines, respectively. PIXCLK can be used as a
clock to latch the data. For each PIXCLK cycle, one 12-bit pixel datum outputs on the
DOUT pins. When both FV and LV are asserted, the pixel is valid. PIXCLK cycles that
occur when FV is negated are called vertical blanking. PIXCLK cycles that occur when
only LV is negated are called horizontal blanking.
Figure 8:
Default Pixel Output Timing
PIXCLK
FV
LV
DOUT[11:0]
P0
Vertical Blanking
Horiz Blanking
P1
P2
Valid Image Data
P3
P4
Pn
Horiz Blanking
Vertical Blanking
LV and FV
The timing of the FV and LV outputs is closely related to the row time and the frame time.
FV will be asserted for an integral number of row times, which will normally be equal to
the height of the output image. If Show_Dark_Rows is set, the dark sample rows will be
output before the active image, and FV will be extended to include them. In this case,
FV’s leading edge happens at time 0.
LV will be asserted during the valid pixels of each row. The leading edge of LV will be
offset from the leading edge of FV by 609 PIXCLKs. If Show_Dark_Columns is set, the
dark columns will be output before the image pixels, and LV will be extended back to
include them; in this case, the first pixel of the active image still occurs at the same position relative to the leading edge of FV. Normally, LV will only be asserted if FV is asserted;
this is configurable as described below.
LV Format Options
The default situation is for LV to be negated when FV is negated. The other option available is shown in Figure 9 on page 14. If Continuous_LV is set, LV is asserted even when
FV is not, with the same period and duty cycle. If XOR_Line_Valid is set, but not Continuous_Line_Valid, the resulting LV will be the XOR of FV and the continuous LV.
MT9P031_DS Rev. J 5/15 EN
13
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Output Data Timing
Figure 9:
LV Format Options
FV
Default
LV
FV
Continuous LV
LV
FV
XOR LV
LV
The timing of an entire frame is shown in Figure 10.
Figure 10:
Frame Timing
t ROW
W
WDC
LV
Dark Columns
Dark Rows
FV
Row Readout
H
tFRAME
HDR
Column Readout
Active Image
Blanking Region
MT9P031_DS Rev. J 5/15 EN
14
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Output Data Timing
Frame Time
The pixel clock (PIXCLK) represents the time needed to sample 1 pixel from the array,
and is typically equal to 1 EXTCLK period. The sensor outputs data at the maximum rate
of 1 pixel per PIXCLK. One row time (tROW) is the period from the first pixel output in a
row to the first pixel output in the next row. The row time and frame time are defined by
equations in Table 8.
Table 8:
Frame Time
Parameter
Name
Equation
fps
Frame Rate
1/tFRAME
t
FRAME
Default Timing at
EXTCLK = 96 MHz
14
t
Frame Time
(H + max(VB, VBMIN)) × ROW
71.66ms
tROW
Row Time
W
Output Image Width
2 × tPIXCLK x max(((W/2) + max(HB, HBMIN)),
(41 + 346 x (Row_Bin+1) + 99))
2 × ceil((Column_Size + 1) / (2 × (Column_Skip + 1)))
H
Output Image Height
2 × ceil((Row_Size + 1) / (2 × (Row_Skip + 1)))
SW
Shutter Width
HB
Horizontal Blanking
VB
Vertical Blanking
HBMIN
Minimum Horizontal
Blanking
VBMIN
Minimum Vertical
Blanking
tPIXCLK
Pixclk Period
36.38s
2592 PIXCLK
1944 rows
max (1, (2 * 16 × Shutter_Width_Upper)
+ Shutter_Width_Lower)
Horizontal_Blank + 1
1 PIXCLK
Vertical_Blank + 1
26 rows
1943 rows
346 × (Row_Bin + 1) + 64 + (WDC / 2)
450 PIXCLK
max (8, SW - H) + 1
9 rows
1/fPIXCLK
10.42ns
The minimum horizontal blanking (HBMIN) values for various Row_Bin and
Column_Bin settings are shown in Table 9.
Table 9:
HBMIN Values for Row_bin vs. Column_bin Settings
Row_
bin
MT9P031_DS Rev. J 5/15 EN
0
1
3
Column_bin (WDC)
0
1
450
430
796
776
1488
1468
15
3
420
766
1458
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Output Data Timing
Frame Rates at Common Resolutions
Table 10 and Table 11 show examples of register settings to achieve common resolutions
and their frame rates. Frame rates are shown both with subsampling enabled and
disabled.
Table 10:
Standard Resolutions
Resolution
2592 x 1944
(Full Resolution)
2048 x 1536 QXGA
1600 x 1200 UXGA
1280 x 1024 SXGA
1024 x 768 XGA
800 x 600 SVGA
640 x 480 VGA
Table 11:
Frame
Rate
Subsampling
Mode
Column_S
ize
(R0x04)
Row_
Size
(R0x03)
Shutter_
Width_
Lower
(R0x09)
Row_
Bin
(R0x22
[5:4])
Row_
Skip
(R0x22
[2:0])
14
N/A
2591
1943
<1943
0
0
0
0
21
31
42
63
63
47
90
90
65
123
123
53
N/A
N/A
N/A
N/A
skipping
binning
N/A
skipping
binning
N/A
skipping
binning
2047
1599
1279
1023
2047
2047
799
1599
1599
639
2559
2559
1535
1199
1023
767
1535
1535
599
1199
1199
479
1919
1919
<1535
<1199
<1023
0
0
0
0
0
1
0
0
1
0
0
3
0
0
0
0
1
1
0
1
1
0
3
3
0
0
0
0
0
1
0
0
1
0
0
3
0
0
0
0
1
1
0
1
1
0
3
3
<767
<599
<479
Column_Bin Column_Skip
(R0x23
(R0x23
[5:4])
[2:0])
Wide Screen (16:9) Resolutions
Resolution
1920 x 1080
HDTV
1280 x 720 HDTV
MT9P031_DS Rev. J 5/15 EN
Row_
Bin
(R0x22
[5:4])
Row_
Skip
(R0x22
[2:0])
Column_Bi
n (R0x23
[5:4])
Column_Ski
p (R0x23
[2:0])
Frame
Rate
31
N/A
1919
1079
<1079
0
0
0
0
60
60
45
N/A
skipping
binning
1279
2559
2559
719
1439
1439
<719
<719
<719
0
0
1
0
1
1
0
0
1
0
1
1
Notes:
Row_
Column_Si
Size
ze (R0x04) (R0x03)
Shutter_
Width_
Lower
(R0x09)
Subsampling
Mode
1. It is assumed that the minimum horizontal blanking and the minimum vertical blanking conditions
are met, and that all other registers are set to default values.
16
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Serial Bus Description
Serial Bus Description
Registers are written to and read from the MT9P031 through the two-wire serial interface
bus. The MT9P031 is a serial interface slave and is controlled by the serial clock (SCLK),
which is driven by the serial interface master. Data is transferred into and out of the
MT9P031 through the serial data (SDATA) line. The SDATA line is pulled up to VDD_IO offchip by a 1.5k resistor. Either the slave or master device can pull the SDATA line LOW—
the serial interface protocol determines which device is allowed to pull the SDATA line
down at any given time.
Protocol
The two-wire serial defines several different transmission codes, as follows:
1. a start bit
2. the slave device 8-bit address
3. an (a no) acknowledge bit
4. an 8-bit message
5. a stop bit
Sequence
A typical READ or WRITE sequence begins by the master sending a start bit. After the
start bit, the master sends the slave device's 8-bit address. The last bit of the address
determines if the request is a READ or a WRITE, where a “0” indicates a WRITE and a “1”
indicates a READ. The slave device acknowledges its address by sending an acknowledge
bit back to the master.
If the request is a WRITE, the master then transfers the 8-bit register address to which a
WRITE should take place. The slave sends an acknowledge bit to indicate that the
register address has been received. The master then transfers the data 8 bits at a time,
with the slave sending an acknowledge bit after each 8 bits. The MT9P031 uses 16-bit
data for its internal registers, thus requiring two 8-bit transfers to write to one register.
After 16 bits are transferred, the register address is automatically incremented, so that
the next 16 bits are written to the next register address. The master stops writing by
sending a start or stop bit.
A typical READ sequence is executed as follows. First the master sends the write-mode
slave address and 8-bit register address, just as in the WRITE request. The master then
sends a start bit and the read-mode slave address. The master then clocks out the
register data 8 bits at a time. The master sends an acknowledge bit after each 8-bit
transfer. The register address is automatically-incremented after every 16 bits is transferred. The data transfer is stopped when the master sends a no-acknowledge bit.
Bus Idle State
The bus is idle when both the data and clock lines are HIGH. Control of the bus is initiated with a start bit, and the bus is released with a stop bit. Only the master can generate
the start and stop bits.
Start Bit
The start bit is defined as a HIGH-to-LOW transition of the data line while the clock line
is HIGH.
MT9P031_DS Rev. J 5/15 EN
17
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Serial Bus Description
Stop Bit
The stop bit is defined as a LOW-to-HIGH transition of the data line while the clock line
is HIGH.
Slave Address
The 8-bit address of a two-wire serial interface device consists of 7 bits of address and 1
bit of direction. A “0” in the LSB (least significant bit) of the address indicates write mode
(0xBA), and a “1” indicates read mode (0xBB).
Data Bit Transfer
One data bit is transferred during each clock pulse. The serial interface clock pulse is
provided by the master. The data must be stable during the HIGH period of the two-wire
serial interface clock—it can only change when the serial clock is LOW. Data is transferred 8 bits at a time, followed by an acknowledge bit.
Acknowledge Bit
The master generates the acknowledge clock pulse. The transmitter (which is the master
when writing, or the slave when reading) releases the data line, and the receiver indicates an acknowledge bit by pulling the data line LOW during the acknowledge clock
pulse.
No-Acknowledge Bit
The no-acknowledge bit is generated when the data line is not pulled down by the
receiver during the acknowledge clock pulse. A no-acknowledge bit is used to terminate
a read sequence.
MT9P031_DS Rev. J 5/15 EN
18
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Two-Wire Serial Interface Sample Write and Read Sequences
Two-Wire Serial Interface Sample Write and Read Sequences
16-Bit WRITE Sequence
A typical WRITE sequence for writing 16 bits to a register is shown in Figure 11. A start bit
given by the master, followed by the write address, starts the sequence. The image sensor
then gives an acknowledge bit and expects the register address to come first, followed by
the 16-bit data. After each 8-bit transfer, the image sensor gives an acknowledge bit. All
16 bits must be written before the register is updated. After 16 bits are transferred, the
register address is automatically incremented so that the next 16 bits are written to the
next register. The master stops writing by sending a start or stop bit.
Figure 11:
Timing Diagram Showing a WRITE to Reg0x09 with the Value 0x0284
SCLK
SDATA
Reg0x09
0xBA ADDR
START
ACK
0000 0010
ACK
1000 0100
ACK
STOP
ACK
16-Bit READ Sequence
A typical READ sequence is shown in Figure 12. First the master has to write the register
address, as in a WRITE sequence. Then a start bit and the read address specify that a
READ is about to happen from the register. The master then clocks out the register data 8
bits at a time. The master sends an acknowledge bit after each 8-bit transfer. The register
address should be incremented after every 16 bits is transferred. The data transfer is
stopped when the master sends a no-acknowledge bit.
Figure 12:
Timing Diagram Showing a READ from Reg0x09; Returned Value 0x0284
SCLK
SDATA
0xBA ADDR
START
MT9P031_DS Rev. J 5/15 EN
Reg0x09
ACK
0xBB ADDR
ACK
START
0000 0010
ACK
19
1000 0100
ACK
STOP
NACK
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
Features
Reset
The MT9P031 may be reset by using RESET_BAR (active LOW) or the reset register.
Hard Reset
Assert (LOW) RESET_BAR, it is not necessary to clock the device. All registers return to
the factory defaults. When the pin is negated (HIGH), the chip resumes normal operation.
Soft Reset
Set the Reset register field to “1” (R0x0D[0] = 1). All registers except the following will be
reset:
• Chip_Enable
• Synchronize_Changes
• Reset
• Use_PLL
• Power_PLL
• PLL_m_Factor
• PLL_n_Divider
• PLL_p1_Divider
When the field is returned to “0,” the chip resumes normal operation.
Power Up and Power Down
When first powering on the MT9P031, follow this sequence:
1. Ensure RESET_BAR is asserted (LOW).
2. Bring up the supplies. If both the analog and the digital supplies cannot be brought
up simultaneously, ensure the digital supply comes up first.
3. Negate RESET_BAR (HIGH) to bring up the sensor.
When powering down, be sure to follow this sequence to ensure that I/Os do not load
any buses that they are connected to.
1. Assert RESET_BAR.
2. Remove the supplies.
Clocks
The MT9P031 requires one clock (EXTCLK), which is nominally 96 MHz. By default, this
results in pixels being output on the DOUT pins at a maximum data rate of 96 Mp/s. With
VDD_IO = 1.8V, maximum master clock and maximum data rate become 48 MHz and
48 Mp/s, respectively. The EXTCLK clock can be divided down internally by setting
Divide_Pixel_Clock to a non-zero value. This slows down the operation of the chip as
though EXTCLK had been divided externally.
fEXTCLK
if Divide_Pixel_Clock = 0
fEXTCLK / (2 × Divide_Pixel_Clock)
otherwise
fPIXCLK= {
MT9P031_DS Rev. J 5/15 EN
20
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
The DOUT, LV, FV, and STROBE outputs are launched on the rising edge of PIXCLK, and
should be captured on the falling edge of PIXCLK. The specific relationship of PIXCLK to
these other outputs can be adjusted in two ways. If Invert_Pixel_Clock is set, the sense of
PIXCLK is inverted from that shown in Figure 8 on page 13. In addition, if the pixel clock
has been divided by Divide_Pixel_Clock, it can be shifted relative to the other outputs by
setting Shift_Pixel_Clock.
PLL-Generated Master Clock
The PLL contains a prescaler to divide the input clock applied on EXTCLK, a VCO to
multiply the prescaler output, and another divider stage to generate the output clock.
The clocking structure is shown in Figure 13. PLL control registers can be programmed
to generate desired master clock frequency.
Note:
Figure 13:
The PLL control registers must be programmed while the sensor is in the software
Standby state. The effect of programming the PLL divisors while the sensor is in the
streaming state is undefined.
PLL-Generated Master Clock
PLL Input Clock
EXTCLK
Pre PLL
Div
(PFD)
PLL
Multiplier
(VCO)
N
PLL_n_divider +1
PLL Output Clock
M
PLL_m_factor
PLL
Output
Div 1
SYSCLK (PIXCLK)
P1
PLL_p1_divider +1
PLL Setup
The MT9P031 has a PLL which can be used to generate the pixel clock internally.
To use the PLL:
1. Bring the MT9P031 up as normal, make sure that fEXTCLK is between 6 and 27 MHz
and then power on the PLL by setting Power_PLL (R0x10[0] = 1).
2. Set PLL_m_Factor, PLL_n_Divider, and PLL_p1_Divider based on the desired input
(fEXTCLK) and output (fPIXCLK) frequencies. Determine the M, N, and P1 values to
achieve the desired fPIXCLK using this formula:
f
PIXCLK = (fEXTCLK × M) / (N × P1)
where
M = PLL_m_Factor
N = PLL_n_Divider + 1
P1 = PLL_p1_Divider + 1
Note:
MT9P031_DS Rev. J 5/15 EN
If P1 is odd (that is, PLL_p1_Divider is even), the duty cycle of the internal system
clock will not be 50:50. In this case, it is important that either a slower clock is used or
all clock enable bits are set in R101.
21
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
2 MHz < fEXTCLK / N < 13.5 MHz
180 MHz < (fEXTCLK × M) / N < 360 MHz
It is desirable to keep (fEXTCLK / n) as large as possible within the limits. Also, "m"
must be between 16 and 255, inclusive.
3. Wait 1ms to ensure that the VCO has locked.
4. Set Use_PLL (R0x10[1] = 1) to switch from EXTCLK to the PLL-generated clock.
Standby and Chip Enable
The can be put in a low-power Standby state by either method below:
1. Hard Standby: By pulling STANDBY_BAR LOW,
or
2. Soft Standby: By clearing the Chip_Enable register field (R0x07[1] = 0).
When the sensor is put in standby, all internal clocks are gated, and analog circuitry is
put in a state that it draws minimal power. The two wire serial interface is still active.
If the sensor was in continuous mode when put in standby, it resumes from where it was
when standby was deactivated. Naturally, this frame and the next frame are corrupted,
though the sensor itself does not realize this. As this could affect automatic black level
calibration, it is recommended that either the chip be paused (by setting Restart_Pause)
before being put in standby mode, or it be restarted (setting Restart) upon resumption of
operation.
Entering Soft Standby
REG= 0x0B, 0x0002
REG= 0x0B, 0x0003
REG= 0x07, 0x1F82
REG= 0x07, 0x1F80
REG= 0x0B, 0x0001
Leaving Soft Standby
REG= 0x0B, 0x0002
REG= 0x0B, 0x0003
REG= 0x07, 0x1F80
REG= 0x07, 0x1F82
REG= 0x0B, 0x0001
For maximum power savings in standby mode, EXTCLK should not be toggling.
When standby mode is entered, either by clearing Chip_Enable or by asserting STANDBY_BAR, the PLL is disabled automatically or powered down. It must be manually reenabled when leaving standby as needed.
MT9P031_DS Rev. J 5/15 EN
22
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
Full-Array Readout
The entire array, including dark pixels, can be read out without digital processing or
automatic black level adjustments. This can be accomplished as follows:
1. Set Row_Start and Column_Start to 0.
2. Set Row_Size to 2003.
3. Set Column_Size to 2751.
4. Set Manual_BLC to 1.
5. Set Row_BLC to 0.
6. Set Row_Black_Default_Offset to 0.
7. Set Show_Dark_Rows and Show_Dark_Columns to 0.
If automatic analog (coarse) BLC is desired, but no digital processing, modify the above
settings as follows:
1. Set Row_Start to 12.
2. Set Row_Size to 1993.
3. Set Manual_BLC to 0.
These settings result in the same array layout as above, but only 22 dark rows are available at the top of the array; the first eight are used in the black level algorithm, and there
should be a two-row buffer between the black region and the active region.
Window Control
The output image window of the pixel (the FOV) is defined by four register fields.
Column_Start and Row_Start define the X and Y coordinates of the upper-left corner of
the FOV. Column_Size defines the width of the FOV, and Row_Size defines the height of
the FOV in array pixels.
The Column_Start and Row_Start fields must be set to an even number. The Column_Size and Row_Size fields must be set to odd numbers (resulting in an even size for the
FOV). The Row_Start register should be set no lower than 12 if either Manual_BLC is
clear or Show_Dark_Rows is set.
If no special resolution modes are set (see below), the width of the output image, W, is
(Column_Size + 1) and the height, H, is (Row_Size + 1).
Readout Modes
Subsampling
By default, the resolution of the output image is the full width and height of the FOV as
defined in “Window Control”. The output resolution can be reduced by two methods:
Skipping and Binning.
Row and column skip modes use subsampling to reduce the output resolution without
reducing FOV. The also has row and column binning modes, which can reduce the
impact of aliasing introduced by the use of skip modes. This is achieved by the averaging
of 2 or 3 adjacent rows and columns (adjacent same-color pixels). Both 2X and 4X
binning modes are supported. Rows and columns can be binned independently.
MT9P031_DS Rev. J 5/15 EN
23
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
Skipping
Skipping reduces resolution by using only selected pixels from the FOV in the output
image. In skip mode, entire rows and columns of pixels are not sampled, resulting in a
lower resolution output image. A skip 2X mode skips one Bayer pair of pixels for every
pair output. Skip 3X skips two pairs for each one pair output. Rows and columns are
always read out in pairs. If skip 2X mode is enabled with otherwise default sensor
settings, the columns in the output image correspond to the pixel array columns 16, 17,
20, 21, 24, 25... .
Figure 14:
Eight Pixels in Normal and Column Skip 2X Readout Modes
LV
Normal readout
DOUT[11:0]
G0
[11:0]
R0
[11:0]
G1
[11:0]
R1
[11:0]
G0
[11:0]
R0
[11:0]
G2
[11:0]
R2
[11:0]
G2
[11:0]
R2
[11:0]
G3
[11:0]
R3
[11:0]
LV
Column skip 2X readout
DOUT[11:0]
Skipping can be enabled separately for rows and columns. To enable skip mode, set
either or both of Row_Skip and Column_Skip to the number of pixel pairs that should be
skipped for each pair used in the output image. For example, to set column skip 2X
mode, set Column_Skip to “1.”
The size of the output image is reduced by the skip mode as shown in the following two
equations:
W = 2 x ceil((Column_Size + 1) / (2 x (Column_Skip + 1)))
H = 2 x ceil((Row_Size + 1) / (2 x (Row_Skip + 1)))
Figure 15:
Pixel Readout (no skipping)
Y incrementing
X incrementing
MT9P031_DS Rev. J 5/15 EN
24
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
Figure 16:
Pixel Readout (Column Skip 2X)
Y incrementing
X incrementing
Figure 17:
Pixel Readout (Row Skip 2X)
Y incrementing
X incrementing
Figure 18:
Pixel Readout (Column Skip 2X, Row Skip 2X)
MT9P031_DS Rev. J 5/15 EN
25
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
Y incrementing
X incrementing
Binning
Binning reduces resolution by combining adjacent same-color imager pixels to produce
one output pixel. All of the pixels in the FOV contribute to the output image in bin mode.
This can result in a more pleasing output image with reduced subsampling artifacts. It
also improves low-light performance. For columns, the combination step can be either
an averaging or summing operation. Depending on lighting conditions, one or the other
may be desirable. In low-light conditions, summing produces a gain roughly equivalent
to the column bin factor. Column summing may be enabled by setting Column_Sum.
Binning works in conjunction with skipping. Pixels that would be skipped because of the
Column_Skip and Row_Skip settings can be averaged instead by setting Column_Bin
and Row_Bin to the number of neighbor pixels to be averaged with each output pixel.
For example, to set bin 2x mode, set Column_Skip and Column_Bin to 1. Additionally,
Column_Start must be a multiple of (2 * (Column_Bin + 1)) and Row_Start must be a
multiple of (2 * (Row_Bin + 1)).
Only certain combinations of binning and skipping are allowed.
These are shown in Table 12. If an illegal skip value is selected for a bin mode, a legal
value is selected instead.
Table 12:
Legal Values for Column_Skip Based on Column_Bin
Note:
Column_Bin
Legal Values for Column_Skip
0 (no binning)
1 (Bin 2x)
3 (Bin 4x)
0, 1, 2, 3, 4, 5, 6
1, 3, 5
3
Ensure that Column_Start (R0x02) is set in the form shown below, where n is an integer:
no bin
Bin 2x
Bin 4x
Mirror Column = 0
4n
8n
16n
Mirror Column = 1
4n + 2
8n + 4
16n + 8
Bin mode is illustrated in Figure 19 and Figure 20.
MT9P031_DS Rev. J 5/15 EN
26
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
Figure 19:
Pixel Readout (Column Bin 2X)
Y incrementing
X incrementing
Figure 20:
Pixel Readout (Column Bin 2X, Row Bin 2X)
Y incrementing
X incrementing
Mirror
Column Mirror Image
By setting R0x20[14] = 1, the readout order of the columns is reversed, as shown in
Figure 21. The starting color, thus Bayer pattern, is preserved when mirroring the
columns.
Figure 21:
Six Pixels in Normal and Column Mirror Readout Modes
LV
Normal readout
DOUT[11:0]
G0[11:0] R0[11:0] G1[11:0] R1[11:0] G2[11:0] R2[11:0]
Reverse readout
DOUT[11:0]
MT9P031_DS Rev. J 5/15 EN
R2[11:0] G2[11:0] R1[11:0] G1[11:0] R0[11:0] G0[11:0]
27
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
Row Mirror Image
By setting R0x20[15] = 1, the readout order of the rows is reversed as shown in Figure 22.
The starting color, thus Bayer pattern, is preserved when mirroring the rows.
Figure 22:
Six Rows in Normal and Row Mirror Readout Modes
FV
Normal readout
Row0 [11:0] Row1 [11:0] Row2 [11:0] Row3 [11:0] Row4 [11:0] Row5 [11:0]
DOUT[11:0]
Reverse readout
DOUT[11:0]
Row5 [11:0] Row4 [11:0] Row3 [11:0] Row2 [11:0] Row1 [11:0] Row0 [11:0]
By default, active pixels in the resulting image are output in row-major order (an entire
row is output before the next row is begun), from lowest row/column number to highest.
If desired, the output (and sampling) order of the rows and columns can be reversed.
This affects only pixels in the active region defined above, not any pixels read out as dark
rows or dark columns. When the readout direction is reversed, the color order is reversed
as well (red, green, red, and so on, instead of green, red, green, and so on, for example).
If row binning is combined with row mirroring, the binning is still done in the positive
direction. Therefore, if the first output row in bin 2x + row mirror was 1997, pixels on
rows 1997 and 1999 would be averaged together. The next pixel output would be from
rows 1996 and 1998, followed by the average of 1993 and 1995.
For column mirroring plus binning, the span of pixels used should be the same as with
non-mirror mode.
Maintaining a Constant Frame Rate
Maintaining a constant frame rate while continuing to have the ability to adjust certain
parameters is the desired scenario. This is not always possible, however, because register
updates are synchronized to the read pointer, and the shutter pointer for a frame is
usually active during the readout of the previous frame. Therefore, any register changes
that could affect the row time or the set of rows sampled causes the shutter pointer to
start over at the beginning of the next frame.
By default, the following register fields cause a "bubble" in the output rate (that is, the
vertical blank increases for one frame) if they are written in continuous mode, even if the
new value would not change the resulting frame rate:
• Row_Start
• Row_Size
• Column_Size
• Horizontal_Blank
• Vertical_Blank
• Shutter_Delay
• Mirror_Row
• Row_Bin
• Row_Skip
• Column_Skip
MT9P031_DS Rev. J 5/15 EN
28
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
The size of this bubble is (SW × tROW), calculating the row time according to the new
settings.
The Shutter_Width_Lower and Shutter_Width_Upper fields may be written without
causing a bubble in the output rate under certain circumstances. Because the shutter
sequence for the next frame often is active during the output of the current frame, this
would not be possible without special provisions in the hardware. Writes to these registers take effect two frames after the frame they are written, which allows the shutter
width to increase without interrupting the output or producing a corrupt frame (as long
as the change in shutter width does not affect the frame time).
Synchronizing Register Writes to Frame Boundaries
Changes to most register fields that affect the size or brightness of an image take effect
on the frame after the one during which they are written. These fields are noted as
“synchronized to frame boundaries” in Table 12 of the register reference. To ensure that
a register update takes effect on the next frame, the write operation must be completed
after the leading edge of FV and before the trailing edge of FV.
As a special case, in Snapshot modes (see “Operating Modes” on page 31), register writes
that occur after FV but before the next trigger will take effect immediately on the next
frame, as if there had been a Restart. However, if the trigger for the next frame in ERS
Snapshot mode occurs during FV, register writes take effect as with continuous mode.
Additional control over the timing of register updates can be achieved by using synchronize_changes. If this bit is set, writes to certain register fields that affect the brightness of
the output image do not take effect immediately. Instead, the new value is remembered
internally. When synchronize_changes is cleared, all the updates simultaneously take
effect on the next frame (as if they had all been written the instant synchronize_changes
was cleared). Register fields affected by this bit are identified in Table 13 of the register
reference.
Fields not identified as being frame-synchronized or affected by synchronize_changes
are updated immediately after the register write is completed. The effect of these registers on the next frame can be difficult to predict if they affect the shutter pointer.
Restart
To restart the MT9P031 at any time during the operation of the sensor, write a “1” to the
restart register (R0x0B[0] = 1). This has two effects: first, the current frame is interrupted
immediately. Second, any writes to frame-synchronized registers and the shutter width
registers take effect immediately, and a new frame starts (in continuous mode). Register
updates being held by synchronize_changes do not take effect until that bit is cleared.
The current row and one following row complete before the new frame is started, so the
time between issuing the Restart and the beginning of the next frame can vary by about
t
ROW.
If Pause_Restart is set, rather than immediately beginning the next frame after a restart
in continuous mode, the sensor pauses at the beginning of the next frame until
Pause_Restart is cleared. This can be used to achieve a deterministic time period from
clearing the Pause_Restart bit to the beginning of the first frame, meaning that the
controller does not need to be tightly synchronized to LV or FV.
Note:
MT9P031_DS Rev. J 5/15 EN
When Pause_Restart is cleared, be sure to leave Restart set to “1” for proper operation.
The Restart bit will be cleared automatically by the device.
29
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
Image Acquisition Modes
The supports two image acquisition modes (Shutter Types) (see “Operating Modes” on
page 31), electronic rolling shutter and global reset release.
Electronic Rolling Shutter
The ERS modes take pictures by scanning the rows of the sensor twice in the order
described in “Full-Array Readout” on page 23. On the first scan, each row is released
from reset, starting the exposure. On the second scan, the row is sampled, processed,
and returned to the reset state. The exposure for any row is therefore the time between
the first and second scans. Each row is exposed for the same duration, but at slightly
different point in time, which can cause a shear in moving subjects.
Whenever the mode is changed to an ERS mode (even from another ERS mode), and
before the first frame following reset, there is an anti-blooming sequence where all rows
are placed in reset. This sequence must complete before continuous readout begins.
This delay is:
t
ALLRESET = 16 × 2004 × tACLK
Global Reset Release
The GRR modes attempt to address the shearing effect by starting all rows' exposures at
the same time. Instead of the first scan used in ERS mode, the reset to each row is
released simultaneously. The second scan occurs as normal, so the exposure time for
each row would different. Typically, an external mechanical shutter would be used to
stop the exposure of all rows simultaneously.
In GRR modes, there is a startup overhead before each frame as all rows are initially
placed in the reset state (tALLRESET). Unlike ERS mode, this delay always occurs before
each frame. However, it occurs as soon as possible after the preceding frame, so typically
the time from trigger to the start of exposure does not include this delay. To ensure that
this is the case, the first trigger must occur no sooner than tALLRESET after the previous
frame is read out.
Exposure
The nominal exposure time, tEXP, is the effective shutter time in ERS modes, and is
defined by the shutter width, SW, and the shutter overhead, SO, which includes the effect
of Shutter_Delay. Exposure time for other modes is defined relative to this time.
Increasing Shutter_Delay (SD) decreases the exposure time. Exposure times are typically
specified in units of row time, although it is possible to fine-tune exposures in units of
tACLKs (where tACLK is 2 * tPIXCLK).
tEXP = SW × tROW – SO × 2 × tPIXCLK
where:
SW = max(1, (2 * 16 × Shutter_Width_Upper) + Shutter_Width_Lower)
SO = 208 × (Row_Bin + 1) + 98 + min(SD, SDmax) – 94
SD = Shutter_Delay + 1
SDmax = 1232; if SW < 3
1504, otherwise
MT9P031_DS Rev. J 5/15 EN
30
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
The exposure time is calculated by determining the reset time of each pixel row (with
time 0 being the start of the first row time), and subtracting it from the sample time.
Under normal conditions in ERS modes, every pixel should end up with the same exposure time. In global shutter release modes, or in row binning modes, the exposure times
of individual pixels can vary.
In global shutter release modes (described later), exposure time starts simultaneously
for all rows, but still ends as defined above. In a real system, the exposure would be
stopped by a mechanical shutter, which would effectively stop the exposure to all rows
simultaneously. Each output row's exposure time will differ by tROW from the previous
row because this specification does not consider the effect of an external shutter.
Global shutter modes also introduce a constant added to the shutter time for each row,
because the exposure starts during the global shutter sequence, and not during any
row's shutter sequence. For each additional row in a row bin, this offset will increase by
the length of the shutter sequence.
In Bulb_Exposure modes (see details in Table 13), the exposure time is determined by
the width of the TRIGGER pulse rather than the shutter width registers. In ERS bulb
mode, it is still a multiple of row times, and the shutter overhead equation still applies. In
GRR bulb mode, the exposure time is granular to ACLKs, and shutter overhead (and thus
Shutter_Delay) has no effect.
Operating Modes
In default operating mode, the MT9P031 continuously samples and outputs frames. It
can be put in “snapshot” or triggered mode by setting snapshot, which means that it
samples and outputs a frame only when triggered. To leave snapshot mode, it is necessary to first clear Snapshot then issue a restart.
When in snapshot mode, the sensor can use the ERS or the GRR. The exposure can be
controlled as normal, with the Shutter_Width_Lower and Shutter_Width_Upper registers, or it can be controlled using the external TRIGGER signal. The various operating
modes are summarized in Table 13.
Table 13:
Operating Modes
Mode
Settings
Description
ERS Continuous
Default
Frames are output continuously at the frame rate defined by tFRAME. ERS is used, and the
exposure time is electronically controlled to be tEXP.
ERS Snapshot
Snapshot = 1
Frames are output one at a time, with each frame initiated by a trigger. ERS is used, and
the exposure time is electronically controlled to be tEXP.
ERS Bulb
Snapshot = 1;
Bulb_Exposure = 1
Frames are output one at a time, with each frame's exposure initiated by a trigger. ERS is
used. End of exposure and readout are initiated by a second trigger.
GRR Snapshot
Snapshot = 1;
Global_Reset = 1
Frames are output one at a time, with each frame initiated by a trigger. GRR is used.
Readout is electronically triggered based on SW.
GRR Bulb
Snapshot = 1;
Bulb_Exposure = 1;
Global_Reset = 1
Frames are output one at a time, with each frame initiated by a trigger. GRR is used.
Readout is initiated by a second trigger.
Note:
In ERS bulb mode, SW must be greater than 4 (use trigger wider than tROW * 4).
All operating modes share a common set of operations:
1. Wait for the first trigger, then start the exposure.
2. Wait for the second trigger, then start the readout.
MT9P031_DS Rev. J 5/15 EN
31
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
The first trigger is by default automatic, producing continuous images. If snapshot is set,
the first trigger can either be a low level on the TRIGGER pin or writing a “1” to the
trigger register field. If Invert_Trigger is set, the first trigger is a high level on TRIGGER
pin or a “1” written to trigger register field. Because TRIGGER is level-sensitive, multiple
frames can be output (with a frame rate of tFRAME) by holding TRIGGER pin at the triggering level.
The second trigger is also normally automatic, and generally occurs SW row times after
the exposure is started. If Bulb_Exposure is set, the second trigger can either be a high
level on TRIGGER or a write to Restart. If Invert_Trigger is set, the second trigger is a low
level on TRIGGER (or a Restart). In bulb modes, the minimum possible exposure time
depends on the mechanical shutter used.
After one frame has been output, the chip will reset step 1, above, eventually waiting for
the first trigger again. The next trigger may be issued after ((VB - 8) x tROW) in ERS
modes or tALLREST in GRR modes.
The choice of shutter type is made by Global_Reset. If it is set, the GRR shutter is used;
otherwise, ERS is used. The two shutters are described in “Electronic Rolling Shutter” on
page 30 and “Global Reset Release” on page 30.
The default ERS continuous mode is shown in Figure 8 on page 13. Figure 23 shows
default signal timing for ERS snapshot modes, while Figure 24 on page 33 shows default
signal timing for GRR snapshot modes.
Figure 23:
ERS Snapshot Timing
TT1
TSE
TSW
TT2
SW x tROW
TRIGGER
8 x tROW
(H + VB) x tROW
STROBE
FV
LV
DOUT
8 x tROW
tROW
(a) ERS Snapshot
tROW
First Row Exposure
TT1
Second Row Exposure
TSE TSW TT2
SW x tROW
TRIGGER
8 x tROW
(H + VB) x tROW
STROBE
FV
LV
DOUT
8 x tROW
tROW
(b) ERS Bulb
MT9P031_DS Rev. J 5/15 EN
32
tROW
First Row Exposure
Second Row Exposure
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
Figure 24:
GRR Snapshot Timing
TSE
TT1
SW x tROW + 2000 x tACLK
TRIGGER
VB x tROW + 2000 x tACLK
STROBE
TSW
TT2
8 x tROW
FV
LV
DOUT
tROW
First Row Exposure
(a) GRR Snapshot
Second Row Exposure
TT1
TSE
TSW TT2
SW x tROW + 2000 x tACLK
TRIGGER
VB x tROW + 2000 x tACLK
STROBE
8 x tROW
FV
LV
DOUT
tROW
First Row Exposure
(b) GRR Bulb
Second Row Exposure
Strobe Control
To support synchronization of the exposure with external events such as a flash or
mechanical shutter, the MT9P031 produces a STROBE output. By default, this signal is
asserted for approximately the time that all rows are simultaneously exposing, minus the
vertical blanking time, as shown in Figure 23 on page 32 and Figure 24. Also indicated in
these figures are the leading and trailing edges of STROBE, which an be configured to
occur at one of several timepoints. The leading edge of STROBE occurs at STROBE_Start,
and the trailing edge at STROBE_End, which are set to codes described in Table 14.
Table 14:
STROBE Timepoints
Symbol
Timepoint
Code
TT1
Trigger 1 (start of shutter scan)
–
TSE
Start of exposure (all rows simultaneously exposing) offset by VB
1
TSW
End of shutter width (expiration of the internal shutter width counter)
2
TT2
Trigger 2 (start of readout scan)
3
If STROBE_Start and STROBE_End are set to the same timepoint, the strobe is a tROW
wide pulse starting at the STROBE_Start timepoint. If the settings are such that the
strobe would occur after the trailing edge of FV, the strobe may be only tACKL wide;
however, because there is no concept of a row at that time. The sense of the STROBE
MT9P031_DS Rev. J 5/15 EN
33
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
signal can be inverted by setting Invert_Strobe (R0x1E[5] = 1. To use strobe as a flash in
snapshot modes or with mechanical shutter, set the Strobe_Enable register bit field
R0x1E[4] = 1.
Signal Chain and Datapath
The signal chain and datapath are shown in Figure 25. Each color is processed independently, including separate gain and offset settings. Voltages sampled from the pixel
array are first passed through an analog gain stage, which can produce gain factors
between 1 and 8. An analog offset is then applied, and the signal is sent through a 12-bit
analog-to-digital converter. In the digital space, a digital gain factor of between 1 and 16
is applied, and then a digital offset of between –2048 and 2047 is added. The resulting 12bit pixel value is then output on the DOUT[11:0] ports.
The analog offset applied is determined automatically by the black level calibration
algorithm, which attempts to shift the output of the analog signal chain so that black is
at a particular level. The digital offset is a fine-tuning of the analog offset.
Figure 25:
Signal Path
Analog Signal Chain
Analog
Gain
Analog
Offset
X
+
Pixel
Voltage
Digital Datapath
Digital
Offset
Correction
Black
Level
Calibration
+
X
ADC
DOUT[11:0]
Digital
Gain
Gain
There are two types of gain supported: analog gain and digital gain. Combined, gains of
between 1 and 128 are possible. The recommended gain settings are shown in Table 15.
Table 15:
Gain Increment Settings
Gain Range
Increments
Digital Gain
Analog Multipier
Analog Gain
1– 4
4.25–8
9–128
0.125
0.25
1
0
0
1–120
0
1
1
8–32
17–32
32
Note:
Analog gain should be maximized before applying digital gain.
The combined gain for a color C is given by:
GC = AGC x DGC.
MT9P031_DS Rev. J 5/15 EN
34
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
Analog Gain
The analog gain is specified independently for each color channel. There are two
components, the gain and the multiplier. The gain is specified by Green1_Analog_Gain,
Red_Analog_Gain, Blue_Analog_Gain, and Green2_Analog_Gain in steps of 0.125. The
analog multiplier is specified by Green1_Analog_Multiplier, Red_Analog_Multiplier,
Blue_Analog_Multiplier, and Green2_Analog_Multiplier. These combine to form the
analog gain for a given color C as shown in this equation:
AGC = (1 + C_Analog_Multiplier) × (C_Analog_Gain / 8)
The gain component can range from 0 to 7.875 in steps of 0.125, and the multiplier
component can be either 0 or 1 (resulting in a multiplier of 1 or 2). However, it is best to
keep the "gain" component between 1 and 4 for the best noise performance, and use the
multiplier for gains between 4 and 8.
Digital Gain
The digital gain is specified independently for each color channel in steps of 0.125. It is
controlled by the register fields Green1_Digital_Gain, Red_Digital_Gain, Blue_Digital_Gain, and Green2_Digital_Gain. The digital gain for a color C is given by:
DGC = 1 + (C_Digital_Gain / 8)
Offset
The MT9P031sensor can apply an offset or shift to the image data in a number of ways.
An analog offset can be applied on a color-wise basis to the pixel voltage as it enters the
ADC. This makes it possible to adjust for the offset introduced in the pixel sampling and
gain stages to be removed, centering the resulting voltage swing in the ADC's range. This
offset can be automatically determined by the sensor using the automatic black level
calibration (BLC) circuit, or it can be set manually by the user. It is a fairly coarse adjustment, with adjustment step sizes of 4 to 8 LSBs.
Digital offset is also added on a color-wise and line-wise basis to fine tune the black level
of the output image. This offset is based on an average black level taken from each row's
dark columns, and is automatically determined by the digital row-wise black level calibration (RBLC) circuit. If the RBLC circuit is not used, a user defined offset can be
applied instead. This offset has a resolution of 1 LSBs.
A digital offset is added on a color-wise basis to account for channel offsets that can be
introduced due to "even" and "odd" pixels of the same color going through a slightly
different ADC chain. This offset is automatically determined based on dark row data, but
it can also be manually set.
Analog Black Level Calibration
The MT9P031 black level calibration circuitry provides a feedback control system since
adjustments to the analog offset are imprecise by nature. The goal is that within the dark
row region of any supported output image size, the offset should have been adjusted
such that the average black level falls within the specified target thresholds.
The analog offsets normally need a major adjustment only when leaving the Reset state
or when there has been a change to a color's analog gain. Factors like shutter width and
temperature have lower-order impact, and generally only require a minor adjustment to
the analog offsets. The MT9P031 has various calibration modes to keep the system stable
while still supporting the need for rapid offset adjustments when necessary.
The two basic steps of black level calibration are:
MT9P031_DS Rev. J 5/15 EN
35
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
1. Take a sample.
2. If necessary, adjust the analog offset.
Black level calibration is normally done separately for each color channel, and different
channels can use different sample or adjustment methods at the same time. However,
because both Green1 and Green2 pixels go through the same signal chain, and Red and
Blue pixels likewise go through the same signal chain, it is expected that the chosen
offset for these pairs should be the same as long as the gains are the same. If
Lock_Green_Calibration is set, and (Green1_Analog_Gain = Green2_Analog_Gain) and
(Green1_Analog_Multiplier = Green2_Analog_Multiplier), the calculated or user-specified Green1_Offset is used for both green channels. Similarly, if Lock_Red/Blue_Calibration is set, and (Red_Analog_Gain = Blue_Analog_Gain) and (Red_Analog_Multiplier =
Blue_Analog_Multiplier), the calculated or user-specified Red_Offset is used for both the
red and blue channels.
The current values of the offsets can be read from the Green1_Offset, Red_Offset,
Blue_Offset, and Green2_Offset registers. Writes to these registers when Manual_BLC is
set change the offsets being used. In automatic BLC mode, writes to these registers are
effective when manual mode is re-entered. In Manual_BLC mode, no sampling or
adjusting takes place for any color.
Digital Black Level Calibration
Digital black level calibration is the final calculation applied to pixel data before it is
output. It provides a precise black level to complement the coarser-grained analog black
level calibration, and also corrects for black level shift introduced by digital gain. This
correction applies to the active columns for all rows, including dark rows.
Test Patterns
The MT9P031 has the capability of injecting a number of test patterns into the top of the
datapath to debug the digital logic. With one of the test patterns activated, any of the
datapath functions can be enabled to exercise it in a deterministic fashion. Test patterns
are enabled when Enable_Test_Pattern is set. Only one of the test patterns can be
enabled at a given point in time by setting the Test_Pattern_Mode register according to
Table 16. When test patterns are enabled the active area will receive the value specified
by the selected test pattern and the dark pixels will receive the value in Test_Pattern_Green for green pixels, Test_Pattern_Blue for blue pixels, and Test_Pattern_Red for
red pixels‘+.
Note:
Table 16:
ON Semiconductor recommends turning off black level calibration (BLC) when Test
Pattern is enabled, otherwise some of the test patterns will not be properly output.
Test Pattern Modes
MT9P031_DS Rev. J 5/15 EN
Test_Pattern_Mode
Test Pattern Output
0
1
2
3
4
5
6
7
Color field (normal operation)
Horizontal gradient
Vertical gradient
Diagonal gradient
Classic test pattern
Walking 1s
Monochrome horizontal bars
Monochrome vertical bars
36
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Features
Table 16:
Test Pattern Modes (continued)
Test_Pattern_Mode
Test Pattern Output
8
Vertical color bars
Classic Test Pattern
When selected, a value from Test_Data will be sent through the digital pipeline instead
of sampled data from the sensor. The value will alternate between Test_Data for even
and odd columns.
Color Field
When selected, the value for each pixel is determined by its color. Green pixels will
receive the value in Test_Pattern_Green, red pixels will receive the value in Test_Pattern_Red, and blue pixels will receive the value in Test_Pattern_Blue.
Vertical Color Bars
When selected, a typical color bar pattern will be sent through the digital pipeline.
Horizontal Gradient
When selected, a horizontal gradient will be produced based on a counter which increments on every active pixel.
Vertical Gradient
When selected, a vertical gradient will be produced based on a counter which increments on every active row.
Diagonal Gradient
When selected, a diagonal gradient will be produced based on the counter used by the
horizontal and vertical gradients.
Walking 1s
When selected, a walking 1s pattern will be sent through the digital pipeline. The first
value in each row is 1.
Monochrome Vertical Bars
When selected, vertical monochrome bars will be sent through the digital pipeline. The
width of each bar can be set in Test_Pattern_Bar_Width and the intensity of each bar is
set by Test_Pattern_Green for even bars and Test_Pattern_Blue for odd bars.
Monochrome Horizontal Bars
When selected, horizontal monochrome bars will be sent through the digital pipeline.
The width of each bar can be set in Test_Pattern_Bar_Width and the intensity of each bar
is set by Test_Pattern_Green for even bars and Test_Pattern_Blue for odd bars.
MT9P031_DS Rev. J 5/15 EN
37
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Spectral Characteristics
Spectral Characteristics
Figure 26:
Typical Spectral Characteristics
Figure 27:
CRA vs. Image Height (7 deg)
Image Height
CRA vs. Image Height Plot
CRA Design
14
12
CRA (deg)
10
8
6
4
2
0
0
10
20
30
40
50
60
70
80
Image Height (%)
MT9P031_DS Rev. J 5/15 EN
38
90
100
110
(%)
(mm)
CRA
(Deg)
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
0
0.178
0.356
0.535
0.713
0.891
1.069
1.247
1.426
1.604
1.782
1.960
2.138
2.317
2.495
2.673
2.851
3.029
3.208
3.386
3.564
0
0.35
0.70
1.05
1.40
1.75
2.10
2.45
2.80
3.15
3.50
3.85
4.20
4.55
4.90
5.25
5.60
5.95
6.30
6.65
7.00
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Electrical Specifications
Electrical Specifications
Two-Wire Serial Register Interface
The electrical characteristics of the two-wire serial register interface (SCLK, SDATA) are
shown in Figure 28 and Table 17 on page 39.
Figure 28:
Two-Wire Serial Bus Timing Parameters
tr_clk
t SRTH
SCLK
t SDH
t SCLK
t SDS
t SHAW
tf_clk
tr_sdat
tf_sdat
90%
90%
10%
10%
t AHSW
t STPS
t STPH
S DATA
Write Address
Bit 7
Write Address
Bit 0
Register Address
Bit 7
Write Start
Register Value
Bit 0
ACK
SCLK
Stop
t AHSR
t SHAR
t SDHR t SDSR
S DATA
Read Address
Bit 7
Read Address
Bit 0
Read Start
Read sequence: For an 8-bit READ, read waveforms start after WRITE command and register
address are issued.
Two-Wire Serial Bus Characteristics
Symbol
Definition
fSCLK
tSCLK
tr_sclk
Register Value
Bit 0
ACK
Note:
Table 17:
Register Value
Bit 7
Condition
Min
Typ
Max
Serial interface input clock frequency
–
–
–
400
kHz
Serial Input clock period
–
–
–
2.5
sec
SCLK duty cycle
–
40
50
60
%
–
34
–
ns
SCLK rise time
Unit
tf_sclk
SCLK fall time
–
8
–
ns
tr_sdat
SDATA rise time
–
34
–
ns
tf_sdat
SDATA fall time
–
10
–
ns
t
SRTH
Start hold time
0
10
28
ns
t
SDH
WRITE/READ
SDATA hold
WRITE
0
0
0
ns
tSDS
SDATA setup
WRITE
0
19.9
59.9
ns
t
SHAW
SDATA hold to ACK
WRITE
279
281
300
ns
t
AHSW
ACK hold to SDATA
WRITE
279
281
300
ns
tSTPS
Stop setup time
WRITE/READ
0
0
0
ns
t
STPH
Stop hold time
WRITE/READ
0
0
0
ns
t
SHAR
SDATA hold to ACK
READ
279
284
300
ns
tAHSR
ACK hold to SDATA
READ
279
284
300
ns
tSDHR
SDATA hold
READ
0
0
0
ns
t
SDATA setup
READ
0
19.9
59.9
ns
SDSR
CIN_SI
Serial interface input pin capacitance
–
–
3.5
–
pF
CLOAD_SD
SDATA max load capacitance
–
–
15
–
pF
MT9P031_DS Rev. J 5/15 EN
39
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Electrical Specifications
Symbol
Definition
RSD
SDATA pull-up resistor
MT9P031_DS Rev. J 5/15 EN
Condition
Min
Typ
Max
Unit
–
–
1.5
–
k
40
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Electrical Specifications
I/O Timing
By default, the MT9P031 launches pixel data, FV and LV with the rising edge of PIXCLK.
The expectation is that the user captures DOUT[11:0], FV and LV using the falling edge of
PIXCLK.
See Figure 29 and Table 18 for I/O timing (AC) characteristics.
Figure 29:
I/O Timing Diagram
tR
t RP
tF
t FP
90%
90%
10%
10%
t EXTCLK
EXTCLK
t CP
PIXCLK
t PD
t PD
Data[7:0]
Pxl _0
Pxl _1
Pxl _2
Pxl _n
t PFH
t PFL
t PLH
FRAME_VALID/
LINE_VALID
t PLL
FRAME_VALID trails
LINE_VALID by 16 PIXCLKs.
FRAME_VALID leads LINE_VALID by 609 PIXCLKs.
*PLL disabled for tCP
Table 18:
I/O Timing Characteristics
Symbol
Definition
fEXTCLK1
Input clock frequency
PLL enabled
6
tEXTCLK1
Input clock period
PLL enabled
166
fEXTCLK2
Input clock frequency
PLL disabled
6
tEXTCLK2
Input clock period
PLL disabled
125
tR
Input clock rise time
0.03
tF
Input clock fall time
0.03
tRP
Pixclk rise time
0.03
–
1
V/ns
tFP
Pixclk fall time
0.03
–
1
V/ns
Clock duty cycle
40
50
60
%
Jitter on PIXCLK
–
–
1.03
ns
tJITTER1
Input clock jitter 48 MHz
–
300
–
ps
tJITTER2
Input clock jitter 96 MHz
–
220
–
ps
t
t
(PIX JITTER)
CP
Min
Typ
Max
Unit
–
27
MHz
–
37
ns
–
96
MHz
–
10.4
ns
–
1
V/ns
–
1
V/ns
Nominal voltages
11.5
17.7
19.1
ns
fPIXCLK
PIXCLK frequency
Default
6
–
96
MHz
tPD
PIXCLK to data valid
Default
0.8
2.1
3.9
ns
tPFH
PIXCLK to FV HIGH
Default
2.8
4.3
5.9
ns
tPLH
PIXCLK to LV HIGH
Default
2.2
3.5
5.9
ns
tPFL
PIXCLK to FV LOW
Default
2.4
4.2
5.9
ns
tPLL
PIXCLK to LV LOW
Default
2.6
4.1
5.9
ns
CLOAD
Output load capacitance
–
<10
–
pF
MT9P031_DS Rev. J 5/15 EN
EXTCLK to PIXCLK propagation delay
Condition
41
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Electrical Specifications
Table 18:
I/O Timing Characteristics (continued)
Symbol
Definition
Condition
CIN
Input pin capacitance
Min
Typ
Max
Unit
–
2.5
–
pF
DC Electrical Characteristics
The DC electrical characteristics are shown in Table 19, Table 20 on page 44, and
Table 21 on page 44.
MT9P031_DS Rev. J 5/15 EN
42
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Electrical Specifications
Table 19:
Symbol
DC Electrical Characteristics
Definition
Condition
Min
Typ
Max
Unit
VDD
Core digital voltage
1.7
1.8
1.9
V
VDD_IO
I/O digital voltage
1.7
1.8/2.8
3.1
V
VAA
Analog voltage
2.6
2.8
3.1
V
VAA_PIX
Pixel supply voltage
2.6
2.8
3.1
V
VDD_PLL
PLL supply voltage
2.6
2.8
3.1
V
VIH
Input HIGH voltage
VDD_IO = 2.8V
2
–
3.3
V
VDD_IO = 1.8V
1.3
–
2.3
V
VDD_IO = 2.8V
–0.3
–
0.8
V
VDD_IO = 1.8V
–0.3
–
0.5
V
VIL
Input LOW voltage
IIN
Input leakage current
No pull-up resistor; VIN = VDD_IO or DGND
–
<10
–
μA
VOH
Output HIGH voltage
VDD_IO = 1.8V
1.3
–
1.82
V
VOL
Output LOW voltage
IOH
Output HIGH current
VDD_IO = 2.8V
2.3
–
–
V
VDD_IO = 2.8V
0.16
–
0.35
V
VDD_IO = 2.8V
–
–
0.6
V
At specified VOH = VDD_IO - 400mv
at 1.7V VDD_IO
At specified VOL = 400mv at 1.7V VDD_IO
8.9
–
22.3
mA
2.6
–
5.1
mA
VIN = VDD_IO or GND
–
–
2
A
Parallel mode 96 MHz full frame
nominal voltage, PLL enabled
Parallel mode 96 MHz full frame
nominal voltage, PLL enabled
Parallel mode 96 MHz full frame
nominal voltage, PLL enabled
Parallel mode 96 MHz full frame
nominal voltage, PLL enabled
Parallel mode 96 MHz full frame
nominal voltage, PLL enabled
Parallel mode 96 MHz 4X binning
nominal voltage, PLL enabled
Parallel mode 96 MHz 4X binning
nominal voltage, PLL enabled
Parallel mode 96 MHz 4X binning
nominal voltage, PLL enabled
Parallel mode 96 MHz 4X binning
nominal voltage, PLL Enabled
Parallel mode 96 MHz 4X binning
nominal voltage, PLL enabled
EXTCLK enabled
–
28
35
mA
–
38.6
50
mA
–
72
80
mA
–
2.4
6
mA
–
5
6
mA
–
15
35
mA
–
6.4
50
mA
–
69
80
mA
–
3.4
6
mA
–
5
6
mA
–
<500
–
A
IOL
Output LOW current
IOZ
Tri-state output leakage current
IDD1
Digital operating current
IDD_IO1
I/O digital operating current
IAA1
Analog operating current
IAA_PIX1
Pixel supply current
IDD_PLL1
PLL supply current
IDD2
Digital operating current
IDD_IO2
I/O digital operating current
IAA2
Analog operating current
IAA_PIX2
Pixel supply current
IDD_PLL2
PLL supply current
ISTBY1
Hard standby current PLL enabled
ISTBY2
Hard standby current PLL disabled
EXTCLK disabled
–
<50
–
A
ISTBY3
Soft standby current PLL enabled
EXTCLK enabled (PLL enabled)
–
<500
–
A
ISTBY4
Soft standby current PLL disabled
EXTCLK enabled (PLL disabled)
–
<500
–
A
MT9P031_DS Rev. J 5/15 EN
43
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Electrical Specifications
Table 20:
Power Consumption
Mode
Full Resolution (14 fps)
4X Binning
Unit
Streaming
381
262
mW
Caution
Table 21:
Stresses greater than those listed in Table 21 may cause permanent damage to the device.
This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol
Definition
VDD_MAX
Core digital voltage
Condition
Min
Max
Unit
–0.3
1.9
V
VDD_IO_MAX
I/O digital voltage
–0.3
3.1
V
VAA_MAX
Analog voltage
–0.3
3.1
V
VAA_PIX_MAX
Pixel supply voltage
–0.3
3.1
V
VDD_PLL_MAX
PLL supply voltage
–0.3
3.1
V
VIN_MAX
Input voltage
–0.3
3.4
V
IDD_MAX
Digital operating current
–
35
mA
IDD_IO_MAX
I/O digital operating current
–
100
mA
IAA_MAX
Analog operating current
–
95
mA
IAA_PIX_MAX
Pixel supply current
–
6
mA
IDD_PLL_MAX
PLL supply current
–
6
mA
TOP
Operating temperature
–30
70
°C
TST
Storage temperature
–40
125
°C
Notes:
MT9P031_DS Rev. J 5/15 EN
Measure at junction
1. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. To keep dark current and shot noise artifacts from impacting image quality, care should be taken to
keep TOP at a minimum.
44
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Revision History
Revision History
Rev. J. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5/5/15
• Updated “Ordering Information” on page 2
Rev. H . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3/31/15
• Converted to ON Semiconductor template
Rev. G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8/5/13
• Updated Table 1, “Available Part Numbers,” on page 1
• Updated Table , “General Description,” on page 1
• Updated Table 20, “Power Consumption,” on page 44
• Applied updated Aptina template
Rev. F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5/3/11
• Updated Table 19, “DC Electrical Characteristics,” on page 43
• Removed ES from Table 1, “Available Part Numbers,” on page 1
• Removed registers and created separate register reference
• Updated “Standby and Chip Enable” on page 22
• Replaced Figure 26: “Typical Spectral Characteristics,” on page 38 with latest curve
Rev. E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7/10
• Updated to non-confidential
Rev. D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5/10
• Updated to Aptina template
• UpdatedTable 13: Register Description on page 25 with new column width equation
Rev. C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9/07
• Update Table 18: I/O Timing Characteristics on page 41
Rev. B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .08/07
• Update VDDQ to VDD_IO
• Update RESET# to RESET_BAR
• Update STANDBY# to STANDBY_BAR
• Update OE# to OE
• Update “Features” on page 1Update Table 18, “I/O Timing Characteristics,” on
page 41
• Update “Features” on page 1Update Table 19, “DC Electrical Characteristics,” on
page 43
• Update Table 21, “Absolute Maximum Ratings,” on page 44
• Add "Appendix A– Power-On and Standby Timing" on page 46Update “Features” on
page 1
• Add Figure 31: “Power-On and Standby Timing Diagram,” on page 46
MT9P031_DS Rev. J 5/15 EN
45
©Semiconductor Components Industries, LLC,2015.
MT9P031: 1/2.5-Inch 5 Mp Digital Image Sensor
Revision History
Rev. A, Production. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .06/06
• Initial release
A-Pix is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the
rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/
Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including
without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey
any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and
distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
This literature is subject to all applicable copyright laws and is not for resale in any manner.
MT9P031_DS Rev. J 5/15 EN
46
©Semiconductor Components Industries, LLC,2015 .