TI CD74HC194M96E4 High-speed cmos logic 4-bit bidirectional universal shift register Datasheet

[ /Title
(CD74
HC194,
CD74H
CT194)
/Subject
(HighSpeed
CMOS
Logic
4-Bit
CD54HC194, CD74HC194,
CD74HCT194
Data sheet acquired from Harris Semiconductor
SCHS164G
September 1997 - Revised May 2006
High-Speed CMOS Logic
4-Bit Bidirectional Universal Shift Register
Features
Description
• Four Operating Modes
- Shift Right, Shift Left, Hold and Reset
• Synchronous Parallel or Serial Operation
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
The ’HC194 and CD74HCT194 are 4-bit shift registers with
Asynchronous Master Reset (MR). In the parallel mode (S0
and S1 are high), data is loaded into the associated flip-flop
and appears at the output after the positive transition of the
clock input (CP). During parallel loading serial data flow is
inhibited. Shift left and shift right are accomplished
synchronously on the positive clock edge with serial data
entered at the shift left (DSL) serial input for the shift left
mode, and at the shift right (DSR) serial input for the shift
right mode. Clearing the register is accomplished by a Low
applied to the Master Reset (MR) pin.
• Wide Operating Temperature Range . . . -55oC to 125oC
Ordering Information
• Typical fMAX = 60MHz at VCC = 5V, CL = 15pF,
TA = 25oC
• Asynchronous Master Reset
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
PART NUMBER
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
Pinout
CD54HC194 (CERDIP)
CD74HC194 (PDIP, SOIC, SOP, TSSOP)
CD74HCT194 (PDIP)
TOP VIEW
MR 1
TEMP. RANGE
(oC)
CD54HC194F3A
-55 to 125
16 Ld CERDIP
CD74HC194E
-55 to 125
16 Ld PDIP
CD74HC194M
-55 to 125
16 Ld SOIC
CD74HC194MT
-55 to 125
16 Ld SOIC
CD74HC194M96
-55 to 125
16 Ld SOIC
CD74HC194NSR
-55 to 125
16 Ld SOP
CD74HC194PW
-55 to 125
16 Ld TSSOP
CD74HC194PWR
-55 to 125
16 Ld TSSOP
CD74HC194PWT
-55 to 125
16 Ld TSSOP
CD74HCT194E
-55 to 125
16 Ld PDIP
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
16 VCC
DSR 2
15 Q0
D0 3
14 Q1
D1 4
13 Q2
D2 5
12 Q3
D3 6
11 CP
DSL 7
10 S1
GND 8
9 S0
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2006, Texas Instruments Incorporated
PACKAGE
1
CD54HC194, CD74HC194, CD74HCT194
Functional Diagram
D0
D1
D2
D3
DSL
3
15
4
14
5
13
6
12
2
7
9
10
1
DSR
11
Q0
Q1
Q2
Q3
GND = 8
VCC = 16
S0
S1
MR
CP
TRUTH TABLE
INPUTS
OPERATING
MODE
OUTPUT
CP
MR
S1
S0
DSR
DSL
Dn
Q0
Q1
Q2
Q3
Reset (Clear)
X
L
X
X
X
X
X
L
L
L
L
Hold (Do Nothing)
X
H
l
l
X
X
X
q0
q1
q2
q3
Shift Left
↑
H
h
l
X
l
X
q1
q2
q3
L
↑
H
h
l
X
h
X
q1
q2
q3
H
↑
H
l
h
l
X
X
L
q0
q1
q2
↑
H
l
h
h
X
X
H
q0
q1
q2
↑
H
h
h
X
X
dn
d0
d1
d2
d3
Shift Right
Parallel Load
H = High Voltage Level,
h = High Voltage Level One Set-up Time Prior To The Low to High Clock Transition,
L = Low Voltage Level,
l = Low Voltage Level One Set-up Time Prior to the Low to High Clock Transition,
dn (qn) = Lower Case Letters Indicate the State of the Referenced Input (or output) One Set-up Time Prior to the Low To High Clock
Transition,
X = Don’t Care,
↑ = Transition from Low to High Level
2
CD54HC194, CD74HC194, CD74HCT194
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA
Package Thermal Impedance, θJA (see Note 2):
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
SYMBOL
VI (V)
VIH
-
25oC
IO (mA) VCC (V)
-40oC TO 85oC
-55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
VIL
VOH
-
VIH or
VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
Low Level Output
Voltage
TTL Loads
VOL
VIH or
VIL
-
-
3
CD54HC194, CD74HC194, CD74HCT194
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
SYMBOL
VI (V)
II
VCC or
GND
-
ICC
VCC or
GND
High Level Input
Voltage
VIH
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
PARAMETER
Input Leakage
Current
Quiescent Device
Current
25oC
IO (mA) VCC (V)
-40oC TO 85oC
-55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
6
-
-
±0.1
-
±1
-
±1
µA
0
6
-
-
8
-
80
-
160
µA
-
-
4.5 to
5.5
2
-
-
2
-
2
-
V
VIL
-
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
VOH
VIH or
VIL
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or
VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
II
VCC to
GND
0
5.5
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
∆ICC
(Note 3)
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
NOTE:
2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
CP
0.6
MR
0.55
DSL, DSR, Dn
0.25
Sn
1.10
NOTE: Unit Load is ∆ICC limit specified in DC Electrical
Specifications table, e.g. 360µA max at 25oC.
4
CD54HC194, CD74HC194, CD74HCT194
Prerequisite For Switching Function
25oC
PARAMETER
SYMBOL
TEST
CONDITIONS VCC (V)
-40oC TO 85oC -55oC TO 125oC
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
2
6
-
5
-
4
-
MHz
4.5
30
-
24
-
20
-
MHz
6
35
-
28
-
23
-
MHz
2
80
-
100
-
120
-
ns
4.5
16
-
20
-
24
-
ns
6
14
-
17
-
20
-
ns
2
80
-
100
-
120
-
ns
4.5
16
-
20
-
24
-
ns
6
14
-
17
-
20
-
ns
2
70
-
90
-
105
-
ns
4.5
14
-
18
-
21
-
ns
6
12
-
15
-
19
-
ns
2
60
-
75
-
90
-
ns
4.5
12
-
15
-
18
-
ns
6
10
-
13
-
15
-
ns
2
80
-
100
-
120
-
ns
4.5
16
-
20
-
24
-
ns
6
14
-
17
-
20
-
ns
2
70
-
90
-
105
-
ns
4.5
14
-
18
-
21
-
ns
6
12
-
15
-
18
-
ns
2
0
-
0
-
0
-
ns
4.5
0
-
0
-
0
-
ns
6
0
-
0
-
0
-
ns
2
0
-
0
-
0
-
ns
4.5
0
-
0
-
0
-
ns
6
0
-
0
-
0
-
ns
HC TYPES
Max. Clock Frequency
(Figure 1)
MR Pulse Width
(Figure 2)
Clock Pulse Width
(Figure 1)
Set-up Time
Data to Clock (Figure 3)
Removal Time,
MR to Clock (Figure 2)
Set-Up Time
S1, S0 to Clock (Figure 4)
Set-up Time
DSL, DSR to Clock (Figure 4)
Hold Time
S1, S0 to Clock (Figure 4)
Hold Time
Data to Clock (Figure 3)
fMAX
tW
tW
tSU
tREM
tSU
tSU
tH
tH
-
-
-
-
-
-
-
-
-
HCT TYPES
Max. Clock Frequency (Figure 1)
fMAX
-
4.5
27
-
22
-
18
-
MHz
MR Pulse Width (Figure 2)
tW
-
4.5
16
-
20
-
24
-
ns
Clock Pulse Width (Figure 1)
tW
-
4.5
16
-
20
-
24
-
ns
Set-up Time, Data to Clock
(Figure 3)
tSU
-
4.5
14
-
18
-
21
-
ns
Removal Time MR to Clock
(Figure 2)
tREM
-
4.5
12
-
15
-
18
-
ns
5
Prerequisite For Switching Function
(Continued)
25oC
PARAMETER
SYMBOL
TEST
CONDITIONS VCC (V)
-40oC TO 85oC -55oC TO 125oC
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
Set-up Time
S1, S0 to Clock (Figure 4)
tSU
-
4.5
20
-
25
-
30
-
ns
Set-up Time
DSL, DSR to Clock (Figure 4)
tSU
-
4.5
14
-
18
-
21
-
ns
Hold Time
S1, S0 to Clock (Figure 4)
tH
-
4.5
0
-
0
-
0
-
ns
Hold Time
Data to Clock (Figure 3)
tH
-
4.5
0
-
0
-
0
-
ns
Switching Specifications
PARAMETER
HC TYPES
Propagation Delay,
Clock to Output (Figure 1)
Input tr, tf = 6ns
SYMBOL
TEST
CONDITIONS
tPLH, tPHL
CL = 50pF
Propagation Delay,
Clock to Q
tPLH, tPHL
Output Transition Time
(Figure 1)
tTLH, tTHL
Propagation Delay,
MR to Output (Figure 2)
tPHL
Input Capacitance
CL = 50pF
CL = 50pF
25oC
-40oC TO 85oC -55oC TO 125oC
VCC
(V)
TYP
MAX
MAX
MAX
UNITS
2
-
175
220
265
ns
4.5
-
35
44
53
ns
6
-
30
37
45
ns
5
14
-
-
-
ns
2
-
75
95
110
ns
4.5
-
15
19
22
ns
6
-
13
16
19
ns
2
-
140
175
210
ns
4.5
-
28
35
42
ns
6
-
24
30
36
ns
CIN
-
-
-
10
10
10
pF
Maximum Clock Frequency
fMAX
-
5
60
-
-
-
MHz
Power Dissipation
Capacitance (Notes 4, 5)
CPD
-
5
55
-
-
-
pF
4.5
-
37
46
56
ns
5
15
-
-
-
ns
HCT TYPES
Propagation Delay,
Clock to Output (Figure 1)
tPLH, tPHL
CL = 50pF
Propagation Delay,
Clock to Q
tPLH, tPHL
Output Transition Times
(Figure 1)
tTLH, tTHL
CL = 50pF
4.5
-
15
19
22
ns
Propagation Delay,
MR to Output (Figure 2)
tPHL
CL = 50pF
4.5
-
40
50
60
ns
Input Capacitance
CIN
-
-
-
10
10
10
pF
Maximum Clock Frequency
fMAX
-
5
50
-
-
-
MHz
Power Dissipation
Capacitance (Notes 4, 5)
CPD
-
5
60
-
-
-
pF
-
NOTES:
3. CPD is used to determine the dynamic power consumption, per gate.
4. PD = VCC2 fi + ∑ (CL VCC2) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.
6
Test Circuits and Waveforms
tr
INPUT LEVEL
CP
10%
tf
90%
VS
VS
10%
MR
VS
INPUT LEVEL
VS
GND
tW
tW
tPLH
tPHL
90%
VS
10%
tTLH
VS
tTHL
tPHL
VALID
S OR DS
CP
VS
INPUT LEVEL
VS
GND
tH
GND
FIGURE 2. MASTER RESET PREREQUISITE TIMES AND
PROPAGATION DELAYS
INPUT LEVEL
tSU
INPUT LEVEL
VS
VALID
VS
tREM
Q
FIGURE 1. CLOCK PREREQUISITE TIMES AND
PROPAGATION AND OUTPUT TRANSITION TIMES
DATA
GND
VS
CP
Q
VS
tSU
INPUT LEVEL
CP
GND
FIGURE 3. DATA PREREQUISITE TIMES
tH
VS
GND
INPUT LEVEL
GND
FIGURE 4. PARALLEL LOAD OR SHIFT-LEFT/SHIFT-RIGHT
PREREQUISITE TIMES
7
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
5962-8682601EA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
Purchase Samples
CD54HC194F3A
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
Contact TI Distributor
or Sales Office
CD74HC194E
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
Contact TI Distributor
or Sales Office
CD74HC194EE4
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
Contact TI Distributor
or Sales Office
CD74HC194M
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
CD74HC194M96
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
CD74HC194M96E4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
CD74HC194M96G4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
CD74HC194ME4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
CD74HC194MG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
CD74HC194MT
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
CD74HC194MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
CD74HC194MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
CD74HC194PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
CD74HC194PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
CD74HC194PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
CD74HC194PWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
28-Aug-2010
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CD74HC194PWRE4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
CD74HC194PWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
CD74HC194PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
CD74HC194PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
CD74HC194PWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
CD74HCT194E
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
Purchase Samples
CD74HCT194EE4
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
Purchase Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
OTHER QUALIFIED VERSIONS OF CD54HC194, CD74HC194 :
• Catalog: CD74HC194
• Military: CD54HC194
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Aug-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CD74HC194M96
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD74HC194PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD74HC194PWT
TSSOP
PW
16
250
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Aug-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD74HC194M96
SOIC
D
16
2500
333.2
345.9
28.6
CD74HC194PWR
TSSOP
PW
16
2000
346.0
346.0
29.0
CD74HC194PWT
TSSOP
PW
16
250
346.0
346.0
29.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and
Automotive
www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
Wireless
www.ti.com/wireless-apps
RF/IF and ZigBee® Solutions
www.ti.com/lprf
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
Similar pages