Rohm BU90004GWZ Step-down switching regulators with built-in power mosfet Datasheet

BU90002GWZ
Datasheet
Single-chip Type with Built-in FET Switching Regulator Series
Step-down Switching regulators
with Built-in Power MOSFET
BU9000xGWZ series
●General Description
The BU9000xGWZ are a high efficiency 6MHz
synchronous step-down switching regulator with ultra
low current PFM mode.
It provides up to 1.0A load current and an input voltage
range from 3.0V to 5.5V, optimized for battery powered
portable applications.
BU9000xGWZ has a mode control pin that allows the
user to select Forced PWM(Pulse Width
Modulation)mode or PFM(Pulse Frequency Modulation)
and PWM auto change mode utilized power save
operation at light load current.
●Applications
Smart phones, Cell phones, Portable applications and
Micro DC/DC modules, USB accessories
●Package(s)
UCSP35L1
W(Typ.) x D(Typ.) x H(Max.)
1.30mm x 0.90mm x 0.40mm
●Typical Application Circuit(s)
●Features
Fast transient response
Automatic PFM/PWM operation
Forced PWM operation
Internal Soft Start
Under voltage lockout
Over current protection
Thermal shutdown
Figure 1. Typical Application Circuit(s)
●Lineup
Operating mode
Part No.
Output
voltage
Input voltage
Switching frequency
BU90002GWZ
3.30V
4.0V to 5.5V
5.4MHz to 6.6MHz
BU90003GWZ
1.20V
2.3V to 5.5V
3.6MHz to 4.4MHz
BU90004GWZ
1.80V
2.3V to 5.5V
4.8MHz to 6.0MHz
BU90005GWZ
2.50V
2.3V to 5.5V
5.4MHz to 6.6MHz
Forced PFM
BU90006GWZ
3.00V
2.3V to 5.5V
5.4MHz to 6.6MHz
BU90007GWZ
1.25V
2.3V to 5.5V
3.6MHz to 4.4MHz
Automatic
PFM/PWM
●Pin Configuration(s)
MODE=L
MODE=H
Automatic
PFM/PWM
Forced PWM
●Pin Description(s)
(BOTTOM VIEW)
B1
M ODE
B2
LX
B3
FB
A1
V IN
A2
EN
A3
GND
Pin No.
Symbol
Function
A1
VIN
Power supply input pin
A2
EN
Enable pin
A3
GND
B1
MODE
Forced PWM mode pin
GND pin
B2
LX
Inductor connection pin
B3
FB
Feedback voltage input pin
Figure 2. Pin Configuration(s)
○Product structure：
：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
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TSZ02201-0F2F0AG00010-1-2
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Datasheet
BU9000xGWZ series
●Block Diagram(s)
L ： PWM/PFM MODE
H ： PWM MODE
MODE
B1
VIN
A1
TSD
UVLO
2.3～5.5V
PWM/PFM
control
FB
B3
VOUT
EN
+
ERROR COMP
1.5～0.47uH
Switching
Control Logic
and
Gate Driver
B2
VOUT
4.7uF
LX
VREF
EN
H ： ON
L ： OFF
A2
SHUTDOWN
Frequency
control
GND
A3
Figure 3. Block Diagram(s)
●Description of Block(s)
The BU9000xGWZ are a synchronous step-down DC/DC converter that achieves fast transient response from light load to
heavy load by hysteretic PWM control system and current constant PFM control system.
○PWM control
BU9000xGWZ operates by hysteretic PWM control. This scheme ensures fast switching, high efficiency, and fast transient
response.
When the output voltage is below the VREF voltage, the error comparator output is low to high and turning on P-channel
MOSFET until above the VREF voltage and minimum on time.
○PFM control
At light load the regulator and MODE=low, the regulator operates with reduced switching frequency and improves the
efficiency.During PFM operation, the output voltage slightly higher than typical output voltage.
output PWM mode voltage
PFM (constant current)Threshold. turn off Pch FET
PFM Threshold. turn on PFET
PFM Mode at Light Load
PWM Mode at Moderate to Heavy Loads
Figure 4. Operation of PFM mode and PWM mode
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Datasheet
BU9000xGWZ series
●Description of operations
1) Shutdown
If the EN input pin set to low (<0.4V), all circuit are shut down and the regulator is standby mode. Do not leave the EN pin
floating.
2) Soft start function
The regulator has a soft start circuit that reduces in-rush current at start-up.Typical start up times with a 4.7uF output
capacitor is 120usec.
3) Current limit
The BU9000xGWZ has a current limit circuit that protects itself and external components during overload condition.
4) UVLO
The BU9000xGWZ has a Under Voltage Lock Out circuit that turn off device when VIN>2.05V(typ.)
5) FORCED PWM MODE
Setting MODE pin high (>1.4V) places the regulator in forced PWM.This control provides noise reduction and output
stability.Do not leave the MODE pin floating.
6) FORCED PFM MODE ( BU90005GWZ)
Setting MODE pin low (<0.4V) places the regulator in forced PFM. It is effective in light load mode.
7) TSD
The BU9000xGWZ has a thermal shutdown feature to protect the device if the junction temperature exceeds 150℃.
In thermal shutdown, the DRIVER is disabled.
This circuit is only to cut off the IC from thermal runaway, and has not been design to protect or guarantee the IC.
Therefore, the user should not plan to activate this circuit with continued operation in mind.
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
VIN
7
V
VEN, VFB,
VLX, VMODE
7
V
Pd
0.39(*1)
W
Topr
-40 to +85
℃
Tstg
-55 to +125
℃
Tjmax
+125
℃
Maximum input power supply voltage
Maximum voltage at EN, FB, LX, MODE
Power dissipation
Operating temperature range
Storage temperature range
Junction temperature
(*1) When mounted on the specified PCB (55mm x 63mm), Deducted by 3.9m W/c when used over Ta=25c
●Recommended Operating Rating(s)
Parameter
Symbol
Input voltage
VIN
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Rating
Min.
Typ.
Max.
4.0
-
5.5
2.3
-
5.5
3/21
Unit
V
Serise
BU90002GWZ
BU90003～BU90007GWZ
TSZ02201-0F2F0AG00010-1-2
04.Jul.2012 Rev.001
Datasheet
BU9000xGWZ series
●Electrical Characteristic(s) (unless otherwise specified VIN=5.0V, Ta=25℃)
Item
Symbol
Min.
Rating
Typ.
Max.
Unit
Condition
【Switching regulator】
Output voltage accuracy
Maximum load current
-2
-
+2
IoutMAX1
IoutMAX2
IoutMAX3
-2
-
-
+3
1.0
0.8
0.6
IoutMAX4
-
-
0.1
A
Tss
65
120
240
usec
5.4
6.0
6.6
MHz
4.8
5.4
6.0
MHz
No load, MODE:H
No load, MODE:H
VOUTA
%
A
A
A
MODE:H(PWM Operation)
MODE:L(PFM Operation)
3.0V≦VIN＜5.5V
2.7V≦VIN＜3.0V
2.3V≦VIN＜2.7V
MODE:L(PFM Operation)
(BU90005GWZ,)
【Soft start】
Soft start time
【Frequency control】
Switching frequency
fosc
No load, MODE:H
(BU90002GWZ,BU90005GWZ,
BU90006GWZ)
(BU90004GWZ)
3.6
4.0
4.4
MHz
RonP1
RonP2
RonN1
RonN2
-
250
300
220
250
400
450
350
380
mOhm
mOhm
mOhm
mOhm
Operation
VENH
1.4
-
VIN
V
Non Operation
VENL
0
-
0.4
V
Operation
VMODEH
1.4
-
VIN
V
Forced PWM
Non Operation
VMODEL
0
-
0.4
V
Automatic PFM/PWM
Uvth
Uvhy
1.95
50
2.05
100
2.15
150
V
mV
Current limit threshold
ILIMIT
1.5
1.7
1.9
A
【Output discharge】
Output discharge resistance
【Circuit current】
DRES
55
110
220
Ohm
(BU90003GWZ)
【Driver】
PchFET on resistance
NchFET on resistance
-
VIN=5.0V
VIN=3.6V
VIN=5.0V
VIN=3.6V
【Control】
EN pin control
voltage
MODE pin
control voltage
(BU90005GWZ:Forced PFM)
【UVLO】
Protect threshold voltage
Hysteresis
【Current limit】
IINS1
-
45
65
uA
PMOS current detect,
Open loop
EN=0V
EN:H, MODE:L,
VOUT=3.6V forced
Not switching
(BU90003GWZ,BU90004GWZ,
BU90005GWZ,BU90007GWZ)
Operating quiescent current
IINS2
-
55
80
uA
EN:H, MODE:L,
VOUT=3.6V forced
Not switching
SHD
-
0
1
uA
EN=0V
(BU90002GWZ,BU90006GWZ)
Shutdown current
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Datasheet
BU9000xGWZ series
●Electrical characteristic curves (Reference data)
BU90002GWZ (3.3V OUTPUT)
Parts
L:LQM21MPN1R0NG0 (2.0mm×1.6mm×1.0mm Murata)
COUT:GRM155R60J475M(1.0mm×0.5mm×0.5mm Murata)
EN
2V/div
EN
2V/div
VOUT
2V/div
VOUT
2V/div
20us
IL
500mA/div
100us
Figure 6. Shut down
Figure 5. Start up
Vout
50mV/div
ac coupled
Vout
50mV/div
ac coupled
10us
4us
IOUT
50mA/div
IOUT
200mA/div
Figure 7. Load transient response 5mA to 50mA
tr=tf=100ns, MODE : Low
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Figure 8. Load transient response 50mA to 350mA
tr=tf=100ns, MODE : Low
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Datasheet
BU9000xGWZ series
Vout
20mV/div
ac coupled
Vout
50mV/div
ac coupled
400ns
4us
LX
5V/div
IOUT
200mA/div
IL
500mA/div
Figure 10. PFM mode Operation
Iout=40mA
Figure 9. Load transient response 150mA to 500mA
tr=tf=100ns, MODE : High
Vout
20mV/div
ac coupled
MODE
2V/div
4us
80ns
Vout
20mV/div
ac coupled
LX
5V/div
IL
500mA/div
IL
500mA/div
Figure 11. PWM mode Operation
Iout=100mA
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Figure 12. Mode Change Response
MODE : High to Low
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Datasheet
BU9000xGWZ series
100
4us
MODE
2V/div
95
Efficiency[%]
90
Vout
20mV/div
ac coupled
85
80
75
70
IL
500mA/div
65
60
1
10
100
1000
Load current[mA]
Figure 13. Mode Change Response
MODE : Low to High
Figure 14. Efficiency vs Load current
VIN=5V PWM/PFM Auto mode
3.38
30
3.37
Vout Ripple Voltage[mv]
25
Output Voltage[v]
3.36
3.35
3.34
3.33
20
15
10
5
3.32
0
3.31
0
200
400
600
800
1000
0
200
400
600
800
Load current[mA]
Load current[mA]
Figure 15. Load regulation
VIN=5V PWM/PFM Auto mode
Figure 16. Vout Ripple Voltage
VIN=5V PWM/PFM Auto mode
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04.Jul.2012 Rev.001
Datasheet
BU9000xGWZ series
●Electrical characteristic curves (Reference data)
BU90003GWZ(1.2V OUTPUT)
EN
2V/div
EN
2V/div
VOUT
500mV/div
40us
VOUT
500m/div
IL
200mA/div
100us
Figure 17. Start up
Figure 18. Shut down
Vout
50mV/div
1.2V offset
Vout
50mV/div
1.2V offset
10us
4us
IOUT
200mA/div
IOUT
200mA/div
Figure 20. Load transient response 50mA to 350mA
tr=tf=100ns, MODE : Low
Figure 19. Load transient response 5mA to 200mA
tr=tf=100ns, MODE : Low
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Datasheet
BU9000xGWZ series
Vout
20mV/div
ac coupled
4us
Vout
50mV/div
ac coupled
400ns
LX
2V/div
IOUT
500mA/div
IL
500mA/div
Figure 22. PFM mode Operation Iout=50mA
Figure 21. Load transient response 400mA to 1000mA
tr=tf=100ns, MODE : Low
2us
Vout
20mV/div
ac coupled
MODE
2V/div
80ns
Vout
50mV/div
ac coupled
LX
2V/div
IL
500mA/div
IL
200mA/div
Figure 23. Fig.23 PWM mode Operation Iout=100mA
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Figure 24. Mode Change Response
MODE : High to Low
TSZ02201-0F2F0AG00010-1-2
04.Jul.2012 Rev.001
Datasheet
BU9000xGWZ series
100
2us
MODE
2V/div
90
80
VIN=2.7V
VIN=3.6V
VIN=4.2V
Efficiency[%]
70
Vout
50mV/div
ac coupled
60
50
40
30
IL
200mA/div
20
10
0
0.1
1
10
100
1000
Load current[mA]
Figure 26. Efficiency vs Load current
PWM/PFM Auto mode
Figure 25. Mode Change Response
MODE : Low to High
1.236
Output Voltage[V]
1.224
VIN=4.2
VIN=3.6
VIN=2.7
1.212
1.200
1.188
0
200
400
600
800
1000
Load current[mA]
Figure 27. Load regulation
PWM/PFM Auto mode
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Datasheet
BU9000xGWZ series
●Electrical characteristic curves (Reference data)
BU90004GWZ(1.80V OUTPUT)
EN
5V/div
EN
5V/div
VOUT
1V/div
VOUT
1V/div
40us
100us
IL
200mA/div
Figure 28. Start up
Figure 29. Shut down
Vout
50mV/div
ac coupled
Vout
50mV/div
ac coupled
4us
4us
IOUT
200mA/div
IOUT
200mA/div
Figure 30. Load transient response 5mA to 200mA
tr=tf=100ns, Mode : Low
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Figure 31. Load transient response 50mA to 350mA
tr=tf=100ns, Mode :Low
TSZ02201-0F2F0AG00010-1-2
04.Jul.2012 Rev.001
Datasheet
BU9000xGWZ series
4us
Vout
50mV/div
ac coupled
Vout
20mV/div
ac coupled
400ns
IOUT
200mA/div
LX
2V/div
Figure 33. PFM mode Operation IIout=50mA
Figure 32. Load transient response 200mA to 600mA
tr=tf=100ns, MODE : Low
80ns
Vout
20mV/div
ac coupled
MODE
5V/div
4us
Vout
50mV/div
ac coupled
LX
2V/div
LX
200mA/div
Figure 34. PWM mode Operation Iout=100mA
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Figure 35. Mode Change Response
MODE : High to Low
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Datasheet
BU9000xGWZ series
100
90
2us
MODE
5V/div
80
VIN=2.7V
VIN=3.6V
VIN=4.2V
Efficiency[%]
70
Vout
50mV/div
ac coupled
60
50
40
30
20
LX
200mA/div
10
0
0.1
1
10
100
1000
Load current[mA]
Figure 37. Efficiency vs Load current
PWM/PFM Auto mode
Figure 36. Mode Change Response
MODE : Low to High
1.854
Output Voltage[V]
1.836
VIN=2.7V
VIN=3.6V
VIN=4.2V
1.818
1.800
1.782
1.764
0
200
400
600
800
1000
Load current[mA]
Figure 38. Load regulation
PWM/PFM Auto mode
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Datasheet
BU9000xGWZ series
●Electrical characteristic curves (Reference data)
BU90005GWZ(2.50V OUTPUT)
EN
1V/div
EN
2V/div
40us
VOUT
1V/div
100us
VOUT
1V/div
IL
200mA/div
Figure 39. Start up
Figure 40. Shut down
Vout
100mV/div
ac coupled
Vout
50mV/div
ac coupled
4us
4us
IOUT
200mA/div
IOUT
100mA/div
Figure 41. Load transient response 5mA to 100mA
tr=tf=100ns, MODE : Low
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Figure 42. Load transient response 50mA to 350mA
tr=tf=100ns, MODE : High
TSZ02201-0F2F0AG00010-1-2
04.Jul.2012 Rev.001
Datasheet
BU9000xGWZ series
Vout
50mV/div
ac coupled
Vout
100mV/div
ac coupled
1us
LX
2V/div
10us
IOUT
200mA/div
IL
500mA/div
Figure 44. PFM mode Operation Iout=50mA
Figure 43. Load transient response 200mA to 600mA
tr=tf=100ns, MODE : High
Vout
20mV/div
ac coupled
80ns
MODE
2V/div
LX
2V/div
Vout
50mV/div
ac coupled
IL
200mA/div
IL
200mA/div
Figure 45. PWM mode Operation Iout=100mA
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4us
Figure 46. Mode Change Response
MODE : High to Low
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Datasheet
BU9000xGWZ series
100
MODE
2V/div
90
4us
80
VIN=2.7V
VIN=3.6V
VIN=4.2V
Efficiency[%]
70
Vout
50mV/div
ac coupled
60
50
40
30
20
IL
200mA/div
10
0
0.1
1
10
100
Load current[mA]
Figure 47. Mode Change Response
MODE : Low to High
Figure 48. Efficiency vs Load current
PFM mode
100
90
VIN=2.7V
VIN=3.6V
VIN=4.2V
80
Efficiency[%]
70
60
50
40
30
20
10
0
0.1
1
10
100
1000
Load current[mA]
Figure 49. Efficiency vs Load current
PWM mode
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Datasheet
BU9000xGWZ series
●PC Board layout
The suggested PCB layout for the BU9000xGWZ are shown in Figure. The following guidelines should be used to ensure a
proper layout.
1) The input capacitor CIN should be connect as closely possible to VIN pin and GND pin.
2) From the output voltage to the FB pin line should be as separate as possible.
3) COUT and L should be connected as closely as possible. The connection of L to the LX pin should be as short as
possible.
Figure 50. PCB layout
●External parts selection
Inductor selection
The inductance significantly depends on output ripple current. As shown by following equation, the ripple current decreases
as the inductor and/or switching frequency increase.
(VIN-VOUT)×VOUT
⊿IL=
L×VIN×f
f: switching frequency
L: inductance
⊿IL: inductor current ripple
As a minimum requirement, the DC current rating of the inductor should be equal to the maximum load current plus half of
the inductor current ripple as shown by the following equation.
ILPEAK= IOUTMAX +
⊿IL
2
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Datasheet
BU9000xGWZ series
1) Recommended inductor selection
・Iout≦1A
LQM21MPN1R0NG0 (2.0mm×1.6mm×1.0mm Murata)
DFE252012C 1R0 (2.5mm×2.0mm×1.0mm TOKO)
・Iout≦0.6A
LQM21PN1R0NGC (2.0mm×1.2mm×1.0mm Murata)
MLP2012H1R0M(2.0mm×1.2mm×1.0mm TDK)
CKP2012N1R0N(2.0mm×1.2mm×1.0mm Taiyo Yuden)
2) Recommended input capacitor(CIN) selection
GRM155R60J225M(1.0mm×0.5mm×0.5mm Murata)
GRM155R60J475M(1.0mm×0.5mm×0.5mm Murata)
GRM155R60G106M(1.0mm×0.5mm×0.5mm Murata)
3) Recommended output capacitor(COUT) selection
GRM155R60J225M(1.0mm×0.5mm×0.5mm Murata)
GRM155R60J475M(1.0mm×0.5mm×0.5mm Murata)
GRM155R60G106M(1.0mm×0.5mm×0.5mm Murata)
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Datasheet
BU9000xGWZ series
●Caution of use
1) Absolute maximum ratings
An excess in the absolute maximum rating, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any
over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as
fuses.
2) GND voltage
The potential of GND pin must be minimum potential in all condition. As an exception, the circuit design allows voltages
up to -0.3 V to be applied to the IC pin.
3) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
5) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
6) Mutual impedance
Power supply and ground wiring should reflect consideration of the need to lower mutual impedance and minimize ripple as
much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and
capacitance).
7) Thermal shutdown Circuit (TSD Circuit)
This model IC has a built-in TSD circuit. This circuit is only to cut off the IC from thermal runaway, and has not been design
to protect or guarantee the IC. Therefore, the user should not plan to activate this circuit with continued operation in mind.
8) Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example, as shown in the figures below, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate,
such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
www.rohm.co
© 2012 ROHM Co., Ltd. All rights reserved.
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TSZ02201-0F2F0AG00010-1-2
04.Jul.2012 Rev.001
Datasheet
BU9000xGWZ series
●Ordering Information
B
U
9
0
0
0
x
G
W
Z
E2
Package
GWZ: UCSP35L1
Part Number
Packaging and forming specification
E2: Embossed tape and reel
(UCSP35L1)
●Physical Dimension Tape and Reel Information
1234
1234
Reel
1234
1234
1pin
1234
1234
Direction of feed
●Marking Diagram(s)(TOP VIEW)
UCSP35L1
(TOP VIEW)
1PIN MARK
Series
Part Number Marking
LOT Number
www.rohm.co
© 2012 ROHM Co., Ltd. All rights reserved.
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BU90002GWZ
Part Number Marking
AB4
BU90003GWZ
AB6
BU90004GWZ
AB7
BU90005GWZ
AB8
BU90006GWZ
AB9
BU90007GWZ
ACM
TSZ02201-0F2F0AG00010-1-2
04.Jul.2012 Rev.001
Datasheet
BU9000xGWZ series
●Revision History
Date
Revision
04.Jul,2012
001
Changes
New Release
www.rohm.co
© 2012 ROHM Co., Ltd. All rights reserved.
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04.Jul.2012 Rev.001
Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.