HP HSMP-386E Surface mount pin diode Datasheet

Surface Mount PIN Diodes
Technical Data
HSMP-386x Series
Features
• Switching
– Low Distortion Switching
– Low Capacitance
• Attenuating
– Low Current Attenuating for
Less Power Consumption
• Matched Diodes for
Consistent Performance
• Better Thermal
Conductivity for Higher
Power Dissipation
• Low Failure in Time (FIT)
Rate[1]
• Lead-free Option Available
Note:
1. For more information see the
Surface Mount PIN Reliability Data
Sheet.
1
2
3
LUx
• Unique Configurations in
Surface Mount Packages
– Add Flexibility
– Save Board Space
– Reduce Cost
Pin Connections and
Package Marking, SOT-363
6
5
4
Notes:
1. Package marking provides
orientation, identification, and
date code.
2. See “Electrical Specifications” for
appropriate package marking.
Description/Applications
The HSMP-386x series of general
purpose PIN diodes are designed
for two classes of applications.
The first is attenuators where
current consumption is the most
important design consideration.
The second application for this
series of diodes is in switches
where low capacitance is the
driving issue for the designer.
The HSMP-386x series Total
Capacitance (CT) and Total
Resistance (RT) are typical specifications. For applications that
require guaranteed performance,
the general purpose HSMP-383x
series is recommended.
A SPICE model is not available
for PIN diodes as SPICE does not
provide for a key PIN diode
characteristic, carrier lifetime.
2
Package Lead Code
Identification, SOT-23
(Top View)
Package Lead Code
Identification, SOT-323
(Top View)
SERIES
SINGLE
SERIES
SINGLE
#0
#2
B
C
COMMON
ANODE
COMMON
CATHODE
COMMON
ANODE
COMMON
CATHODE
#3
#4
E
F
Package Lead Code
Identification, SOT-363
(Top View)
UNCONNECTED
TRIO
6
5
1
2
4
3
L
Absolute Maximum Ratings[1] TC = +25°C
Symbol
Parameter
Unit
SOT-23
SOT-323
If
Forward Current (1 µs Pulse)
Amp
1
1
PIV
Peak Inverse Voltage
V
50
50
Tj
Junction Temperature
°C
150
150
Tstg
Storage Temperature
°C
-65 to 150
-65 to 150
θjc
Thermal Resistance[2]
°C/W
500
150
ESD WARNING:
Handling Precautions Should Be
Taken To Avoid Static Discharge.
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to
the device.
2. TC = +25°C, where TC is defined to be the temperature at the package pins where
contact is made to the circuit board.
Electrical Specifications TC = 25°C, each diode
PIN General Purpose Diodes, Typical Specifications TA = 25°C
Part Number
HSMP3860
3862
3863
3864
386B
386C
386E
386F
386L
Package
Marking
Code
Lead
Code
Configuration
0
2
3
4
B
C
E
F
L
Single
Series
Common Anode
Common Cathode
Single
Series
Common Anode
Common Cathode
Unconnected Trio
[1]
L0
L2 [1]
L3 [1]
L4 [1]
L0 [2]
L2 [2]
L3 [2]
L4 [2]
LL [2]
Test Conditions
Notes:
1. Package marking code is laser marked.
Minimum
Typical
Typical
Breakdown
Series Resistance Total Capacitance
Voltage VBR (V)
RS (Ω)
CT (pF)
50
3.0/1.5*
0.20
VR = VBR
Measure
IR ≤ 10 µA
IF = 10 mA
f = 100 MHz
VR = 50 V
f = 1 MHz
IF = 100 mA*
3
HSMP-386x Typical Parameters at TC = 25°C
Part Number
HSMP-
Total Resistance
RT (Ω)
Carrier Lifetime
τ (ns)
Reverse Recovery Time
Trr (ns)
Total Capacitance
CT (pF)
386x
22
500
80
0.20
IF = 1 mA
f = 100 MHz
IF = 50 mA
TR = 250 mA
VR = 10 V
IF = 20 mA
90% Recovery
VR = 50 V
f = 1 MHz
Test Conditions
Typical Performance, TC = 25°C, each diode
1000
1 MHz
0.25
100 MHz
0.20
0.15
1 GHz
0
2
4
6
8
100
10
0.1
1
10
100
Figure 2. Typical RF Resistance vs.
Forward Bias Current.
1000
VR = 10 V
100
VR = 20 V
IF – FORWARD CURRENT (mA)
100
VR = 5 V
10
1
0.1
125°C 25°C –50°C
10
10
0.01
20
30
FORWARD CURRENT (mA)
Figure 4. Reverse Recovery Time vs.
Forward Current for Various Reverse
Voltages.
0
0.2
0.4
0.6
0.8
1.0
1.2
VF – FORWARD VOLTAGE (mA)
Figure 5. Forward Current vs.
Forward Voltage.
Equivalent Circuit Model
HSMP-386x Chip*
Rs
Rj
1.5 Ω
Cj
0.12 pF
110
Diode Mounted as a
Series Switch in a
50 Ω Microstrip and
Tested at 123 MHz
105
100
95
90
1
10
30
IF – FORWARD BIAS CURRENT (mA)
BIAS CURRENT (mA)
Figure 1. RF Capacitance vs. Reverse
Bias.
115
85
1
0.01
10 12 14 16 18 20
REVERSE VOLTAGE (V)
Trr – REVERSE RECOVERY TIME (ns)
INPUT INTERCEPT POINT (dBm)
0.30
120
TA = +85°C
TA = +25°C
TA = –55°C
RESISTANCE (OHMS)
TOTAL CAPACITANCE (pF)
0.35
RT = 1.5 + R j
CT = C P + C j
12
R j = 0.9 Ω
I
I = Forward Bias Current in mA
* See AN1124 for package models
Figure 3. 2nd Harmonic Input
Intercept Point vs. Forward Bias
Current for Switch Diodes.
4
Typical Applications for Multiple Diode Products
RF COMMON
RF COMMON
RF 2
RF 1
RF 1
RF 2
BIAS 1
BIAS
BIAS 2
BIAS
Figure 7. High Isolation SPDT Switch, Dual Bias.
Figure 6. Simple SPDT Switch, Using Only Positive
Current.
RF COMMON
RF COMMON
BIAS
RF 1
RF 2
RF 2
RF 1
BIAS
Figure 8. Switch Using Both Positive and Negative
Current.
Figure 9. Very High Isolation SPDT Switch, Dual Bias.
VARIABLE BIAS
RF IN/OUT
INPUT
FIXED
BIAS
VOLTAGE
Figure 10. Four Diode π Attenuator. See AN1048 for details.
5
Typical Applications for Multiple Diode Products (continued)
BIAS
“ON”
“OFF”
1
1
+V
0
2
0
+V
1
6
5
4
1
2
3
RF out
RF in
2
Figure 12. HSMP-386L Unconnected Trio used in a
Positive Voltage, High Isolation Switch.
Figure 11. High Isolation SPST Switch
(Repeat Cells as Required).
1
2
3
0
3
2
1
4
5
6
2
“ON”
“OFF”
1
b1
b2
3
2
1
4
5
6
1
0
0
2
+V
–V
1
b3
RF out
RF in
Figure 13. HSMP-386L used in a SP3T Switch.
Figure 14. HSMP-386L Unconnected Trio used in a
Dual Voltage, High Isolation Switch.
Ordering Information
Specify part number followed by option. For example:
HSMP - 386x - XXX
Bulk or Tape and Reel Option
Part Number; x = Lead Code
Surface Mount PIN
Option Descriptions
-BLK = Bulk, 100 pcs. per antistatic bag
-TR1 = Tape and Reel, 3000 devices per 7" reel
-TR2 = Tape and Reel, 10,000 devices per 13" reel
Tape and Reeling conforms to Electronic Industries RS-481, “Taping of
Surface Mounted Components for Automated Placement.”
For lead-free option, the part number will have the character "G" at the
end, eg. -TR2G for a 10K pc lead-free reel.
6
Assembly Information
SOT-323 PCB Footprint
Recommended PCB pad layouts
for the miniature SOT packages
are shown in Figures 15, 16, 17.
These layouts provide ample
allowance for package placement
by automated assembly equipment
without adding parasitics that
could impair the performance.
0.026
0.07
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT
package, will reach solder reflow
temperatures faster than those
with a greater mass.
0.035
0.016
Figure 15. PCB Pad Layout, SOT-323.
(dimensions in inches).
0.026
Agilent’s diodes have been
qualified to the time-temperature
profile shown in Figure 18. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporating solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of temperature for the ramp-up and cooldown zones are chosen to be low
enough to not cause deformation
of the board or damage to components due to thermal shock. The
maximum temperature in the
reflow zone (TMAX) should not
exceed 235°C.
These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum temperatures and times necessary to
achieve a uniform reflow of
solder.
0.075
250
0.035
TMAX
0.016
Figure 16. PCB Pad Layout, SOT-363.
(dimensions in inches).
0.037
0.95
0.037
0.95
TEMPERATURE (°C)
200
150
Reflow
Zone
100
Preheat
Zone
Cool Down
Zone
50
0
0
0.079
2.0
120
0.031
0.8
inches
mm
Figure 17. PCB Pad Layout, SOT-23.
180
TIME (seconds)
Figure 18. Surface Mount Assembly Profile.
0.035
0.9
DIMENSIONS IN
60
240
300
7
Package Dimensions
Outline 23 (SOT-23)
Outline SOT-323 (SC-70, 3 Lead)
PACKAGE
MARKING
CODE (XX)
1.30 (0.051)
REF.
2.20 (0.087)
2.00 (0.079)
XXX
1.02 (0.040)
0.89 (0.035)
DATE CODE (X)
0.54 (0.021)
0.37 (0.015)
PACKAGE
MARKING
CODE (XX)
1.35 (0.053)
1.15 (0.045)
DATE CODE (X)
3
1.40 (0.055)
1.20 (0.047)
XXX
2.65 (0.104)
2.10 (0.083)
2
1
0.650 BSC (0.025)
0.425 (0.017)
TYP.
2.20 (0.087)
1.80 (0.071)
0.60 (0.024)
0.45 (0.018)
2.04 (0.080)
1.78 (0.070)
TOP VIEW
0.10 (0.004)
0.00 (0.00)
0.30 REF.
0.152 (0.006)
0.066 (0.003)
3.06 (0.120)
2.80 (0.110)
1.00 (0.039)
0.80 (0.031)
0.25 (0.010)
0.15 (0.006)
10°
1.02 (0.041)
0.85 (0.033)
0.20 (0.008)
0.10 (0.004)
0.30 (0.012)
0.10 (0.004)
0.69 (0.027)
0.45 (0.018)
0.10 (0.004)
0.013 (0.0005)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
SIDE VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Outline 363 (SC-70, 6 Lead)
PACKAGE
MARKING
CODE (XX)
1.30 (0.051)
REF.
2.20 (0.087)
2.00 (0.079)
XXX
DATE CODE (X)
1.35 (0.053)
1.15 (0.045)
0.650 BSC (0.025)
0.425 (0.017)
TYP.
2.20 (0.087)
1.80 (0.071)
0.10 (0.004)
0.00 (0.00)
0.30 REF.
1.00 (0.039)
0.80 (0.031)
0.25 (0.010)
0.15 (0.006)
10°
0.30 (0.012)
0.10 (0.004)
0.20 (0.008)
0.10 (0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Package Characteristics
Lead Material ............................ Copper (SOT-323/363); Alloy 42 (SOT-23)
Lead Finish ............................................................................ Tin-Lead 85-15%
Maximum Soldering Temperature .............................. 260°C for 5 seconds
Minimum Lead Strength .......................................................... 2 pounds pull
Typical Package Inductance .................................................................. 2 nH
Typical Package Capacitance .............................. 0.08 pF (opposite leads)
END VIEW
8
Device Orientation
REEL
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
For Outlines SOT-23, -323
For Outline SOT-363
TOP VIEW
END VIEW
TOP VIEW
4 mm
8 mm
ABC
ABC
END VIEW
4 mm
ABC
8 mm
ABC
Tape Dimensions and Product Orientation
For Outline SOT-23
P2
D
E
P0
F
W
D1
t1
Ko
9° MAX
13.5° MAX
8° MAX
B0
A0
DESCRIPTION
SYMBOL
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" represents date code.
Note: "AB" represents package marking code.
"C" represents date code.
P
ABC
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A0
B0
K0
P
D1
3.15 ± 0.10
2.77 ± 0.10
1.22 ± 0.10
4.00 ± 0.10
1.00 + 0.05
0.124 ± 0.004
0.109 ± 0.004
0.048 ± 0.004
0.157 ± 0.004
0.039 ± 0.002
PERFORATION
DIAMETER
PITCH
POSITION
D
P0
E
1.50 + 0.10
4.00 ± 0.10
1.75 ± 0.10
0.059 + 0.004
0.157 ± 0.004
0.069 ± 0.004
CARRIER TAPE
WIDTH
THICKNESS
W
t1
8.00 +0.30 –0.10
0.229 ± 0.013
0.315 +0.012 –0.004
0.009 ± 0.0005
DISTANCE
BETWEEN
CENTERLINE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 ± 0.05
0.138 ± 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P2
2.00 ± 0.05
0.079 ± 0.002
Tape Dimensions and Product Orientation
For Outlines SOT-323, -363
P
P2
D
P0
E
F
W
C
D1
t1 (CARRIER TAPE THICKNESS)
Tt (COVER TAPE THICKNESS)
K0
An
A0
DESCRIPTION
B0
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A0
B0
K0
P
D1
2.40 ± 0.10
2.40 ± 0.10
1.20 ± 0.10
4.00 ± 0.10
1.00 + 0.25
0.094 ± 0.004
0.094 ± 0.004
0.047 ± 0.004
0.157 ± 0.004
0.039 + 0.010
PERFORATION
DIAMETER
PITCH
POSITION
D
P0
E
1.55 ± 0.05
4.00 ± 0.10
1.75 ± 0.10
0.061 ± 0.002
0.157 ± 0.004
0.069 ± 0.004
CARRIER TAPE
WIDTH
THICKNESS
W
t1
8.00 ± 0.30
0.254 ± 0.02
0.315 ± 0.012
0.0100 ± 0.0008
COVER TAPE
WIDTH
TAPE THICKNESS
C
Tt
5.4 ± 0.10
0.062 ± 0.001
0.205 ± 0.004
0.0025 ± 0.00004
DISTANCE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 ± 0.05
0.138 ± 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P2
2.00 ± 0.05
0.079 ± 0.002
FOR SOT-323 (SC70-3 LEAD)
An
8°C MAX
ANGLE
FOR SOT-363 (SC70-6 LEAD)
An
10°C MAX
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5988-7917EN
March 24, 2004
5989-0485EN
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