HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 2001.03.01 Revised Date : 2001.03.29 Page No. : 1/3 HTL294MD PNP EPITAXIAL PLANAR TRANSISTOR Description The HTL294MD is designed for high voltage low power switching applications especially for use in telephone and telecommunication circuits. Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ..................................................................................... 150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ................................................................................... 1.5 W • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ..................................................................................... -400 V VCEO Collector to Emitter Voltage .................................................................................. -400 V VEBO Emitter to Base Voltage ............................................................................................ -6 V IC Collector Current ...................................................................................................... -400 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO ICES IEBO *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VBE(sat) *hFE1 *hFE2 *hFE3 fT Cob Min. -400 -400 -6 50 60 50 30 - Typ. - Max. -1 -10 -0.2 -200 -300 -1.2 -750 250 30 Unit V V V uA uA uA mV mV V mV MHz pF Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=10uA VCB=-400V, IE=0 VCE=-400V, IE=0 VEB=-6V, IC=0 IC=-10mA, IB=-1mA IC=-50mA, IB=-5mA IC=-80mA, IB=-4mA IC=-10mA, IB=-1mA VCE=-10V, IC=-1mA VCE=-10V, IC=-20mA VCE=-10V, IC=-80mA VCE=-20V, IE=-10mA, f=1MHz VCB=-20V, f=1MHz, IE=0 *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% HTL294MD HSMC Product Specification HI-SINCERITY Spec. No. : Preliminary Data Issued Date : 2001.03.01 Revised Date : 2001.03.29 Page No. : 2/3 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Sasturation Voltage & Collector Current 100000 1000 Saturation Voltage (mV) hFE @ VCE=10V hFE 100 10 10000 1000 VCE(sat) @ IC=20IB 100 VCE(sat) @ IC=10IB 10 1 0.1 1 10 100 1 1000 10 Saturation Voltage & Collector Current 100 Cob Capacitance (pF) Saturation Voltage (mV) 1000 Capacitance & Reverse-Biased Voltage 10000 1000 VBE(sat) @ IC=10IB 100 10 1 1 10 100 1000 0.1 Collector Current-IC (mA) 1 10 100 Reverse Biased Voltage (V) Safe Operating Area Power Derating 10 1.6 1.4 1 PD(W) , Power Dissipation PT=1mS Collector Current-IC (A) 100 Collector Current-IC (mA) Collector Current-IC (mA) PT=100mS PT=1S 0.1 1.2 1 0.8 0.6 0.4 0.2 0 0.01 1 10 100 Forward Biased Voltage-VCE (V) HTL294MD 1000 0 50 100 150 200 o Ta( C) , Ambient Temperature HSMC Product Specification HI-SINCERITY Spec. No. : Preliminary Data Issued Date : 2001.03.01 Revised Date : 2001.03.29 Page No. : 3/3 MICROELECTRONICS CORP. TO-126ML Dimension Marking : A HSMC Logo Part Number Date Code B D F C Rank O H E Product Series Ink Marking 3 2 I Style : Pin 1.Emitter 2.Collector 3.Base G N 1 J M L K 3-Lead TO-126ML Plastic Package HSMC Package Code : D *:Typical Inches Min. Max. 0.1356 0.1457 0.0170 0.0272 0.0344 0.0444 0.0501 0.0601 0.1131 0.1231 0.0737 0.0837 0.0294 0.0494 0.0462 0.0562 DIM A B C D E F G H Millimeters Min. Max. 3.44 3.70 0.43 0.69 0.87 1.12 1.27 1.52 2.87 3.12 1.87 2.12 0.74 1.25 1.17 1.42 DIM I J K L M N O Inches Min. Max. *0.1795 0.0268 0.0331 0.5512 0.5906 0.2903 0.3003 0.1378 0.1478 0.1525 0.1625 0.0740 0.0842 Millimeters Min. Max. *4.56 0.68 0.84 14.00 15.00 7.37 7.62 3.50 3.75 3.87 4.12 1.88 2.14 Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 HTL294MD HSMC Product Specification