HSMC HTL294MD Pnp epitaxial planar transistor Datasheet

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 2001.03.01
Revised Date : 2001.03.29
Page No. : 1/3
HTL294MD
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HTL294MD is designed for high voltage low power switching
applications especially for use in telephone and telecommunication
circuits.
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150 °C
Junction Temperature ..................................................................................... 150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ................................................................................... 1.5 W
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ..................................................................................... -400 V
VCEO Collector to Emitter Voltage .................................................................................. -400 V
VEBO Emitter to Base Voltage ............................................................................................ -6 V
IC Collector Current ...................................................................................................... -400 mA
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
ICES
IEBO
*VCE(sat)1
*VCE(sat)2
*VCE(sat)3
*VBE(sat)
*hFE1
*hFE2
*hFE3
fT
Cob
Min.
-400
-400
-6
50
60
50
30
-
Typ.
-
Max.
-1
-10
-0.2
-200
-300
-1.2
-750
250
30
Unit
V
V
V
uA
uA
uA
mV
mV
V
mV
MHz
pF
Test Conditions
IC=-100uA, IE=0
IC=-1mA, IB=0
IE=10uA
VCB=-400V, IE=0
VCE=-400V, IE=0
VEB=-6V, IC=0
IC=-10mA, IB=-1mA
IC=-50mA, IB=-5mA
IC=-80mA, IB=-4mA
IC=-10mA, IB=-1mA
VCE=-10V, IC=-1mA
VCE=-10V, IC=-20mA
VCE=-10V, IC=-80mA
VCE=-20V, IE=-10mA, f=1MHz
VCB=-20V, f=1MHz, IE=0
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HTL294MD
HSMC Product Specification
HI-SINCERITY
Spec. No. : Preliminary Data
Issued Date : 2001.03.01
Revised Date : 2001.03.29
Page No. : 2/3
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Sasturation Voltage & Collector Current
100000
1000
Saturation Voltage (mV)
hFE @ VCE=10V
hFE
100
10
10000
1000
VCE(sat) @ IC=20IB
100
VCE(sat) @ IC=10IB
10
1
0.1
1
10
100
1
1000
10
Saturation Voltage & Collector Current
100
Cob
Capacitance (pF)
Saturation Voltage (mV)
1000
Capacitance & Reverse-Biased Voltage
10000
1000
VBE(sat) @ IC=10IB
100
10
1
1
10
100
1000
0.1
Collector Current-IC (mA)
1
10
100
Reverse Biased Voltage (V)
Safe Operating Area
Power Derating
10
1.6
1.4
1
PD(W) , Power Dissipation
PT=1mS
Collector Current-IC (A)
100
Collector Current-IC (mA)
Collector Current-IC (mA)
PT=100mS
PT=1S
0.1
1.2
1
0.8
0.6
0.4
0.2
0
0.01
1
10
100
Forward Biased Voltage-VCE (V)
HTL294MD
1000
0
50
100
150
200
o
Ta( C) , Ambient Temperature
HSMC Product Specification
HI-SINCERITY
Spec. No. : Preliminary Data
Issued Date : 2001.03.01
Revised Date : 2001.03.29
Page No. : 3/3
MICROELECTRONICS CORP.
TO-126ML Dimension
Marking :
A
HSMC Logo
Part Number
Date Code
B
D
F
C
Rank
O
H
E
Product Series
Ink Marking
3
2
I
Style : Pin 1.Emitter 2.Collector 3.Base
G
N
1
J
M
L
K
3-Lead TO-126ML Plastic Package
HSMC Package Code : D
*:Typical
Inches
Min.
Max.
0.1356
0.1457
0.0170
0.0272
0.0344
0.0444
0.0501
0.0601
0.1131
0.1231
0.0737
0.0837
0.0294
0.0494
0.0462
0.0562
DIM
A
B
C
D
E
F
G
H
Millimeters
Min.
Max.
3.44
3.70
0.43
0.69
0.87
1.12
1.27
1.52
2.87
3.12
1.87
2.12
0.74
1.25
1.17
1.42
DIM
I
J
K
L
M
N
O
Inches
Min.
Max.
*0.1795
0.0268
0.0331
0.5512
0.5906
0.2903
0.3003
0.1378
0.1478
0.1525
0.1625
0.0740
0.0842
Millimeters
Min.
Max.
*4.56
0.68
0.84
14.00
15.00
7.37
7.62
3.50
3.75
3.87
4.12
1.88
2.14
Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
HTL294MD
HSMC Product Specification
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