Fairchild MTC20 Octal d-type flip-flop Datasheet

Revised April 2005
74VHC273
Octal D-Type Flip-Flop
General Description
Features
The VHC273 is an advanced high speed CMOS Octal
D-type flip-flop fabricated with silicon gate CMOS technology. It achieves the high speed operation similar to equivalent Bipolar Schottky TTL while maintaining the CMOS low
power dissipation.
■ High Speed: fMAX
The register has a common buffered Clock (CP) which is
fully edge-triggered. The state of each D input, one setup
time before the LOW-to-HIGH clock transition, is transferred to the corresponding flip-flop’s Q output. The Master
Reset (MR) input will clear all flip-flops simultaneously. All
outputs will be forced LOW independently of Clock or Data
inputs by a LOW voltage level on the MR input.
■ Low noise: VOLP
165 MHz (typ) at VCC
5V
■ Low power dissipation: ICC
4 PA (max) at TA
■ High noise immunity: VNIH
VNIL
25qC
28% VCC (min)
■ Power down protection is provided on all inputs
0.9V (max)
■ Pin and function compatible with 74HC273
■ Leadless DQFN Package
An input protection circuit insures that 0V to 7V can be
applied to the inputs pins without regard to the supply voltage. This device can be used to interface 5V to 3V systems
and two supply systems such as battery backup. This circuit prevents device destruction due to mismatched supply
and input voltages.
Ordering Code:
Order Number
Package
Number
74VHC273M
M20B
74VHC273SJ
M20D
74VHC273BQ
(Preliminary)
MLP020B
(Preliminary)
74VHC273MTC
74VHC273N
MTC20
N20A
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Surface mount packages are also available on Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
© 2005 Fairchild Semiconductor Corporation
DS011670
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74VHC273 Octal D-Type Flip-Flop
April 1994
74VHC273
Logic Symbols
Connection Diagrams
Pin Assignments for PDIP, SOIC, SOP, and TSSOP
IEEE/IEC
Pad Assignments for DQFN
Pin Descriptions
Pin Names
Description
D0–D7
Data Inputs
MR
Master Reset
CP
Clock Pulse Input
Q0–Q7
Data Outputs
Function Table
Inputs
Outputs
Operating Mode
MR
CP
Reset (Clear)
L
Load '1'
H
Load '0'
H
H HIGH Voltage Level
L LOW Voltage Level
X Immaterial
LOW-to-HIGH Transition
X
Dn
Qn
X
L
H
H
L
L
(Top Through View)
Logic Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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2
Recommended Operating
Conditions (Note 2)
0.5V to 7.0V
0.5V to 7.0V
0.5V to VCC 0.5V
20 mA
r20 mA
r25 mA
r75 mA
65qC to 150qC
Supply Voltage (VCC )
DC Input Voltage (VIN)
DC Output Voltage (VOUT)
Input Diode Current (IIK)
Output Diode Current (IOK)
DC Output Current (IOUT)
DC VCC /GND Current (ICC )
Storage Temperature (TSTG)
0V to 5.5V
Output Voltage (VOUT)
0V to VCC
40qC to 85qC
Operating Temperature (TOPR)
Input Rise and Fall Time (tr, tf)
Lead Temperature (TL)
VCC
3.3V r 0.3V
0 ns/V a 100 ns/V
VCC
5.0V r 0.5V
0 ns/V a 20 ns/V
Note 1: Absolute Maximum Ratings are values beyond which the device
may be damaged or have its useful life impaired. The databook specifications should be met, without exception, to ensure that the system design is
reliable over its power supply, temperature, and output/input loading variables. Fairchild does not recommend operation outside databook specifications.
260qC
(Soldering, 10 seconds)
2.0V to 5.5V
Supply Voltage (VCC)
Input Voltage (VIN)
Note 2: Unused inputs must be held HIGH or LOW. They may not float.
DC Electrical Characteristics
Symbol
VIH
VOL
TA
Min
25qC
Typ
TA
Max
40qC to 85qC
Min
Max
2.0
1.50
1.50
3.0 5.5
0.7 VCC
0.7 VCC
LOW Level Input
Voltage
VOH
(V)
HIGH Level Input
Voltage
VIL
VCC
Parameter
2.0
0.50
0.50
0.3 VCC
0.3 VCC
2.0
1.9
2.0
1.9
Voltage
3.0
2.9
3.0
2.9
4.5
4.4
4.5
3.0
2.58
2.48
4.5
3.94
3.80
VIN
3.0
0.0
0.1
0.1
4.5
0.0
0.1
0.1
Quiescent Supply Current
0.0
IOH
V
Voltage
ICC
VIH IOH
50 PA
or VIL
4.4
2.0
Input Leakage Current
V
V
LOW Level Output
IIN
Conditions
V
3.0 5.5
HIGH Level Output
Units
0.1
0.1
IOH
VIN
V
VIH IOL
4 mA
8 mA
50 PA
or VIL
3.0
0.36
0.44
4.5
0.36
0.44
0 5.5
r0.1
r1.0
PA
VIN
5.5V or GND
5.5
4.0
40.0
PA
VIN
VCC or GND
V
IOL
4 mA
IOL
8 mA
Noise Characteristics
Symbol
VOLP
Parameter
TA
VCC
25qC
Units
Conditions
(V)
Typ
Limits
Quiet Output Maximum Dynamic VOL
5.0
0.6
0.9
V
CL
50 pF
Quiet Output Minimum Dynamic VOL
5.0
0.6
0.9
V
CL
50 pF
Minimum HIGH Level Dynamic Input Voltage
5.0
3.5
V
CL
50 pF
Maximum LOW Level Dynamic Input Voltage
5.0
1.5
V
CL
50 pF
(Note 3)
VOLV
(Note 3)
VIHD
(Note 3)
VILD
(Note 3)
Note 3: Parameter guaranteed by design.
3
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74VHC273
Absolute Maximum Ratings(Note 1)
74VHC273
AC Electrical Characteristics
Symbol
fMAX
VCC
Parameter
Maximum Clock
TA
Typ
3.3 r 0.3
75
120
65
50
75
45
120
165
100
80
110
70
5.0 r 0.5
Propagation Delay
tPHL
Time (CK - Q)
3.3 r 0.3
5.0 r 0.5
tPHL
3.3 r 0.3
Propagation Delay
40qC to 85qC
TA
Min
Frequency
tPLH
25qC
(V)
Time (MR - Q)
5.0 r 0.5
Max
Min
Max
MHz
8.7
13.6
1.0
16.0
11.2
17.1
1.0
19.5
5.8
9.0
1.0
10.5
7.3
11.0
1.0
12.5
8.9
13.6
1.0
16.0
11.4
17.1
1.0
19.5
5.2
8.5
1.0
10.0
6.7
10.5
1.0
12.0
Output to
3.3 r 0.3
1.5
1.5
tOSHL
Output Skew
5.0 r 0.5
1.0
1.0
CIN
Input Capacitance
4.0
10.0
10.0
CPD
Power Dissipation
31
ns
ns
ns
ns
ns
pF
pF
Capacitance
|tPLHmax tPLHmin|; tOSHL
Conditions
MHz
tOSLH
Note 4: Parameter guaranteed by design tOSLH
Units
(Note 4)
VCC
CL
15 pF
CL
50 pF
CL
15 pF
CL
50 pF
CL
15 pF
CL
50 pF
CL
15 pF
CL
50 pF
CL
15 pF
CL
50 pF
CL
15 pF
CL
50 pF
CL
50 pF
CL
50 pF
Open
(Note 5)
|tPHLmax tPHLmin|.
Note 5: CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average
operating current can be obtained from the equation: ICC (opr.) C PD * VCC * fIN ICC/8 (per F/F). The total CPD when n pieces of the Flip-Flop operates can
be calculated by the equation: CPD (total) 22 9n.
AC Operating Requirements
Symbol
tW(L)
Parameter
Minimum Pulse Width (CK)
tW(H)
tW(L)
tS
tH
tREC
Minimum Pulse Width (MR)
Minimum Setup Time
Minimum Hold Time
Minimum Removal Time (MR)
VCC
(V)
(Note 6)
25qC
TA
40qC to 85qC
Guaranteed Minimum
3.3
5.5
6.5
5.0
5.0
5.0
3.3
5.0
6.0
5.0
5.0
5.0
3.3
5.5
6.5
5.0
4.5
4.5
3.3
1.0
1.0
5.0
1.0
1.0
3.3
2.5
2.5
5.0
2.0
2.0
Note 6: VCC is 3.3 r 0.3V or 5.0 r 0.5V
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TA
Typ
4
Units
ns
ns
ns
ns
ns
Tape Format for DQFN
Package
Designator
BQ
Tape
Number
Cavity
Section
Cavities
Status
Cover Tape
Status
Leader (Start End)
125 (typ)
Empty
Sealed
Carrier
2500/3000
Filled
Sealed
Trailer (Hub End)
75 (typ)
Empty
Sealed
TAPE DIMENSIONS inches (millimeters)
REEL DIMENSIONS inches (millimeters)
Tape Size
12 mm
A
B
C
D
N
W1
W2
13.0
0.059
0.512
0.795
7.008
0.488
0.724
(330)
(1.50)
(13.00)
(20.20)
(178)
(12.4)
(18.4)
5
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74VHC273
Tape and Reel Specification
74VHC273
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package Number M20B
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6
74VHC273
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
7
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74VHC273
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm
Package Number MLP020B
(Preliminary)
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8
74VHC273
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
9
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74VHC273 Octal D-Type Flip-Flop
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package Number N20A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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10
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