DATASHEET N OT R E C OM ME NDED F R E C OM OR N E W M ENDE DESIGN D REPL S A C E ME NT PAR ISL5501 T 4 ISL55011 FN6218 Rev 0.00 May 22, 2006 MMIC Silicon Bipolar Broadband Amplifier The ISL55005, ISL55007, ISL55008 and ISL55009, ISL55010, ISL55011 constitute a family of high performance gain blocks featuring a Darlington configuration using high ft transistors and excellent thermal performance. They are an ideal choice for DVB-S LNB cable receiver applications. ISL55005, ISL55007, ISL55008 offer higher OIP3 performance while the ISL55009, ISL55010, ISL55011 offer lower operating supply currents. ISL55005 and ISL55009 match a 75 source to a 50 load. ISL55007 and ISL55010 match a 75 source to a 75 load. ISL55008 and ISL55011 match a 50 source to a 50 load. Features • Input impedance of 50 • Output impedance of 50 • Noise figure of 3.9dB • OIP3 of 10dBm • Low supply current of 14mA • Low input and output return losses • Pb-free plus anneal available (RoHS compliant) Applications • LNB and LNB-T line amplifiers Ordering Information PART NUMBER (Note) PART MARKING ISL55011IEZ-T7 CBH • IF gain blocks for satellite and terrestrial HDTV STBs TAPE & REEL PACKAGE (Pb-Free) 7” (3k pcs) 6 Ld SC-70 PKG. DWG. # P6.049 • PA driver amplifier • Wireless data, satellite • Bluetooth/WiFi NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. • Satellite locator and signal strength meters Typical Application Circuit Pinout 6 LD SC-70 +3.3V 0.1µF 100pF 3 68pF FN6218 Rev 0.00 May 22, 2006 100pF 4 6 1, 2, 5 0.1µF GND 1 6 OUT GND 2 5 GND IN 3 4 VSP 100nH 68pF Page 1 of 6 ISL55011 Absolute Maximum Ratings (TA = 25°C) Supply Voltage from VSP to GND . . . . . . . . . . . . . . . . . . . . . . . . 6V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . VS+ +0.3V to GND -0.3V Power Dissipation . . . . . . . . . . . . See Packging Information Section Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +125°C Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +125°C ESD Rating Human Body Model (Per MIL-STD-883 Method 3015.7) . . .3000V Machine Model (Per EIAJ ED-4701 Method C-111). . . . . . . .300V CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications PARAMETER Gt P1dB OIP3 VSP = +3.3V, Zrsc = Zload = 50, TA = 25°C, unless otherwise specified. DESCRIPTION CONDITIONS Small Signal Gain Output Power at 1dB Compression Output Third Order Intercept Point MIN TYP MAX UNIT 1.0GHz 13.4 14.4 15.4 dB 1.5GHz 13.3 14.3 15.3 dB 2.0GHz 13.1 14.1 15.1 dB 1.0GHz -0.8 1.2 3.2 dBm 2.0GHz -0.7 0.8 2.3 dBm 1.0GHz 10.9 dBm 2.0GHz 10.3 dBm BW 3dB Bandwidth 3dB below Gain @ 500MHz 3.4 GHz IRL Input Return Loss 1.0GHz 11.1 dB ORL Output Return Loss 1.0GHz 13.5 dB RISOL Reverse Isolation 2.0GHz 19.6 dB NF Noise Figure 2.0GHz 3.9 dB ID Device Operating Current 11.5 13.7 15.5 mA Device Test Setup Agilent _8753ES VNA 50 50 CONNECTORLESS PLATFORM DC BLOCK 50 PIN 3 PIN 6 DUT PICOSECOND LABS MODEL 5542 50 3.3V PICOSECOND LABS MODEL 5508-110 I1 BIAS TEE I2 IDEVICE INPUT REFERENCE PLANE FN6218 Rev 0.00 May 22, 2006 OUTPUT REFERENCE PLANE 3.3V POWER SUPPLY Page 2 of 6 ISL55011 Typical Performance Curves 50 environment 12 14 ORL (dB) IRL (dB) 13 11 10 12 11 10 9 9 0.5 1.0 1.5 2.0 2.5 0.5 3.0 Frequency (GHz) 2.0 2.5 3.0 FIGURE 2. OUTPUT RETURN LOSS vs FREQUENCY -6 20 S11 (dB) 18 S21 (dB) 1.5 Frequency (GHz) FIGURE 1. INPUT RETURN LOSS vs FREQUENCY 16 14 12 10 -8 -10 -12 0.5 1.0 1.5 2.0 Frequency (GHz) 2.5 3.0 0.5 FIGURE 3. |S21| vs FREQUENCY 1.0 1.5 2.0 Frequency (GHz) 2.5 3.0 FIGURE 4. |S11| vs FREQUENCY -16 -8 S22 (dB) -18 S12 (dB) 1.0 -20 -22 -10 -12 -14 -24 0.5 1.0 1.5 2.0 Frequency (GHz) 2.5 FIGURE 5. |S12| vs FREQUENCY FN6218 Rev 0.00 May 22, 2006 3.0 0.5 1.0 1.5 2.0 Frequency (GHz) 2.5 3.0 FIGURE 6. |S22| vs FREQUENCY Page 3 of 6 ISL55011 13 4 12 3 dBm OIP3 (dBm) Typical Performance Curves 50 environment (Continued) 11 2 1 10 0 9 0.5 1.0 1.5 2.0 Frequency (GHz) 2.5 0.5 3.0 1.0 1.5 2.0 Frequency (GHz) 2.5 3.0 FIGURE 8. P1dB vs FREQUENCY FIGURE 7. OIP3 vs FREQUENCY Noise Figure (dB) 6 5 4 3 2 1 0 0.5 1.0 1.5 2.0 Frequency (GHz) 2.5 3.0 1.8 0.6 1.6 0.7 1.4 1.2 0.8 0.9 1.0 FIGURE 9. NOISE FIGURE vs FREQUENCY 2.0 0.2 0.5 0.4 0.4 3.0 0.6 0.3 0.8 4.0 1.0 5.0 1.0 0.2 6.0 0.8 7.0 8.0 9.0 10 0.6 0.1 0.4 20 50 50 20 10 5.0 4.0 3.0 2.0 1.8 1.6 1.4 1.2 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0 S22 50 0.1 0.2 3 GHz 0.5 GHz 0.5 GHz 1.0 1.0 0.2 20 0.4 0.8 2.2 6.0 0.6 7.0 S11 3 GHz 1.0 5.0 1.0 4.0 2.2 0.2 8.0 9.0 10 0.1 0.8 0.3 0.6 3.0 0.4 0.4 1.8 2.0 0.5 1.4 1.2 1.0 0.9 0.8 0.7 1.6 0.6 0.2 RF Café 2002 FIGURE 10. S11 AND S22 vs FREQUENCY FN6218 Rev 0.00 May 22, 2006 Page 4 of 6 ISL55011 Packaging Information POWER DISSIPATION (W) 0.3 JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.25 0.2 0.15 176mW JA 0.1 SC 7 = 5 0- 6 67 °C /W 0.05 0 0 25 50 75 85 100 125 150 AMBIENT TEMPERATURE (°C) FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FN6218 Rev 0.00 May 22, 2006 Page 5 of 6 ISL55011 Small Outline Transistor Plastic Packages (SC70-6) 0.20 (0.008) M VIEW C C P6.049 CL 6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE e b 6 INCHES 5 4 CL CL E1 E 1 2 3 e1 C D CL A A2 SEATING PLANE A1 -C- SYMBOL MIN MAX MIN MAX NOTES A 0.031 0.043 0.80 1.10 - A1 0.000 0.004 0.00 0.10 - A2 0.031 0.039 0.00 1.00 - b 0.006 0.012 0.15 0.30 b1 0.006 0.010 0.15 0.25 c 0.003 0.009 0.08 0.22 6 c1 0.003 0.009 0.08 0.20 6 D 0.073 0.085 1.85 2.15 3 E 0.071 0.094 1.80 2.40 - E1 0.045 0.053 1.15 1.35 3 e e1 L 0.10 (0.004) C 0.0256 Ref 0.65 Ref 0.0512 Ref 0.010 0.018 - 1.30 Ref 0.26 - 0.46 L1 0.017 Ref. 0.420 Ref. L2 0.006 BSC 0.15 BSC WITH b N PLATING b1 R 0.004 - 0.10 - R1 0.004 0.010 0.15 0.25 0o 8o 0o 8o c c1 6 5 - NOTES: 1. Dimensioning and tolerance per ASME Y14.5M-1994. 4X 1 2. Package conforms to EIAJ SC70 and JEDEC MO203AB. 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. R1 4. Footlength L measured at reference to gauge plane. R 5. “N” is the number of terminal positions. GAUGE PLANE L C 6 4 Rev. 2 9/03 BASE METAL SEATING PLANE MILLIMETERS L1 4X 1 L2 6. These Dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only VIEW C © Copyright Intersil Americas LLC 2006. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN6218 Rev 0.00 May 22, 2006 Page 6 of 6