IXD_609 9-Ampere Low-Side Ultrafast MOSFET Drivers INTEGRATED CIRCUITS DIVISION Features Description • 9A Peak Source/Sink Drive Current • Wide Operating Voltage Range: 4.5V to 35V • -40°C to +125°C Extended Operating Temperature Range • Logic Input Withstands Negative Swing of up to 5V • Matched Rise and Fall Times • Low Propagation Delay Time • Low, 10A Supply Current • Low Output Impedance The IXDD609/IXDI609/IXDN609 high-speed gate drivers are especially well suited for driving the latest IXYS MOSFETs and IGBTs. The IXD_609 high-current output can source and sink 9A of peak current while producing voltage rise and fall times of less than 25ns. The input is CMOS compatible, and is virtually immune to latch up. Proprietary circuitry eliminates cross-conduction and current “shoot-through.” Low propagation delay and fast, matched rise and fall times make the IXD_609 family ideal for high-frequency and high-power applications. Applications • • • • • • Efficient Power MOSFET and IGBT Switching Switch Mode Power Supplies Motor Controls DC to DC Converters Class-D Switching Amplifiers Pulse Transformer Driver The IXDD609 is configured as a non-inverting driver with an enable, the IXDN609 is configured as a non-inverting driver, and the IXDI609 is configured as an inverting driver. The IXD_609 family is available in a standard 8-pin DIP (PI); an 8-pin SOIC (SIA); an 8-pin Power SOIC with an exposed metal back (SI); an 8-pin DFN (D2); a 5-pin TO-263 (YI); and a 5-pin TO-220 (CI). Ordering Information Part Number IXDD609D2TR IXDD609SI IXDD609SITR IXDD609SIA IXDD609SIATR IXDD609PI IXDD609CI IXDD609YI IXDI609SI IXDI609SITR IXDI609SIA IXDI609SIATR IXDI609PI IXDI609CI IXDI609YI IXDN609SI IXDN609SITR IXDN609SIA IXDN609SIATR IXDN609PI IXDN609CI IXDN609YI DS-IXD_609-R06 Logic Configuration IN OUT EN IN OUT IN OUT Package Type Packing Method Quantity 8-Pin DFN 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DIP 5-Pin TO-220 5-Pin TO-263 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DIP 5-Pin TO-220 5-Pin TO-263 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DIP 5-Pin TO-220 5-Pin TO-263 Tape & Reel Tube Tape & Reel Tube Tape & Reel Tube Tube Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tube 2000 100 2000 100 2000 50 50 50 100 2000 100 2000 50 50 50 100 2000 100 2000 50 50 50 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION IXD_609 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 3 4 4 5 2. IXD_609 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 IXDD609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 IXDI609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 IXDN609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 6 6 4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.ixysic.com 10 10 10 10 11 R06 IXD_609 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Pin Configurations 1.2 Pin Definitions IXDD609 D2 / PI / SI / SIA IXDD609 CI / YI Pin Name VCC 1 8 VCC IN 2 7 OUT EN 3 6 OUT GND 4 5 GND VCC 1 OUT 2 GND 3 IN 4 EN 5 IXDI609 PI / SI / SIA VCC 1 8 VCC IN 2 7 OUT NC GND 3 6 OUT 4 5 GND IN NC GND 1 2 8 7 VCC OUT 3 6 OUT 4 5 GND IN Logic Input EN Output Enable - Drive pin low to disable output, and force output to a high impedance state OUT Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT OUT Inverted Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT VCC Supply Voltage - Provides power to the device GND Ground - Common ground reference for the device IXDI609 CI / YI VCC 1 OUT 2 GND 3 IN 4 NC 5 IXDN609 PI / SI / SIA VCC Description NC IXDN609 CI / YI VCC 1 OUT 2 GND 3 IN 4 NC 5 Not connected 1.3 Absolute Maximum Ratings Parameter Supply Voltage Input Voltage Output Current Junction Temperature Storage Temperature Symbol Minimum Maximum Units VCC -0.3 40 V VIN, VEN -5 VCC+0.3 V IOUT TJ TSTG - ±9 -55 +150 A °C -65 +150 °C Unless stated otherwise, absolute maximum electrical ratings are at 25°C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.4 Recommended Operating Conditions Parameter Supply Voltage Operating Temperature Range R06 Symbol Range Units VCC TA 4.5 to 35 V -40 to +125 °C www.ixysic.com 3 IXD_609 INTEGRATED CIRCUITS DIVISION 1.5 Electrical Characteristics: TA = 25°C Test Conditions: 4.5V < VCC < 35V (unless otherwise noted). Parameter Conditions Symbol Minimum Typical Maximum Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - - Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8 0V < VIN < VCC IIN ±10 A IXDD609 only VENH 2/3VCC - EN Input Voltage, High - EN Input Voltage, Low IXDD609 only VENL - V Output Voltage, High - VOH VCC-0.025 1/3VCC - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-100mA ROH - 0.6 1 Output Resistance, Low State ROL - 0.4 0.8 IDC - - ±2 Rise Time VCC=18V, IOUT=100mA Limited by package power dissipation VCC=18V, CLOAD=10nF tr - 22 35 Fall Time VCC=18V, CLOAD=10nF tf - 15 25 On-Time Propagation Delay VCC=18V, CLOAD=10nF tondly - 40 60 Off-Time Propagation Delay Enable to Output-High Delay Time (IXDD609 Only) Disable to High Impedance State Delay Time (IXDD609 Only) Enable Pull-Up Resistor VCC=18V, CLOAD=10nF toffdly - 42 60 tENOH - 25 60 tDOLD - 35 60 REN - 200 1 <1 <1 2 10 10 Input Current Output Current, Continuous Power Supply Current VCC=18V VCC=18V VCC=18V, VIN=3.5V VCC=18V, VIN=0V VCC=18V, VIN=VCC ICC Units V V A ns k mA A 1.6 Electrical Characteristics: TA = - 40°C to +125°C Test Conditions: 4.5V < VCC < 35V unless otherwise noted. Conditions Symbol Minimum Input Voltage, High Parameter 4.5V < VCC < 18V VIH Maximum 3.3 - Input Voltage, Low 4.5V < VCC < 18V VIL - 0.65 0V < VIN < VCC IIN - VOH VCC-0.025 ±10 Output Voltage, High Output Voltage, Low - VOL - 0.025 Output Resistance, High State VCC=18V, IOUT=-100mA ROH - 2 Output Resistance, Low State ROL - 1.5 IDC - ±1 Rise Time VCC=18V, IOUT=100mA Limited by package power dissipation VCC=18V, CLOAD=10nF tr - 40 Fall Time VCC=18V, CLOAD=10nF tf - 30 On-Time Propagation Delay VCC=18V, CLOAD=10nF tondly - 75 Off-Time Propagation Delay VCC=18V, CLOAD=10nF toffdly - 75 Enable to Output-High Delay Time IXDD609 only, VCC=18V tENOH - 75 Disable to High Impedance State Delay Time IXDD609 only, VCC=18V VCC=18V, VIN=3.5V VCC=18V, VIN=0V VCC=18V, VIN=VCC tDOLD - 75 2.5 150 150 Input Current Output Current, Continuous Power Supply Current 4 www.ixysic.com ICC - Units V A V A ns mA A R06 IXD_609 INTEGRATED CIRCUITS DIVISION 1.7 Thermal Characteristics Package Parameter Symbol Rating D2 (8-Pin DFN) 35 CI (5-Pin TO-220) 36 PI (8-Pin DIP) 125 JA Thermal Resistance, Junction-to-Ambient SI (8-Pin Power SOIC) 85 SIA (8-Pin SOIC) 120 YI (5-Pin TO-263) 46 CI (5-Pin TO-220) Units °C/W 3 JC Thermal Resistance, Junction-to-Case SI (8-Pin Power SOIC) 10 YI (5-Pin TO-263) °C/W 2 2 IXD_609 Performance 2.1 Timing Diagrams VIH IN VIH IN VIL tondly VIL toffdly toffdly tondly 90% OUT OUT 10% 90% 10% tf tr tf tr 2.2 Characteristics Test Diagram + 0.1μF 10μF OUT VCC EN VIN R06 VCC IN VCC - GND CLOAD www.ixysic.com Tektronix Current Probe 6302 5 IXD_609 INTEGRATED CIRCUITS DIVISION 3 Block Diagrams & Truth Tables 3.1 IXDD609 3.3 IXDN609 VCC VCC IN OUT IN OUT GND EN GND IN EN OUT IN OUT 0 1 or open 0 0 0 1 1 or open 1 1 1 x 0 Z 3.2 IXDI609 VCC OUT IN GND 6 IN OUT 0 1 1 0 www.ixysic.com R06 IXD_609 INTEGRATED CIRCUITS DIVISION 4 Typical Performance Characteristics Rise Time vs. Supply Voltage (Input=0-5V, f=10kHz, TA=25ºC) 60 60 CL=10nF CL=5.4nF CL=1.5nF 50 40 30 20 30 20 10 0 0 5 10 15 20 25 Supply Voltage (V) 30 CL=10nF CL=5.4nF CL=1.5nF 40 10 0 35 5 10 15 20 25 Supply Voltage (V) VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=25V VCC=30V VCC=35V 40 30 Fall Time (ns) Rise Time (ns) 50 20 4000 6000 8000 Load Capacitance (pF) -40 -20 35 40 30 0 20 40 60 80 Temperature (ºC) 100 120 140 20 150 toffdly tondly 10000 0 2000 4000 6000 8000 Load Capacitance (pF) Propagation Delay vs. Input Voltage (VIN=5V, VCC=12V, f=1kHz, CL=5.4nF) 180 160 tondly 140 120 100 80 toffdly 60 40 20 30 Input Threshold Voltage vs. Temperature (VCC=18V, CL=2.5nF) 50 toffdly 45 40 tondly 35 30 2 35 10000 Propagation Delay vs. Temperature (VCC=18V, f=1kHz, CL=5.4nF) 55 0 10 15 20 25 Supply Voltage (V) 4 6 8 Input Voltage (V) 10 -40 -20 12 Input Threshold vs. Supply Voltage 0 20 40 60 80 Temperature (ºC) 100 120 140 Enable Threshold vs. Supply Voltage 3.5 25 2.7 2.6 2.5 Min VIH 2.4 2.3 2.2 2.1 Max VIL 2.0 3.0 Enable Threshold (V) Input Threshold (V) Input Threshold Voltage (V) 30 Propagation Delay (ns) Propagation Delay vs. Supply Voltage (VIN=0-5V, f=1kHz, CL=5.4nF) Propagation Delay (ns) Propagation Delay (ns) 2000 0 Min VIH 2.5 Max VIL 2.0 1.5 1.0 1.9 -40 -20 R06 6 0 0 2.8 tf 7 10 0 5 8 VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=25V VCC=30V VCC=35V 50 10 0 tr 9 60 60 50 10 Fall Time vs. Load Capacitance Rise Time vs. Load Capacitance 100 Rise and Fall Times vs. Temperature (VIN=0-5V, VCC=18V, f=10kHz, CL=2.5nF) 5 0 70 200 11 50 Fall Time (ns) Rise Time (ns) Fall Time vs. Supply Voltage (Input=0-5V, f=10kHz, TA=25ºC) Rise & Fall Times (ns) 70 0 20 40 60 80 Temperature (ºC) 100 120 140 20 Min VENH 15 Max VENL 10 5 0 0 5 10 15 20 25 Supply Voltage (V) www.ixysic.com 30 35 0 5 10 15 20 25 Supply Voltage (V) 30 35 7 IXD_609 INTEGRATED CIRCUITS DIVISION 300 200 100 0 1000 150 100 50 150 100 50 0 1000 10000 10000 Load Capacitance (pF) Supply Current vs. Frequency (VCC=18V) Supply Current vs. Frequency (VCC=12V) Supply Current vs. Frequency (VCC=8V) 1000 1 1000 CL=10nF CL=5.4nF CL=1.5nF 100 10 1 10 100 1000 Frequency (kHz) 10000 1 10 100 1000 Frequency (kHz) 1.0 0.8 0.6 0.4 0.2 VIN=0V & 18V 0 1 0.1 20 40 60 80 Temperature (ºC) 10000 1 10 100 1000 Frequency (kHz) 10000 0.60 0.55 0.50 0.45 0.40 0.35 -40 -20 100 120 140 Output Source Current vs. Supply Voltage (f=422Hz, CL=66nF) -25 -20 -15 -10 -5 0 20 40 60 80 Temperature (ºC) 100 120 140 Output Sink Current vs. Supply Voltage (f=422Hz, CL=66nF) 30 Output Sink Current (A) -30 Output Source Current (A) 0.65 VIN=3.5V VIN=5V VIN=10V 1.2 Supply Current (mA) Supply Current (mA) 1.4 -40 -20 10 Dynamic Supply Current vs. Temperature (VIN=5V, VCC=18V, f=1kHz, CL=1.5nF) Quiescent Supply Current vs. Temperature 0.0 CL=10nF CL=5.4nF CL=1.5nF 100 0.01 0.1 0.1 25 20 15 10 5 0 0 0 8 f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz Load Capacitance (pF) 10 1 Supply Current vs. Load Capacitance (VCC=8V) Load Capacitance (pF) CL=10nF CL=5.4nF CL=1.5nF 100 200 0 1000 10000 Supply Current (mA) Supply Current (mA) 1000 200 f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz 250 Supply Current (mA) 400 Supply Current vs. Load Capacitance (VCC=12V) Supply Current (mA) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz 300 Supply Current (mA) Supply Current (mA) 500 Supply Current vs. Load Capacitance (VCC=18V) 5 10 15 20 25 Supply Voltage (V) 30 35 0 www.ixysic.com 5 10 15 20 25 Supply Voltage (V) 30 35 R06 IXD_609 INTEGRATED CIRCUITS DIVISION Output Source Current vs. Temperature (VCC=18V, f=422Hz, CL=66nF) 14.0 Output Sink Current (A) Output Source Current (A) -12.0 -11.5 -11.0 -10.5 -10.0 -9.5 -9.0 -40 -20 13.0 12.5 12.0 11.5 11.0 10.5 100 120 140 -40 -20 1.0 0.5 0 20 40 60 80 Temperature (ºC) 100 120 140 Low State Output Resistance vs. Supply Voltage (IOUT= +10mA ) 1.1 Output Resistance (Ω) Output Resistance (Ω) 20 40 60 80 Temperature (ºC) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.0 0 R06 13.5 10.0 0 High State Output Resistance vs. Supply Voltage (IOUT= -10mA) 1.5 Output Sink Current vs. Temperature (VCC=18V, f=422Hz, CL=66nF) 5 10 15 20 25 Supply Voltage (V) 30 35 0 www.ixysic.com 5 10 15 20 25 Supply Voltage (V) 30 35 9 IXD_609 INTEGRATED CIRCUITS DIVISION 5 Manufacturing Information 5.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating IXD_609 All Versions MSL 1 5.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 5.3 Soldering Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. 10 Device Maximum Temperature x Time Maximum Reflow Cycles IXD_609CI IXD_609YI IXD_609PI IXD_609SI / IXD_609SIA / IXD_609D2 245°C for 30 seconds 245°C for 30 seconds 250°C for 30 seconds 260°C for 30 seconds 3 3 www.ixysic.com R06 IXD_609 INTEGRATED CIRCUITS DIVISION 5.4 Mechanical Dimensions 5.4.1 SIA (8-Pin SOIC) 1.270 REF (0.050) Pin 8 PCB Land Pattern 0.60 (0.024) 0.762 ± 0.254 (0.030 ± 0.010) 3.937 ± 0.254 (0.155 ± 0.010) 5.994 ± 0.254 (0.236 ± 0.010) 1.55 (0.061) 5.40 (0.213) Pin 1 0.406 ± 0.076 (0.016 ± 0.003) 1.346 ± 0.076 (0.053 ± 0.003) 4.928 ± 0.254 (0.194 ± 0.010) 1.27 (0.050) 0.559 ± 0.254 (0.022 ± 0.010) Dimensions mm (inches) 0.051 MIN - 0.254 MAX (0.002 MIN - 0.010 MAX) 5.4.2 SI (8-Pin Power SOIC with Exposed Metal Back) 3.80 (0.150) 0.762 ± 0.254 (0.030 ± 0.010) 3.937 ± 0.254 (0.155 ± 0.010) 5.994 ± 0.254 (0.236 ± 0.010) 5.40 2.75 (0.209) (0.108) 1.55 (0.061) Pin 1 0.406 ± 0.076 (0.016 ± 0.003) 1.27 (0.050) 1.270 REF (0.050) 4.928 ± 0.254 (0.194 ± 0.010) 0.60 (0.024) Recommended PCB Land Pattern 1.346 ± 0.076 (0.053 ± 0.003) 2.540 ± 0.254 (0.100 ± 0.010) 7º 0.051 MIN - 0.254 MAX (0.002 MIN - 0.010 MAX) 3.556 ± 0.254 (0.140 ±0.010) Dimensions mm (inches) Note: The exposed metal pad on the back of the SI package should be connected to GND. It is not suitable for carrying current. R06 www.ixysic.com 11 IXD_609 INTEGRATED CIRCUITS DIVISION 5.4.3 Tape & Reel Information for SI and SIA Packages 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=12.00 (0.472) B0=5.30 (0.209) A0=6.50 (0.256) K0= 2.10 (0.083) P=8.00 (0.315) Dimensions mm (inches) User Direction of Feed Embossed Carrier NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 Embossment 5.4.4 YI (5-Pin TO-263) 14.605 / 15.875 (0.575 / 0.625) 1.143 / 1.651 (0.045 / 0.065) 1.143 / 1.397 (0.045 / 0.055) 9.652 / 10.312 (0.380 / 0.406) 4.318 / 4.597 (0.170 / 0.181) Recommended PCB Pattern 10.40 (0.409) 8.636 / 9.144 (0.340 / 0.360) 3.65 (0.144) 1 2 3 4 5 6.35 (0.250) 3.95 (0.156) 0º - 8º 1.70 BSC (0.067 BSC) 0.737 / 0.889 (0.029 / 0.035) 9.30 (0.366) 1.70 (0.067) 2.286 / 2.794 (0.090 / 0.110) 1.00 (0.039) 6.223 MIN (0.245 MIN) 0.000 / 0.305 (0.000 / 0.012) 6.858 MIN (0.270 MIN) DIMENSIONS mm MIN / mm MAX (inches MIN / inches / MAX) 6 NOTES: 1. All metal surfaces are solder-plated except trimmed area. 2. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally. 12 www.ixysic.com R06 IXD_609 INTEGRATED CIRCUITS DIVISION 5.4.5 PI (8-Pin DIP) 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 3.302 ± 0.051 (0.130 ± 0.002) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) 5.4.6 CI (5-Pin TO-220) 1.14 / 1.40 (0.045 / 0.055) 4.32 / 4.83 (0.170 / 0.190) 9.91 / 10.54 (0.390 / 0.415) 14.73 / 15.75 (0.580 / 0.620) 11.94 / 12.95 (0.470 / 0.510) 7.823 (0.308) 12.387 (0.487) 8.64 / 9.40 (0.340 / 0.370) 6.299 (0.248) 3 1 2 3 4 5 6.502 (0.256) 25.27 / 26.54 (0.995 / 1.045) 0.64 / 1.02 (0.025 / 0.040) DIMENSIONS mm MIN / mm MAX (inches MIN / inches / MAX) 1.70 BSC (0.067 BSC) 0.38 / 0.64 (0.015 / 0.025) 2.29 / 2.92 (0.090 / 0.115) NOTES: 1. This drawing will meet all dimensions requirement of JEDEC outlines TS-001AA and 5-lead version TO-220AB. 2. Mounting hole diameter: 3.53 / 3.96 (0.139 / 0.156) 3. The metal tab is connected to pin 3 (GND). R06 7.620 (0.300) 12.70 / 14.73 (0.50 / 0.58) Recommended Hole Pattern Finished Hole Diameter = 1.45mm (0.057 in.) 1.70mm (0.067 in.) www.ixysic.com 13 IXD_609 INTEGRATED CIRCUITS DIVISION 5.4.7 D2 (8-Pin DFN) 5.00 BSC (0.197 BSC) 0.80 / 1.00 (0.031 / 0.039) 0.20 REF (0.008 REF) Pin 1 4.00 BSC (0.157 BSC) 0.35 x 45º (0.014 x 45º) 0.95 (0.037) 4.50 (0.177) 3.10 (0.122) 0.45 (0.018) 0.10 (0.004) 2.60 (0.102) 1.20 (0.047) 0.74 / 0.83 (0.029 / 0.033) Recommended PCB Land Pattern 3.03 / 3.10 (0.119 / 0.122) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 0.30 / 0.45 (0.012 / 0.018) 0.95 BSC (0.037 BSC) Pin 1 Pin 8 2.53 / 2.60 (0.100 / 0.102) 0.35 / 0.45 x 45º (0.014 / 0.018 x 45º) NOTE: The exposed metal pad on the back of the D2 package should be connected to GND. Pad is not suitable for carrying current. 5.4.8 Tape & Reel Information for D2 Package 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) ∅1.55 ± 0.05 4.00 ± 0.10 See Note #2 2.00 ± 0.05 R0.75 TYP 1.75 ± 0.10 (0.05) 5º MAX 5.50 ± 0.05 (0.05) B0=5.40 ± 0.10 12.00 ± 0.30 Embossed Carrier K0=1.90 ± 0.10 8.00 ± 0.10 5º MAX A0=4.25 ± 0.10 Embossment 0.30 ± 0.05 ∅1.50 (MIN) NOTES: 1. A0 & B0 measured at 0.3mm above base of pocket. 2. 10 pitches cumulative tol. ± 0.2mm 3. ( ) Reference dimensions only. 4. Unless otherwise specified, all dimensions in millimeters. For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IXD_609-R06 ©Copyright 2014, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 9/25/2014 14 www.ixysic.com R06