Material Content Data Sheet Sales Product Name BSF450NE7NH3 MA# MA001030190 Package MG-WDSON-2-1 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip leadframe leadfinish inorganic material non noble metal non noble metal noble metal non noble metal plastics noble metal non noble metal noble metal non noble metal plastics < 10% silicon copper nickel silver nickel epoxy resin silver copper silver tin epoxy resin 7440-21-3 7440-50-8 7440-02-0 7440-22-4 7440-02-0 7440-22-4 7440-50-8 7440-22-4 7440-31-5 - plating glue solder passivation *deviation 29. August 2013 Weight [mg] 49.87 mg Average Mass [%] Sum [%] Average Mass [ppm] 1.774 3.56 3.56 35579 35579 45.429 91.11 91.11 911027 911027 0.121 0.24 0.482 0.97 1.21 9663 12092 0.121 0.24 0.24 2429 2429 0.107 0.21 2429 2145 0.657 1.32 0.005 0.01 1.53 13176 0.032 0.06 1.028 2.06 2.13 20605 0.110 0.22 0.22 2199 2. 3. 641 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 15321 107 Important Remarks: 1. Sum [ppm] 21353 2199 1000000