LM137, LM337-N www.ti.com SNVS778D – MAY 1999 – REVISED APRIL 2013 LM137/LM337-N 3-Terminal Adjustable Negative Regulators Check for Samples: LM137, LM337-N FEATURES 1 • • 2 • • • • • • • • • • • Output Voltage Adjustable from −1.2V to −37V 1.5A Output Current Specified, −55°C to +150°C Line Regulation Typically 0.01%/V Load Regulation Typically 0.3% Excellent Thermal Regulation, 0.002%/W 77 dB Ripple Rejection Excellent Rejection of Thermal Transients 50 ppm/°C Temperature Coefficient Temperature-independent Current Limit Internal Thermal Overload Protection P+ Product Enhancement Tested Standard 3-lead Transistor Package Output is Short Circuit Protected DESCRIPTION The LM137/LM337-N are adjustable 3-terminal negative voltage regulators capable of supplying in excess of −1.5A over an output voltage range of −1.2V to −37V. These regulators are exceptionally easy to apply, requiring only 2 external resistors to set the output voltage and 1 output capacitor for frequency compensation. The circuit design has been optimized for excellent regulation and low thermal transients. Further, the LM137 series features internal current limiting, thermal shutdown and safe-area compensation, making them virtually blowout-proof against overloads. The LM137/LM337-N serve a wide variety of applications including local on-card regulation, programmable-output voltage regulation or precision current regulation. The LM137/LM337-N are ideal complements to the LM117/LM317 adjustable positive regulators. Table 1. LM137 Series Packages and Power Capability Device LM137/337-N Package TO-3 (K) Rated Power Dissipation Design Load Current 20W 1.5A TO (NDT) 2W 0.5A LM337-N TO-220 (NDE) 15W 1.5A LM337-N SOT-223 (DCY) 2W 1A 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM137, LM337-N SNVS778D – MAY 1999 – REVISED APRIL 2013 www.ti.com Typical Applications Full output current not available at high input-output voltages †C1 = 1 μF solid tantalum or 10 μF aluminum electrolytic required for stability *C2 = 1 μF solid tantalum is required only if regulator is more than 4″ from power-supply filter capacitor Output capacitors in the range of 1 μF to 1000 μF of aluminum or tantalum electrolytic are commonly used to provide improved output impedance and rejection of transients Figure 1. Adjustable Negative Voltage Regulator Comparison between SOT-223 and D-Pak (TO-252) Packages Figure 2. Scale 1:1 2 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM137 LM337-N LM137, LM337-N www.ti.com SNVS778D – MAY 1999 – REVISED APRIL 2013 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) Power Dissipation Internally Limited Input-Output Voltage Differential 40V Operating Junction Temperature Range LM137 −55°C to +150°C LM337-N 0°C to +125°C −40°C to +125°C LM337I −65°C to +150°C Storage Temperature Lead Temperature (Soldering, 10 sec.) 300°C Plastic Package (Soldering, 4 sec.) 260°C ESD Rating (1) (2) 2k Volts Refer to RETS137H drawing for LM137H or RETS137K drawing for LM137K military specifications. Unless otherwise specified, these specifications apply −55°C ≤ Tj ≤ +150°C for the LM137, 0°C ≤ Tj ≤ +125°C for the LM337-N; VIN − VOUT = 5V; and IOUT = 0.1A for the TO package and IOUT = 0.5A for the TO-3, SOT-223 and TO-220 packages. Although power dissipation is internally limited, these specifications are applicable for power dissipations of 2W for the TO and SOT-223 (see APPLICATION HINTS), and 20W for the TO-3, and TO-220. IMAX is 1.5A for the TO-3, SOT-223 and TO-220 packages, and 0.2A for the TO package. ELECTRICAL CHARACTERISTICS (1) Parameter Conditions LM137 Min Line Regulation Tj = 25°C, 3V ≤ |VIN − VOUT| ≤ 40V LM337 Typ Max 0.01 0.02 Min Units Typ Max 0.01 0.04 %/V (2) IL = 10 mA Load Regulation Tj = 25°C, 10 mA ≤ IOUT ≤ IMAX Thermal Regulation Tj = 25°C, 10 ms Pulse Adjustment Pin Current Adjustment Pin Current Charge 10 mA ≤ IL ≤ IMAX 0.3 0.5 0.3 1.0 % 0.002 0.02 0.003 0.04 %/W 65 100 65 100 μA 2 5 2 5 μA 3.0V ≤ |VIN − VOUT| ≤ 40V, TA = 25°C Reference Voltage Tj = 25°C (3) 3V ≤ |VIN − VOUT| ≤ 40V, (3) −1.225 −1.250 −1.275 −1.213 −1.250 −1.287 V −1.200 −1.250 −1.300 −1.200 −1.250 −1.300 V 10 mA ≤ IOUT ≤ IMAX, P ≤ PMAX Line Regulation 3V ≤ |VIN − VOUT| ≤ 40V, (2) (2) 0.02 0.05 0.02 0.07 %/V 0.3 1 0.3 1.5 % Load Regulation 10 mA ≤ IOUT ≤ IMAX, Temperature Stability TMIN ≤ Tj ≤ TMAX 0.6 Minimum Load Current |VIN − VOUT| ≤ 40V 2.5 5 2.5 10 mA |VIN − VOUT| ≤ 10V 1.2 3 1.5 6 mA (1) (2) (3) 0.6 % Unless otherwise specified, these specifications apply −55°C ≤ Tj ≤ +150°C for the LM137, 0°C ≤ Tj ≤ +125°C for the LM337-N; VIN − VOUT = 5V; and IOUT = 0.1A for the TO package and IOUT = 0.5A for the TO-3, SOT-223 and TO-220 packages. Although power dissipation is internally limited, these specifications are applicable for power dissipations of 2W for the TO and SOT-223 (see APPLICATION HINTS), and 20W for the TO-3, and TO-220. IMAX is 1.5A for the TO-3, SOT-223 and TO-220 packages, and 0.2A for the TO package. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specification for thermal regulation. Load regulation is measured on the output pin at a point ⅛ in. below the base of the TO-3 and TO packages. Selected devices with tightened tolerance reference voltage available. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM137 LM337-N 3 LM137, LM337-N SNVS778D – MAY 1999 – REVISED APRIL 2013 www.ti.com ELECTRICAL CHARACTERISTICS(1) (continued) Parameter Current Limit Conditions LM137 LM337 Units Min Typ Max Min Typ Max K, DCY and NDE Package 1.5 2.2 3.5 1.5 2.2 3.7 A NDT Package 0.5 0.8 1.8 0.5 0.8 1.9 A K, DCY and NDE Package 0.24 0.4 0.15 0.4 NDT Package 0.15 0.17 0.10 |VIN − VOUT| ≤ 15V |VIN − VOUT| = 40V, Tj = 25°C RMS Output Noise, % of VOUT Tj = 25°C, 10 Hz ≤ f ≤ 10 kHz Ripple Rejection Ratio VOUT = −10V, f = 120 Hz CADJ = 10 μF 66 A 0.17 A 0.003 0.003 % 60 60 dB 77 66 77 dB Long-Term Stability Tj = 125°C, 1000 Hours 0.3 1 0.3 1 % Thermal Resistance, Junction to Case NDT Package 12 15 12 15 °C/W K Package 2.3 3 2.3 3 °C/W NDE Package Thermal Resistance, Junction to Ambient (No Heat Sink) 4 4 °C/W NDT Package 140 140 °C/W K Package 35 35 °C/W NDE Package 50 °C/W DCY Package 170 °C/W Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM137 LM337-N LM137, LM337-N www.ti.com SNVS778D – MAY 1999 – REVISED APRIL 2013 SCHEMATIC DIAGRAM Thermal Regulation When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC circuit components. With an IC regulator, this gradient can be especially severe since power dissipation is large. Thermal regulation is the effect of these temperature gradients on output voltage (in percentage output change) per Watt of power change in a specified time. Thermal regulation error is independent of electrical regulation or temperature coefficient, and occurs within 5 ms to 50 ms after a change in power dissipation. Thermal regulation depends on IC layout as well as electrical design. The thermal regulation of a voltage regulator is defined as the percentage change of VOUT, per Watt, within the first 10 ms after a step of power is applied. The LM137's specification is 0.02%/W, max. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM137 LM337-N 5 LM137, LM337-N SNVS778D – MAY 1999 – REVISED APRIL 2013 www.ti.com LM137, VOUT = −10V VIN − VOUT = −40V IIL = 0A → 0.25A → 0A Vertical sensitivity, 5 mV/div Figure 3. In Figure 3, a typical LM137's output drifts only 3 mV (or 0.03% of VOUT = −10V) when a 10W pulse is applied for 10 ms. This performance is thus well inside the specification limit of 0.02%/W × 10W = 0.2% max. When the 10W pulse is ended, the thermal regulation again shows a 3 mV step at the LM137 chip cools off. Note that the load regulation error of about 8 mV (0.08%) is additional to the thermal regulation error. In Figure 4, when the 10W pulse is applied for 100 ms, the output drifts only slightly beyond the drift in the first 10 ms, and the thermal error stays well within 0.1% (10 mV). LM137, VOUT = −10V VIN − VOUT = −40V IL = 0A → 0.25A → 0A Horizontal sensitivity, 20 ms/div Figure 4. 6 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM137 LM337-N LM137, LM337-N www.ti.com SNVS778D – MAY 1999 – REVISED APRIL 2013 Connection Diagrams Case Is Input See STD Mil DWG 5962P99517 for Radiation Tolerant Devices Case is Input Figure 5. TO-3 Metal Can Package Bottom View See Package Number K0002C See Package Number NDS0002A Figure 6. TO Metal Can Package Bottom View See Package Number NDT0003A Figure 7. TO-220 Plastic Package Front View See Package Number NDE0003B Figure 8. 3-Lead SOT-223 Front View Package Marked N02A See Package Number DCY0004A Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM137 LM337-N 7 LM137, LM337-N SNVS778D – MAY 1999 – REVISED APRIL 2013 www.ti.com APPLICATION HINTS When a value for θ(H−A) is found using the equation shown, a heatsink must be selected that has a value that is less than or equal to this number. HEATSINKING SOT-223 PACKAGE PARTS The SOT-223 (“DCY”) packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane. Figure 9 and Figure 10 show the information for the SOT-223 package. Figure 10 assumes a θ(J−A) of 75°C/W for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C. Figure 9. θ(J−A) vs Copper (2 ounce) Area for the SOT-223 Package Figure 10. Maximum Power Dissipation vs. TAMB for the SOT-223 Package Please see AN-1028 (literature number SNVA036) for power enhancement techniques to be used with the SOT223 package. 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM137 LM337-N LM137, LM337-N www.ti.com SNVS778D – MAY 1999 – REVISED APRIL 2013 Typical Applications Figure 11. Adjustable Lab Voltage Regulator Full output current not available at high input-output voltages *The 10 μF capacitors are optional to improve ripple rejection Figure 12. Current Regulator Figure 13. Negative Regulator with Protection Diodes *When CL is larger than 20 μF, D1 protects the LM137 in case the input supply is shorted **When C2 is larger than 10 μF and −VOUT is larger than −25V, D2 protects the LM137 in case the output is shorted Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM137 LM337-N 9 LM137, LM337-N SNVS778D – MAY 1999 – REVISED APRIL 2013 www.ti.com Figure 14. −5.2V Regulator with Electronic Shutdown* *Minimum output ≃ −1.3V when control input is low Figure 15. Adjustable Current Regulator Figure 16. High Stability −10V Regulator 10 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM137 LM337-N LM137, LM337-N www.ti.com SNVS778D – MAY 1999 – REVISED APRIL 2013 TYPICAL PERFORMANCE CHARACTERISTICS (K Steel and NDE Packages) Load Regulation Current Limit Figure 17. Figure 18. Adjustment Current Dropout Voltage Figure 19. Figure 20. Temperature Stability Minimum Operating Current Figure 21. Figure 22. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM137 LM337-N 11 LM137, LM337-N SNVS778D – MAY 1999 – REVISED APRIL 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) (K Steel and NDE Packages) 12 Ripple Rejection Ripple Rejection Figure 23. Figure 24. Ripple Rejection Output Impedance Figure 25. Figure 26. Line Transient Response Load Transient Response Figure 27. Figure 28. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM137 LM337-N LM137, LM337-N www.ti.com SNVS778D – MAY 1999 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision C (April 2013) to Revision D • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 12 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM137 LM337-N 13 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM137H ACTIVE TO NDT 3 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 150 LM137HP+ LM137H/NOPB ACTIVE TO NDT 3 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 150 LM137HP+ LM337H ACTIVE TO NDT 3 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -40 to 125 LM337H LM337H/NOPB ACTIVE TO NDT 3 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -40 to 125 LM337H LM337IMP ACTIVE SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 125 N02A LM337IMP/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 N02A LM337IMPX ACTIVE SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 125 N02A LM337IMPX/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 N02A LM337T ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM337T P+ LM337T/LF01 ACTIVE TO-220 NDG 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR LM337T/NOPB ACTIVE TO-220 NDE 3 45 Pb-Free (RoHS Exempt) CU SN Level-1-NA-UNLIM LM337T P+ -40 to 125 LM337T P+ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM337IMP SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM337IMP/NOPB SOT-223 DCY 4 1000 330.0 LM337IMPX SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 16.4 7.0 7.5 2.2 12.0 16.0 LM337IMPX/NOPB SOT-223 DCY 4 2000 330.0 Q3 16.4 7.0 7.5 2.2 12.0 16.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM337IMP SOT-223 DCY 4 1000 367.0 367.0 35.0 LM337IMP/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM337IMPX SOT-223 DCY 4 2000 367.0 367.0 35.0 LM337IMPX/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NDT0003A H03A (Rev D) www.ti.com MECHANICAL DATA NDE0003B www.ti.com MECHANICAL DATA NDG0003F T03F (Rev B) www.ti.com MECHANICAL DATA MPDS094A – APRIL 2001 – REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 4 0,10 (0.004) M 3,70 (0.146) 3,30 (0.130) 7,30 (0.287) 6,70 (0.264) Gauge Plane 1 2 0,84 (0.033) 0,66 (0.026) 2,30 (0.091) 4,60 (0.181) 1,80 (0.071) MAX 3 0°–10° 0,10 (0.004) M 0,25 (0.010) 0,75 (0.030) MIN 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,08 (0.003) 0,10 (0.0040) 0,02 (0.0008) 4202506/B 06/2002 NOTES: A. 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