ON MC74VHC1G66 Spst (no) normally open analog switch Datasheet

MC74VHC1G66,
NLVHC1G66
SPST (NO) Normally Open
Analog Switch
MARKING DIAGRAMS
5
SC−88A
DF SUFFIX
CASE 419A
V9 M G
G
1
5
5
1
V9 M G
G
TSOP−5
DT SUFFIX
CASE 483
1
VW M
G
1
UDFN6
MU SUFFIX
CASE 517AA
Features
•
•
•
•
•
•
•
•
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M
The MC74VHC1G66, NLVHC1G66 is a single pole single throw
(SPST) analog switch. It achieves high speed propagation delays and
low ON resistances while maintaining low power dissipation. This
bilateral switch controls analog and digital voltages that may vary
across the full power−supply range (from VCC to GND).
The MC74VHC1G66, NLVHC1G66 is compatible in function to a
single gate of the High Speed CMOS MC74VHC4066 and the
metal−gate CMOS MC14066. The device has been designed so that
the ON resistances (RON) are much lower and more linear over input
voltage than RON of the metal−gate CMOS or High Speed CMOS
analog switches.
The newer NLVHC offers the same functionality in a
1.2x1.0x0.55mm UDFN6 package.
The ON/OFF control inputs are compatible with standard CMOS
outputs. The ON/OFF control input structure provides protection when
voltages between 0 V and 5.5 V are applied, regardless of the supply
voltage. This input structure helps prevent device destruction caused by
supply voltage − input/output voltage mismatch, battery backup,
hot insertion, etc.
High Speed: tPD = 20 ns (Typ) at VCC = 5.0 V
Low Power Dissipation: ICC = 1.0 mA (Max) at TA = 25°C
Diode Protection Provided on Inputs and Outputs
Improved Linearity and Lower ON Resistance over Input Voltage
Chip Complexity: 11 FETs or 3 Equivalent Gates
ON/OFF Control Input has OVT
V9, V = Device Code
M
= Date Code*
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
Chip Complexity: FETs = 11
Pb−Free Packages are Available
PIN ASSIGNMENT
1
IN/OUT XA
2
OUT/IN YA
3
GND
4
ON/OFF CONTROL
5
VCC
FUNCTION TABLE
On/Off Control Input
State of Analog Switch
L
H
Off
On
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
© Semiconductor Components Industries, LLC, 2007
February, 2007 − Rev. 13
1
Publication Order Number:
MC74VHC1G66/D
MC74VHC1G66, NLVHC1G66
IN/OUT XA
1
OUT/IN YA
2
GND
3
5
4
VCC
IN/OUT XA
1
6
VCC
OUT/IN YA
2
5
NC
GND
3
4
ON/OFF
CONTROL
ON/OFF
CONTROL
(SC−88A, TSOP−5)
(UDFN6)
Figure 1. Pinout Diagrams
ON/OFF CONTROL
X1
1
U
1
U
IN/OUT XA
Figure 2. Logic Symbol
OUT/IN
YA
MAXIMUM RATINGS
Symbol
Characteristics
VCC
DC Supply Voltage
VIN
Digital Input Voltage
VIS
Analog Output Voltage
IIK
ICC
TSTG
V
−0.5 to +7.0
V
V
Digital Input Diode Current
−20
mA
DC Supply Current, VCC and GND
+25
mA
*65 to )150
°C
260
°C
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
qJA
Thermal Resistance
PD
Power Dissipation in Still Air at 85°C
MSL
Moisture Sensitivity
FR
Flammability Rating
ILATCHUP
Unit
−0.5 to VCC +0.5
TL
VESD
Value
−0.5 to +7.0
ESD Withstand Voltage
Latchup Performance
)150
°C
SC70−5 (Note 1)
SOT23−5
350
230
°C/W
SC70−5
SOT23−5
150
200
mW
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
u2000
u200
N/A
V
Above VCC and Below GND at 125°C (Note 5)
$500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
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2
MC74VHC1G66, NLVHC1G66
RECOMMENDED OPERATING CONDITIONS
Characteristics
Min
Max
Unit
2.0
5.5
V
DC Input Voltage
GND
5.5
V
VIS
DC Output Voltage
GND
VCC
V
TA
Operating Temperature Range
−55
+125
°C
tr, tf
Input Rise and Fall Time
ON/OFF Control Input
0
0
100
20
ns/V
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
TJ = 80 ° C
Time, Hours
TJ = 90 ° C
Junction
Temperature °C
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ =100° C
Device Junction Temperature versus
Time to 0.1% Bond Failures
TJ =110 ° C
VIN
TJ =120° C
DC Supply Voltage
TJ = 130° C
VCC
NORMALIZED FAILURE RATE
Symbol
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Test Conditions
TA = 25°C
VCC
(V)
Min
1.5
2.1
3.15
3.85
Max
TA ≤ 85°C
Min
Max
Min
Max
Minimum High−Level
Input Voltage
ON/OFF Control Input
RON = Per Spec
2.0
3.0
4.5
5.5
VIL
Maximum Low−Level
Input Voltage
ON/OFF Control Input
RON = Per Spec
2.0
3.0
4.5
5.5
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
V
IIN
Maximum Input
Leakage Current
ON/OFF Control Input
VIN = VCC or GND
0 to
5.5
±0.1
±1.0
±1.0
mA
ICC
Maximum Quiescent
Supply Current
VIN = VCC or GND
VIO = 0 V
5.5
1.0
20
40
mA
RON
Maximum ”ON”
Resistance
VIN = VIH
VIS = VCC or GND
|IIS| ≤ 5 mA (Figure 4)
3.0
4.5
5.5
60
45
40
70
50
45
100
60
55
W
IOFF
Maximum Off−Channel
Leakage Current
VIN = VIL
VIS = VCC or GND
Switch Off (Figure 5)
5.5
0.1
0.5
1.0
mA
3
1.5
2.1
3.15
3.85
Unit
VIH
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1.5
2.1
3.15
3.85
−55 ≤ TA ≤ 125°C
V
MC74VHC1G66, NLVHC1G66
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AC ELECTRICAL CHARACTERISTICS Cload = 50 pF, Input tr/tf = 3.0 ns
Symbol
tPLH,
tPHL
tPLZ,
tPHZ
tPZL,
tPZH
CIN
Parameter
VCC
(V)
TA ≤ 85°C
TA = 25°C
Typ
Max
Max
Unit
2.0
3.0
4.5
5.5
1
0.6
0.6
0.6
5
2
1
1
6
3
1
1
7
4
2
1
ns
2.0
3.0
4.5
5.5
32
28
24
20
40
35
30
25
45
40
35
30
50
45
40
35
ns
2.0
3.0
4.5
5.5
32
28
24
20
40
35
30
25
45
40
35
30
50
45
40
35
ns
ON/OFF Control Input
0.0
3
10
10
10
pF
Control Input = GND
Analog I/O
Feedthrough
5.0
4
4
10
10
10
10
10
10
Test Conditions
Maximum
Propagation Delay,
Input X to Y
YA = Open
Maximum
Propagation Delay,
ON/OFF Control to Analog
Output
RL = 1000 W
Maximum
Propagation Delay,
ON/OFF Control to
Analog Output
RL = 1000 W
Maximum Input
Capacitance
(Figure 14)
(Figure 15)
(Figure 15)
Min
Min
−55 ≤ TA ≤ 125°C
Max
Min
Typical @ 25°C, VCC = 5.0 V
CPD
18
Power Dissipation Capacitance (Note 6)
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted)
Symbol
BW
ISOoff
NOISEfeed
THD
Test Conditions
VCC
Limit
25°C
Maximum On−Channel Bandwidth or
Minimum Frequency Response
(Figure 10)
fin = 1 MHz Sine Wave
Adjust fin voltage to obtain 0 dBm at VOS
Increase fin = frequency until dB meter reads −3 dB
RL = 50 W
3.0
4.5
5.5
150
175
180
MHz
Off−Channel Feedthrough Isolation
(Figure 11)
fin = Sine Wave
Adjust fin voltage to obtain 0 dBm at VIS
fin = 10 kHz, RL = 600 W
3.0
4.5
5.5
−80
−80
−80
dB
Feedthrough Noise Control to Switch
(Figure 12)
Vin ≤ 1 MHz Square Wave (tr = tf = 2 ns)
3.0
4.5
5.5
45
60
130
mVPP
Total Harmonic Distortion
(Figure 13)
fin = 1 kHz, RL = 10 kW
THD = THDMeasured − THDSource
VIS = 3.0 VPP sine wave
VIS = 5.0 VPP sine wave
Parameter
RL = 600 W
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4
Unit
%
3.3
5.5
0.30
0.15
MC74VHC1G66, NLVHC1G66
PLOTTER
POWER
SUPPLY
−
DC PARAMETER
ANALYZER
COMPUTER
+
VCC
VCC
1
VCC
5
1
2
5
2
VCC
3
VIL
A
4
3
Figure 4. On Resistance Test Set−Up
VCC
4
Figure 5. Maximum Off−Channel Leakage Current
Test Set−Up
VCC
1
A
5
1
2
N/C
VCC
3
2
TEST
POINT
VIH
5
4
VCC
3
Figure 6. Maximum On−Channel Leakage Current
Test Set−Up
4
Figure 7. Propagation Delay Test Set−Up
Switch to Position 2 when testing tPLZ and tPZL
Switch to Position 1 when testing tPHZ and tPZH
VCC
TEST POINT
VCC
VCC
1
1
2
A
5
2
VCC
1
N/C
1
N/C
2
5
RL
C L*
3
3
4
4
2
*Includes all probe and jig capacitance.
Figure 8. Propagation Delay Output Enable/Disable
Test Set−Up
Figure 9. Power Dissipation Capacitance
Test Set−Up
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5
MC74VHC1G66, NLVHC1G66
VIS
VOS
VCC
0.1 mF
fin
1
VOS
VCC
0.1 mF
fin
5
1
2
dB
Meter
5
2
3
dB
Meter
4
RL
3
*Includes all probe and jig capacitance.
*Includes all probe and jig capacitance.
Figure 10. Maximum On−Channel Bandwidth
Test Set−Up
Figure 11. Off−Channel Feedthrough Isolation
Test Set−Up
(VCC)/2
VCC
RL
RL
1
5
V
VOS
IS
2
IN
v 1 MHz
t r + t + 2 ns
f
3
VCC
4
GND
*Includes all probe and jig capacitance.
Figure 12. Feedthrough Noise, ON/OFF Control to
Analog Out, Test Set−Up
To Distortion
Meter
(VCC)/2
VIS
VCC
0.1 mF
RL
4
fin
1
VOS
5
2
3
4
*Includes all probe and jig capacitance.
Figure 13. Total Harmonic Distortion Test Set−Up
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6
MC74VHC1G66, NLVHC1G66
VCC
XA
50% VCC
50%
tPLH
tPHL
VOH
YA
50% VCC
VOL
Figure 14. Propagation Delay, Analog In to Analog Out Waveforms
tr
Control
tf
90%
50% VCC
10%
tPZL
VCC
tPLZ
High
Impedance
50% VCC
10%
Analog Out
90%
50% VCC
tPHZ
tPZH
VOL
VOH
High
Impedance
Figure 15. Propagation Delay, ON/OFF Control
ORDERING INFORMATION
Device
MC74VHC1G66DFT1
MC74VHC1G66DFT1G
MC74VHC1G66DFT2
MC74VHC1G66DFT2G
MC74VHC1G66DTT1
Package
Shipping †
SC−88A
SC−88A
(Pb−Free)
SC−88A
SC−88A
(Pb−Free)
3000 / Tape & Reel
TSOP−5
MC74VHC1G66DTT1G
TSOP−5
(Pb−Free)
NLVHC1G66MUR2G
UDFN6
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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7
MC74VHC1G66, NLVHC1G66
PACKAGE DIMENSIONS
SC−88A, SOT−353, SC−70
CASE 419A−02
ISSUE J
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
−−−
0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
J
C
K
H
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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8
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
−−−
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
MC74VHC1G66, NLVHC1G66
PACKAGE DIMENSIONS
TSOP−5, SOT23−5
CASE 483−02
ISSUE F
NOTE 5
2X
0.10 T
2X
0.20 T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
D 5X
0.20 C A B
5
1
4
2
3
M
B
S
K
L
DETAIL Z
G
A
DIM
A
B
C
D
G
H
J
K
L
M
S
DETAIL Z
J
C
0.05
SEATING
PLANE
H
T
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
1.25
1.55
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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9
MC74VHC1G66, NLVHC1G66
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA−01
ISSUE A
PIN ONE
REFERENCE
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
ÉÉ
ÉÉ
ÉÉ
E
DIM
A
A1
A3
b
D
E
e
L
L2
TOP VIEW
2X
0.10 C
(A3)
0.10 C
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.00 BSC
1.20 BSC
0.40 BSC
0.30
0.40
0.40
0.50
A
10X
0.08 C
SEATING
PLANE
SIDE VIEW
C
A1
5X
1
L
MOUNTING FOOTPRINT*
3
6X
L2
6X
6X
0.42
0.22
b
0.10 C A B
0.05 C
6
4
e
NOTE 3
BOTTOM VIEW
0.40
PITCH
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MC74VHC1G66/D