LIGITEK LTD521-25-XX-PF Triple digit led display (0.56 inch) Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TRIPLE DIGIT LED DISPLAY (0.56 Inch)
Pb
Lead-Free Parts
LTD521/25-XX-PF
DATA SHEET
DOC. NO
REV.
DATE
:
:
QW0905- LTD521/25-XX-PF
A
:
12 - Mar.- 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/9
PART NO. LTD521/25-XX-PF
Package Dimensions
37.6
(1.481")
DIG.1
DIG.2
14.2
(0.56")
8.1
(0.319")
DIG.3
19.0
(0.748")
15.28
(0.602")
ψ1.7(0.067")
A
LTD521/25-XX-PF
LIGITEK
F
B
G
E
C
D
DP
4.1±0.5
Ø0.51
TYP
2.54X13=33.02(1.3")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ± 0.25(0.01") unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD521/25-XX-PF
Page 2/9
Internal Circuit Diagram
LTD5215-XX-PF
25
24
4
2
1
27
28
5
21
20
8
7
6
23
22
9
16
15
13
11
10
17
12
14
A DIG.1
B
C
3,26
D
E
F
G
DP
A DIG.2
B
C
19
D
E
F
G
DP
A DIG.3
B
C
18
D
E
F
G
DP
LTD5225-XX-PF
25
24
4
2
1
27
28
5
21
20
8
7
6
23
22
9
16
15
13
11
10
17
12
14
A DIG.1
B
C
3,26
D
E
F
G
DP
A DIG.2
B
C
19
D
E
F
G
DP
A DIG.3
B
C
18
D
E
F
G
DP
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD521/25-XX-PF
Page 3/9
Electrical Connection
PIN NO.
LTD5215-XX-PF
PIN NO.
LTD5215-XX-PF
1
Anode Dig.1 E
15
Anode Dig.3 B
2
Anode Dig.1 D
16
Anode Dig.3 A
3
Common Cathode Dig.1
17
Anode Dig.3 F
4
Anode Dig.1 C
18
Common Cathode Dig.3
5
Anode Dig.1 DP
19
Common Cathode Dig.2
6
Anode Dig.2 E
20
Anode Dig.2 B
7
Anode Dig.2 D
21
Anode Dig.2 A
8
Anode Dig.2 C
22
Anode Dig.2 G
9
Anode Dig.2 DP
23
Anode Dig.2 F
10
Anode Dig.3 E
24
Anode Dig.1 B
11
Anode Dig.3 D
25
Anode Dig.1 A
12
Anode Dig.3 G
26
Common Cathode Dig.1
13
Anode Dig.3 C
27
Anode Dig.1 F
14
Anode Dig.3 DP
28
Anode Dig.1 G
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD521/25-XX-PF
Page 4/9
Electrical Connection
PIN NO.
LTD5225-XX-PF
PIN NO.
LTD5225-XX-PF
1
Cathode Dig.1 E
15
Cathode Dig.3 B
2
Cathode Dig.1 D
16
Cathode Dig.3 A
3
Common Anode Dig.1
17
Cathode Dig.3 F
4
Cathode Dig.1 C
18
Common Anode Dig.3
5
Cathode Dig.1 DP
19
Common Anode Dig.2
6
Cathode Dig.2 E
20
Cathode Dig.2 B
7
Cathode Dig.2 D
21
Cathode Dig.2 A
8
Cathode Dig.2 C
22
Cathode Dig.2 G
9
Cathode Dig.2 DP
23
Cathode Dig.2 F
10
Cathode Dig.3 E
24
Cathode Dig.1 B
11
Cathode Dig.3 D
25
Cathode Dig.1 A
12
Cathode Dig.3 G
26
Common Anode Dig.1
13
Cathode Dig.3 C
27
Cathode Dig.1 F
14
Cathode Dig.3 DP
28
Cathode Dig.1 G
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/9
PART NO. LTD521/25-XX-PF
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
SR
Forward Current Per Chip
IF
30
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
100
mA
Power Dissipation Per Chip
PD
100
mW
Ir
10
μA
Operating Temperature
Topr
-25 ~ +85
℃
Storage Temperature
Tstg
-25 ~ +85
℃
Reverse Current Per Any Chip
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Part Selection And Application Information(Ratings at 25℃)
common
cathode
Material Emitted or anode
CHIP
PART NO
△λ
Iv(mcd)
Vf(v)
(nm)
IV-M
Min. Typ. Max. Min. Typ.
Common
Cathode
LTD5215-XX-PF
GaAlAs
LTD5225-XX-PF
Electrical
λP
(nm)
660
Red
20
1.5
1.8
Common
Anode
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ± 15% testing tolerance.
2.4
4.0
6.1
2:1
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 6/9
PART NO. LTD521/25-XX-PF
Test Condition For Each Parameter
Symbol
Unit
Test Condition
Forward Voltage Per Chip
Vf
volt
If=20mA
Luminous Intensity Per Chip
Iv
mcd
If=10mA
Peak Wavelength
λp
nm
If=20mA
△λ
nm
If=20mA
Ir
μA
Vr=5V
Parameter
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD521/25-XX-PF
Page 7/9
Typical Electro-Optical Characteristics Curve
SR CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
1.0
2.0
3.0
4.0
1.0
5.0
10
Fig.4 Relative Intensity vs. Temperature
1.2
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
Relative Intensity@20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
650
700
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature( ℃)
Ambient Temperature( ℃)
600
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
750
80
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD521/25-XX-PF
Page 8/9
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One Time)
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260° C
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
Temp(°C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 9/9
PART NO. LTD521/25-XX-PF
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
Thermal Shock Test
1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
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