Rohm BD9895FV Silicon monolithic integrated circuit Datasheet

1/4
STRUCTURE
Silicon Monolithic Integrated Circuit
NAME OF PRODUCT
DC-AC Inverter Control IC
TYPE
BD9895FV
FUNCTION
・2ch control with Half-Bridge
・Lamp current and voltage sense feed back control
・Sequencing easily achieved with Soft Start Control
・Circuit protection with Timer Latch
・Under Voltage Lock Out
・Over Voltage Protection
・Mode-selectable the operating or stand-by mode by stand-by pin
・BURST mode controlled by PWM and DC input
・Output linear Controllable Analog dimming by external DC voltage
・Synchronous operating the other several BD9895FV IC’s
○Absolute Maximum Ratings(Ta = 25℃)
Parameter
Supply Voltage
Operating Temperature Range
Storage Temperature Range
Power Dissipation
Maximum Junction Temperature
*
Symbol
VCC
Topr
Tstg
Pd
Tjmax
Limits
15
-40~+90
-55~+150
1062*
+150
Unit
V
℃
℃
mW
℃
Pd derated at 8.5mW/℃ for temperature above Ta = 25℃ (When mounted on a PCB 70.0mm×70.0mm×1.6mm)
〇Recommended operating condition
Parameter
Supply voltage
Output oscillation frequency
BCT oscillation frequency
Symbol
VCC
fout
fBCT
Limits
6.0~14.0
25~90
0.05~1.00
Unit
V
kHz
kHz
Status of this document
The Japanese version of this document is the official specification.
Please use the translation version of this document as a reference to expedite understanding of the official version.
If these are any uncertainty in translation version of this document, official version takes priority.
REV. C
2/4
○Electric Characteristics(Ta=25℃,VCC=7V)
Parameter
((WHOLE DEVICE)
)
Operating current
Stand-by current
((OVER VOLTAGE DETECT))
FB over voltage detect voltage
((STAND BY CONTROL))
Stand-by voltage L
Input voltage range of Slave setting
Input voltage range of Master setting
((TIMER LATCH))
Timer Latch voltage
Timer Latch current
((BURST MODE))
BOSC Max voltage
BOSC Min Voltage
BOSC constant current
BOSC frequency
((OSC BLOCK))
MAX DUTY
Soft start current
IS COMP detect Voltage
SS COMP detect voltage
SRT ON resistance
((UVLO BLOCK))
Detect voltage (VCC_UVLO)
Hysteresis width (UVLO)
Operating voltage (VCC_UVLO)
Hysteresis width (VCC_UVLO)
((REG BLOCK))
REG output voltage
REG source current
((FEED BACK BLOCK))
IS threshold voltage ①
IS threshold voltage ②
VS threshold voltage
IS source current 1
IS source current 2
VS source current
VREF input voltage range
((OUTPUT BLOCK)
)
Pch output voltage H
Nch output voltageH
Pch output voltage L
Nch output voltage L
Pch output sink resistance
Pch output source resistance
Nch output sink resistance
Nch output source resistance
Drive output frequency
((COMP BLOCK))
Overr voltage detect
Hysteresis width (COMP)
Symbol
MIN.
Limits
TYP.
MAX.
Unit
Icc1
Icc2
-
-
-
-
17.0
10
mA
μA
Vovf
2.20
2.40
2.60
V
VstL
VstH1
VstH2
-0.3
1.8
2.55
-
-
0.8
2.25
VCC
V
V
V
Vcp
Icp
1.9
0.5
2.0
1.0
2.1
1.5
V
μA
VburH
VburL
IBCT
fBCT
1.94
0.4
1.35/BRT
292.5
2.0
0.5
1.5/BRT
300
2.06
0.6
1.65/BRT
307.5
V
V
A
Hz
MAXDUTY
Iss
Visc
Vssc
RSRT
44.0
1.0
0.45
2.0
-
48.0
2.0
0.50
2.2
200
49.5
3.0
0.55
2.4
400
%
μA
V
V
Ω
Vcc_vuvlo
5.100
5.300
5.500
V
⊿Vcc_vuvlo
Vuvlo
⊿Vuvlo
0.150
2.260
0.075
0.200
2.340
0.100
0.250
2.420
0.125
V
V
V
VREG
IREG
3.038
5.0
3.100
-
3.162
-
V
mA
Vis①
Vis②
Vvs
Iis1
Iis2
Ivs
1.225
-
1.220
-
13.0
-
1.250
VREFIN
1.250
-
20.0
-
1.275
VIS①
1.280
1.5
27.0
1.0
V
V
V
μA
μA
μA
VREF IN
0.6
-
1.6
V
VoutPH
VoutNH
VoutPL
VoutNL
RsinkP
RsourceP
RsinkN
RsourceN
fOUT
VCC-0.3
VCC-0.3
-
-
-
-
-
-
57.9
VCC-0.1
VCC-0.1
0.1
0.1
5
8
5
8
60.0
-
-
0.3
0.3
10
16
10
16
62.1
V
V
V
V
Ω
Ω
Ω
Ω
KHz
VCOMPH
⊿VCOMPH
2.4
0.040
2.5
0.060
2.6
0.080
V
V
((PROTECT CLOCK))
FAIL-pin On resistor value
R_FAIL
-
200
400
(( SYNCRO BLOCK))
CT_SYNC_IN_High input Voltage Range
VCT_SYNC_IN_H
2.0
-
VCC*0.8
CT_SYNC_IN_Low input Voltage Range
VCT_SYNC_IN_L
-0.3
-
1.5
CT_SYNC_IN Pull-up resistor
RCT_SYNC_IN_pull_up
500
-
-
VCT_SYNC_IN
VCC*0.9
-
VCC
CT_SYNC_IN Self-oscillation voltage
RCT_SYNC_OUT_sink
CT_SYNC_OUT sink resistor value
-
150
300
RCT_SYNC_OUT_source
CT_SYNC_OUT source resistor value
-
370
740
CT_SYNC_OUT_High output Voltage Range VCT_SYNC_OUT _H
2.8
3.1
3.4
CT_SYNC_OUT_Low output Voltage Range
VCT_SYNC_OUT_L
-
-
0.5
SRT SYNC Exchange detect Voltage
Vsrtc
0.5
0.8
1.1
(This product is not designed for normal operation with in a radio active environment.)
REV. C
Ω
V
V
kΩ
V
Ω
Ω
V
V
V
Conditions
CT_SYNC_IN=Low
CT_SYNC_IN=OPEN
fBCT=0.3kHz
fBCT=0.3kHz
BRT=36kΩ BCT=0.048μF
fout=60kHz
VREF pin:OPEN,REG is shorted
VREF pin is supplied
DUTY=2.2V
DUTY=0V、IS=0.5V
Over 1.25V
effective
Isink = 10mA
Isource = 10mA
Isink = 10mA
Isource = 10mA
RT=15kΩ
is
not
3/4
〇Package Dimensions
Device Mark
BD9895FV
1
Lot No.
SSOP-B28 (Unit:mm)
〇Block Diagram
〇Pin Description
REV. C
端子番号
1
2
端子名
N1
P1
3
CP
4
5
6
7
8
REG
FAIL
VREF
CT_SYNC_OUT
CT_SYNC_IN
9
RT
10
SRT
11
GND
12
BCT
13
BRT
14
15
16
17
18
19
20
21
DUTY
STB
VS2
IS2
FB2
VS1
IS1
FB1
22
SS
23
24
25
26
27
28
COMP
VCC
UVLO
P2
N2
PGND
機 能
FET driver for 1ch
FET driver for 1ch
External capacitor from CP to GND for
Timer Latch
Internal regulator output
Protect clock output
Reference voltage
Output pin of CT synchronous signal
Input pin of CT synchronous signal
External resistor from SRT to RT for
adjusting the triangle oscillator
External resistor from SRT to RT for
adjusting the triangle oscillator
GROUND
External capacitor from BCT to GND for
adjusting the BURST triangle oscillator
External resistor from BRT to GND for
adjusting the BURST triangle oscillator
Control PWM mode and BURST mode
Stand-by switch, Master/Slave selection
Error amplifier input④
Error amplifier input③
Error amplifier output②
Error amplifier input②
Error amplifier input①
Error amplifier output①
External capacitor from SS to GND for Soft
Start Control
Over voltage detector
Supply voltage input
External Under Voltage Lock OUT
FET driver for 2ch
FET driver for 2ch
Ground for FET drivers
4/4
〇NOTE FOR USE
1. When designing the external circuit, including adequate margins for variation between external devices and the IC.Use
adequate margins for steady state and transient characteristics.
2. Recommended Operating Range
The circuit functionality is guaranteed within of ambient temperature operation range as long as it is within recommended
operating range. The standard electrical characteristic values cannot be guaranteed at other voltages in the operating
ranges, however, the variation will be small.
3. Mounting Failures
Mounting failures, such as misdirection or miscounts, may harm the device.
4. Electromagnetic Fields
A strong electromagnetic field may cause the IC to malfunction.
5.
The GND pin should be the location within
±0.3V compared with the PGND pin
6. BD9895FV has the short circuit protection with Thermal Shut Down System. When STB or Vcc pin re-supplied, They enables
to cancel the latch. If It rise the temperature of the chip more than 170℃(TYP), It make the external FET OFF
7. Absolute maximum ratings are those values that, if exceeded, may cause the life of a device to become significantly
shortened. Moreover, the exact failure mode caused by short or open is not defined. Physical countermeasures, such
as a fuse, need to be considered when using a device beyond its maximum ratings.
8. About the external FET, the parasitic Capacitor may cause the gate voltage to change, when the drain voltage is switching.
Make sure to leave adequate margin for this IC variation.
9. On operating Slow Start Control (SS is less than 2.2V), It does not operate Timer Latch.
10. By STB voltage, BD9895FV is changed to 3 states. Therefore, do not input STB pin voltage between one state and the
other state (0.8~1.8,2.25~2.55).
11.The pin connected a connector need to connect to the resistor for electrical surge destruction.
12.This IC is a monolithic IC which (as shown is Fig-1)has P+ substrate and between the various pins. A P-N junction
is formed from this P layer of each pin. For example, the relation between each potential is as follows,
○(When GND > PinB and GND > PinA, the P-N junction operates as a parasitic diode.)
○(When PinB > GND > PinA, the P-N junction operates as a parasitic transistor.)
Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits as well as operation faults and physical damage. Accordingly you must not use methods by
which parasitic diodes operate, such as applying a voltage that is lower than the GND(P substrate)voltage to an input
Transistor (NPN)
Resistance
pin.
(PinA)
B
(PinB)
E
C
C
GND
P
P+
N
P+
N
N
N
N
P substrate
GND
Parasitic diode
N
P substrate
GND
Parasitic diode
(PinB)
(PinA)
B
CC
B
EE
Parasitic diode
GND
GND
Other adjacent components
Parasitic diode
Fig-1 Simplified structure of a Bipolar IC
REV. C
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