Sample & Buy Product Folder Technical Documents Support & Community Tools & Software LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 LMK03806 Ultra Low Jitter Clock Generator With 14 Programmable Outputs 1 Features 2 Applications • • • 1 • • • • • • • • High Performance, Ultra Low Jitter Clock Generator Low Jitter – < 50-fs Jitter (1.875 MHz – 20 MHz) at 312.5MHz Output Frequency – < 150-fs Jitter (12 kHz – 20 MHz) at 312.5MHz Output Frequency Generates Multiple Clocks from a Low-Cost Crystal or External Clock. 14 Outputs With Programmable Output Format (LVDS, LVPECL, CMOS) Up to 8 Unique Output Frequencies. Industrial Temperature Range: –40 to 85 °C Tunable VCO Frequency from 2.37 – 2.6 GHz Programmable Dividers to Generate Multiple Clocks from a Low Cost Crystal. 3.15-V to 3.45-V Operation • • • • Ultra High-Speed Serial Interfaces in SONET/SDH Multi-Gigabit Ethernet and Fiber Channel Line Cards Base Band Units (BBUs) for RAN Applications GPON OLT/ONU , High-Speed Serial Interface such as PCIe, XAUI, SATA, SAS Clocking ADC, and DACs Clocking DSP, Microprocessors, and FPGAs 3 Description The LMK03806 device is a high-performance, ultra low-jitter, multi-rate clock generator capable of synthesizing 8 different frequencies on 14 outputs at frequencies of up to 2.6 GHz. Each output clock is programmable in LVDS, LVPECL or LVCMOS format. The LMK03806 integrates a high-performance integer-N PLL, low-noise VCO, and programmable output dividers to generate multiple reference clocks for SONET, Ethernet, Fiber Channel, XAUI, Backplane, PCIe, SATA, and Network Processors from a low-cost crystal. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LMK03806 WQFN (64) 9.00 mm × 9.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Functional Block Diagram OSCout0 Divide OSCin OSCout1 PLL CLKout0 CLKout6 Divide Divide CLKout1 CLKout7 CLKout2 CLKout8 Divide Divide CLKout3 CLKout9 CLKout4 CLKout10 Divide CLKout5 Divide CLKout11 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 6.1 6.2 6.3 6.4 6.5 6.6 6.7 1 1 1 2 3 5 Absolute Maximum Ratings ..................................... 5 ESD Ratings.............................................................. 5 Recommended Operating Conditions....................... 5 Thermal Information .................................................. 6 Electrical Characteristics........................................... 6 Timing Requirements .............................................. 14 Typical Characteristics ............................................ 15 7 Parameter Measurement Information ................ 16 8 Detailed Description ............................................ 17 7.1 Differential Voltage Measurement Terminology ..... 16 8.1 8.2 8.3 8.4 8.5 Overview ................................................................. Functional Block Diagrams .................................... Features Description ............................................... Device Functional Modes........................................ Programming........................................................... 17 17 19 21 22 8.6 Register Maps ......................................................... 23 9 Application and Implementation ........................ 40 9.1 9.2 9.3 9.4 Application Information............................................ Typical Application ................................................. System Examples ................................................... Do's and Don'ts ....................................................... 40 46 52 53 10 Power Supply Recommendations ..................... 53 10.1 Current Consumption and Power Dissipation Calculations.............................................................. 53 11 Layout................................................................... 54 11.1 Layout Guidelines ................................................. 54 11.2 Layout Example .................................................... 56 12 Device and Documentation Support ................. 57 12.1 12.2 12.3 12.4 12.5 12.6 12.7 Device Support...................................................... Documentation Support ........................................ Related Links ........................................................ Community Resource............................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 57 57 57 57 57 57 57 13 Mechanical, Packaging, and Orderable Information ........................................................... 58 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision H (August 2012) to Revision I Page • Added Device Information table, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .................................................................................................................................................................................. 1 • Separated Timing Requirements into its own section .......................................................................................................... 14 • Moved Serial MICROWIRE Timing Diagram and Terminology section ............................................................................... 19 • Moved Achievable Frequencies table and Common Frequency Plans table to Device Functional Modes section............. 21 • Added Driving OSCin Pins with a Differential Source section.............................................................................................. 41 • Added Frequency Planning with the LMK03806 and Configuring the PLL sections............................................................ 42 • Moved Thermal Management section and renamed it to Layout Guidelines ....................................................................... 54 2 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 5 Pin Configuration and Functions Vcc13 GPout1 GPout0 CLKout11 CLKout11* CLKout10* CLKout10 Vcc12 CLKout9 CLKout9* CLKout8* CLKout8 Vcc11 CLKout7 CLKout7* CLKout6* NKD Package 64-Pin WQFN Top View 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 CLKout0 1 48 CLKout6 CLKout0* 2 47 Vcc10 CLKout1* 3 46 DATAuWire CLKout1 4 45 CLKuWire NC 5 44 LEuWire SYNC 6 43 Vcc9 NC 7 42 CPout NC 8 41 Vcc8 NC 9 40 OSCout0* Vcc1 10 39 OSCout0 LDObyp1 11 38 Vcc7 LDObyp2 12 37 OSCin* CLKout2 13 36 OSCin CLKout2* 14 35 Vcc6 CLKout3* 15 34 NC CLKout3 16 33 Ftest/LD 27 28 29 30 31 32 OSCout1* CLKout5 26 Vcc5 CLKout5* 25 OSCout1 CLKout4* 24 NC Vcc3 CLKout4 23 NC 22 Readback 21 NC 20 NC 19 Vcc4 18 GND 17 Vcc2 DAP Pin Functions PIN I/O TYPE 1, 2 O Programmable Clock output 0 (clock group 0). 3, 4 O Programmable Clock output 1 (clock group 0). CLKout2, CLKout2* 13, 14 O Programmable Clock output 2 (clock group 1). CLKout3*, CLKout3 15, 16 O Programmable Clock output 3 (clock group 1). CLKout4, CLKout4* 19, 20 O Programmable Clock output 4 (clock group 2). CLKout5*, CLKout5 21, 22 O Programmable Clock output 5 (clock group 2). CLKout6, CLKout6* 48, 49 O Programmable Clock output 6 (clock group 3). CLKout7*, CLKout7 50, 51 O Programmable Clock output 7 (clock group 3). CLKout8, CLKout8* 53, 54 O Programmable Clock output 8 (clock group 4). CLKout9*, CLKout9 55, 56 O Programmable Clock output 9 (clock group 4). CLKout10, CLKout10* 58, 59 O Programmable Clock output 10 (clock group 5). CLKout11*, CLKout11 60, 61 O Programmable Clock output 11 (clock group 5). CLKuWire 45 I CMOS NAME NO. CLKout0, CLKout0* CLKout1*, CLKout1 DESCRIPTION MICROWIRE Clock Input. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 3 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com Pin Functions (continued) PIN NAME CPout NO. I/O TYPE DESCRIPTION 42 O ANLG Charge pump output. DAP — GND DIE ATTACH PAD, connect to GND. DATAuWire 46 I CMOS Ftest/LD 33 O Programmable GND 23 — PWR 62, 63 O CMOS These pins can be programmed for general purpose output. LDObyp1 11 — ANLG LDO Bypass, bypassed to ground with 10 µF capacitor. LDObyp2 12 — ANLG LDO Bypass, bypassed to ground with a 0.1 µF capacitor. MICROWIRE Latch Enable Input. DAP GPout0, GPout1 LEuWire NC OSCout1, OSCout1* 44 I CMOS 5, 7, 8, 9, 25, 26, 28,29, 34 — Do Not Connect 31, 32 O LVPECL MICROWIRE Data Input. Multiplexed Lock Detect and Test output pin. Ground These pins must be left floating. Do NOT ground. Buffered output 1 of OSCin port. Reference input to PLL. Reference input may be: OSCin, OSCin* 36, 37 I A Crystal for use with the internal crystal oscillator circuit. ANLG A XO, TCXO, or other external clock. Must be AC Coupled. OSCout0, OSCout0* Readback 39, 40 O Programmable 27 O CMOS Buffered output 0 of OSCin port. Pin that can be used to readback register information. SYNC 6 I CMOS Clock synchronization input. Vcc1 10 — PWR Power supply for VCO LDO. Vcc2 17 — PWR Power supply for clock group 1: CLKout2 and CLKout3. Vcc3 18 — PWR Power supply for clock group 2: CLKout4 and CLKout5. Vcc4 24 — PWR Power supply for digital. Vcc5 30 — PWR Power supply for clock inputs. Vcc6 35 — PWR Power supply. No bypassing required on this pin. Vcc7 38 — PWR Power supply for OSCin port. Vcc8 41 — PWR Power supply for PLL charge pump. Vcc9 43 — PWR Power supply for PLL. Vcc10 47 — PWR Power supply for clock group 3: CLKout6 and CLKout7. Vcc11 52 — PWR Power supply for clock group 4: CLKout8 and CLKout9. Vcc12 57 — PWR Power supply for clock group 5: CLKout10 and CLKout11. Vcc13 64 — PWR Power supply for clock group 0: CLKout0 and CLKout1. 4 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 6 Specifications 6.1 Absolute Maximum Ratings See (1) (2) . (3) VCC Supply voltage VIN Input voltage TL Lead temperature (solder 4 seconds) TJ Junction temperature IIN Differential input current (OSCin/OSCin*) MSL Moisture sensitivity level Tstg Storage temperature (1) (2) (3) MIN MAX UNIT –0.3 3.6 V –0.3 VCC + 0.3 V 260 °C 150 °C 5 mA –5 3 –65 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Never to exceed 3.6 V. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) ±750 Machine model (MM) ±150 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±750 V may actually have higher performance. 6.3 Recommended Operating Conditions TA Ambient temperature VCC = 3.3 V TJ Junction temperature VCC = 3.3 V VCC Supply voltage MIN NOM MAX –40 25 85 °C 125 °C 3.45 V 3.15 3.3 UNIT Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 5 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com 6.4 Thermal Information LMK03806 THERMAL METRIC (1) NKD (WQFN) UNIT 64 PINS Junction-to-ambient thermal resistance on 4-layer JEDEC PCB (2) RθJA (3) 25.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 6.9 °C/W RθJB Junction-to-board thermal resistance 4.0 °C/W ψJT Junction-to-top characterization parameter 0.1 °C/W ψJB Junction-to-board characterization parameter 4.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 0.8 °C/W (1) (2) (3) For more information about traditional and new thermal metrics, see the Semiconductors and IC Package Thermal Metrics application report (SPRA953). Specification assumes 32 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC PCB. These vias play a key role in improving the thermal performance of the WQFN. Note that the JEDEC PCB is a standard thermal measurement PCB and does not represent best performance a PCB can achieve. TI recommends that the maximum number of vias be used in the board layout. R θJA is unique for each PCB. Case is defined as the DAP (die attach pad) 6.5 Electrical Characteristics 3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Junction Temperature TJ ≤ 125 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at Recommended Operating Conditions at the time of product characterization and are not ensured. (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT CURRENT CONSUMPTION ICC_PD Powerdown supply current No DC path to ground on OSCout1/1* (2) ICC_CLKS Supply current with all clocks enabled (3) CLKoutX_Y_DIV = 16, CLKoutX_TYPE = 1 (LVDS), PLL locked 1 mA 445 mA EXTERNAL CLOCK (OSCin) SPECIFICATIONS fOSCin PLL reference Input (4) SLEWOSCin PLL reference clock minimum slew rate 20% to 80% on OSCin (5) VOSCin Input voltage for OSCin or OSCin* (5) AC coupled; Single-ended (Unused pin AC coupled to GND) Differential voltage swing AC coupled, see Figure 5 VOSCin-offset DC offset voltage between OSCin/OSCin* OSCinX* - OSCinX Each pin AC coupled fdoubler_max Doubler input frequency (5) EN_PLL_REF_2X = 1; OSCin Duty Cycle 40% to 60% VIDOSCin VSSOSCin 1 0.15 500 0.5 MHz V/ns 0.2 2.4 Vpp 0.2 1.55 |V| 0.4 3.1 Vpp 20 mV 155 MHz CRYSTAL OSCILLATOR MODE SPECIFICATIONS fXTAL (1) (2) (3) (4) (5) 6 Crystal frequency range (5) RESR ≤ 40 Ω CL ≤ 20 pF 16 20.5 MHz RESR ≤ 80 Ω CL ≤ 22 pF 6 16 MHz In order to meet the jitter performance listed in the subsequent sections of this data sheet, the minimum recommended slew rate for all input clocks is 0.5 V/ns. This is especially true for single-ended clocks. Phase noise performance will begin to degrade as the clock input slew rate is reduced. However, the device will function at slew rates down to the minimum listed. When compared to single-ended clocks, differential clocks (LVDS, LVPECL) will be less susceptible to degradation in phase noise performance at lower slew rates due to their common mode noise rejection. However, it is also recommended to use the highest possible slew rate for differential clocks to achieve optimal phase noise performance at the device outputs. If emitter resistors are placed on the OSCout1/1* pins, there will be a DC current to ground which will cause powerdown Icc to increase. Load conditions for output clocks: LVDS: 100 Ω differential. See Current Consumption and Power Dissipation Calculations for Icc for specific part configuration and how to calculate Icc for a specific design. FOSCin maximum frequency guaranteed by characterization. Production tested at 200 MHz. Guaranteed by characterization. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Electrical Characteristics (continued) 3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Junction Temperature TJ ≤ 125 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at Recommended Operating Conditions at the time of product characterization and are not ensured.(1) PARAMETER TEST CONDITIONS PXTAL Crystal power dissipation Vectron VXB1 crystal, 20.48 MHz, RESR ≤ 40 Ω CL ≤ 20 pF CIN Input capacitance of the OSCin port -40 to +85 °C MIN TYP MAX UNIT 120 µW 6 pF 156.25 MHz, LVDS/LVPECL 81 fs 312.5 MHz, LVDS/LVPECL 85 fs 100 MHz, LVDS 139 fs 100 MHz, LVPECL 117 fs 106.25 MHz, LVDS 145 fs 106.25 MHz, LVPECL 126 fs 156.25 MHz, LVDS 111 fs 156.25 MHz, LVPECL 100 fs 312.5 MHz, LVDS 108 fs 95 fs RMS JITTER PERFORMANCE Integration bandwidth 10 kHz to 1 MHz Integration bandwidth 12 kHz to 20 MHz XO mode (6) (7) (8) 312.5 MHz, LVPECL 622.08 MHz, LVDS/LVPECL Integration bandwidth 637 kHz to 10 MHz Integration bandwidth 1.875 MHz to 20 MHz (6) (7) (8) 141 fs 106.25 MHz, LVDS 78 fs 106.25 MHz, LVPECL 60 fs 156.25 MHz, LVDS 70 fs 156.25 MHz, LVPECL 57 fs 312.5 MHz, LVDS 57 fs 312.5 MHz, LVPECL 43 fs Jitter and phase noise data for 100 MHz, 156.25, and 312.5 MHz collected using a Wenzel crystal oscillator, part number 501–04623G. Loop filter values are C1 = 39 pF, C2 = 3.3 nF, R2 = 680 Ω, C3 = 10 pF, R3 = 200 Ω, C4 = 10 pF, R4 = 200 Ω. Charge pump current = 3.2 mA. LVPECL emitter resistors, Re = 240 Ω. Reference doubler disabled. VCO frequency = 2500 MHz using a phase detector frequency = 100 MHz the loop bandwidth = 80 kHz and phase margin = 60°. Jitter and phase noise data for 106.25 MHz collected using a Wenzel crystal oscillator, part number 501–04623G. Loop filter values are C1 = 39pF, C2 = 3.3 nF, R2 = 820Ω, C3 = 10 pF, R3 = 200 Ω, C4 = 10 pF, R4 = 200 Ω. Charge pump current = 3.2 mA. LVPECL emitter resistors, Re = 240 Ω. Reference doubler disabled. VCO frequency = 2550 MHz using a phase detector frequency = 10 MHz the loop bandwidth = 80 kHz and phase margin = 60°. Jitter and phase noise data for 622.08 MHz collected using a Crystec oscillator, part number CVHD-950. Loop filter values are C1 = 39 pF, C2 = 3.3 nF, R2 = 680 Ω, C3 = 10 pF, R3 = 200 Ω, C4 = 10 pF, R4 = 200 Ω. Charge pump current = 3.2 mA. LVPECL emitter resistors, Re = 240 Ω. Reference doubler enabled. VCO frequency = 2488.32 MHz using a phase detector frequency = 30.72 MHz the loop bandwidth = 80 kHz and phase margin = 60°. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 7 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com Electrical Characteristics (continued) 3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Junction Temperature TJ ≤ 125 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at Recommended Operating Conditions at the time of product characterization and are not ensured.(1) PARAMETER Integration bandwidth 10 kHz to 1 MHz Integration bandwidth 12 kHz to 20 MHz Crystal mode jitter (9) (10) (11) Integration bandwidth 637 kHz to 10 MHz Integration bandwidth 1.875 MHz to 20 MHz TEST CONDITIONS MIN TYP MAX UNIT 156.25 MHz, LVDS/LVPECL 190 fs 312.5 MHz, LVDS/LVPECL 200 fs 100 MHz, LVDS 235 fs 100 MHz, LVPECL 210 fs 106.25 MHz, LVDS 280 fs 106.25 MHz, LVPECL 250 fs 156.25 MHz, LVDS 200 fs 156.25 MHz, LVPECL 195 fs 312.5 MHz, LVDS 220 fs 312.5 MHz, LVPECL 190 fs 622.08 MHz, LVDS/LVPECL 255 fs 106.25 MHz, LVDS 90 fs 106.25 MHz, LVPECL 65 fs 156.25 MHz, LVDS 75 fs 156.25 MHz, LVPECL 65 fs 312.5 MHz, LVDS 60 fs 312.5 MHz, LVPECL 45 fs (9) Jitter and phase noise data for 100 MHz, 156.25, and 312.5 MHz collected using an ECS crystal, part number ECS-200-20-30B-DU. Loop filter values are C1 = 220 pF, C2 = 18 nF, R2 = 820 Ω, C3 = 10 pF, R3 = 200 Ω, C4 = 10 pF, R4 = 200 Ω. Charge pump current = 3.2 mA. LVPECL emitter resistors, Re = 240 Ω. Reference doubler disabled. VCO frequency = 2500 MHz using a phase detector frequency = 20 MHz the loop bandwidth = 62 kHz and phase margin = 76°. (10) Jitter and phase noise data for 106.25 MHz collected using an ECS crystal, part number ECS-200-20-30B-DU. Loop filter values are C1 = 220 pF, C2 = 18 nF, R2 = 820 Ω, C3 = 10 pF, R3 = 200 Ω, C4 = 10 pF, R4 = 200 Ω. Charge pump current = 3.2 mA. LVPECL emitter resistors, Re = 240 Ω. Reference doubler disabled. VCO frequency = 2550 MHz using a phase detector frequency = 10 MHz the loop bandwidth = 32 kHz and phase margin = 69°. (11) Jitter and phase noise data for 622.08 MHz collected using a Vectron crystal, part number VXB1-1137-15M360. Loop filter values are C1 = 100 pF, C2 = 120 nF, R2 = 470 Ω, C3 = 10 pF, R3 = 200 Ω, C4 = 10 pF, R4 = 200 Ω. Charge pump current = 3.2 mA. LVPECL emitter resistors, Re = 240 Ω. Reference doubler enabled. VCO frequency = 2488.32 MHz using a phase detector frequency = 30.72 MHz the loop bandwidth = 54 kHz and phase margin = 86°. 8 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Electrical Characteristics (continued) 3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Junction Temperature TJ ≤ 125 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at Recommended Operating Conditions at the time of product characterization and are not ensured.(1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PHASE NOISE PERFORMANCE 100 MHz (LVDS/LVPECL) (6) 106.25 MHz (LVDS/LVPECL) (7) XO mode phase 156.25 MHz (LVDS/LVPECL) (6) noise 312.5 MHz (LVDS/LVPECL) (6) 622.08 MHz (LVDS/LVPECL) (8) 10 kHz –142 dBc/Hz 100 kHz –143 dBc/Hz 1 MHz –157 dBc/Hz 10 MHz (LVDS) –159 dBc/Hz 20 MHz (LVDS) –160 dBc/Hz 10 MHz (LVPECL) –160 dBc/Hz 20 MHz (LVPECL) –161 dBc/Hz 10 kHz –141 dBc/Hz 100 kHz –140 dBc/Hz 1 MHz –156 dBc/Hz 10 MHz (LVDS) –159 dBc/Hz 20 MHz (LVDS) –160 dBc/Hz 10 MHz (LVPECL) –162 dBc/Hz 20 MHz (LVPECL) –163 dBc/Hz 10 kHz –139 dBc/Hz 100 kHz –140 dBc/Hz 1 MHz –153 dBc/Hz 10 MHz (LVDS) –159 dBc/Hz 20 MHz (LVDS) –159 dBc/Hz 10 MHz (LVPECL) –160 dBc/Hz 20 MHz (LVPECL) –160 dBc/Hz 10 kHz –132 dBc/Hz 100 kHz –133 dBc/Hz 1 MHz –148 dBc/Hz 10 MHz (LVDS) –154 dBc/Hz 20 MHz (LVDS) –155 dBc/Hz 10 MHz (LVPECL) –157 dBc/Hz 20 MHz (LVPECL) –158 dBc/Hz 10 kHz –123 dBc/Hz 100 kHz –121 dBc/Hz 1 MHz –143 dBc/Hz 10 MHz (LVDS) –154 dBc/Hz 20 MHz (LVDS) –154 dBc/Hz 10 MHz (LVPECL) –157 dBc/Hz 20 MHz (LVPECL) –158 dBc/Hz Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 9 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com Electrical Characteristics (continued) 3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Junction Temperature TJ ≤ 125 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at Recommended Operating Conditions at the time of product characterization and are not ensured.(1) PARAMETER 100 MHz (LVDS/LVPECL) (9) 106.25 MHz (LVDS/LVPECL) (10) Crystal mode phase noise 156.25 MHz (LVDS/LVPECL) (9) 312.5 MHz (LVDS/LVPECL) (9) 622.08 MHz (LVDS/LVPECL) (11) 10 TEST CONDITIONS MIN TYP MAX UNIT 10 kHz –129 dBc/Hz 100 kHz –137 dBc/Hz 1 MHz –156 dBc/Hz 10 MHz (LVDS) –158 dBc/Hz 20 MHz (LVDS) –159 dBc/Hz 10 MHz (LVPECL) –160 dBc/Hz 20 MHz (LVPECL) –161 dBc/Hz 10 kHz –124 dBc/Hz 100 kHz –137 dBc/Hz 1 MHz –156 dBc/Hz 10 MHz (LVDS) –158 dBc/Hz 20 MHz (LVDS) –159 dBc/Hz 10 MHz (LVPECL) –160 dBc/Hz 20 MHz (LVPECL) –161 dBc/Hz 10 kHz –125 dBc/Hz 100 kHz –132 dBc/Hz 1 MHz –153 dBc/Hz 10 MHz (LVDS) –158 dBc/Hz 20 MHz (LVDS) –159 dBc/Hz 10 MHz (LVPECL) –160 dBc/Hz 20 MHz (LVPECL) –160 dBc/Hz 10 kHz –119 dBc/Hz 100 kHz –126 dBc/Hz 1 MHz –147 dBc/Hz 10 MHz (LVDS) –153 dBc/Hz 20 MHz (LVDS) –154 dBc/Hz 10 MHz (LVPECL) –156 dBc/Hz 20 MHz (LVPECL) –157 dBc/Hz 10 kHz –110 dBc/Hz 100 kHz –120 dBc/Hz 1 MHz –140 dBc/Hz 10 MHz (LVDS) –153 dBc/Hz 20 MHz (LVDS) –153 dBc/Hz 10 MHz (LVPECL) –154 dBc/Hz 20 MHz (LVPECL) –154 dBc/Hz Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Electrical Characteristics (continued) 3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Junction Temperature TJ ≤ 125 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at Recommended Operating Conditions at the time of product characterization and are not ensured.(1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PLL PHASE DETECTOR AND CHARGE PUMP SPECIFICATIONS fPD ICPoutSOURCE ICPoutSINK Phase detector frequency 155 PLL charge pump source current PLL charge pump sink current MHz VCPout=VCC/2, PLL_CP_GAIN = 0 100 µA VCPout=VCC/2, PLL_CP_GAIN = 1 400 µA VCPout=VCC/2, PLL_CP_GAIN = 2 1600 µA VCPout=VCC/2, PLL_CP_GAIN = 3 3200 µA VCPout=VCC/2, PLL_CP_GAIN = 0 –100 µA VCPout=VCC/2, PLL_CP_GAIN = 1 –400 µA VCPout=VCC/2, PLL_CP_GAIN = 2 –1600 µA VCPout=VCC/2, PLL_CP_GAIN = 3 –3200 µA ICPout%MIS Charge pump sink/source mismatch VCPout=VCC/2, TA = 25 °C 3% ICPoutVTUNE Magnitude of charge pump current vs. charge pump voltage variation 0.5 V < VCPout < VCC – 0.5 V TA = 25 °C 4% ICPout%TEMP Charge pump current vs. temperature variation ICPoutTRI Charge pump leakage 0.5 V < VCPout < VCC – 0.5 V PLL_CP_GAIN = 400 µA –118 dBc/Hz PN10kHz PLL 1/f noise at 10 kHz offset (12). Normalized to 1-GHz output frequency PLL_CP_GAIN = 3200 µA –121 dBc/Hz PN1Hz Normalized phase noise contribution (13) –222.5 dBc/Hz –227 dBc/Hz –93 dBc/Hz 10 kHz –103 dBc/Hz 100-kHz Offset –116 dBc/Hz 1-MHz Offset –116 dBc/Hz L(f) PLL phase noise (Assumes a very wide bandwidth, noiseless crystal, 2500-MHz output frequency, and 25-MHz phase detector frequency) 10% 4% 10 PLL_CP_GAIN = 400 µA PLL_CP_GAIN = 3200 µA 1-kHz Offset nA INTERNAL VCO SPECIFICATIONS fVCO VCO tuning range KVCO Fine tuning sensitivity fVCO at low end (The range displayed in the typical column indicates the lower sensitivity is typical at the lower end of the tuning range, and the higher tuning sensitivity fVCO at high end is typical at the higher end of the tuning range). 2370 2600 MHz 16 21 MHz/V (12) A specification in modeling PLL in-band phase noise is the 1/f flicker noise, LPLL_flicker(f), which is dominant close to the carrier. Flicker noise has a 10 dB/decade slope. PN10kHz is normalized to a 10 kHz offset and a 1 GHz carrier frequency. PN10kHz = LPLL_flicker(10 kHz) - 20log(Fout / 1 GHz), where LPLL_flicker(f) is the single side band phase noise of only the flicker noise's contribution to total noise, L(f). To measure LPLL_flicker(f) it is important to be on the 10 dB/decade slope close to the carrier. A high compare frequency and a clean crystal are important to isolating this noise source from the total phase noise, L(f). LPLL_flicker(f) can be masked by the reference oscillator performance if a low power or noisy source is used. The total PLL in-band phase noise performance is the sum of LPLL_flicker(f) and LPLL_flat(f). (13) A specification modeling PLL in-band phase noise. The normalized phase noise contribution of the PLL, LPLL_flat(f), is defined as: PN1HZ=LPLL_flat(f) - 20log(N) - 10log(fPD). LPLL_flat(f) is the single side band phase noise measured at an offset frequency, f, in a 1 Hz bandwidth and fPD is the phase detector frequency of the synthesizer. LPLL_flat(f) contributes to the total noise, L(f). Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 11 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com Electrical Characteristics (continued) 3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Junction Temperature TJ ≤ 125 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at Recommended Operating Conditions at the time of product characterization and are not ensured.(1) PARAMETER TEST CONDITIONS |ΔTCL| Allowable temperature drift for continuous lock (14) (5) L(f) Phase noise (Assumes a very narrow loop bandwidth) MIN TYP After programming R30 for lock, no changes to output configuration are permitted to guarantee continuous lock MAX 125 UNIT °C 10-kHz Offset –87 dBc/Hz 100-kHz Offset –112 dBc/Hz 1-MHz Offset –133 dBc/Hz CLOCK SKEW Maximum CLKoutX to CLKoutY (15) (5) |TSKEW| MixedSKEW LVDS-to-LVDS, T = 25 °C, fCLK = 800 MHz, RL= 100 Ω AC coupled 30 ps LVPECL-to-LVPECL, T = 25 °C, fCLK = 800 MHz, RL= 100 Ω emitter resistors = 240 Ω to GND AC coupled 30 ps Maximum skew between any two LVCMOS outputs, same CLKout or different CLKout (15) (5) RL = 50 Ω, CL = 5 pF, T = 25 °C, FCLK = 100 MHz. (15) 100 ps LVDS or LVPECL to LVCMOS Same device, T = 25 °C, 250 MHz 750 ps LVDS CLOCK OUTPUTS (CLKoutX), CLKoutX_TYPE = 1 fCLKout VOD VSS Operating frequency (5) (16) RL = 100 Ω 1300 Differential output voltageFigure 6 ΔVOD Change in magnitude of VOD for complementary output states VOS Output offset voltage ΔVOS Change in VOS for complementary output states T = 25 °C, DC measurement AC-coupled to receiver input R = 100-Ω differential termination MHz 250 400 450 |mV| 500 800 900 mVpp 50 mV –50 1.125 1.25 1.375 35 V |mV| Output rise time 20% to 80%, RL = 100 Ω 200 ps Output fall time 80% to 20%, RL = 100 Ω 200 ps ISA ISB Output short circuit current - singleended Single-ended output shorted to GND, T = 25 °C –24 24 mA ISAB Output short circuit current - differential Complimentary outputs tied together, T = 25 °C –12 12 mA 1300 MHz TR / TF LVPECL CLOCK OUTPUTS (CLKoutX) fCLKout Operating frequency (5) (16) 20% to 80% output rise TR / TF 80% to 20% output fall time RL = 100 Ω, emitter resistors = 240 Ω to GND CLKoutX_TYPE = 4 or 5 (1600 or 2000 mVpp) 150 ps (14) Maximum Allowable Temperature Drift for Continuous Lock is how far the temperature can drift in either direction from the value it was at the time that the R30 register was last programmed, and still have the part stay in lock. The action of programming the R30 register, even to the same value, activates a frequency calibration routine. This implies the part will work over the entire frequency range, but if the temperature drifts more than the maximum allowable drift for continuous lock, then it will be necessary to reload the R30 register to ensure it stays in lock. Regardless of what temperature the part was initially programmed at, the temperature can never drift outside the frequency range of -40 °C to 85 °C without violating specifications. (15) Equal loading and identical clock output configuration on each clock output is required for specification to be valid. (16) Refer to typical performance charts for output operation performance at higher frequencies than the minimum maximum output frequency. 12 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Electrical Characteristics (continued) 3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Junction Temperature TJ ≤ 125 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at Recommended Operating Conditions at the time of product characterization and are not ensured.(1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 700-mVpp LVPECL CLOCK OUTPUTS (CLKoutX), CLKoutX_TYPE = 2 VOH VOL VOD VSS Output high voltage Output low voltage Output voltageFigure 6 VCC – 1.03 T = 25 °C, DC measurement Termination = 50 Ω to VCC – 1.4 V V VCC – 1.41 V 305 380 440 |mV| 610 760 880 mVpp 1200-mVpp LVPECL CLOCK OUTPUTS (CLKoutX), CLKoutX_TYPE = 3 VOH Output high voltage VOL Output low voltage VOD VSS Output voltageFigure 6 T = 25 °C, DC measurement Termination = 50 Ω to VCC – 1.7 V VCC – 1.07 V VCC – 1.69 V 545 625 705 |mV| 1090 1250 1410 mVpp 1600-mVpp LVPECL CLOCK OUTPUTS (CLKoutX), CLKoutX_TYPE = 4 VOH VOL VOD VSS Output high voltage Output low voltage Output voltageFigure 6 VCC – 1.10 T = 25 °C, DC Measurement Termination = 50 Ω to VCC – 2 V V VCC – 1.97 V 660 870 965 |mV| 1320 1740 1930 mVpp 2000-mVpp LVPECL (2VPECL) CLOCK OUTPUTS (CLKoutX), CLKoutX_TYPE = 5 VOH Output high voltage VOL Output low voltage VOD VSS Output voltageFigure 6 T = 25 °C, DC Measurement Termination = 50 Ω to VCC – 2.3 V VCC – 1.13 V VCC – 2.20 V 800 1070 1200 |mV| 1600 2140 2400 mVpp 250 MHz LVCMOS CLOCK OUTPUTS (CLKoutX) fCLKout Operating frequency (5) 5-pF Load VOH Output high voltage 1-mA Load VOL Output low voltage 1-mA Load IOH Output high current (Source) VCC = 3.3 V, VO = 1.65 V 28 mA IOL Output low current (Sink) VCC = 3.3 V, VO = 1.65 V 28 mA (5) VCC/2 to VCC/2, FCLK = 100 MHz, T = 25 °C VCC – 0.1 V 0.1 45 50 55 V DUTYCLK Output duty cycle % TR Output rise time 20% to 80%, RL = 50 Ω, CL = 5 pF 400 ps TF Output fall time 80% to 20%, RL = 50 Ω, CL = 5 pF 400 ps DIGITAL OUTPUTS (Ftest/LD, Readback, GPoutX) VOH High-level output voltage IOH = –500 µA VOL Low-level output voltage IOL = 500 µA VCC – 0.4 V 0.4 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 V 13 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com Electrical Characteristics (continued) 3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Junction Temperature TJ ≤ 125 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at Recommended Operating Conditions at the time of product characterization and are not ensured.(1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DIGITAL INPUTS (SYNC) VIH High-level input voltage VIL Low-level input voltage 1.6 VCC V 0.4 V VCC V DIGITAL INPUTS (CLKuWire, DATAuWire, LEuWire) VIH High-level input voltage 1.6 VIL Low-level input voltage IIH High-level input current VIH = VCC IIL Low-level input current VIL = 0 0.4 V 5 25 µA –5 5 µA 6.6 Timing Requirements See Programming for additional information MIN NOM MAX UNIT TECS LE to clock set-up time See Figure 1 25 ns TDCS Data to clock set-up time See Figure 1 25 ns TCDH Clock to data hold time See Figure 1 8 ns TCWH Clock pulse width high See Figure 1 25 ns TCWL Clock pulse width low See Figure 1 25 ns TCES Clock to LE set-up time See Figure 1 25 ns TEWH LE pulse width See Figure 1 25 ns TCR Falling clock to readback time See READBACK 25 ns MSB MSB LSB DATAuWire CLKuWire tCES tDCS tCDH tCWH tECS tCWL LEuWire tEWH Figure 1. MICROWIRE Timing Diagram 14 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 6.7 Typical Characteristics Clock Output AC Characteristics 1200 500 2000 mVpp 1600 mVpp 1200 mVpp 700 mVpp 450 1000 400 VOD(mV) VOD(mV) 350 300 250 200 800 600 400 150 100 200 50 0 0 0 500 1000 1500 2000 2500 3000 FREQUENCY (MHz) 0 Figure 2. LVDS VOD vs Frequency 500 1000 1500 2000 2500 3000 FREQUENCY (MHz) Figure 3. LVPECL With 240-Ω Emitter Resistors VOD vs Frequency 1200 VOD(mV) 1000 2000 mVpp 800 600 1600 mVpp 400 200 0 0 500 1000 1500 2000 2500 3000 FREQUENCY (MHz) Figure 4. LVPECL With 120-Ω Emitter Resistors VOD vs Frequency Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 15 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com 7 Parameter Measurement Information 7.1 Differential Voltage Measurement Terminology The differential voltage of a differential signal can be described by two different definitions causing confusion when reading data sheets or communicating with other engineers. This section will address the measurement and description of a differential signal so that the reader will be able to understand and discern between the two different definitions when used. The first definition used to describe a differential signal is the absolute value of the voltage potential between the inverting and noninverting signal. The symbol for this first measurement is typically VID or VOD depending on if an input or output voltage is being described. The second definition used to describe a differential signal is to measure the potential of the noninverting signal with respect to the inverting signal. The symbol for this second measurement is VSS and is a calculated parameter. Nowhere in the IC does this signal exist with respect to ground, it only exists in reference to its differential pair. VSS can be measured directly by oscilloscopes with floating references, otherwise this value can be calculated as twice the value of VOD as described in the first description. Figure 5 shows the two different definitions side-by-side for inputs and Figure 6 shows the two different definitions side-by-side for outputs. The VID and VOD definitions show VA and VB DC levels that the noninverting and inverting signals toggle between with respect to ground. VSS input and output definitions show that if the inverting signal is considered the voltage potential reference, the noninverting signal voltage potential is now increasing and decreasing above and below the noninverting reference. Thus the peak-to-peak voltage of the differential signal can be measured. VID and VOD are often defined as volts (V) and VSS is often defined as volts peak-to-peak (VPP). VID Definition VSS Definition for Input Non-Inverting Clock VA 2· VID VID VB Inverting Clock VSS = 2· VID VID = | VA - VB | GND Figure 5. Two Different Definitions for Differential Input Signals VOD Definition VSS Definition for Output Non-Inverting Clock VA 2· VOD VOD VB Inverting Clock VOD = | VA - VB | VSS = 2· VOD GND Figure 6. Two Different Definitions for Differential Output Signals Refer to application note AN-912, Common Data Transmission Parameters and their Definitions (SNLA036) for more information. 16 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 8 Detailed Description 8.1 Overview The LMK03806 is an ultra-low-noise clock generator that integrates a high-performance integer-N PLL, low-noise VCO, and flexible output clock division/fan-out with 14 programmable drivers. It operates with a standard off-theshelf crystal or low noise external clock as the reference oscillator input (OSCin). The integrated VCO tuning range is from 2370 to 2600 MHz. The VCO clock drives 6 output dividers that support a divide range of 1 to 1045 (even and odd) with 50% output duty cycle. Each output divider feeds 2 output drivers for a total of 12 CLKoutX outputs. Each CLKoutX driver is programmable to LVDS, LVPECL, or 2x LVCMOS 3.3-V output levels and synchronized by means of the SYNC input pin. The device provides 2 additional outputs (OSCout0 and OSCout1) that are buffered or divided-down copies of the OSCin input. The divide value for the OSCoutX outputs can be set independently by programming the OSC divider. The OSC divider value range is 1 to 8. The OSCout0 driver is programmable to LVDS, LVPECL or 2x LVCMOS 3.3-V output levels. The OSCout1 driver supports LVPECL output levels only. The LMK03806 has programmable 3rd and 4th order loop filter resistors and capacitors for the internal PLL. The integrated programmable resistors and capacitors compliment external loop filter components mounted near the chip. These integrated components can be disabled through register programming. The device registers are programmable through serial Microwire interface. 8.2 Functional Block Diagrams Figure 7 shows the complete LMK03806 block diagram. CLKuWire DATAuWire PWire Port Readback Control Registers SYNC LEuWire Device Control Ftest/LD GPout0 OSCout0 OSCout0* OSCout1 OSCout1* OSCout0 _MUX OSC Divider (2 to 8) CPout GPout1 2X 2X Mux R Divider (1 to 4,095) OSCout1 _MUX Phase Detector Prescaler (2 to 8) Partially Integrated Loop Filter Internal VCO N Divider (1 to 262,143) OSC Clock Distribution Path OSCin* OSCin CLKout6 CLKout6* CLKout0 CLKout0* Clock Group 0 CLKout1 CLKout1* Divider (1 to 1045) Divider (1 to 1045) CLKout7 CLKout7* Clock Buffer 1 CLKout8 CLKout8* CLKout2 CLKout2* Clock Group 1 Divider (1 to 1045) Divider (1 to 1045) CLKout3 CLKout3* Clock Group 2 Clock Group 4 CLKout9 CLKout9* Clock Buffer 3 CLKout4 CLKout4* CLKout5 CLKout5* Clock Group 3 CLKout10 CLKout10* Divider (1 to 1045) Divider (1 to 1045) Clock Buffer 2 Clock Group 5 CLKout11 CLKout11* Clock Buffer 1 Figure 7. Detailed LMK03806 Block Diagram Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 17 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com Functional Block Diagrams (continued) OSCout0 20 MHz Divide 20 MHz OSCout1 20 MHz OSCin PLL 2500 MHz 625 MHz CLKout0 CLKout6 125 MHz Divide /4 Divide /20 625 MHz CLKout1 CLKout7 125 MHz 156.25 MHz CLKout2 CLKout8 100 MHz Divide /16 Divide /25 156.25 MHz CLKout3 CLKout9 100 MHz 227.27 MHz CLKout4 CLKout10 33.33 MHz Divide /11 Divide /75 227.27 MHz CLKout5 CLKout11 33.33 MHz Figure 8. 10 Gigabit Ethernet Reference Clocks OSCout0 20 MHz Divide 20 MHz OSCout1 20 MHz OSCin PLL 2550 MHz 106.25 MHz CLKout0 CLKout6 212.5 MHz Divide /24 Divide /12 106.25 MHz CLKout1 CLKout7 212.5 MHz 159.375 MHz CLKout2 CLKout8 75 MHz Divide /16 Divide /34 159.375 MHz CLKout3 CLKout9 75 MHz 150 MHz CLKout4 CLKout10 425 MHz Divide /17 Divide /6 150 MHz CLKout5 CLKout11 425 MHz Figure 9. Fiber Channel Reference Clocks 18 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Functional Block Diagrams (continued) OSCout0 19.44 MHz Divide 19.44 MHz OSCout1 19.44 MHz OSCin PLL 2488.32 MHz 622.08 MHz CLKout0 CLKout6 77.76 MHz Divide /4 Divide /32 622.08 MHz CLKout1 CLKout7 77.76 MHz 155.52 MHz CLKout2 CLKout8 30.72 MHz Divide /16 Divide /81 155.52 MHz CLKout3 CLKout9 30.72 MHz 38.88 MHz CLKout4 CLKout10 311.04 MHz Divide /64 Divide /8 38.88 MHz CLKout5 CLKout11 311.04 MHz Figure 10. SONET/SDH Reference Clocks 8.3 Features Description 8.3.1 Serial MICROWIRE Timing Diagram and Terminology Register programming information on the DATAuWire pin is clocked into a shift register on each rising edge of the CLKuWire signal. On the rising edge of the LEuWire signal, the register is sent from the shift register to the register addressed. A few programming considerations are listed below: • A slew rate of at least 30 V/us is recommended for the programming signals • After the programming is complete, the CLKuWire, DATAuWire, and LEuWire signals should be returned to a low state • If the CLKuWire or DATAuWire lines are toggled while the VCO is in lock, as is sometimes the case when these lines are shared with other parts, the phase noise may be degraded during this programming. 8.3.2 Crystal Support With Buffered Outputs The LMK03806 provides 2 dedicated outputs which are a buffered copy of the PLL reference input. This reference input is typically a low noise external clock or Crystal. The OSCout0 buffer output type is programmable to LVDS, LVPECL, or LVCMOS. The OSCout1 buffer is fixed to LVPECL. The dedicated output buffers OSCout0 and OSCout1 can output frequency lower than the Input frequency by programming the OSC Divider. The OSC Divider value range is 1 to 8. Each OSCoutX can individually choose to use the OSC Divider output or to bypass the OSC Divider. Crystal buffered outputs cannot be synchronized to the VCO clock distribution outputs. The assertion of SYNC will still cause these outputs to become low. Since these outputs will turn off and on asynchronously with respect to the VCO sourced clock outputs during a SYNC, it is possible for glitches to occur on the buffered clock outputs when SYNC is asserted and unasserted. If the NO_SYNC_CLKoutX_Y bits are set these outputs will not be affected by the SYNC event except that the phase relationship will change with the other synchronized clocks unless a buffered clock output is used as a qualification clock during SYNC. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 19 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com Features Description (continued) 8.3.3 Integrated Loop Filter Poles The LMK03806 features programmable 3rd and 4th order loop filter poles for PLL. These internal resistors and capacitor values may be selected from a fixed range of values to achieve either a 3rd or 4th order loop filter response. The integrated programmable resistors and capacitors compliment external components mounted near the chip. These integrated components can be effectively disabled by programming the integrated resistors and capacitors to their minimum values. 8.3.4 Integrated VCO The output of the internal VCO is routed to the Clock Distribution Path and also fed back to the PLL phase detector through a prescaler and N-divider. 8.3.5 Clock Distribution The LMK03806 features a total of 12 outputs driven from the internal or external VCO. All VCO driven outputs have programmable output types. They can be programmed to LVPECL, LVDS, or LVCMOS. When all distribution outputs are configured for LVCMOS or single-ended LVPECL a total of 24 outputs are available. 8.3.5.1 CLKout DIvider Each clock group, which is a pair of outputs such as CLKout0 and CLKout1, has a single clock output divider. The divider supports a divide range of 1 to 1045 (even and odd) with 50% output duty cycle. When divides of 26 or greater are used, the divider block uses extended mode. 8.3.5.2 Programmable Output Type For increased flexibility all LMK03806 clock outputs (CLKoutX) and OSCout0 can be programmed to an LVDS, LVPECL, or LVCMOS output type. OSCout1 is fixed as LVPECL. Any LVPECL output type can be programmed to 700-, 1200-, 1600-, or 2000-mVpp amplitude levels. The 2000mVpp LVPECL output type is a Texas Instruments proprietary configuration that produces a 2000-mVpp differential swing for compatibility with many data converters and is also known as 2VPECL. 8.3.5.3 Clock Output Synchronization Using the SYNC input causes all active clock outputs to share a rising edge. By toggling the SYNC_POL_INV bit, it is possible to generate a SYNC through uWire eliminating the need for connecting the external SYNC pin to external circuitry. 8.3.6 Default Start-Up Clocks Before the LMK03806 is programmed some clocks will operate at default frequencies upon power up. The active output clocks depend upon the reference input type. If a crystal reference is used with OSCin, only CLKout8 will operate at a nominal VCO frequency /25. When an XO or other external reference is used as a reference with OSCin, OSCout0 will buffer the OSCin frequency in addition to CLKout8 operating at a nominal VCO frequency /25. These clocks can be used to clock external devices such as microcontrollers, FPGAs, CPLDs, and so forth, before the LMK03806 is programmed. Refer to Figure 11 or Figure 12 for illustration of start-up clocks. The nominal VCO frequency of CLKout8 on power up will typically be 98 MHz. Note during programming CLKout8 may momentarily stop or glitch during the VCO calibration routine. 20 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Features Description (continued) OSCin OSCin Crystal OSCout0 XO or External Reference VCO /25 VCO /25 CLKout8 Figure 11. Start-Up Clock Using Crystal Reference CLKout8 Figure 12. Start-Up Clock Using XO or Other External Reference 8.4 Device Functional Modes By using the tunable range of the VCO followed by a programmable divider, the LMK03806 can achieve any of the frequencies in Table 1. Table 1. Achievable Frequencies OUTPUT DIVIDER VALUE ACHIEVED FREQUENCY (MHZ) 1 2370 - 2600 2 1185 - 1300 3 790 - 866.7 4 592.5 - 650 5 474 - 520 6 395.7 - 433 7 338.6 - 371.4 8 296.25 - 325 9 263.3 - 288.9 10 237 - 260 11 to 1045 Any frequency in the range of 2.27 - 236.36 Table 2. Common Frequency Plans STANDARD/APPLICATION Infiniband OUTPUT FREQUENCIES (MHZ) 75, 150, 300, 600 SAS 37.5, 75, 120, 150 Fast Ethernet 25 1 GbE 125 10 GbE 156.25, 312.5, 625 Backplane 2G/4G/16G Fiber Channel 10G Fiber Channel RECOMMENDED CRYSTAL VALUE 100, 200 SATA XAUI VCO FREQUENCY 2400 MHz 2500 MHz 20 MHz 78.125, 156.25, 312.5 227.27... 106.25, 212.5 159.375 2550 MHz 644.53125, 322.265625, 161.1328125 2578.125 MHz 12.5 MHz SONET 19.44, 38.88, 77.76, 155.52, 311.04, 622.08 2488.32 MHz 19.44 MHz A/D Clocking 30.72, 61.44, 122.88, 153.6, 245.76, 491.52, 983.04 2457.6 MHz 19.2 MHz or 12.288 MHz 40/100 GbE Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 21 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com 8.5 Programming 8.5.1 General Information LMK03806 devices are programmed using 32-bit registers. Each register consists of a 5-bit address field and 27bit data field. The address field is formed by bits 0 through 4 (LSBs) and the data field is formed by bits 5 through 31 (MSBs). The contents of each register is clocked in MSB first (bit 31), and the LSB (bit 0) last. During programming, the LEuWire signal should be held low. The serial data is clocked in on the rising edge of the CLKuWire signal. After the LSB (bit 0) is clocked in the LEuWire signal should be toggled low-to-high-to-low to latch the contents into the register selected in the address field. TI recommends to program registers in numeric order, for example R0 to R14, R16, R24, R26, and R28 to R31 to achieve proper device operation. Refer to the Timing Requirements for the timing for the programming. To achieve proper frequency calibration, the OSCin port must be driven with a valid signal before programming register R30. Changes to PLL R divider or the OSCin port frequency require register R30 to be reloaded in order to activate the frequency calibration process. 8.5.1.1 Special Programming Case for R0 to R5 for CLKoutX_Y_DIV > 25 When programming register R0 to R5 to change the CLKoutX_Y_DIV divide value, the register must be programmed twice if the CLKoutX_Y_DIV value is greater than 25. 8.5.1.2 Recommended Initial Programming Sequence The registers are to be programmed in numeric order with R0 being the first and R31 being the last register programmed as shown below: 1. Program R0 with RESET bit = 1. This ensures that the device is configured with default settings. When RESET = 1, all other R0 bits are ignored. – If R0 is programmed again during the initial configuration of the device, the RESET bit must be cleared. 2. R0 through R5: CLKouts. – Program as necessary to configure the clock outputs, CLKout0 to CLKout11 as desired. These registers configure clock output controls such as powerdown, divider value, and clock source select. 3. R6 through R8: CLKouts. – Program as necessary to configure the clock outputs, CLKout0 to CLKout11 as desired. These registers configure the output format for each clock output. 4. R9: Undisclosed bits. – Program this register as shown in the register map for proper operation. 5. R10: OSCouts. 6. R11: SYNC, and XTAL. 7. R12: LD pin and SYNC. 8. R13: Readback pin & GPout0. 9. R14: GPout1. 10. R16: Undisclosed bits. – Program this register as shown in the register map for proper operation. 11. R24: Partially integrated PLL filter values. 12. R26, R28, R29, and R30: PLL. 13. R31: uWire readback and uWire lock. 22 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Programming (continued) 8.5.1.3 READBACK At no time should the MICROWIRE registers be programmed to any value other than what is specified in the datasheet. For debug of the MICROWIRE interface or programming, TI recommends to simply program an LD_MUX to active low and then toggle the output type register between output and inverting output while observing the output pin for a low to high transition. For example, to verify MICROWIRE programming, set the LD_MUX = 0 (Low) and then toggle the LD_TYPE register between 3 (Output, push-pull) and 4 (Output inverted, pushpull). The result will be that the Ftest/LD pin will toggle from low to high. Readback from the MICROWIRE programming registers is available. The MICROWIRE readback function can be accessed on the Readback pin. The READBACK_TYPE register can be programmed to Output (push-pull) for active output, or for communication with FPGAs/microcontrollers with lower voltage rails than 3.3 V the READBACK_TYPE register can be programmed to Output (Open-Drain) while connecting an external pull-up resistor to the voltage rail needed. To perform a readback operation: 1. Write the register address to be read back by programming the READBACK_ADDR register in R31. 2. With the LEuWire pin held low continue to clock the CLKuWire pin. On every rising edge of the CLKuWire pin a new data bit is clocked onto the Readback pin. 3. Data is clocked out MSB first. After 32 clocks all the data values will have been read and the read operation is complete. The 5 LSB bits which are the address will be undefined during readback. 8.5.1.3.1 Readback Example To readback register R3 perform the following steps: 1. Write R31 with READBACK_ADDR = 3. DATAuWire and CLKuWire are toggled as shown in Figure 1 with new data being clocked in on rising edges of CLKuWire 2. Toggle LEuWire high and low as shown in Figure 1. 3. Toggle CLKuWire high and then low 32 times to read back all 32 bits of register R3. Data is read MSB first. Data is valid on falling edge of CLKuWire. 8.6 Register Maps Table 3 Provides the register map for device programming. At no time should registers be programmed to undefined values. Only valid register values should be written. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 23 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com Table 3. Register Map 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 REGISTER 0 0 0 0 0 0 0 0 0 0 CLKout 2_3_PD 0 0 0 0 0 0 0 0 0 0 0 0 0 CLKout 4_5_PD 0 0 0 0 0 0 0 0 0 0 0 0 0 CLKout 6_7_PD 0 0 0 0 0 0 0 0 0 0 0 0 CLKout 8_9_PD 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 RESET 0 0 CLKout0_1_DIV [15:5] 0 0 0 0 0 POWERDOWN CLKout 0_1_PD 0 ADDRESS [4:0] 0 CLKout2_3_DIV [15:5] 0 0 0 0 1 0 0 CLKout4_5_DIV [15:5] 0 0 0 1 0 0 0 0 CLKout6_7_DIV [15:5] 0 0 0 1 1 0 0 0 0 CLKout8_9_DIV [15:5] 0 0 1 0 0 0 0 0 0 CLKout10_11_DIV [15:5] 0 0 1 0 1 0 0 0 1 1 0 0 0 0 1 1 1 0 0 0 1 0 0 0 0 1 0 0 1 0 0 1 0 0 0 0 1 0 1 0 R4 R5 R6 CLKout3_TYPE [31:28] CLKout2_TYPE [27:24] CLKout1_TYPE [23:20] CLKout0_TYPE [19:16] 0 0 0 0 0 0 0 0 0 0 R7 CLKout7_TYPE [31:28] CLKout6_TYPE [27:24] CLKout5_TYPE [23:20] CLKout4_TYPE [19:16] 0 0 0 0 0 0 0 0 0 0 R8 CLKout11_TYPE [31:28] CLKout10_TYPE [27:24] CLKout9_TYPE [23:20] CLKout8_TYPE [19:16] 0 0 0 0 0 0 0 0 0 R9 0 0 1 0 1 0 1 0 1 0 1 0 0 0 0 0 0 OSCout1 _TYPE [31:30] 1 0 1 0 1 0 1 0 1 0 0 1 OSCout0_TYPE [27:24] OSCout0_MUX R3 OSCout1_MUX R2 EN_OSCout0 R1 EN_OSCout1 R0 R10 24 0 CLKout 10_11_PD DATA [26:0] 1 0 0 1 0 OSCout_DIV [18:16] 1 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Table 3. Register Map (continued) 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 REGISTER NO_SYNC_CLKout0_1 0 1 R13 0 0 1 1 1 READBACK _TYPE [26:24] 0 0 0 0 0 R14 0 0 0 0 0 GPout1 [26:24] 0 0 0 0 0 0 R16 1 1 0 0 0 0 1 0 1 0 1 0 1 1 0 EN_PLL_ REF_2X PLL_C4_LF [31:28] Ftest/LD _TYPE [26:24] 0 0 1 PLL_C3_LF [27:24] 0 PLL_CP _GAIN [27:26] R28 1 PLL_R4_LF [22:20] 0 1 1 0 1 PLL_R R29 0 0 0 0 0 R30 0 0 0 0 0 PLL_P R31 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 1 0 GPout0 [18:16] 0 1 0 1 1 1 0 1 1 0 0 0 0 0 1 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 0 1 0 0 0 0 0 1 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 1 1 0 1 0 0 1 1 1 0 0 PLL_R3_LF [18:16] 0 PLL_DLD_CNT [19:6] 0 0 OSCin_FREQ [26:24] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 PLL_N_CAL [22:5] 1 1 1 0 1 0 PLL_N [22:5] 1 1 1 1 0 1 1 1 1 1 0 0 0 READBACK_ADDR [20:16] 0 0 0 0 0 0 0 0 0 0 uWire_LOCK 1 LD_MUX [31:27] R24 R26 1 EN_PLL_XTAL NO_SYNC_CLKout2_3 0 R12 0 SYNC_TYPE [13:12] NO_SYNC_CLKout4_5 SYNC_PLL _DLD 0 0 ADDRESS [4:0] SYNC_POL_INV NO_SYNC_CLKout6_7 0 R11 NO_SYNC_CLKout8_9 NO_SYNC_CLKout10_11 DATA [26:0] Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 25 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com 8.6.1 Default Device Register Settings After Power On Reset Table 4 shows the default register settings programmed in silicon for the LMK03806 after power on or asserting the reset bit. Capital X and Y represent numeric values. Table 4. Default Device Register Settings After Power On/Reset GROUP DEFAULT VALUE (DECIMAL) DEFAULT STATE CLKout0_1_PD 1 PD CLKout2_3_PD 1 PD CLKout4_5_PD 1 PD CLKout6_7_PD 0 Normal CLKout8_9_PD 0 Normal CLKout10_11_PD 1 PD FIELD NAME Clock Output Control SYNC Control 26 REGISTER BIT LOCATION (MSB:LSB) R0 R1 Powerdown control for divider, and both output buffers R2 R3 31 R4 R5 RESET 0 Not in reset Performs power on reset for device POWERDOWN 0 Disabled (device is active) Device power down control CLKout0_1_DIV 25 Divide-by-25 R0 CLKout2_3_DIV 25 Divide-by-25 R1 CLKout4_5_DIV 25 Divide-by-25 CLKout6_7_DIV 1 Divide-by-1 CLKout8_9_DIV 25 Divide-by-25 R4 CLKout10_11_DIV 25 Divide-by-25 R5 CLKout3_TYPE 0 Powerdown R6 CLKout7_TYPE 0 Powerdown R7 CLKout11_TYPE 0 Powerdown R8 CLKout2_TYPE 0 Powerdown R6 8 LVCMOS (Norm/Norm) CLKout6_TYPE Osc Buffer Control Mode FIELD DESCRIPTION Divide for clock outputs R0 17 R1 17 R2 R3 R7 Individual clock output format. Select from LVDS/LVPECL/LVCMOS. CLKout10_TYPE 0 Powerdown CLKout1_TYPE 0 Powerdown CLKout5_TYPE 0 Powerdown R7 CLKout9_TYPE 0 Powerdown R8 CLKout0_TYPE 0 Powerdown R6 CLKout4_TYPE 0 Powerdown R7 CLKout8_TYPE 1 LVDS R8 OSCout1_TYPE 2 1600 mVpp LVPECL OSCout0_TYPE 1 LVDS EN_OSCout1 0 EN_OSCout0 1 15:5 [11] 31:28 [4] 27:24 [4] R8 R6 23:20 [4] 19:16 [4] Set LVPECL amplitude R10 31:30 [2] OSCout0 default clock output R10 27:24 [4] Disabled Disable OSCout1 output buffer R10 23 Enabled Enable OSCout0 output buffer R10 22 R10 21 OSCout1_MUX 0 Bypass Divider Select OSCout divider for OSCout1 or bypass OSCout0_MUX 0 Bypass Divider Select OSCout divider for OSCout0 or bypass R10 20 OSCout_DIV 0 Divide-by-8 OSCout divider value R10 18:16 [3] NO_SYNC_CLKout10_11 0 Will sync R11 25 NO_SYNC_CLKout8_9 1 Will not sync R11 24 NO_SYNC_CLKout6_7 1 Will not sync R11 23 NO_SYNC_CLKout4_5 0 Will sync R11 22 NO_SYNC_CLKout2_3 0 Will sync R11 21 NO_SYNC_CLKout0_1 0 Will sync R11 20 Sets the polarity of the SYNC pin when input. (Use for software SYNC) R11 16 SYNC IO pin type R11 13:12 [2] SYNC_POL_INV 1 Logic Low SYNC_TYPE 1 Input /w Pull-up Disable individual clock groups from becoming synchronized. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Table 4. Default Device Register Settings After Power On/Reset (continued) GROUP Other Mode Control GPout DEFAULT VALUE (DECIMAL) DEFAULT STATE EN_PLL_XTAL 0 Disabled LD_MUX 3 Reserved LD_TYPE 3 Output (Push-Pull) SYNC_PLL_DLD 0 No effect READBACK_TYPE 3 GPout0 2 GPout1 2 FIELD NAME REGISTER BIT LOCATION (MSB:LSB) Enable Crystal oscillator for OSCin R11 5 Ftest/LD pin selection when output R12 31:27 [5] LD IO pin type R12 26:24 [3] When set, force SYNC until PLL locks R12 23 Output (Push-Pull) Readback Pin Type R13 26:24 [3] Weak pull-down GPout0 output state R13 18:16 [3] Weak pull-down GPout1 output state R14 28:26 [3] R24 31:28 [4] PLL_C4_LF 0 10 pF PLL integrated capacitor C4 value PLL_C3_LF 0 10 pF PLL integrated capacitor C3 value R24 27:24 [4] PLL_R4_LF 0 200 Ω PLL integrated resistor R4 value R24 22:20 [3] PLL_R3_LF 0 200 Ω PLL integrated resistor R3 value R24 18:16 [3] EN_PLL_REF_2X 0 Disabled, 1x Doubles reference frequency of PLL. R26 29 PLL_CP_GAIN 3 3.2 mA PLL Charge Pump Gain R26 27:26 [2] Number of PDF cycles which phase error must be within DLD window before LD state is asserted. R26 19:6 [14] PLL R Divider (1 to 4095) R28 31:20 [12] OSCin frequency range R29 26:24 [3] Divide-by-48 Must be programmed to PLL_N value. R29 22:5 [18] PLL Control PLL_DLD_CNT 8192 8192 Counts PLL_R 4 Divide-by-4 OSCin_FREQ 7 448 to 500 MHz PLL_N_CAL uWire FIELD DESCRIPTION 48 PLL_P 2 Divide-by-2 PLL N Divider Prescaler (2 to 8) R30 26:24 [3] PLL_N 48 Divide-by-48 PLL N Divider (1 to 262143) R30 22:5 [18] Writable The values of registers R0 to R30 are lockable R31 5 uWire_LOCK 0 8.6.2 Register R0 TO R5 Registers R0 through R5 control the 12 clock outputs CLKout0 to CLKout11. Register R0 controls CLKout0 and CLKout1, Register R1 controls CLKout2 and CLKout3, and so on. The X and Y in CLKoutX_Y_PD, CLKoutX_Y_DIV denote the actual clock output which may be from 0 to 11 where X is even and Y is odd. Two clock outputs CLKoutX and CLKoutY form a clock output group and are often run together in bit names as CLKoutX_Y. Two additional bits within the R0 to R5 register range are: • The RESET bit, which is only in register R0. • The POWERDOWN bit, which is only in register R1. 8.6.2.1 CLKoutX_Y_PD, Powerdown CLKoutX_Y Output Path This bit powers down the clock group as specified by CLKoutX and CLKoutY. This includes the divider and output buffers. Table 5. CLKoutX_Y_PD R0-R5[31] STATE 0 Power up clock group 1 Power down clock group Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 27 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com 8.6.2.2 RESET The RESET bit is located in register R0 only. Setting this bit will cause the silicon default values to be loaded. When programming register R0 with the RESET bit set, all other programmed values are ignored. After resetting the device, the register R0 must be programmed again (with RESET = 0) to set non-default values in register R0. The reset occurs on the falling edge of the LEuWire pin which loaded R0 with RESET = 1. The RESET bit is automatically cleared upon writing any other register. For instance, when R0 is written to again with default values. Table 6. RESET R0[17] STATE 0 Normal operation 1 Reset (automatically cleared) 8.6.2.3 POWERDOWN The POWERDOWN bit is located in register R1 only. Setting the bit causes the device to enter powerdown mode. Normal operation is resumed by clearing this bit with MICROWIRE. Table 7. POWERDOWN R1[17] STATE 0 Normal operation 1 Powerdown 8.6.2.4 CLKoutX_Y_DIV, Clock Output Divide CLKoutX_Y_DIV sets the divide value for the clock group. The divide may be even or odd. Both even and odd divides output a 50% duty cycle clock. Using a divide value of 26 or greater will cause the clock group to operate in extended mode. Programming CLKoutX_Y_DIV can require special attention. Table 8. CLKoutX_Y_DIV, 11 bits R0-R5[15:5] DIVIDE VALUE 0 (0x00) Reserved 1 (0x01) 2 (0x02) 1 2 3 (0x03) (1) 28 POWER MODE (1) 3 4 (0x04) 4 (1) 5 (0x05) 5 (1) 6 (0x06) 6 ... ... 24 (0x18) 24 25 (0x19) 25 26 (0x1A) 26 27 (0x1B) 27 ... ... 1044 (0x414) 1044 1045 (0x415) 1045 Normal Mode Extended Mode After programming PLL_N value, a SYNC must occur on channels using this divide value. Programming PLL_N does generate a SYNC event automatically which satisfies this requirement, but NO_SYNC_CLKoutX_Y must be set to 0 for these clock groups. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 8.6.3 Registers R6 TO R8 8.6.3.1 CLKoutX_TYPE The clock output types of the LMK03806 are individually programmable. The CLKoutX_TYPE registers set the output type of an individual clock output to LVDS, LVPECL, LVCMOS, or powers down the output buffer. Note that LVPECL supports four different amplitude levels and LVCMOS supports single LVCMOS outputs, inverted, and normal polarity of each output pin for maximum flexibility. The programming addresses table shows at what register and address the specified clock output CLKoutX_TYPE register is located. The CLKoutX_TYPE table shows the programming definition for these registers. Table 9. CLKoutX_TYPE Programming Addresses CLKoutX PROGRAMMING ADDRESS CLKout0 R6[19:16] CLKout1 R6[23:20] CLKout2 R6[27:24] CLKout3 R6[31:28] CLKout4 R7[19:16] CLKout5 R7[23:20] CLKout6 R7[27:24] CLKout7 R7[31:28] CLKout8 R8[19:16] CLKout9 R8[23:20] CLKout10 R8[27:24] CLKout11 R8[31:28] Table 10. CLKoutX_TYPE, 4 Bits R6-R8[31:28, 27:24, 23:20] DEFINITION 0 (0x00) Powerdown 1 (0x01) LVDS 2 (0x02) LVPECL (700 mVpp) 3 (0x03) LVPECL (1200 mVpp) 4 (0x04) LVPECL (1600 mVpp) 5 (0x05) LVPECL (2000 mVpp) 6 (0x06) LVCMOS (Norm/Inv) 7 (0x07) (1) LVCMOS (Inv/Norm) 8 (0x08) (1) LVCMOS (Norm/Norm) 9 (0x09) (1) LVCMOS (Inv/Inv) 10 (0x0A) (1) 11 (0x0A) (1) LVCMOS (Low/Inv) 12 (0x0C) (1) LVCMOS (Norm/Low) LVCMOS (Low/Norm) 13 (0x0D) (1) LVCMOS (Inv/Low) 14 (0x0E) (1) LVCMOS (Low/Low) TI recommends to use one of the complementary LVCMOS modes. Best noise performance is achieved using LVCMOS (Norm/Inv) or LVCMOS (Inv/Norm) due to the differential switching of the outputs. The next best performance is achieved using an LVCMOS mode with only one output on. Finally, LVCMOS (Norm/Norm) or LVCMOS (Inv/Inv) have the create the most switching noise. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 29 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com 8.6.4 REGISTER R9 Register 9 contains no user programmable bits, but must be programmed as described in the register map. 8.6.5 REGISTER R10 8.6.5.1 OSCout1_TYPE, LVPECL Output Amplitude Control The OSCout1 clock output can only be used as an LVPECL output type. OSCout1_TYPE sets the LVPECL output amplitude of the OSCout1 clock output. Table 11. OSCout1_TYPE, 2 Bits R10[31:30] OUTPUT FORMAT 0 (0x00) LVPECL (700 mVpp) 1 (0x01) LVPECL (1200 mVpp) 2 (0x02) LVPECL (1600 mVpp) 3 (0x03) LVPECL (2000 mVpp) 8.6.5.2 OSCout0_TYPE The OSCout0 clock output has a programmable output type. The OSCout0_TYPE register sets the output type to LVDS, LVPECL, LVCMOS, or powers down the output buffer. Note that LVPECL supports four different amplitude levels and LVCMOS supports dual and single LVCMOS outputs with inverted, and normal polarity of each output pin for maximum flexibility. To turn on the output, the OSCout0_TYPE must be set to a non-power down setting and enabled with EN_OSCoutX, OSCout Output Enable. Table 12. OSCout0_TYPE, 4 Bits (1) 30 R10[27:24] DEFINITION 0 (0x00) Powerdown 1 (0x01) LVDS 2 (0x02) LVPECL (700 mVpp) 3 (0x03) LVPECL (1200 mVpp) 4 (0x04) LVPECL (1600 mVpp) 5 (0x05) LVPECL (2000 mVpp) 6 (0x06) LVCMOS (Norm/Inv) 7 (0x07) LVCMOS (Inv/Norm) 8 (0x08) (1) 9 (0x09) (1) LVCMOS (Norm/Norm) LVCMOS (Inv/Inv) 10 (0x0A) (1) 11 (0x0B) (1) LVCMOS (Low/Inv) 12 (0x0C) (1) LVCMOS (Norm/Low) 13 (0x0D) (1) LVCMOS (Inv/Low) 14 (0x0E) (1) LVCMOS (Low/Low) LVCMOS (Low/Norm) TI recommends to use one of the complementary LVCMOS modes. Best noise performance is achieved using LVCMOS (Norm/Inv) or LVCMOS (Inv/Norm) due to the differential switching of the outputs. The next best performance is achieved using an LVCMOS mode with only one output on. Finally, LVCMOS (Norm/Norm) or LVCMOS (Inv/Inv) have the create the most switching noise. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 8.6.5.3 EN_OSCoutX, OSCout Output Enable EN_OSCoutX is used to enable an oscillator buffered output. Table 13. EN_OSCout1 R10[23] OUTPUT STATE 0 OSCout1 Disabled 1 OSCout1 Enabled Table 14. EN_OSCout0 R10[22] OUTPUT STATE 0 OSCout0 Disabled 1 OSCout0 Enabled OSCout0 note: In addition to enabling the output with EN_OSCout0. The OSCout0_TYPE must be programmed to a non-power down value for the output buffer to power up. 8.6.5.4 OSCoutX_MUX, Clock Output Mux Sets OSCoutX buffer to output a divided or bypassed OSCin signal. Table 15. OSCout1_MUX R10[21] MUX OUTPUT 0 Bypass divider 1 Divided OSCout0_MUX R10[20] Mux Output 0 Bypass divider 1 Divided 8.6.5.5 OSCout_DIV, Oscillator Output Divide The OSCout divider can be programmed from 2 to 8. Divide by 1 is achieved by bypassing the divider with OSCoutX_MUX, Clock Output Mux. Table 16. OSCout_DIV, 3 Bits R10[18:16] DIVIDE 0 (0x00) 8 1 (0x01) 2 2 (0x02) 2 3 (0x03) 3 4 (0x04) 4 5 (0x05) 5 6 (0x06) 6 7 (0x07) 7 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 31 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com 8.6.6 REGISTER R11 8.6.6.1 NO_SYNC_CLKoutX_Y The NO_SYNC_CLKoutX_Y bits prevent individual clock groups from becoming synchronized during a SYNC event. A reason to prevent individual clock groups from becoming synchronized is that during synchronization, the clock output is in a fixed low state or can have a glitch pulse. By disabling SYNC on a clock group, it will continue to operate normally during a SYNC event. Setting the NO_SYNC_CLKoutX_Y bit has no effect on clocks already synchronized together. Table 17. NO_SYNC_CLKoutX_Y Programming Addresses NO_SYNC_CLKoutX_Y PROGRAMMING ADDRESS CLKout0 and 1 R11:20 CLKout2 and 3 R11:21 CLKout4 and 5 R11:22 CLKout6 and 7 R11:23 CLKout8 and 9 R11:24 CLKout10 and 11 R11:25 Table 18. NO_SYNC_CLKoutX_Y R11[25, 24, 23, 22, 21, 20] DEFINITION 0 CLKoutX_Y will synchronize 1 CLKoutX_Y will not synchronize 8.6.6.2 SYNC_POL_INV Sets the polarity of the SYNC pin when input. When SYNC is asserted the clock outputs will transition to a low state. Table 19. SYNC_POL_INV R11[16] POLARITY 0 SYNC is active high 1 SYNC is active low 8.6.6.3 SYNC_TYPE Sets the IO type of the SYNC pin. Table 20. SYNC_TYPE, 2 Bits R11[13:12] POLARITY 0 (0x00) Input 1 (0x01) Input /w pull-up resistor 2 (0x02) Input /w pull-down resistor 8.6.6.4 EN_PLL_XTAL If an external crystal is being used to implement a discrete VCXO, the internal feedback amplifier must be enabled with this bit in order to complete the oscillator circuit. Table 21. EN_PLL_XTAL 32 R11[5] OSCILLATOR AMPLIFIER STATE 0 Disabled 1 Enabled Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 8.6.7 REGISTER R12 8.6.7.1 LD_MUX LD_MUX sets the output value of the Ftest/LD pin. All the outputs logic is active high when LD_TYPE = 3 (Output). All the outputs logic is active low when LD_TYPE = 4 (Output Inverted). For example, when LD_MUX = 0 (Logic Low) and LD_TYPE = 3 (Output) then Ftest/LD pin outputs a logic low. When LD_MUX = 0 (Logic Low) and LD_TYPE = 4 (Output Inverted) then Ftest/LD pin outputs a logic high. Table 22. LD_MUX, 5 Bits (1) R12[31:27] DIVIDE 0 (0x00) Logic Low 1 (0x01) Reserved 2 (0x02) PLL DLD 3 (0x03) Reserved ... ... 12 (0x0C) Reserved 13 (0x0D) PLL N 14 (0x0E) PLL N/2 15 (0x0F) Reserved 16 (0x10) Reserved 17 (0x11) PLL R 18 (0x12) PLL R/2 (1) (1) Only valid when LD_MUX is not set to 2 (PLL_DLD). 8.6.7.2 LD_TYPE Sets the IO type of the LD pin. Table 23. LD_TYPE, 3 Bits R12[26:24] POLARITY 0 (0x00) Reserved 1 (0x01) Reserved 2 (0x02) Reserved 3 (0x03) Output (push-pull) 4 (0x04) Output inverted (push-pull) 5 (0x05) Output (NMOS open source) 6 (0x06) Output (PMOS open drain) 8.6.7.3 SYNC_PLL_DLD By setting SYNC_PLL_DLD a SYNC mode will be engaged (asserted SYNC) until the PLL locks. Table 24. SYNC_PLL_DLD R12[23] SYNC MODE FORCED 0 No 1 Yes Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 33 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com 8.6.8 REGISTER R13 8.6.8.1 READBACK_TYPE Sets the IO format of the readback pin. The open drain output type can be used to interface the LMK03806 with low voltage IO rails. Table 25. READBACK_TYPE, 3 Bits R13[26:24] POLARITY 0 (0x00) Reserved 1 (0x01) Reserved 2 (0x02) Reserved 3 (0x03) Output (push-pull) 4 (0x04) Output inverted (push-pull) 5 (0x05) Output (NMOS open source) 6 (0x06) Output (PMOS open drain) 8.6.8.2 GPout0 Sets the output state of the GPout0 pin. Table 26. GPout0, 3 Bits R13[18:16] OUTPUT STATE 0 (0x00) Reserved 1 (0x01) Reserved 2 (0x02) Weak pull-down 3 (0x03) Low (0 V) 4 (0x04) High (3.3 V) 8.6.9 REGISTER 14 8.6.9.1 GPout1 Sets the output state of the GPout1 pin. Table 27. GPout1, 3 Bits 34 R14[26:24] OUTPUT STATE 0 (0x00) Reserved 1 (0x01) Reserved 2 (0x02) Weak pull-down 3 (0x03) Low (0 V) 4 (0x04) High (3.3 V) Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 8.6.10 REGISTER 16 Register 16 contains no user programmable bits, but must be programmed as described in the register map. 8.6.11 REGISTER 24 8.6.11.1 PLL_C4_LF, PLL Integrated Loop Filter Component Internal loop filter components are available for the PLL, enabling either 3rd or 4th order loop filters without requiring external components. Internal loop filter capacitor C4 can be set according to the values listed in Table 28. Table 28. PLL_C4_LF, 4 Bits R24[31:28] LOOP FILTER CAPACITANCE (pF) 0 (0x00) 10 pF 1 (0x01) 15 pF 2 (0x02) 29 pF 3 (0x03) 34 pF 4 (0x04) 47 pF 5 (0x05) 52 pF 6 (0x06) 66 pF 7 (0x07) 71 pF 8 (0x08) 103 pF 9 (0x09) 108 pF 10 (0x0A) 122 pF 11 (0x0B) 126 pF 12 (0x0C) 141 pF 13 (0x0D) 146 pF 14 (0x0E) Reserved 15 (0x0F) Reserved 8.6.11.2 PLL_C3_LF, PLL Integrated Loop Filter Component Internal loop filter components are available for the PLL, enabling either 3rd or 4th order loop filters without requiring external components. Internal loop filter capacitor C3 can be set according to the values listed in Table 29. Table 29. PLL_C3_LF, 4 Bits R24[27:24] LOOP FILTER CAPACITANCE (pF) 0 (0x00) 10 pF 1 (0x01) 11 pF 2 (0x02) 15 pF 3 (0x03) 16 pF 4 (0x04) 19 pF 5 (0x05) 20 pF 6 (0x06) 24 pF 7 (0x07) 25 pF 8 (0x08) 29 pF 9 (0x09) 30 pF 10 (0x0A) 33 pF 11 (0x0B) 34 pF 12 (0x0C) 38 pF Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 35 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com Table 29. PLL_C3_LF, 4 Bits (continued) R24[27:24] LOOP FILTER CAPACITANCE (pF) 13 (0x0D) 39 pF 14 (0x0E) Reserved 15 (0x0F) Reserved 8.6.11.3 PLL_R4_LF, PLL Integrated Loop Filter Component Internal loop filter components are available for the PLL, enabling either 3rd or 4th order loop filters without requiring external components. Internal loop filter resistor R4 can be set according to the values listed in Table 30. Table 30. PLL_R4_LF, 3 Bits R24[22:20] RESISTANCE 0 (0x00) 200 Ω 1 (0x01) 1 kΩ 2 (0x02) 2 kΩ 3 (0x03) 4 kΩ 4 (0x04) 16 kΩ 5 (0x05) Reserved 6 (0x06) Reserved 7 (0x07) Reserved 8.6.11.4 PLL_R3_LF, PLL Integrated Loop Filter Component Internal loop filter components are available for the PLL, enabling either 3rd or 4th order loop filters without requiring external components. Internal loop filter resistor R3 can be set according to the values listed in Table 31. Table 31. PLL_R3_LF, 3 Bits R24[18:16] RESISTANCE 0 (0x00) 200 Ω 1 (0x01) 1 kΩ 2 (0x02) 2 kΩ 3 (0x03) 4 kΩ 4 (0x04) 16 kΩ 5 (0x05) Reserved 6 (0x06) Reserved 7 (0x07) Reserved 8.6.12 REGISTER 26 8.6.12.1 EN_PLL_REF_2X, PLL Reference Frequency Doubler Enabling the PLL reference frequency doubler allows for higher phase detector frequencies on the PLL than would normally be allowed with the given VCXO or Crystal frequency. Higher phase detector frequencies reduces the PLL N values which makes the design of wider loop bandwidth filters possible. 36 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Table 32. EN_PLL_REF_2X R26[29] DESCRIPTION 0 Reference frequency normal 1 Reference frequency doubled (2x) 8.6.12.2 PLL_CP_GAIN, PLL Charge Pump Current This bit programs the PLL charge pump output current level. Table 33. PLL_CP_GAIN, 2 Bits R26[27:26] CHARGE PUMP CURRENT (µA) 0 (0x00) 100 1 (0x01) 400 2 (0x02) 1600 3 (0x03) 3200 8.6.12.3 PLL_DLD_CNT The reference and feedback of the PLL must be within the window of acceptable phase error for PLL_DLD_CNT cycles before PLL digital lock detect is asserted. Table 34. PLL_DLD_CNT, 14 Bits R26[19:6] DIVIDE 0 (0x00) Reserved 1 (0x01) 1 2 (0x02) 2 3 (0x03) 3 ... ... 16,382 (0x3FFE) 16,382 16,383 (0x3FFF) 16,383 8.6.13 REGISTER 28 8.6.13.1 PLL_R, PLL R Divider The reference path into the PLL phase detector includes the PLL R divider. Table 35 lists the valid values for PLL_R. Table 35. PLL_R, 12 Bits R28[31:20] DIVIDE 0 (0x00) Not Valid 1 (0x01) 1 2 (0x02) 2 3 (0x03) 3 ... ... 4,094 (0xFFE) 4,094 4,095 (0xFFF) 4,095 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 37 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com 8.6.14 REGISTER 29 8.6.14.1 OSCin_FREQ, PLL Oscillator Input Frequency Register The frequency of the PLL reference input to the PLL Phase Detector (OSCin/OSCin* port) must be programmed in order to support proper operation of the frequency calibration routine which locks the internal VCO to the target frequency. Table 36. OSCin_FREQ, 3 Bits R29[26:24] OSCin FREQUENCY 0 (0x00) 0 to 63 MHz 1 (0x01) >63 MHz to 127 MHz 2 (0x02) >127 MHz to 255 MHz 3 (0x03) Reserved 4 (0x04) >255 MHz to 500 MHz 8.6.14.2 PLL_N_CAL, PLL N Calibration Divider During the frequency calibration routine, the PLL uses the divide value of the PLL_N_CAL register instead of the divide value of the PLL_N register to lock the VCO to the target frequency. Table 37. PLL_N_CAL, 18 Bits R29[22:5] DIVIDE 0 (0x00) Not Valid 1 (0x01) 1 2 (0x02) 2 ... ... 262,143 (0x3FFFF) 262,143 8.6.15 REGISTER 30 Programming Register 30 triggers the frequency calibration routine. This calibration routine will also generate a SYNC event. 8.6.15.1 PLL_P, PLL N Prescaler Divider The PLL N Prescaler divides the output of the VCO and is connected to the PLL N divider. Table 38. PLL_P, 3 Bits R30[26:24] DIVIDE VALUE 0 (0x00) 8 1 (0x01) 2 2 (0x02) 2 3 (0x03) 3 4 (0x04) 4 5 (0x05) 5 6 (0x06) 6 7 (0x07) 7 8.6.15.2 PLL_N, PLL N Divider The feeback path into the PLL phase detector includes the PLL N divider. Each time register 30 is updated through the MICROWIRE interface, a frequency calibration routine runs to lock the VCO to the target frequency. During this calibration PLL_N is substituted with PLL_N_CAL. 38 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Table 39 lists the valid values for PLL_N. Table 39. PLL_N, 18 Bits R30[22:5] DIVIDE 0 (0x00) Not Valid 1 (0x01) 1 2 (0x02) 2 ... 262,143 (0x3FFFF) 262,143 8.6.16 REGISTER 31 8.6.16.1 READBACK_ADDR Table 40. READBACK_ADDR R31[20:16] STATE 0 R0 1 R1 2 R2 3 R3 4 R4 5 R5 6 R6 7 R7 8 R8 9 R9 10 R10 11 R11 12 R12 13 R13 14 R14 15 Reserved 16 R16 17 Reserved ... ... 23 Reserved 24 R24 25 Reserved 26 R26 27 Reserved 28 R28 29 R29 30 R30 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 39 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com 8.6.16.2 uWire_LOCK Setting uWire_LOCK will prevent any changes to uWire registers R0 to R30. Only by clearing the uWire_LOCK bit in R31 can the uWire registers be unlocked and written to once more. It is not necessary to lock the registers to perform a readback operation. Table 41. uWire_LOCK R31[5] STATE 0 Registers unlocked 1 Registers locked, Write-protect 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information 9.1.1 Crystal Interface C1 XTAL RLIM OSCin OSCout LMK03806 The LMK03806 has an integrated crystal oscillator circuit on that supports a fundamental mode, AT-cut crystal. The crystal interface is shown in Figure 13. C2 Figure 13. Crystal Interface The load capacitance (CL) is specific to the crystal, but usually on the order of 18 - 20 pF. While CL is specified for the crystal, the OSCin input capacitance (CIN = 6 pF typical) of the device and PCB stray capacitance (CSTRAY ~ 1~3 pF) can affect the discrete load capacitor values, C1 and C2. For the parallel resonant circuit, the discrete capacitor values can be calculated as follows: CL = (C1 × C2) / (C1 + C2) + CIN + CSTRAY (1) Typically, C1 = C2 for optimum symmetry, so Equation 1 can be rewritten in terms of C1 only: CL = C1 2 / (2 × C1) + CIN + CSTRAY (2) Finally, solve for C1: C1 = (CL – CIN – CSTRAY) × 2 (3) Electrical Characteristics provides crystal interface specifications with conditions that ensure start-up of the crystal, but it does not specify crystal power dissipation. The designer will need to ensure the crystal power dissipation does not exceed the maximum drive level specified by the crystal manufacturer. Overdriving the crystal can cause premature aging, frequency shift, and eventual failure. Drive level should be held at a sufficient level necessary to start-up and maintain steady-state operation. The power dissipated in the crystal, PXTAL, can be computed by: 40 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Application Information (continued) PXTAL = IRMS 2 × RESR × (1 + C0/CL)2 where • • • • IRMS is the RMS current through the crystal. RESR is the maximum equivalent series resistance specified for the crystal CL is the load capacitance specified for the crystal C0 is the minimum shunt capacitance specified for the crystal (4) IRMS can be measured using a current probe (for example, Tektronix CT-6 or equivalent) placed on the leg of the crystal connected to OSCin* with the oscillation circuit active. As shown in Figure 13, an external resistor, RLIM, can be used to limit the crystal drive level, if necessary. If the power dissipated in the selected crystal is higher than the drive level specified for the crystal with RLIM shorted, then a larger resistor value is mandatory to avoid overdriving the crystal. However, if the power dissipated in the crystal is less than the drive level with RLIM shorted, then a zero value for RLIM can be used. As a starting point, a suggested value for RLIM is 1.5 kΩ. 9.1.2 Driving OSCin Pins With a Single-Ended Source The LMK03806 has an the ability to be driven by an external reference. Typical external reference interfaces are shown in Figure 14 and Figure 15. In applications where the external reference amplitude is less than the VOSCin specification of 2.4 Vpp Figure 14 is an appropriate method of interfacing the reference to the LMK03806. In applications where the external reference amplitude is greater than the VOSCin specification of 2.4 Vpp Figure 15 is an appropriate method of interfacing the reference to the LMK03806. In both cases C1 and C2 should be present a low impedance at the reference frequency. A typical value for C1 and C2 is 0.1 µF. OSC OSC 0.1 PF 51Ÿ C2 OSCin* 33Ÿ C1 C2 51Ÿ OSCin* LMK03806 C1 OSCin LMK03806 OSCin 0.1 PF Figure 14. LVCMOS External Reference Interface Figure 15. 3.3 Vpp External Reference Interface Using an external reference, such as a crystal oscillator (XO), may provide better phase noise than a crystal at offsets below the loop bandwidth. If the jitter integration bandwidth for the application of interest is above the loop filter bandwidth, the added phase noise of a crystal will not be a significant jitter contributor and may be a more cost effective solution than an XO. Also, operating at higher reference frequencies allows higher phase detector frequencies, which also improves in band PLL phase noise performance. 9.1.3 Driving OSCin Pins With a Differential Source The OSCin port can be driven by differential signals. The LMK03806 internally biases the input pins so the differential interface should be AC coupled. The recommended circuits for driving the OSCin pins with either LVDS or LVPECL are shown below. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 41 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com OSCin 0.1 µF 100 100- Trace (Differential) LVDS 0.1 µF LMK03806 Application Information (continued) OSCin* 240 Figure 16. OSCin/OSCin* Termination for an LVDS Reference Clock Source 0.1 µF 100- Trace (Differential) 0.1 µF 100 0.1 µF LVPECL 0.1 µF 240 OSCin* LMK03806 OSCin Figure 17. OSCin/OSCin* Termination for an LVPECL Reference Clock Source 9.1.4 Frequency Planning With the LMK03806 Calculating the value of the output dividers is simple due to the architecture of the LMK03806. That is, the clock output dividers allow for even and odd output divide values from 2 to 1045. The procedure for determining the PLL and clock output divider values for a set of clock output frequencies is straightforward. 1. Calculate the least common multiple (LCM) of the clock output frequencies. 2. Determine which VCO frequency will support the target clock output frequencies given the LCM. 3. Determine the clock output divide values based on VCO frequency. 4. Determine the PLL divider values – VCO_DIV, PLL_P, PLL_N, and PLL_R – to allow the VCO frequency to lock to the OSCin frequency. For best in-band PLL noise, try to maximize the PLL phase detector frequency by using the smallest PLL divider values and enabling the PLL doubler. For example, given the following target output frequencies: 156.25 MHz, 125 MHz, 100 MHz, and 25 MHz with a OSCin frequency of 20 MHz: 1. Determine the LCM of the three frequencies. LCM(156.25, 125, 100, 25) = 2500 MHz. The LCM frequency is the lowest frequency for which all of the target output frequencies are integer divisors of the LCM. Note: if there is one frequency which causes the LCM to be very large, greater than 2.6 GHz for example, determine if there is a single frequency requirement which causes this. It may be possible to select the crystal frequency to satisfy this frequency requirement through OSCout or CLKout6/7/8/9 driven by OSCin. In this way it is possible to get non-integer related frequencies at the outputs. 2. Multiply the LCM frequency by an integer value that causes the product (LCM * x) to fall into the valid VCO frequency range from 2370 to 2600 MHz. In this case, the LCM frequency of 2500 MHz is already within the VCO frequency. 3. Continuing the example by using a VCO frequency of 2500 MHz, the CLKout dividers can be calculated by simply dividing the VCO frequency by the output frequency. To output 156.25 MHz, 125 MHz, 100 MHz, and 25 MHz, the output dividers will be 16, 20, 25, and 100, respectively. (a) 2500 MHz / 156.25 MHz = 16 (b) 2500 MHz / 125 MHz = 20 (c) 2500 MHz / 100 MHz = 25 (d) 2500 MHz / 25 MHz = 100 4. The PLL must be locked to its input reference. Refer to Configuring the PLL for more information on this topic. By programming the clock output dividers and the PLL dividers, the VCO can be locked to 2500 MHz 42 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Application Information (continued) and the clock outputs dividers can each divide-down the VCO frequency to the achieve the target output frequencies. Refer to Application Note AN-1865, Frequency Synthesis and Planning for PLL Architectures (SNAA061) for more information on this topic and LCM calculations. 9.1.5 Configuring the PLL For the PLL to operate in closed-loop mode, the following relationships in Equations 5 and 6 must be satisfied to ensure the PLL phase detector input frequencies for the reference and feedback paths are equal. Fpd = Fosc * PLL_D / PLL_R (PLL reference path) Fpd = Fvco / (PLL_P * PLL_N) (PLL feedback path) (5) where Fpd = PLL phase detector frequency (Fpd ≤ 155 MHz) FOSCin = OSCin reference frequency (Fosc ≤ 500 MHz) Fvco = VCO frequency (VCO tuning range = 2370 to 2600 MHz) PLL_D = PLL reference doubler mode (Disabled = 1, Enabled = 2) PLL_R = PLL reference divider (values = 1 to 4095) PLL_P = PLL N prescaler divider (values = 2 to 8) PLL_N = PLL N divider (values = 1 to 262143) • • • • • • • (6) NOTE When FOSCin and Fpd are equal, the best PLL in-band noise can be achieved with the PLL reference doubler enabled (EN_PLL_REF_2X=1) and the PLL reference divider is 2 (PLL_R =2), rather than with the doubler disabled (EN_PLL_REF_2X=0) and PLL reference divider of 1 (PLL_R=1). The output frequency is related to Fvco as follows. FCLKout = Fvco / OUT_DIV where • OUT_DIV: Output channel divider (value = 1 to 1045) (7) 9.1.5.1 Example PLL Configuration Continuing the example above, we are given the target output frequencies of 156.25 MHz, 125 MHz, 100 MHz, and 25 MHz with an OSCin frequency of 20 MHz. As previously calculated, the LCM and Fvco is 2500 MHz. First, we will consider the PLL reference path. For lowest possible in-band PLL flat noise, we will try to maximize phase detector frequency. In this case, the highest Fpd possible from the reference path is 40 MHz (with the reference doubler enabled, doubling the 20 MHz OSCin). However, since 40 MHz does not divide into 2500 MHz by an integer value (and thus is unable to be reproduced by the PLL feedback path), we are required to use an Fpd of 20 MHz instead, which does divide into 2500 by an integer value of 125. As noted above, when FOSCin and Fpd are equal, the best PLL in-band noise can be achieved with the PLL reference doubler enabled (EN_PLL_REF_2X=1) and the PLL reference divider is 2 (PLL_R =2). Next, we will consider the PLL feedback path. As determined earlier, Fvco is 2500 MHz and Fpd is 20 MHz, which is 2500 MHz divided by 125. The prescaler and N divider settings together must divide Fvco by 125. Given that the prescaler can be set between 2 to 8 and the N divider can be set between 1 to 262,143, the only setting that would work in this case is a prescaler value of 5 and an N divider value of 25. Note that in a case where multiple configurations are possible, increasing the N divider value will reduce loop filter component sizes. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 43 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com Application Information (continued) 9.1.6 Digital Lock Detect The digital lock detect circuit is used to determine the lock status of the PLL. The flowchart in Figure 18 shows the general way this circuit works. EVENT PLL WINDOW SIZE (ε) LOCK COUNT PLL Locked PLL 3.7 ns PLL_DLD_CNT For a digital lock detect event to occur there must be a number of PLL phase detector cycles during which the time/phase error of the PLL_R reference and PLL_N feedback signal edges are within the 3.7 ns window size of the LMK03806. Lock count is the term which is used to specify how many PLL phase detector cycles have been within the window size of 3.7 ns at any given time. Since there must be a specified number phase detector events before a lock event occurs, a minimum digital lock event time can be calculated as lock count / Fpd. START Lock Detected = False Lock Count = 0 Phase Error < â NO YES Increment Lock Count YES NO Lock Count = DLD_CNT YES Lock Detected = True NO Phase Error > â YES Figure 18. Digital Lock Detect Flow Diagram A user specified ppm accuracy for lock detect is programmable using a lock count register. By using Equation 8, values for a lock count and window size can be chosen to set the frequency accuracy required by the system in ppm before the digital lock detect event occurs. Units of Fpd are Hertz: ppm = 2e6 × 3.7 ns × fPD PLL_DLD_CNT (8) The effect of the lock count value is that it shortens the effective lock window size by dividing the window size by lock count. 44 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 If at any time the PLL_R reference and PLL_N feedback signals are outside the time window set by window size, then the lock count value is reset to 0. For example, we will calculate the minimum PLL digital lock time given a PLL Fpd of 40 MHz and PLL_DLD_CNT = 10,000. The minimum lock time of PLL will be 10,000 / 40 MHz = 250 µs. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 45 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com 9.2 Typical Application Normal use case of the LMK03806 device is as a clock generator. This section will discuss a design example to show the various functional aspects of the LMK03806 device. 2 outputs OSCoutX OSCoutX* Div OSCin OSCin* External Loop Filter CPout R N Phase Detector /Charge Pump Partially Integrated Loop Filter Divider Internal VCO PLL CLKoutY CLKoutY* CLKoutX CLKoutX* 12 outputs 6 blocks LMK03806 Figure 19. Simplified Functional Block Diagram 9.2.1 Design Requirements A networking line card type application needs a clocking solution for an ASIC, FPGA, CPU, PCIe 3.0 interface, and a 10G PHY. The input clock will be a crystal oscillator. A summary of clock input and output requirements are as follows: Clock Input: • 20 MHz oscillator Clock Outputs: • 2x 156.25-MHz LVPECL clock for ASIC • 2x 156.25-MHz LVPECL clock for 10G PHY • 4x 100-MHz HCSL for PCIe 3.0 • 2x 100-MHz LVDS for FPGA • 2x 50-MHz LVCMOS for CPU The following information reviews the steps to produce this design. 9.2.2 Detailed Design Procedure Design of all aspects of the LMK03806 is quite involved and software has been written to assist in part selection, part programming, loop filter design, and simulation. This design procedure will give a quick outline of the process. NOTE This information is current as of the date of the release of this datasheet. Design tools receive continuous enhancements to add features and improve model accuracy. Refer to software instructions or training for latest features. 1. Device Selection – The key to device selection is the required Fvco given the required output frequencies. The device must be able to produce a Fvco that can be divided down to required output frequencies. – The software design tools will take into account the Fvco range for specific devices based on the application's required output frequencies. 2. Device Configuration – There are many possible permutations of dividers and other registers to get same output frequencies from a device. However there are some optimizations and trade-offs to be considered. – If more than one divider is in series, for instance PLL prescaler followed by PLL N divider, it is possible although not assured that some crosstalk/mixing could be created when using some divides. – The design software normally attempts to maximize Fpd, use smallest dividers, and maximize PLL charge 46 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Typical Application (continued) 3. 4. 5. 6. pump current. – Refer to Configuring the PLL for divider equations to ensure the PLL is locked. The design software is able to configure the device for most cases. – These guidelines may be followed when configuring PLL related dividers or other related registers: – For lowest possible in-band PLL flat noise, maximize Fpd to minimize N divide value. – For lowest possible in-band PLL flat noise, maximize charge pump current. Higher value charge pump currents often yield similar performance. – To reduce loop filter component sizes, increase the total feedback divide value (PLL_P * PLL_N) and/or reduce charge pump current. – As rule of thumb, keep Fpd approximately between 10 * PLL loop bandwidth and 100 * PLL loop bandwidth. An Fpd value less than 5 * PLL bandwidth may be unstable and a Fpd > 100 * loop bandwidth may experience increased lock time due to cycle slipping. PLL Loop Filter Design – TI recommends to use Clock Design Tool or Clock Architect to design your loop filter. – The Clock Design Tool will return solutions with high reference/phase detector frequencies by default. In the Clock Design Tool the user may choose to increase the reference divider to reduce the Fpd to achieve a narrow loop bandwidth, so it is possible to reduce loop filter capacitor to a practical value. – While designing the loop filter, adjusting the charge pump current and/or the total feedback divide value (PLL_P * PLL_N) can help with loop filter component selection. Lower charge pump currents and larger N values result in smaller loop filter capacitor values but at the expense of increased in-band PLL phase noise. – More detailed understanding of PLL loop filter design can found in PLL Performance, Simulation, and Design (www.ti.com/tool/pll_book). Clock Output Assignment – At this point of time, the design software does not take into account frequency assignment to specific outputs except to ensure that the output frequencies can be achieved. It is best to consider proximity of each clock output to each other and other PLL circuitry when choosing final clock output locations. Here are some guidelines to help achieve best performance when assigning outputs to specific CLKout/OSCout pins. – Group common frequencies together. – PLL charge pump circuitry can cause crosstalk at charge pump frequency. Place outputs sharing charge pump frequency or lower priority outputs that are not sensitive to charge pump frequency spurs together. Other device specific configuration. For LMK03806 consider the following: – PLL digital lock detect based on programming: – There is a digital lock detect circuit which is used to determine the lock status of the PLL. It can also be used to ensure a specific frequency accuracy. A user specified frequency accuracy required to trigger a lock detect event is programmable using a lock count register. Refer to Digital Lock Detect for more information. Device Programming – The software tool CodeLoader for EVM programming can be used to set up the device in the desired configuration, then export a hex register map suitable for use in application. Some additional information on each part of the design procedure for the example is outlined below. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 47 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com Typical Application (continued) 9.2.2.1 Device Selection WEBENCH Clock Architect Tool or Clock Design Tool can be used as aids in device selection. Enter the required frequencies and formats into the tools. To find this device, select a solution based on LMK03806B (referring to the evaluation board). 9.2.2.1.1 Clock Architect When generating solutions, it is possible to narrow the parts used in the solution by setting the appropriate part filter. 9.2.2.1.2 Clock Design Tool In wizard-mode, select Single PLL and fill in the input frequency and desired output frequencies to generate a list of solutions. If the example values are used, the LMK03806 should be listed as the first result. 9.2.2.1.3 Calculation Using LCM In this example, the LCM of 156.25 MHz, 100 MHz, and 50 MHz = 2500 MHz. This value is a valid Fvco for the LMK03806. Therefore, it may be used to produce these output frequencies. 9.2.2.2 Device Configuration The tools listed above automatically configure the clock solution to meet the input and output frequency requirements given and make assumptions about certain parameters to give default simulation results. The assumptions made are to maximize input frequencies, Fpd, and charge pump currents while minimizing Fvco and divider values. We will also outline the steps for manually configuring the device below for greater flexibility. Note that this procedure is the same as the one outlined in the Frequency Planning With the LMK03806 and Configuring the PLL sections, which can be referenced for a more detailed explanation. We are given the target output frequencies of 156.25 MHz, 125 MHz, 100 MHz, and 25 MHz with an FOSCin of 20 MHz. As previously calculated, the LCM and Fvco is 2500 MHz. First, we will consider the PLL reference path. For lowest possible in-band PLL flat noise, we will try to maximize Fpd. 20 MHz is the highest frequency which divides into 2500 MHz by an integer value and which can also be synthesized from FOSCin. As noted earlier, when FOSCin and fpd are equal, the best PLL in-band noise can be achieved with the PLL reference doubler enabled (EN_PLL_REF_2X=1) and the PLL reference divider is 2 (PLL_R =2). Next, we will consider the PLL feedback path. As determined earlier, Fvco is 2500 MHz and the Fpd is 20 MHz, which is 2500 MHz divided by 125. The prescaler and N divider settings together must divide Fvco by 125. The only setting that works in this case is a prescaler value of 5 and an N divider value of 25. At this point the design meets all input and output frequency requirements and it is possible to design a loop filter for the application and simulate phase noise of the output clocks. 9.2.2.3 PLL Loop Filter Design At this time, the user may choose to use the simulation tools for more accurate simulations. For example: • Clock Design Tool allows loading a custom phase noise profile for various blocks. Typically, a custom phase noise plot is entered for OSCin to match the reference phase noise to the device. For improved accuracy in simulation and optimum loop filter design, be sure to load these custom noise profiles for use in application. After loading a phase noise plot, user should recalculate the recommended loop filter design. • The Clock Design Tool will return solutions with high reference/phase detector frequencies by default. In the Clock Design Tool the user may increase the reference divider to reduce the frequency if desired. For example, if a narrow loop bandwidth is desired, it is possible to reduce Fpd by increasing the PLL R divider. Note: Clock Design Tool provides some recommended loop filters upon first loading the simulation. These values are not re-calculated any time PLL related values are changed (for example, input phase noise, charge pump current, divider values, etc.), so it is recommended to re-design the PLL loop filter, either by manually entering desired values, or by using the ‘Design a Loop Filter’ button in the LOOPFILTER box. 48 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Typical Application (continued) 9.2.2.3.1 Example Loop Filter Design In the LOOPFILTER box, there are options for displaying a bode plot, simulating phase noise, and re-calculating loop filter values. Selecting the ‘Design a Loop Filter’ button brings up a window where a target bandwidth and phase margin can be entered and the tool will re-design the loop filter component values to converge to the specified targets. Component values can also be manually entered and the tool will calculate the resulting loop filter parameters. For this example, a custom phase noise plot was uploaded based on measured data for the reference oscillator input. Fpd was set to 20 MHz and loop filter was optimized to achieve a loop bandwidth of 62 kHz and phase margin of 76°. The loop filter values used were C1 = 220 pF, C2 = 18 nF, R2 = 820 Ω, C3 = 10 pF, R3 = 200 Ω, C4 = 10 pF, and R4 = 200 Ω. The charge pump current was set to 3.2 mA. 9.2.2.4 Other Device Specific Configuration 9.2.2.4.1 Digital Lock Detect Digital lock time for the PLL will ultimately depend upon the programming of the PLL_DLD_CNT register as discussed in Digital Lock Detect. Since the PLL Fpd in this example is 20 MHz, the lock time will = PLL_DLD_CNT / 20 MHz. If PLL_DLD_CNT is set to 10,000, the lock time will be 0.5 ms. The ppm accuracy required to indicate lock will be (2e6 * 3.7 ns * fpd) / PLL_DLD_CNT, or 14.8 ppm. Refer to Digital Lock Detect for more detail on calculating lock times. 9.2.2.5 Device Programming The CodeLoader software is used to program the LMK03806B evaluation board using the LMK03806B profile. It also allows the exporting of a register map which can be used to program the device to the user’s desired configuration. Once a configuration of dividers has been achieved using the Clock Design Tool to meet the requested input/output frequencies with the desired performance, the CodeLoader software needs to be manually updated with this configuration to meet the required application. At this time no automatic import between the two tools exists. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 49 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com Typical Application (continued) 9.2.3 Application Curves The following jitter and phase noise data was captured from an LMK03806 evaluation board. Fvco was set to 2500 MHz and Fpd was set to 20 MHz. In order to obtain a loop bandwidth of 62 kHz and a phase margin of 76°, the loop filter values used were C1 = 220 pF, C2 = 18 nF, R2 = 820 Ω, C3 = 10 pF, R3 = 200 Ω, C4 = 10 pF, and R4 = 200 Ω. The charge pump current was set to 3.2 mA. Figure 20. LVPECL Phase Noise, 156.25 MHz Figure 21. LVDS Phase Noise, 100 MHz Figure 22. LVCMOS Phase Noise, 50 MHz 50 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Typical Application (continued) The following PCIe 3.0 phase jitter results were obtained using the Intel Clock Jitter Tool using waveform data captured with an Agilent DSA90804A. The RMS jitter result of 0.107 ps easily meets the PCIe 3.0 jitter requirement of 1ps with significant margin. Figure 23. PCIe 3.0 Phase Jitter, 100-MHz HCSL Figure 24. PCIe 3.0 RMS Jitter, 100-MHz HCSL Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 51 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com 9.3 System Examples 9.3.1 System Level Diagram Figure 25 shows a detailed system level diagram of the example above to serve as a guideline for good practices when designing with the LMK03806. NOTE: DO NOT directly copy schematic for CLKout Vcc[2,3,10,11,12]. This is for an example frequency plan only. LDO LP3878-ADJ FB = Ferrite bead PLL Supply Plane 3.3 V Output Supply Plane FB FB 10 µF, 1 µF, 0.1 µF Vcc[1,4,5,6,7,9] VCO LDO, Digital, OSC, PLL Core 10 µF, 1 µF, 0.1 µF CLKout [0/1,2/3] Vcc[13,2] It is recommended to group CLKout Vcc supplies by same frequency and share a ferrite bead for CLKout Vcc at the same or related frequencies. 156.25 MHz Vcc group FB 0.1 µF Vcc Groups 1 µF, 0.1 µF, 10 nF Vcc8 FB Charge Pump 0.1 µF 0.1 µF CLKout [4/5,6/7, 8/9,10/11] Vcc[3,10,11,12] 100 & 50 MHz Vcc group FB 0.1 µF 240 Ö 0.1 PF CLKout[0:1] 33 Ö SYNC CNR 2x 156.25 MHz LVPECL to ASIC CLKout[0:1]* 0.1 PF Ftest / LD 240 Ö Readback To Host processor LEuWire CMOS I/2¶V 240 Ö CLKuWire 0.1 PF CLKout[2:3] LMK03806 DATAuWire CLKout[2:3]* 0.1 PF 240 Ö 240 Ö Clock Outputs 2x 156.25 MHz LVPECL to 10G PHY LVPECL-to-HCSL AC-coupled termination (at receiver inputs) 470 Ö 56 Ö 3.3V 22 pF (CL1) 0.1 PF CLKout[4:7] OSCin 4x 100 MHz HCSL to PCIe 3.0 CLKout[4:7]* 0.1 PF PLL Ref. In 20-MHz XTAL CL = 18 pF 3.3V 240 Ö OSCin* CLKout[8:9] 22 pF (CL2) 1.5 kÖ (RLIM) LDObyp2 10 PF CLKout11 LDO Bypass Caps 0.1 PF 56 Ö 2x 100 MHz LVDS to FPGA (with 100 Ö on-chip termination) CLKout[8:9]* LDObyp1 470 Ö 2x 50 MHz LVCMOS 3.3 V to CPU (complementary phases) CLKout11* CPout Loop Filter 22 nF (C2) 820 Ö (R2) 220 pF (C1) Clock outputs drive 50-Ö traces (single-ended Zo), and differential clocks are terminated at the receiver inputs. Unused output pairs (not shown) are left floating and disabled via register control Figure 25. Example Network Line Card Application 52 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 9.4 Do's and Don'ts 9.4.1 LVCMOS Complementary vs. Non-Complementary Operation • TI recommends to use a complementary LVCMOS output format such as LVCMOS (Norm/Inv) to reduce switching noise and crosstalk when using LVCMOS. • If only a single LVCMOS output is required, the complementary LVCMOS output format can still be used by leaving the unused LVCMOS output floating. • A non-complimentary format such as LVCMOS (Norm/Norm) is not recommended as increased switching noise is present. 9.4.2 LVPECL Outputs When using an LVPECL output it is not recommended to place a capacitor to ground on the output as might be done when using a capacitor input LC lowpass filter. The capacitor will appear as a short to the LVPECL output drivers which are able to supply large amounts of switching current. The effect of the LVPECL sourcing large switching currents can result in the following: 1. Large switching currents through the Vcc pin of the LVPECL power supply resulting in more Vcc noise and possible Vcc spikes. 2. Large switching currents injected into the ground plane through the capacitor which could couple onto other Vcc pins with bypass capacitors to ground resulting in more Vcc noise and possible Vcc spikes. 9.4.3 Sharing MICROWIRE (SPI) Lines When CLKuWire and DATAuWire toggle and an internal VCO mode is used, there may some spurious content on the phase noise plot related to the frequency of the CLKuWire and DATAuWire pins. 9.4.4 SYNC Pin If the SYNC pin is connected to a host device (for example, FPGA, CPLD, CPU) with noisy I/O power rails, use small series resistor and shunt capacitor (CNR) as shown in Figure 25. An external low-pass filter can prevent noise on the SYNC input from coupling unwanted spurious content to nearby internal analog circuitry. 10 Power Supply Recommendations 10.1 Current Consumption and Power Dissipation Calculations From Table 42 the current consumption can be calculated for any configuration. For example, the current for the entire device with 1 LVDS (CLKout0) and 1 LVPECL 1.6 Vpp with 240-Ω emitter resistors (CLKout1) output active with a clock output divide = 1, and no other features enabled can be calculated by adding up the following blocks: core current, base clock distribution, clock output group, clock divider, one LVDS output buffer current, and one LVPECL output buffer current. There will also be one LVPECL output drawing emitter current, which means some of the power from the current draw of the device is dissipated in the external emitter resistors which doesn't add to the thermal power dissipation budget for the device. In addition to emitter resistor power, power dissipated in the load for LVDS/LVPECL do not contribute to the thermal power dissipation budget for the device. For total current consumption of the device, add up the significant functional blocks. In this example, 212.9 mA = • 122 mA (core current) • 17.3 mA (base clock distribution) • 2.8 mA (CLKout group for 2 outputs) • 25.5 mA (CLKout0 & 1 divider) • 14.3 mA (LVDS buffer) • 31 mA (LVPECL 1.6 Vpp buffer /w 240-Ω emitter resistors) Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 53 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com Current Consumption and Power Dissipation Calculations (continued) Once total current consumption has been calculated, power dissipated by the device can be calculated. The power dissipation of the device is equation to the total current entering the device multiplied by the voltage at the device minus the power dissipated in any emitter resistors connected to any of the LVPECL outputs or any other external load power dissipation. Continuing the above example which has 212.9 mA total Icc and one output with 240-Ω emitter resistors and one LVDS output. Total IC power = 666 mW = 3.3 V * 212.9 mA - 35 mW - 1.5 mW. Table 42. Typical Current Consumption for Selected Functional Blocks (TA = 25 °C, VCC = 3.3 V) BLOCK CONDITION TYPICAL ICC (mA) POWER DISSIPATED IN DEVICE (mW) (1) POWER DISSIPATED EXTERNALL Y (mW) (2) CORE AND FUNCTIONAL BLOCKS Core Internal VCO Locked 122 403 - Base Clock Distribution At least 1 CLKoutX_Y_PD = 0 17.3 57.1 - CLKout Group Each CLKout group (CLKout0/1 & 10/11, CLKout2/3 & 4/5, CLKout 6/7 & 8/9) 2.8 9.2 - Divide < 25 25.5 84.1 - Divide >= 25 29.6 97.7 - SYNC Asserted While SYNC is asserted, this extra current is drawn 1.7 5.6 - Crystal Mode Crystal Oscillator Buffer 1.8 5.9 - OSCin Doubler EN_OSCin_2X = 1 2.8 9.2 - 14.3 45.7 1.5 LVPECL 2.0 Vpp, AC coupled using 240-Ω emitter resistors 32 70.6 35 LVPECL 1.6 Vpp, AC coupled using 240-Ω emitter resistors 31 67.3 35 LVPECL 1.6 Vpp, AC coupled using 120-Ω emitter resistors 46 91.8 60 LVPECL 1.2 Vpp, AC coupled using 240-Ω emitter resistors 30 59 40 LVPECL 0.7 Vpp, AC coupled using 240-Ω emitter resistors 29 55.7 40 3 MHz 24 79.2 - 30 MHz 26.5 87.5 - 150 MHz 36.5 120.5 - 3 MHz 15 49.5 - 30 MHz 16 52.8 - 150 MHz 21.5 71 - Clock Divider CLOCK OUTPUT BUFFERS LVDS 100-Ω differential termination LVPECL (3) LVCMOS Pair (CLKoutX_Y_TYPE = 6 to 10) CL = 5 pF LVCMOS LVCMOS Single (CLKoutX_Y_TYPE = 11 to 13) CL = 5 pF (1) (2) (3) Assuming θJA = 15 °C/W, the total power dissipated on chip must be less than (125 °C – 85 °C) / 16 °C/W = 2.5 W to guarantee a junction temperature is less than 125 °C. Worst case power dissipation can be estimated by multiplying typical power dissipation with a factor of 1.15. Power is dissipated externally in LVPECL emitter resistors. The externally dissipated power is calculated as twice the DC voltage level of one LVPECL clock output pin squared over the emitter resistance. That is to say power dissipated in emitter resistors = 2 * Vem2 / Rem. 11 Layout 11.1 Layout Guidelines Power consumption of the LMK03806 can be high enough to require attention to thermal management. For reliability and performance reasons the die temperature should be limited to a maximum of 125°C. That is, as an estimate, TA (ambient temperature) plus device power consumption times θJA should not exceed 125°C. 54 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 Layout Guidelines (continued) The package of the device has an exposed pad that provides the primary heat removal path as well as excellent electrical grounding to a printed-circuit-board. To maximize the removal of heat from the package a thermal land pattern including multiple vias to a ground plane must be incorporated on the PCB within the footprint of the package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package. A recommended land and via pattern is shown in Figure 26. More information on soldering WQFN packages and gerber footprints can be obtained: http://www.ti.com/packaging. A recommended footprint including recommended solder mask and solder paste layers can be found at: http://www.ti.com/packaging for the NKD0064A package. 7.2 mm 0.2 mm 1.46 mm 1.15 mm Figure 26. Recommended Land and Via Pattern To minimize junction temperature, TI recommends that a simple heat sink be built into the PCB (if the ground plane layer is not exposed). This is done by including a copper area of about 2 square inches on the opposite side of the PCB from the device. This copper area may be plated or solder coated to prevent corrosion but should not have conformal coating (if possible), which could provide thermal insulation. The vias shown in Figure 26 should connect these top and bottom copper layers and to the ground layer. These vias act as heat pipes to carry the thermal energy away from the device side of the board to where it can be more effectively dissipated. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 55 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com 11.2 Layout Example Figure 27. LMK03806 Layout Example Crystal input to OSCin pins (purple circle): • Place crystal with associated load capacitors (C6 and C9) as close as possible to the chip, and use short/direct routing to the OSCin pins. • If possible, cut out both ground plane and power plane under the area where the crystal and the routing to the device are placed. In this area, avoid using vias in the crystal signal path and routing other signals below the crystal paths, as these could be potential areas for noise coupling. Clock outputs (blue circles): • Differential signals should be routed tightly coupled to minimize PCB crosstalk. Trace impedance and loading/terminations should be designed according to output type being used (that is, LVDS, LVPECL...). • Unused output pins should be left open without connection to a trace. Unused outputs should be powered down through registers to reduce power and switching noise. Power pins (green rectangles): • Place ferrite beads and bypass caps as close as possible to the Vcc pins as possible. Design a low impedance power distribution network over a wide frequency range using multiple decoupling and bypass caps with different values/sizes. Use ferrite beads to isolate the device supply pins from board noise sources. Loop filter (orange oval): • Place loop filter resistor and capacitors nearby the chip, and route loop filter nodes from digital traces or noisy power traces/planes to avoid noise coupling. 56 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 LMK03806 www.ti.com SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 12 Device and Documentation Support 12.1 Device Support 12.1.1 Development Support For additional support, see the following: • Clock Design Tool: http://www.ti.com/tool/clockdesigntool • Clock Architect: http://www.ti.com/lsds/ti/analog/webench/clock-architect.page • Loop Filter Design: PLL Performance, Simulation, and Design (www.ti.com/tool/pll_book) 12.2 Documentation Support 12.2.1 Related Documentation For additional information, see the following: • Common Data Transmission Parameters and their Definitions, Application Note AN-912 (SNLA036) • Crystal Based Oscillator Design with the LMK04000 Family, Application Note AN-1939 (SNAA065) • Frequency Synthesis and Planning for PLL Architectures, Application Note AN-1865 (SNAA061) 12.3 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 43. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LMK03806 Click here Click here Click here Click here Click here 12.4 Community Resource The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.6 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 57 LMK03806 SNAS522I – SEPTEMBER 2011 – REVISED NOVEMBER 2015 www.ti.com 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 58 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: LMK03806 PACKAGE OPTION ADDENDUM www.ti.com 12-Jun-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMK03806BISQ/NOPB ACTIVE WQFN NKD 64 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K03806BISQ LMK03806BISQE/NOPB ACTIVE WQFN NKD 64 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K03806BISQ LMK03806BISQX/NOPB ACTIVE WQFN NKD 64 2000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K03806BISQ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 12-Jun-2014 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 13-May-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing LMK03806BISQ/NOPB WQFN NKD 64 LMK03806BISQE/NOPB WQFN NKD LMK03806BISQX/NOPB WQFN NKD SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1000 330.0 16.4 9.3 9.3 1.3 12.0 16.0 Q1 64 250 178.0 16.4 9.3 9.3 1.3 12.0 16.0 Q1 64 2000 330.0 16.4 9.3 9.3 1.3 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 13-May-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMK03806BISQ/NOPB WQFN NKD 64 1000 367.0 367.0 38.0 LMK03806BISQE/NOPB WQFN NKD 64 250 213.0 191.0 55.0 LMK03806BISQX/NOPB WQFN NKD 64 2000 367.0 367.0 38.0 Pack Materials-Page 2 PACKAGE OUTLINE NKD0064A WQFN - 0.8 mm max height SCALE 1.600 WQFN 9.1 8.9 B A PIN 1 INDEX AREA 0.5 0.3 9.1 8.9 0.3 0.2 DETAIL OPTIONAL TERMINAL TYPICAL 0.8 MAX C SEATING PLANE (0.1) TYP 7.2 0.1 SEE TERMINAL DETAIL 32 17 60X 0.5 33 16 4X 7.5 1 PIN 1 ID (OPTIONAL) 48 64 49 64X 0.5 0.3 64X 0.3 0.2 0.1 0.05 C A C B 4214996/A 08/2013 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT NKD0064A WQFN - 0.8 mm max height WQFN ( 7.2) SYMM 64X (0.6) 64X (0.25) 64 SEE DETAILS 49 1 48 60X (0.5) SYMM (8.8) (1.36) TYP ( 0.2) VIA TYP 8X (1.31) 16 33 32 17 (1.36) TYP 8X (1.31) (8.8) LAND PATTERN EXAMPLE SCALE:8X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND METAL SOLDER MASK OPENING SOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) METAL SOLDER MASK DEFINED SOLDER MASK DETAILS 4214996/A 08/2013 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, refer to QFN/SON PCB application note in literature No. SLUA271 (www.ti.com/lit/slua271). www.ti.com EXAMPLE STENCIL DESIGN NKD0064A WQFN - 0.8 mm max height WQFN SYMM 64X (0.6) 64X (0.25) (1.36) TYP 64 49 1 48 (1.36) TYP 60X (0.5) SYMM (8.8) METAL TYP 33 16 32 17 25X (1.16) (8.8) SOLDERPASTE EXAMPLE BASED ON 0.125mm THICK STENCIL EXPOSED PAD 65% PRINTED SOLDER COVERAGE BY AREA SCALE:10X 4214996/A 08/2013 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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