MT9M021, MT9M031 MT9M021/MT9M031 1/3‐inch CMOS Digital Image Sensor Description The MT9M021/MT9M031 from ON Semiconductor is a 1/3-inch CMOS digital image sensor with an active-pixel array of 1280 (H) × 960 (V). It includes sophisticated camera functions such as auto exposure control, windowing, scaling, row skip mode, and both video and single frame modes. It is designed for low light performance and features a global shutter for accurate capture of moving scenes. It is programmable through a simple two-wire serial interface. The MT9M021/MT9M031 produces extraordinarily clear, sharp digital pictures, and its ability to capture both continuous video and single frames makes it the perfect choice for a wide range of applications, including scanning and HD video. www.onsemi.com IBGA63 9 y 9 CASE 503AQ Table 1. KEY PERFORMANCE PARAMETERS Parameter Typical Value Optical Format 1/3-inch (6 mm) Active Pixels 1280 (H) × 960 (V) = 1.2 Mp Pixel Size 3.75 mm Color Filter Array RGB Bayer or Monochrome Shutter Type Global Shutter Input Clock Range 6–50 MHz ORDERING INFORMATION Output Pixel Clock (Maximum) 74.25 MHz See detailed ordering and shipping information on page 2 of this data sheet. Output Serial Parallel HiSPi (iBGA Package Only) 12-bit Frame Rate Full Resolution 720p 45 fps 60 fps Responsivity Monochrome Color 6.1 V/lux−sec 5.3 V/lux−sec SNRMAX 38 dB Dynamic Range 64 dB Supply Voltage I/O Digital Analog HiSPi 1.8 or 2.8 V 1.8 V 2.8 V 0.4 V Power Consumption < 400 mW Operating Temperature (Ambient) –30°C to + 70°C Package Options 9 × 9 mm 63-pin iBGA ILCC48 10 y 10 CASE 847AJ Features • • • • • • • • • • Applications • Scene Processing • Scanning and Machine Vision • 720p60 Video Applications 10 × 10 mm 48-pin iLCC © Semiconductor Components Industries, LLC, 2016 January, 2017 − Rev. 10 Superior Low-light Performance HD Video (720p60) Global Shutter Video/Single Frame Mode Flexible Row-skip Modes On-chip AE and Statistics Engine Parallel and Serial Output Support for External LED or Flash Auto Black Level Calibration Context Switching 1 Publication Order Number: MT9M021/D MT9M021, MT9M031 ORDERING INFORMATION Table 2. AVAILABLE PART NUMBERS Product Description Part Number Orderable Product Attribute Description MT9M021IA3XTC−DPBR1 1.2 MP 1/3″ GS CIS Dry Pack with Protective Film, Double Side BBAR Glass MT9M021IA3XTC−DRBR 1.2 MP 1/3″ GS CIS Dry Pack without Protective Film, Double Side BBAR Glass MT9M021IA3XTM−DPBR1 1.2 MP 1/3″ GS CIS Dry Pack with Protective Film, Double Side BBAR Glass MT9M021IA3XTM−DRBR1 1.2 MP 1/3″ GS CIS Dry Pack without Protective Film, Double Side BBAR Glass MT9M021IA3XTMZ−DPBR 1.2 MP 1/3″ GS CIS Dry Pack with Protective Film, Double Side BBAR Glass MT9M021IA3XTMZ−DRBR 1.2 MP 1/3″ GS CIS Dry Pack without Protective Film, Double Side BBAR Glass MT9M021IA3XTMZ−TPBR 1.2 MP 1/3″ GS CIS Tape & Reel with Protective Film, Double Side BBAR Glass MT9M031D00STMC24BC1−200 1 MP 1/6″ SOC Die Sales, 200 mm Thickness MT9M031I12STC−DPBR1 1 MP 1/6″ SOC Dry Pack with Protective Film, Double Side BBAR Glass MT9M031I12STC−DRBR 1.2 MP 1/3″ GS CIS Dry Pack without Protective Film, Double Side BBAR Glass MT9M031I12STM−DPBR 1.2 MP 1/3″ GS CIS Dry Pack with Protective Film, Double Side BBAR Glass MT9M031I12STM−DRBR1 1.2 MP 1/3″ GS CIS Dry Pack without Protective Film, Double Side BBAR Glass MT9M031I12STMZ−DRBR 1.2 MP 1/3″ GS CIS Dry Pack without Protective Film, Double Side BBAR Glass See the ON Semiconductor Device Nomenclature document (TND310/D) for a full description of the naming convention used for image sensors. For reference documentation, including information on evaluation kits, please visit our web site at www.onsemi.com. GENERAL DESCRIPTION The ON Semiconductor MT9M021/MT9M031 can be operated in its default mode or programmed for frame size, exposure, gain, and other parameters. The default mode output is a full-resolution image at 45 frames per second (fps). It outputs 12-bit raw data, using either the parallel or serial (HiSPi) output ports. The device may be operated in video (master) mode or in frame trigger mode. FRAME_VALID and LINE_VALID signals are output on dedicated pins, along with a synchronized pixel clock. A dedicated FLASH pin can be programmed to control external LED or flash exposure illumination. The MT9M021/MT9M031 includes additional features to allow application-specific tuning: windowing, adjustable auto-exposure control, auto black level correction, on-board temperature sensor, and row skip and digital binning modes. The sensor is designed to operate in a wide temperature range (–30°C to +70°C). FUNCTIONAL OVERVIEW The MT9M021/MT9M031 is a progressive-scan sensor that generates a stream of pixel data at a constant frame rate. It uses an on-chip, phase-locked loop (PLL) that can be optionally enabled to generate all internal clocks from a single master input clock running between 6 and 50 MHz. The maximum output pixel rate is 74.25 Mp/s, corresponding to a clock rate of 74.25 MHz. Figure 1 shows a block diagram of the sensor. Temperature Sensor Power Active Pixel Sensor (APS) Array OTPM Timing and Control (Sequencer) Memory PLL External Clock Auto Exposure and Stats Engine Serial Output Trigger Two-wire Serial Interface Pixel Data Path (Signal Processing) Analog Processing and A/D Conversion Parallel Output Flash Control Registers Figure 1. Block Diagram www.onsemi.com 2 MT9M021, MT9M031 from the columns is sequenced through an analog signal chain (providing offset correction and gain), and then through an analog-to-digital converter (ADC). The output from the ADC is a 12-bit value for each pixel in the array. The ADC output passes through a digital processing signal chain (which provides further data path corrections and applies digital gain). The pixel data are output at a rate of up to 74.25 Mp/s, in parallel to frame and line synchronization signals. User interaction with the sensor is through the two-wire serial bus, which communicates with the array control, analog signal chain, and digital signal chain. The core of the sensor is a 1.2 Mp Active-Pixel Sensor array. The MT9M021/MT9M031 features global shutter technology for accurate capture of moving images. The exposure of the entire array is controlled by programming the integration time by register setting. All rows simultaneously integrate light prior to readout. Once a row has been read, the data FEATURES OVERVIEW The MT9M021/MT9M031 Global Sensor shutter has a wide array of features to enhance functionality and to increase versatility. A summary of features follows. Please refer to the MT9M021/MT9M031 Developer Guide for detailed feature descriptions, register settings, and tuning guidelines and recommendations. • Operating Modes The MT9M021/MT9M031 works in master (video), trigger (single frame), or Auto Trigger modes. In master mode, the sensor generates the integration and readout timing. In trigger mode, it accepts an external trigger to start exposure, then generates the exposure and readout timing. The exposure time is programmed through the two-wire serial interface for both modes. • • • • • • PLL • • • • • • • NOTE: Trigger mode is not compatible with the HiSPi interface. Window Control Configurable window size and blanking times allow a wide range of resolutions and frame rates. Digital binning and skipping modes are supported, as are vertical and horizontal mirror operations. Context Switching Context switching may be used to rapidly switch between two sets of register values. Refer to the MT9M021/MT9M031 Developer Guide for a complete set of context switchable registers. Gain The MT9M021/MT9M031 Global Shutter sensor can be configured for analog gain of up to 8x, and digital gain of up to 8x. Automatic Exposure Control The integrated automatic exposure control may be used to ensure optimal settings of exposure and gain are computed and updated every other frame. Refer to the MT9M021/MT9M031 Developer Guide for more details. HiSPi The MT9M021/MT9M031 Global Shutter image sensor supports two or three lanes of Streaming-SP or Packetized-SP protocols of ON Semiconductor’s High-Speed Serial Pixel Interface. An on chip PLL provides reference clock flexibility and supports spread spectrum sources for improved EMI performance. Reset The MT9M021/MT9M031 may be reset by a register write, or by a dedicated input pin. Output Enable The MT9M021/MT9M031 output pins may be tri-stated using a dedicated output enable pin. Temperature Sensor Black Level Correction Row Noise Correction Column Correction Test Patterns Several test patterns may be enabled for debug purposes. These include a solid color, color bar, fade to grey, and a walking 1s test pattern. www.onsemi.com 3 MT9M021, MT9M031 1.5 kW2, 3 1.5 kW2 TYPICAL CONFIGURATION AND PINOUT Digital I/O Power1 Digital Core Power1 HiSPi Power1 PLL Power1 Analog Power1 Analog Power1 VDD_IO VDD VDD_SLVS VDD_PLL VAA VAA_PIX SLVS0_P SLVS0_N SLVS1_P Master Clock (6−50 MHz) EXTCLK SLVS1_N SLVS2_P SLVS2_N SDATA SCLK From Controller SLVS3_P SLVS3_N OE_BAR STANDBY RESET_BAR To Controller 7 7 SLVSC_P SLVSC_N FLASH TEST VDD_IO VDD DGND AGND Digital Ground Analog Ground VDD_SLVS VDD_PLL VAA VAA_PIX Notes: 1. All power supplies must be adequately decoupled. 2. ON Semiconductor recommends a resistor value of 1.5 kW, but a greater value may be used for slower two-wire speed. 3. This pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times. 4. The parallel interface output pads can be left unconnected if the serial output interface is used. 5. ON Semiconductor recommends that 0.1 mF and 10 mF decoupling capacitors for each power supply are mounted as close as possible to the pad. Actual values and results may vary depending on the layout and design considerations. Refer to the MT9M021/MT9M031 demo headboard schematics for circuit recommendations. 6. ON Semiconductor recommends that analog power planes be placed in a manner such that coupling with the digital power planes is minimized. 7. Although 4 serial lanes are shown, the MT9M021/MT9M031 supports only 2- or 3-lane HiSPi. Figure 2. Serial 4-lane HiSPi Interface www.onsemi.com 4 1.5 kW2, 3 1.5 kW2 MT9M021, MT9M031 Master Clock (6−50 MHz) Digital I/O Power1 Digital Core Power1 PLL Power1 Analog Power1 Analog Power1 VDD_IO VDD VDD_PLL VAA VAA_PIX DOUT[11:0] EXTCLK PIXCLK SDATA SCLK From Controller LINE_VALID To Controller FRAME_VALID TRIGGER OE_BAR STANDBY FLASH RESET_BAR TEST VDD_IO VDD DGND AGND Digital Ground Analog Ground VDD_PLL VAA VAA_PIX Notes: 1. All power supplies must be adequately decoupled. 2. ON Semiconductor recommends a resistor value of 1.5 kW, but a greater value may be used for slower two-wire speed. 3. This pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times. 4. The serial interface output pads can be left unconnected if the parallel output interface is used. 5. ON Semiconductor recommends that 0.1 mF and 10 mF decoupling capacitors for each power supply are mounted as close as possible to the pad. Actual values and results may vary depending on the layout and design considerations. Refer to the MT9M021/MT9M031 demo headboard schematics for circuit recommendations. 6. ON Semiconductor recommends that analog power planes be placed in a manner such that coupling with the digital power planes is minimized. Figure 3. Parallel Pixel Data Interface www.onsemi.com 5 MT9M021, MT9M031 1 A 2 3 4 5 6 7 8 SLVS0N SLVS0P SLVS1N SLVS1P VDD VDD STANDBY B VDD_PLL SLVSCN SLVSCP SLVS2N SLVS2P VDD VAA VAA C EXTCLK VDD_SLVS SLVS3N SLVS3P DGND VDD AGND AGND D SADDR SCLK SDATA DGND DGND VDD VAA_PIX VAA_PIX E LINE_ VALID FRAME_ VALID PIXCLK FLASH DGND VDD_IO RESERVED RESERVED F DOUT8 DOUT9 DOUT10 DOUT11 DGND VDD_IO TEST RESERVED G DOUT4 DOUT5 DOUT6 DOUT7 DGND VDD_IO TRIGGER OE_BAR H DOUT0 DOUT1 DOUT2 DOUT3 DGND VDD_IO VDD_IO RESET_ BAR Top View (Ball Down) Figure 4. 9 y 9 mm 63-ball iBGA Package Table 3. PIN DESCRIPTIONS − 63-BALL IBGA PACKAGE Name iBGA Pin Type Description SLVS0_N A2 Output HiSPi serial data, lane 0, differential N SLVS0_P A3 Output HiSPi serial data, lane 0, differential P SLVS1_N A4 Output HiSPi serial data, lane 1, differential N SLVS1_P A5 Output HiSPi serial data, lane 1, differential P STANDBY A8 Input VDD_PLL B1 Power PLL power SLVSC_N B2 Output HiSPi serial DDR clock differential N Standby-mode enable pin (active HIGH) www.onsemi.com 6 MT9M021, MT9M031 Table 3. PIN DESCRIPTIONS − 63-BALL IBGA PACKAGE (continued) Name iBGA Pin Type Description SLVSC_P B3 Output HiSPi serial DDR clock differential P SLVS2_N B4 Output HiSPi serial data, lane 2, differential N SLVS2_P B5 Output HiSPi serial data, lane 2, differential P VAA B7, B8 Power Analog power EXTCLK C1 Input VDD_SLVS C2 Power HiSPi power SLVS3_N C3 Output HiSPi serial data, lane 3, differential N SLVS3_P C4 Output HiSPi serial data, lane 3, differential P DGND C5, D4, D5, E5, F5, G5, H5 Power Digital GND VDD A6, A7, B6, C6, D6 Power Digital power AGND C7, C8 Power Analog GND SADDR D1 Input Two-Wire Serial address select SCLK D2 Input Two-Wire Serial clock input SDATA D3 I/O VAA_PIX D7, D8 Power Pixel power LINE_VALID E1 Output Asserted when DOUT line data is valid FRAME_VALID E2 Output Asserted when DOUT frame data is valid PIXCLK E3 Output Pixel clock out. DOUT is valid on rising edge of this clock FLASH E4 Output Control signal to drive external light sources VDD_IO E6, F6, G6, H6, H7 Power I/O supply power DOUT8 F1 Output Parallel pixel data output DOUT9 F2 Output Parallel pixel data output DOUT10 F3 Output Parallel pixel data output DOUT11 F4 Output Parallel pixel data output (MSB) TEST F7 Input DOUT4 G1 Output Parallel pixel data output DOUT5 G2 Output Parallel pixel data output DOUT6 G3 Output Parallel pixel data output DOUT7 G4 Output Parallel pixel data output TRIGGER G7 Input Exposure synchronization input OE_BAR G8 Input Output enable (active LOW) DOUT0 H1 Output Parallel pixel data output (LSB) DOUT1 H2 Output Parallel pixel data output DOUT2 H3 Output Parallel pixel data output DOUT3 H4 Output Parallel pixel data output RESET_BAR H8 Input Asynchronous reset (active LOW). All settings are restored to factory default Reserved E7, E8, F8 N/A Reserved (do not connect) External input clock Two-Wire Serial data I/O Manufacturing test enable pin (connect to DGND) www.onsemi.com 7 6 5 4 3 2 1 48 47 46 45 44 43 DGND EXTCLK VDD_PLL DOUT6 DOUT5 DOUT4 DOUT3 DOUT2 DOUT1 DOUT0 DGND NC MT9M021, MT9M031 13 PIXCLK VAA 36 14 VDD AGND 35 15 SCLK VAA 34 16 SDATA Reserved 33 17 RESET_BAR Reserved 32 18 VDD_IO Reserved 31 DGND 37 30 VAA_PIX LINE_VALID VDD_IO 29 12 FRAME_VALID 38 28 VAA_PIX TRIGGER DOUT11 27 11 FLASH 39 26 AGND TEST DOUT10 25 10 SADDR 40 24 VAA OE_BAR DOUT9 23 9 STANDBY 41 22 NC NC DOUT8 21 8 NC 42 20 NC VDD DOUT7 19 7 Figure 5. 10 y 10 mm 48-pin iLCC Package, Parallel Output Table 4. PIN DESCRIPTIONS − 48-PIN ILCC PACKAGE, PARALLEL Pin Number Name Type 1 DOUT4 Output Parallel pixel data output 2 DOUT5 Output Parallel pixel data output 3 DOUT6 Output Parallel pixel data output 4 VDD_PLL Power PLL power 5 EXTCLK Input 6 DGND Power Digital ground 7 DOUT7 Output Parallel pixel data output 8 DOUT8 Output Parallel pixel data output 9 DOUT9 Output Parallel pixel data output Description External input clock www.onsemi.com 8 MT9M021, MT9M031 Table 4. PIN DESCRIPTIONS − 48-PIN ILCC PACKAGE, PARALLEL (continued) Pin Number Name Type Description 10 DOUT10 Output Parallel pixel data output 11 DOUT11 Output Parallel pixel data output (MSB) 12 VDD_IO Power I/O supply power 13 PIXCLK Output Pixel clock out. DOUT is valid on rising edge of this clock 14 VDD Power Digital power 15 SCLK Input 16 SDATA I/O 17 RESET_BAR Input 18 VDD_IO Power I/O supply power 19 VDD Power Digital power 20 NC Two-Wire Serial clock input Two-Wire Serial data I/O Asynchronous reset (active LOW). All settings are restored to factory default No connection 21 NC 22 STANDBY Input No connection Standby-mode enable pin (active HIGH) 23 OE_BAR Input Output enable (active LOW) 24 SADDR Input Two-Wire Serial address select 25 TEST Input Manufacturing test enable pin (connect to DGND) 26 FLASH Output Flash output control 27 TRIGGER Input 28 FRAME_VALID Output Exposure synchronization input Asserted when DOUT frame data is valid 29 LINE_VALID Output Asserted when DOUT line data is valid 30 DGND Power Digital ground 31 Reserved N/A Reserved (do not connect) 32 Reserved N/A Reserved (do not connect) 33 Reserved N/A Reserved (do not connect) 34 VAA Power Analog power 35 AGND Power Analog ground 36 VAA Power Analog power 37 VAA_PIX Power Pixel power 38 VAA_PIX Power Pixel power 39 AGND Power Analog ground 40 VAA Power Analog power 41 NC No connection 42 NC No connection 43 NC No connection 44 DGND Power Digital ground 45 DOUT0 Output Parallel pixel data output (LSB) 46 DOUT1 Output Parallel pixel data output 47 DOUT2 Output Parallel pixel data output 48 DOUT3 Output Parallel pixel data output www.onsemi.com 9 MT9M021, MT9M031 ELECTRICAL SPECIFICATIONS Unless otherwise stated, the following specifications apply to the following conditions: VDD = 1.8 V –0.10/+0.15; VDD_IO = VDD_PLL = VAA = VAA_PIX = 2.8 V ±0.3 V; VDD_SLVS = 0.4 V –0.1/+0.2; TA = −30°C to +70°C; Output Load = 10 pF; PIXCLK Frequency = 74.25 MHz; HiSPi off. Two-Wire Serial Register Interface The electrical characteristics of the two-wire serial register interface (SCLK, SDATA) are shown in Figure 6 and Table 5. SDATA tLOW tf tSU;DAT tr tf tHD;STA tBUF tr SCLK tSU;STA tHD;STA tHD;DAT S NOTE: tHIGH tSU;STO Sr P S Read sequence: For an 8-bit READ, read waveforms start after WRITE command and register address are issued. Figure 6. Two-Wire Serial Bus Timing Parameters Table 5. TWO-WIRE SERIAL BUS CHARACTERISTICS (fEXTCLK = 27 MHz; VDD = 1.8 V; VDD_IO = 2.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; TA = 25°C) Standard Mode Fast-Mode Symbol Min Max Min Max Unit fSCL 0 100 0 400 kHz Hold Time (Repeated) START Condition tHD;STA 4.0 − 0.6 − ms LOW Period of the SCLK Clock tLOW 4.7 − 1.3 − ms HIGH Period of the SCLK Clock tHIGH 4.0 − 0.6 − ms Set-up Time for a Repeated START Condition tSU;STA 4.7 − 0.6 − ms Data Hold Time tHD;DAT 0 (Note 4) 3.45 (Note 5) 0 (Note 6) 0.9 (Note 5) ms Data Set-up Time tSU;DAT 250 − 100 (Note 6) − ns Rise Time of both SDATA and SCLK Signals tr − 1000 20 + 0.1Cb (Note 7) 300 ns Fall Time of both SDATA and SCLK Signals tf − 300 20 + 0.1Cb (Note 7) 300 ns Set-up Time for STOP Condition tSU;STO 4.0 − 0.6 − ms Bus Free Time between a STOP and START Condition tBUF 4.7 − 1.3 − ms Cb − 400 − 400 pF CIN_SI − 3.3 − 3.3 pF Parameter SCLK Clock Frequency Capacitive Load for each Bus Line Serial Interface Input Pin Capacitance www.onsemi.com 10 MT9M021, MT9M031 Table 5. TWO-WIRE SERIAL BUS CHARACTERISTICS (continued) (fEXTCLK = 27 MHz; VDD = 1.8 V; VDD_IO = 2.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; TA = 25°C) Standard Mode Parameter SDATA Max Load Capacitance Fast-Mode Symbol Min Max Min Max Unit CLOAD_SD − 30 − 30 pF RSD 1.5 4.7 1.5 4.7 kW SDATA Pull-up Resistor I2C 1. 2. 3. 4. 5. 6. This table is based on standard (v2.1 January 2000). Philips Semiconductor. Two-wire control is I2C-compatible. All values referred to VIHmin = 0.9 VDD_IO and VILmax = 0.1 VDD_IO levels. Sensor EXCLK = 27 MHz. A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the undefined region of the falling edge of SCLK. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCLK signal. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCLK signal. If such a device does stretch the LOW period of the SCLK signal, it must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification) before the SCLK line is released. 7. Cb = total capacitance of one bus line in pF. I/O Timing By default, the MT9M021/MT9M031 launches pixel data, FV and LV with the falling edge of PIXCLK. The expectation is that the user captures DOUT[11:0], FV and LV tR using the rising edge of PIXCLK. The launch edge of PIXCLK can be configured in register R0x3028. See Figure 7 and Table 6 for I/O timing (AC) characteristics. tF 90% 10% tRP 90% tFP 90% 10% 10% 90% 10% tEXTCLK EXTCLK PIXCLK tPD Data[11:0] LINE_VALID/ FRAME_VALID Pxl_0 Pxl_1 Pxl_2 Pxl_n tPFL tPLL tPLH tPFH FRAME_VALID Leads LINE_VALID by 6 PIXCLKs Figure 7. I/O Timing Diagram www.onsemi.com 11 FRAME_VALID Trails LINE_VALID by 6 PIXCLKs MT9M021, MT9M031 Table 6. I/O TIMING CHARACTERISTICS, PARALLEL OUTPUT (1.8 V VDD_IO) (Note 1) Symbol Min Typ Max Unit fEXTCLK Input Clock Frequency Definition Condition 6 − 50 MHz tEXTCLK Input Clock Period 20 − 166 ns tR Input Clock Rise Time PLL Enabled − 3 4 ns tF Input Clock Fall Time PLL Enabled − 3 4 ns tRP PIXCLK Rise Time Slew Setting = 4 (Default) 2.3 − 4.6 ns tFP PIXCLK Fall Time Slew Setting = 4 (Default) 3 − 4.4 ns PIXCLK Duty Cycle fPIXCLK 40 50 60 % PIXCLK Frequency (Note 2) Nominal Voltages, PLL Enabled 6 − 74.25 MHz tPD PIXCLK to Data Valid Nominal Voltages, PLL Enabled −3 2.3 4.5 ns tPFH PIXCLK to FV HIGH Nominal Voltages, PLL Enabled −3 1.5 4.5 ns tPLH PIXCLK to LV HIGH Nominal Voltages, PLL Enabled −3 2.3 4.5 ns tPFL PIXCLK to FV LOW Nominal Voltages, PLL Enabled −3 1.5 4.5 ns tPLL PIXCLK to LV LOW Nominal Voltages, PLL Enabled −3 2 4.5 ns 1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C ambient at 90% of VDD_IO, and −30°C at 110% of VDD_IO. All values are taken at the 50% transition point. The loading used is 20 pF. 2. Jitter from PIXCLK is already taken into account in the data for all of the output parameters. Table 7. I/O TIMING CHARACTERISTICS, PARALLEL OUTPUT (2.8 V VDD_IO) (Note 1) Symbol Definition Condition Min Typ Max Unit fEXTCLK Input Clock Frequency 6 − 50 MHz tEXTCLK Input Clock Period 20 − 166 ns tR Input Clock Rise Time PLL Enabled − 3 4 ns tF Input Clock Fall Time PLL Enabled − 3 4 ns tRP PIXCLK Rise Time Slew Setting = 4 (Default) 2.3 − 4.6 ns tFP PIXCLK Fall Time Slew Setting = 4 (Default) 3 − 4.4 ns PIXCLK Duty Cycle fPIXCLK 40 50 60 % PIXCLK Frequency (Note 2) Nominal Voltages, PLL Enabled 6 − 74.25 MHz tPD PIXCLK to Data Valid Nominal Voltages, PLL Enabled −3 2.3 4 ns tPFH PIXCLK to FV HIGH Nominal Voltages, PLL Enabled −3 1.5 4 ns tPLH PIXCLK to LV HIGH Nominal Voltages, PLL Enabled −3 2.3 4 ns tPFL PIXCLK to FV LOW Nominal Voltages, PLL Enabled −3 1.5 4 ns tPLL PIXCLK to LV LOW Nominal Voltages, PLL Enabled −3 2 4 ns 1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C ambient at 90% of VDD_IO, and −30°C at 110% of VDD_IO. All values are taken at the 50% transition point. The loading used is 20 pF. 2. Jitter from PIXCLK is already taken into account in the data for all of the output parameters. Table 8. I/O RISE SLEW RATE (2.8 V VDD_IO) (Note 1) Parallel Slew (R0x306E[15:13]) Condition Min Typ Max Unit 7 Default 1.08 1.77 2.72 V/ns 6 Default 0.77 1.26 1.94 V/ns 5 Default 0.58 0.95 1.46 V/ns 4 Default 0.44 0.70 1.08 V/ns 3 Default 0.32 0.51 0.78 V/ns 2 Default 0.23 0.37 0.56 V/ns 1 Default 0.16 0.25 0.38 V/ns 0 Default 0.10 0.15 0.22 V/ns 1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C ambient at 90% of VDD_IO, and −30°C at 110% of VDD_IO. All values are taken at the 50% transition point. The loading used is 20 pF. www.onsemi.com 12 MT9M021, MT9M031 Table 9. I/O FALL SLEW RATE (2.8 V VDD_IO) (Note 1) Parallel Slew (R0x306E[15:13]) Condition Min Typ Max Unit 7 Default 1.00 1.62 2.41 V/ns 6 Default 0.76 1.24 1.88 V/ns 5 Default 0.60 0.98 1.50 V/ns 4 Default 0.46 0.75 1.16 V/ns 3 Default 0.35 0.56 0.86 V/ns 2 Default 0.25 0.40 0.61 V/ns 1 Default 0.17 0.27 0.41 V/ns 0 Default 0.11 0.16 0.24 V/ns 1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C ambient at 90% of VDD_IO, and −30°C at 110% of VDD_IO. All values are taken at the 50% transition point. The loading used is 20 pF. Table 10. I/O RISE SLEW RATE (1.8 V VDD_IO) (Note 1) Parallel Slew (R0x306E[15:13]) Condition Min Typ Max Unit 7 Default 0.41 0.65 1.10 V/ns 6 Default 0.30 0.47 0.79 V/ns 5 Default 0.24 0.37 0.61 V/ns 4 Default 0.19 0.28 0.46 V/ns 3 Default 0.14 0.21 0.34 V/ns 2 Default 0.10 0.15 0.24 V/ns 1 Default 0.07 0.10 0.16 V/ns 0 Default 0.04 0.06 0.10 V/ns 1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C ambient at 90% of VDD_IO, and −30°C at 110% of VDD_IO. All values are taken at the 50% transition point. The loading used is 20 pF. Table 11. I/O FALL SLEW RATE (1.8 V VDD_IO) (Note 1) Parallel Slew (R0x306E[15:13]) Condition Min Typ Max Unit 7 Default 0.42 0.68 1.11 V/ns 6 Default 0.32 0.51 0.84 V/ns 5 Default 0.26 0.41 0.67 V/ns 4 Default 0.20 0.32 0.52 V/ns 3 Default 0.16 0.24 0.39 V/ns 2 Default 0.12 0.18 0.28 V/ns 1 Default 0.08 0.12 0.19 V/ns 0 Default 0.05 0.07 0.11 V/ns 1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C ambient at 90% of VDD_IO, and −30°C at 110% of VDD_IO. All values are taken at the 50% transition point. The loading used is 20 pF. www.onsemi.com 13 MT9M021, MT9M031 DC Electrical Characteristics The DC electrical characteristics are shown in Table 12, Table 13, Table 14, and Table 15. Table 12. DC ELECTRICAL CHARACTERISTICS Symbol Definition Min Typ Max Unit 1.7 1.8 1.95 V 1.7/2.5 1.8/2.8 1.9/3.1 V Analog Voltage 2.5 2.8 3.1 V VAA_PIX Pixel Supply Voltage 2.5 2.8 3.1 V VDD_PLL PLL Supply Voltage 2.5 2.8 3.1 V HiSPi Supply Voltage 0.3 0.4 0.6 V VDD Condition Core Digital Voltage VDD_IO I/O Digital Voltage VAA VDD_SLVS VIH Input HIGH Voltage VDD_IO * 0.7 – – V VIL Input LOW Voltage – – VDD_IO * 0.3 V IIN Input Leakage Current 20 – – mA VOH Output HIGH Voltage VDD_IO – 0.3 – – V VOL Output LOW Voltage VDD_IO = 2.8 V – – 0.4 V IOH Output HIGH Current At Specified VOH –22 – – mA IOL Output LOW Current At Specified VOL – – 22 mA CAUTION: No Pull-up Resistor; VIN = VDD_IO or DGND Stresses greater than those listed in Table 13 may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Table 13. ABSOLUTE MAXIMUM RATINGS Parameter Minimum Maximum Unit –0.3 4.5 V Total Power Supply Current – 200 mA IGND Total Ground Current – 200 mA VIN Symbol VSUPPLY Power Supply Voltage (All Supplies) ISUPPLY DC Input Voltage –0.3 VDD_IO + 0.3 V VOUT DC Output Voltage –0.3 VDD_IO + 0.3 V TSTG Storage Temperature (Note 1) –40 +85 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Table 14. OPERATING CURRENT CONSUMPTION FOR PARALLEL OUTPUT (VAA = VAA_PIX = VDD_IO = VDD_PLL = 2.8 V; VDD = 1.8 V; PLL Enabled and PIXCLK = 74.25 MHz; TA = 25°C; CLOAD = 10 pF) Condition Min Typ Max Unit Digital Operating Current Parallel, Streaming, Full Resolution 45 fps − 45 55 mA I/O Digital Operating Current Parallel, Streaming, Full Resolution 45 fps − 50 (Note 1) – mA Analog Operating Current Parallel, Streaming, Full Resolution 45 fps − 45 50 mA IAA_PIX Pixel Supply Current Parallel, Streaming, Full Resolution 45 fps − 6 10 mA IDD_PLL PLL Supply Current Parallel, Streaming, Full Resolution 45 fps − 6 8 mA Symbol IDD IDD_IO IAA Parameter 1. IDD_IO operating current is specified with image at 1/2 saturation level. www.onsemi.com 14 MT9M021, MT9M031 Table 15. STANDBY CURRENT CONSUMPTION (Analog − VAA + VAA_PIX + VDD_PLL; Digital − VDD + VDD_IO; TA = 25°C) Condition Min Typ Max Unit Analog, 2.8 V – 3 10 mA Digital, 1.8 V – 8 75 mA Analog, 2.8 V – 12 20 mA Digital, 1.8 V – 0.87 1.3 mA Analog, 2.8 V – 3 10 mA Digital, 1.8 V – 8 75 mA Analog, 2.8 V – 12 20 mA Digital, 1.8 V – 0.87 1.3 mA Definition Hard Standby (Clock Off, Driven Low) Hard Standby (Clock On, EXTCLK = 20 MHz) Soft Standby (Clock Off, Driven Low) Soft Standby (Clock On, EXTCLK = 20 MHz) HiSPi Electrical Specifications information. The VDD_SLVS supply in this data sheet corresponds to VDD_TX in the HiSPi Physical Layer Specification. Similarly, VDD is equivalent to VDD_HiSPi as referenced in the specification. The HiSPi transmitter electrical specifications are listed at 700 MHz. The ON Semiconductor MT9M021/MT9M031 sensor supports SLVS mode only, and does not have a DLL for timing adjustments. Refer to the High-Speed Serial Pixel (HiSPi) Interface Physical Layer Specification v2.00.00 for electrical definitions, specifications, and timing Table 16. INPUT VOLTAGE AND CURRENT (HiSPi POWER SUPPLY 0.4 V) (Measurement Conditions: Max Freq. 700 MHz) Symbol IDD_SLVS Parameter Min Supply Current (PWRHiSPi) (Driving 100 W Load) Typ Max Unit – 10 15 mA VCMD HiSPi Common Mode Voltage (Driving 100 W Load) VDD_SLVS x 0.45 VDD_SLVS/2 VDD_SLVS x 0.55 V |VOD| HiSPi Differential Output Voltage (Driving 100 W Load) VDD_SLVS x 0.36 VDD_SLVS/2 VDD_SLVS x 0.64 V DVCM Change in VCM between Logic 1 and 0 − − 25 mV |VOD| Change in |VOD| between Logic 1 and 0 − − 25 mV VOD Noise Margin – − 30 % |DVCM| Difference in VCM between any Two Channels − − 50 mV |DVOD| Difference in VOD between any Two Channels − − 100 mV DVCM_ac Common-mode AC Voltage (pk) without VCM Cap Termination − − 50 mV DVCM_ac NM Common-mode AC Voltage (pk) with VCM Cap Termination − − 30 mV VOD_ac Max Overshoot Peak |VOD| − − 1.3 x |VOD| V Vdiff_pkpk Max Overshoot Vdiff pk-pk V Veye Ro DRo − − 2.6 x |VOD| 1.4 x VOD − − Single-ended Output Impedance 35 50 70 W Output Impedance Mismatch − − 20 % Eye Height www.onsemi.com 15 MT9M021, MT9M031 VDIFFmax VDIFFmin 0 V (Diff) Output Signal is ‘Cp − Cn’ or ‘Dp − Dn’ Figure 8. Differential Output Voltage for Clock and Data Pairs Table 17. RISE AND FALL TIMES (Measurement Conditions: HiSPi Power Supply 0.4 V, Max Freq. 700 MHz) Parameter Min Typ Max Unit Data Rate 280 – 700 Mb/s TxPRE Max Setup Time from Transmitter (Note 1) 0.3 – – UI TxPost Max Hold Time from Transmitter 0.3 – – UI Symbol 1/UI RISE Rise Time (20−80%) – 0.25 UI – FALL Fall Time (20−80%) 150 ps 0.25 UI – PLL_DUTY 45 50 55 % tpw Bitrate Period (Note 1) 1.43 − 3.57 ns teye Eye Width (Notes 1, 2) 0.3 − − UI ttotaljit Clock Duty Data Total Jitter (pk pk)@1e−9 (Notes 1, 2) − − 0.2 UI tckjit Clock Period Jitter (RMS) (Note 2) − − 50 ps tcyjit Clock Cycle to Cycle Jitter (RMS) (Note 2) − − 100 ps tchskew Clock to Data Skew (Notes 1, 2) −0.1 − 0.1 UI t|PHYskew| PHY-to-PHY Skew (Notes 1, 5) − − 2.1 UI tDIFFSKEW Mean Differential Skew (Note 6) –100 − 100 ps 1. One UI is defined as the normalized mean time between one edge and the following edge of the clock. 2. Taken from 0 V crossing point. 3. Also defined with a maximum loading capacitance of 10 pF on any pin. The loading capacitance may also need to be less for higher bitrates so the rise and fall times do not exceed the maximum 0.3 UI. 4. The absolute mean skew between the Clock lane and any Data Lane in the same PHY between any edges. 5. The absolute mean skew between any Clock in one PHY and any Data lane in any other PHY between any edges. 6. Differential skew is defined as the skew between complementary outputs. It is measured as the absolute time between the two complementary edges at mean VCM point. www.onsemi.com 16 MT9M021, MT9M031 RISE VDIFF 80% DATA MASK 20% TxPre TxPost FALL Max VDIFF UI/2 VDIFF UI/2 CLOCK MASK CLKJITTER Trigger/Reference Figure 9. Eye Diagram for Clock and Data Signals VCMD tCMPSKEW tCHSKEW1PHY Figure 10. Skew within the PHY and Output Channels www.onsemi.com 17 MT9M021, MT9M031 POWER-ON RESET AND STANDBY TIMING Power-Up Sequence 5. Assert RESET_BAR for at least 1 ms. 6. Wait 150000 EXTCLKs (for internal initialization into software standby). 7. Configure PLL, output, and image settings to desired values. 8. Wait 1 ms for the PLL to lock. 9. Set streaming mode (R0x301a[2] = 1). The recommended power-up sequence for the MT9M021/MT9M031 is shown in Figure 11. The available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have the separation specified below. 1. Turn on VDD_PLL power supply. 2. After 0−10 ms, turn on VAA and VAA_PIX power supply. 3. After 0−10 ms, turn on VDD_IO power supply. 4. After the last power supply is stable, enable EXTCLK. VDD_PLL (2.8) t0 VAA_PIX VAA (2.8) t1 VDD_IO (1.8/2.8) t2 VDD (1.8) t3 VDD_SLVS (0.4) EXTCLK t4 RESET_BAR t5 tX Hard Reset t6 Internal Initialization Software Standby PLL Lock Streaming Figure 11. Power Up Table 18. POWER-UP SEQUENCE Symbol Definition Min Typ Max Unit t0 VDD_PLL to VAA/VAA_PIX 0 10 – ms t1 VAA/VAA_PIX to VDD_IO 0 10 – ms t2 VDD_IO to VDD 0 10 – ms t3 VDD to VDD_SLVS 0 10 – ms tX Xtal Settle Time t4 Hard Reset t5 Internal Initialization t6 PLL Lock Time – 30 (Note 1) – ms 1 (Note 2) – – ms 150000 – – EXTCLKs 1 – – ms 1. Xtal settling time is component-dependent, usually taking about 10–100 ms. 2. Hard reset time is the minimum time required after power rails are settled. In a circuit where hard reset is held down by RC circuit, then the RC time must include the all power rail settle time and Xtal settle time. 3. It is critical that VDD_PLL is not powered up after the other power supplies. It must be powered before or at least at the same time as the others. If the case happens that VDD_PLL is powered after other supplies then the sensor may have functionality issues and will experience high current draw on this supply. www.onsemi.com 18 MT9M021, MT9M031 Power-Down Sequence The recommended power-down sequence for the MT9M021/MT9M031 is shown in Figure 12. The available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have the separation specified below. 1. Disable streaming if output is active by setting standby R0x301a[2] = 0. 2. The soft standby state is reached after the current row or frame, depending on configuration, has ended. 3. Turn off VDD_SLVS. 4. Turn off VDD. 5. Turn off VDD_IO. 6. Turn off VAA/VAA_PIX. 7. Turn off VDD_PLL. VDD_SLVS (0.4) t0 VDD (1.8) t1 VDD_IO (1.8/2.8) t2 VAA_PIX VAA (2.8) t3 VDD_PLL (2.8) EXTCLK t4 Power Down until Next Power Up Cycle Figure 12. Power Down Table 19. POWER-DOWN SEQUENCE Symbol Parameter Min Typ Max Unit t0 VDD_SLVS to VDD 0 – – ms t1 VDD to VDD_IO 0 – – ms t2 VDD_IO to VAA/VAA_PIX 0 – – ms t3 VAA/VAA_PIX to VDD_PLL 0 – – ms t4 PwrDn until Next PwrUp Time 100 – – ms 1. t4 is required between power down and next power up time; all decoupling caps from regulators must be completely discharged. www.onsemi.com 19 MT9M021, MT9M031 80 70 Quantum Efficiency (%) 60 50 40 30 20 10 0 350 400 450 500 550 600 700 650 800 750 850 900 950 1000 1050 1100 Wavelength (nm) Figure 13. Quantum Efficiency − Monochrome Sensor 70 Red Green Blue 60 Quantum Efficiency (%) 50 40 30 20 10 0 350 400 450 500 550 600 650 700 750 800 850 Wavelength (nm) Figure 14. Quantum Efficiency − Color Sensor www.onsemi.com 20 900 950 1000 1050 MT9M021, MT9M031 Note: All dimensions in millimeters. PACKAGE DIMENSIONS Figure 15. 63-Ball iBGA Package Outline Drawing (Case 503AQ) www.onsemi.com 21 MT9M021, MT9M031 PACKAGE DIMENSIONS Figure 16. 48-Pin iLCC Package Outline Drawing (Case 847AJ) www.onsemi.com 22 MT9M021, MT9M031 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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