T PL IA N M CO *R oH S Features Applications ■ 0603 size ■ Mobile phones ■ Available in E12 series ■ Cellular phones ■ High Q - up to 80 typ. ■ CTV, VCR, HIC, FDD ■ High operating temperature of 125 °C ■ Small size of only 1.6 mm ■ RoHS compliant* CW160808 Series - High Q Chip Inductors Electrical Specifications General Specifications Inductance ® Bourns Part No. Q Test Freq. (MHz) SRF (MHz) RDC I rms (mA) nH Tol. % Min. L Q Min. Ohms Max. CW160808-1N8M 1.8 ±20 16 250 250 6000 0.04 700 CW160808-2N2D 2.2 ±15 16 250 250 6000 0.08 700 CW160808-3N9J 3.9 ±5 16 250 250 6000 0.08 700 CW160808-4N7J 4.7 ±5 16 250 250 5800 0.10 700 CW160808-6N8J 6.8 ±5 25 250 250 5800 0.11 700 CW160808-8N2J 8.2 ±5 30 250 250 5000 0.11 700 CW160808-10NJ 10 ±5 30 250 250 4800 0.13 700 CW160808-12NJ 12 ±5 30 250 250 4000 0.13 700 CW160808-15NJ 15 ±5 30 250 250 4000 0.17 700 CW160808-18NJ 18 ±5 30 250 250 3100 0.17 700 CW160808-22NJ 22 ±5 35 250 250 3000 0.19 700 CW160808-27NJ 27 ±5 35 250 250 2800 0.22 600 CW160808-33NJ 33 ±5 35 250 250 2300 0.22 600 CW160808-39NJ 39 ±5 35 250 250 2200 0.25 600 CW160808-47NJ 47 ±5 35 200 250 2100 0.28 600 CW160808-56NJ 56 ±5 35 200 250 1900 0.31 600 CW160808-68NJ 68 ±5 35 200 250 1700 0.34 600 CW160808-72NJ 72 ±5 34 200 250 1700 0.49 400 CW160808-82NJ 82 ±5 34 150 250 1700 0.54 400 CW160808-R10J 100 ±5 34 150 250 1400 0.71 400 CW160808-R12J 120 ±5 32 150 250 1350 0.79 300 CW160808-R15J 150 ±5 28 150 150 1300 0.92 280 CW160808-R18J 180 ±5 25 100 100 990 1.25 240 CW160808-R22J 220 ±5 25 100 100 990 1.90 200 CW160808-R27J 270 ±5 25 100 100 990 2.30 170 Materials Core Material .............................Alumina (1CC150707-302291) Wire ........ Enameled copper (1W1E180) Terminal ...........................Mo/Mn+Ni+Au Encapsulate ......... Epoxy (1EAS-UV300) Packaging ................. 3,000 pcs. per reel Product Dimensions 1.0 ± 0.2 (.040 ± .008) 0.35 (.014) 1.65 ± 0.2 (.065 ± .008) 1.05 ± 0.2 (.041 ± .008) 0.35 (.014) Solder Profile Temperature Rising Area Preheat Area - 4 °C/ Sec. Max. - 150~200 °C / 60~120 Sec. Reflow Area 20~ 40 °C/ Sec. Max. Forced Cooling Area - 0.35 (.014) Recommended Layout -1~5 °C/Sec. Max. REF. PEAK TEMP. 260 °C 250 Temperature (°C) Temperature Rise .................20 °C max. at rated current Operating Temperature ................................-40 °C to +125 °C Storage Temperature ................................-40 °C to +125 °C Reflow Soldering .. 230 °C, 50 sec. max. Resistance to Soldering Heat .......................... +260 °C, 10 seconds 0.7 (.028) 0.7 REF. (.028) 230 °C - 50 SECONDS MAX. 200 REF. 150 70 SECONDS MAX. 100 DIMENSIONS: 50 0 50 100 150 200 1.2 REF. (.047) 0.64 (.025) 250 Time (Seconds) *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MM (INCHES) CW160808 Series - High Q Chip Inductors Packaging Specifications 2.0 ± 0.5 (.079 ± .020) 178.0 (7.00) DIA. 21.0 ± 0.8 (.827 ± .031) 12.5 (.492) THICKNESS 0.10 (.004) MAX. 13.0 ± 0.5 (.512 ± .020) DIA. EMBOSSED CAVITY 50.0 (1.969) 13.0 ± 0.5 DIA. (.512 ± .020) EMBOSSED CARRIER DIMENSIONS: MM (INCHES) 8.0 (.315) 10.0 (.393) REV. 02/13 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.