TI CDCE62005 Five/ten output clock generator/jitter cleaner with integrated dual vco Datasheet

CDCE62005
www.ti.com
SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
Five/Ten Output Clock Generator/Jitter Cleaner With Integrated Dual VCOs
Check for Samples: CDCE62005
FEATURES
1
•
•
•
•
•
•
•
•
Frequency Synthesizer With PLL/VCO and
Partially Integrated Loop Filter.
Fully Configurable Outputs Including
Frequency, Output Format, and Output Skew.
Smart Input Multiplexer Automatically
Switches Between One of Three Reference
Inputs.
Multiple Operational Modes Include Clock
Generation via Crystal, SERDES Startup Mode,
Jitter Cleaning, and Oscillator Holdover Mode
Integrated EEPROM Determines Device
Configuration at Power-up
Excellent Jitter Performance
Integrated Frequency Synthesizer including
PLL, Multiple VCOs, and Loop Filter:
– Full Programmability Facilitates Phase
Noise Performance Optimization Enabling
Jitter Cleaner Mode.
– Programmable Charge Pump Gain and
Loop Filter Settings
– Unique Dual-VCO Architecture Supports a
Wide Tuning Range 1.750 GHz–2.356 GHz
Universal Output Blocks Support up to 5
Differential, 10 Single-ended, or Combinations
of Differential or Single-ended:
– 0.35 ps RMS (10 kHz to 20 MHz) Output
Jitter Performance
– Low Output Phase Noise: –130 dBc/Hz at 1
MHz offset, Fc = 491.52 MHz
– Output Frequency Ranges From 4.25 MHz
to 1.175 GHz in Synthesizer Mode
– Output Frequency up to 1.5 GHz in Fan-out
Mode
– LVPECL, LVDS, LVCMOS, and Special High
Output Swing Modes
– Independent Output Dividers Support
Divide Ratios from 1–80, Non-continuous
values supported.
•
•
•
•
•
•
– Independent Coarse Skew Control on all
Outputs, The coarse skew control does not
operate for reference input frequencies less
than 1 MHz
Flexible Inputs With Innovative Smart
Multiplexer Feature:
– Two Universal Differential Inputs Accept
Frequencies in the Range of 40 kHz to
1500 MHz (LVPECL), 800 MHz (LVDS), or
250 MHz (LVCMOS).
– One Auxiliary Input Accepts Crystals in the
Range of 2 MHz–42 MHz
– Clock Generator Mode Using Crystal Input.
– Smart Input Multiplexer can be Configured
to Automatically Switch Between Highest
Priority Clock Source Available Allowing
for Fail-safe Operation and Holdover
Modes.
Typical Power Consumption 1.7W (See
Table 44) at 3.3V
Integrated EEPROM Stores Default Settings;
Therefore, The Device Can Power up in a
Known, Predefined State.
Offered in QFN-48 Package
ESD Protection Exceeds 2kV HBM
Industrial Temperature Range –40°C to 85°C
APPLICATIONS
•
•
•
•
•
•
•
Data Converter and Data Aggregation Clocking
Wireless Infrastructure
Switches and Routers
Medical Electronics
Military and Aerospace
Industrial
Clock Generation and Jitter Cleaning
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2010, Texas Instruments Incorporated
CDCE62005
SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
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DESCRIPTION
The CDCE62005 is a high performance clock generator and distributor featuring low output jitter, a high degree
of configurability via a SPI interface, and programmable start up modes determined by on-chip EEPROM.
Specifically tailored for clocking data converters and high-speed digital signals, the CDCE62005 achieves jitter
performance well under 1 ps RMS (1). It incorporates a synthesizer block with partially integrated loop filter, a
clock distribution block including programmable output formats, and an input block featuring an innovative smart
multiplexer. The clock distribution block includes five individually programmable outputs that can be configured to
provide different combinations of output formats (LVPECL, LVDS, LVCMOS). Each output can also be
programmed to a unique output frequency (ranging from 125 kHz to 1.5 GHz (2)) and skew relationship via a
programmable delay block. If all outputs are configured in single-ended mode (e.g., LVCMOS), the CDCE62005
supports up to ten outputs. Each output can select one of four clock sources to condition and distribute including
any of the three clock inputs or the output of the frequency synthesizer. The input block includes two universal
differential inputs which support frequencies in the range of 80 kHz to 500 MHz and an auxiliary input that can be
configured to connect to an external crystal via an on board oscillator block. The smart input multiplexer has two
modes of operation, manual and automatic. In manual mode, the user selects the synthesizer reference via the
SPI interface. In automatic mode, the input multiplexer will automatically select between the highest priority input
clock available.
Data
DSP
SerDes
Cleaned Clock
Recovered Clock
DSP Clock
CDCE62005
ADC Clock
ADC Clock
DAC Clock
Figure 1. CDCE62005 Application Example
(1)
(2)
2
10 kHz to 20 MHz integration bandwidth.
Frequency range depends on operational mode and output format selected.
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DEVICE INFORMATION
PACKAGE
The CDCE62005 is packaged in a 48-Pin Plastic Quad Flatpack Package with enhanced bottom thermal pad for
heat dissipation. The Texas Instruments Package Designator is: RGZ (S-PQFP-N48)
36
25
37
24
Top View
Not up to Scale
48
13
12
1
Figure 2. 48-Pin QFN Package Outline
PIN FUNCTIONS (1)
PIN
NAME
VCC_OUT
QFN
8, 11, 18,
21, 26, 29,
32
TYPE
DESCRIPTION
Power
3.3V Supply for the Output Buffers and Output Dividers
3.3V to Power the AUX_OUT circuitry
VCC_AUXOUT
15
Power
VCC1_PLL
5
A. Power
3.3V PLL Supply Voltage for the PLL circuitry. (Filter Required)
VCC2_PLL
39, 42
A. Power
3.3V PLL Supply Voltage for the PLL circuitry. (Filter Required)
VCC_VCO
34, 35
A. Power
3.3V VCO Input Buffer and Circuitry Supply Voltage. (Filter Required)
VCC_IN_PRI
47
A. Power
3.3V References Input Buffer and Circuitry Supply Voltage.
VCC_IN_SEC
1
A. Power
3.3V References Input Buffer and Circuitry Supply Voltage.
VCC_AUXIN
44
A. Power
3.3V Crystal Oscillator Input Circuitry.
36
Ground
Ground that connects to VCO Ground. (VCO_GND is shorted to GND)
PAD
Ground
Ground is on Thermal PAD. See Layout recommendation
GND_VCO
GND
SPI_MISO
SPI_LE
SPI_CLK
22
25
24
OD
In SPI Mode it is an Open Drain Output and it functions as a Master In Slave Out as a serial
Control Data Output to CDCE62005 .
I
LVCMOS input, control Latch Enable for Serial Programmable Interface (SPI), with Hysteresis in
SPI Mode. The input has an internal 150-kΩ pull-up resistor if left unconnected it will default to
logic level “1”.
I
LVCMOS input, serial Control Clock Input for the SPI bus interface, with Hysteresis. The input
has an internal 150-kΩ pull-up resistor if left unconnected it will default to logic level “1”.
SPI_MOSI
23
I
LVCMOS input, Master Out Slave In as a serial Control Data Input to CDCE62005 for the SPI
bus interface. The input has an internal 150-kΩ pull-up resistor if left unconnected it will default
to logic level “1”.
TEST_MODE
33
I
This pin should be tied high or left unconnected.
(1)
Note: The internal memory (EEPROM and RAM) are sourced from various power pins. All VCC connections must be powered for proper
functionality of the device.
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PIN FUNCTIONS (1) (continued)
PIN
NAME
QFN
TYPE
DESCRIPTION
REF_SEL
31
I
If Auto Reference Select Mode is OFF this Pin acts as External Input Reference Select Pin;
The REF_SEL signal selects one of the two input clocks:
REF_SEL [1]: PRI_IN is selected; REF_SEL [0]: SEC_IN is selected;
The input has an internal 150-kΩ pull-up resistor if left unconnected it will default to logic level
“1”. If Auto Reference Select Mode in ON this Pin not used.
Power_Down
12
I
Active Low. Power down mode can be activated via this pin. See Table 15 for more details. The
input has an internal 150-kΩ pull-up resistor if left unconnected it will default to logic level “1”.
SPI_LE has to be HIGH in order for the rising edge of Power_Down signal to load the
EEPROM.
SYNC
14
I
Active Low. Sync mode can be activated via this pin. See Table 15 for more details. The input
has an internal 150-kΩ, pull-up resistor if left unconnected it will default to logic level “1”.
AUX IN
43
I
Auxiliary Input is a single ended input including an on-board oscillator circuit so that a crystal
may be connected.
AUX OUT
13
O
Auxiliary Output LVCMOS level that can be programmed via SPI interface to be driven by
Output 2 or Output 3.
PRI REF+
45
I
Universal Input Buffer (LVPECL, LVDS, LVCMOS) positive input for the Primary Reference
Clock,
PRI REF–
46
I
Universal Input Buffer (LVPECL, LVDS) negative input for the Primary Reference Clock. In case
of LVCMOS signaling Ground this pin.
I
Universal Input Buffer (LVPECL, LVDS, LVCMOS) positive input for the Secondary Reference
Clock,
Universal Input Buffer (LVPECL, LVDS,) negative input for the Secondary Reference Clock.
SEC REF+
3
SEC REF–
2
I
TESTOUTA
30
Analog
Analog Test Point for Use for TI Internal Testing. Pull Down to GND Via a 1kΩs Resistor.
REG_CAP1
4
Analog
Capacitor for the internal Regulator. Connect to a 10uF Capacitor (Y5V)
REG_CAP2
38
Analog
Capacitor for the internal Regulator. Connect to a 10uF Capacitor (Y5V)
VBB
48
Analog
Capacitor for the internal termination Voltage. Connect to a 1uF Capacitor (Y5V)
EXT_LFP
40
Analog
External Loop Filter Input Positive
EXT_LFN
41
Analog
External Loop Filter Input Negative.
PLL_LOCK
37
AI/O
U0P:U0N
U1P:U1N:
U2P:U2N
U3P:U3N
U4P:U4N
27, 28
19, 20
16,17
9, 10
6, 7
O
4
Output that indicates PLL Lock Status. See Figure 37.
The Main outputs of CDCE62005 are user definable and can be any combination of up to 5
LVPECL outputs, 5 LVDS outputs or up to 10 LVCMOS outputs. The outputs are selectable via
SPI interface. The power-up setting is EEPROM configurable.
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FUNCTIONAL DESCRIPTION
PRI_IN
Output
Divider 0
SEC_IN
U0P
U0N
/1:/2:HiZ
/1:/2:HiZ
Reference
Divider
Output
Divider 1
XTAL /
AUX_IN
EXT_LFP
EXT_LFN
Output
Divider 2
Input
Divider
Feedback
Divder
PFD /
CP
Prescaler
Output
Divider 3
Output
Divider 4
REF_SELECT
/Power_down
/SYNC
SPI_LE
SPI_CLK
SPI_MISO
SPI_MOSI
Interface
&
Control
U1P
U1N
U2P
U2N
U3P
U3N
U4P
U4N
EEPROM
AUX
OUT
Figure 3. CDCE62005 Block Diagram
The CDCE62005 comprises of four primary blocks: the interface and control block, the input block, the output
block, and the synthesizer block. In order to determine which settings are appropriate for any specific
combination of input/output frequencies, a basic understanding of these blocks is required. The interface and
control block determines the state of the CDCE62005 at power-up based on the contents of the on-board
EEPROM. In addition to the EEPROM, the SPI port is available to configure the CDCE62005 by writing directly
to the device registers after power-up. The input block selects which of the three input ports is available for use
by the synthesizer block and buffers all clock inputs. The output block provides five separate clock channels that
are fully programmable and configurable to select and condition one of four internal clock sources. The
synthesizer block multiplies and filters the input clock selected by the input block.
NOTE
This Section of the data sheet provides a high-level description of the features of the
CDCE62005 for purpose of understanding its capabilities. For a complete description of
device registers and I/O, please refer to the Device Configuration Section.
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Interface and Control Block
The CDCE62005 is a highly flexible and configurable architecture and as such contains a number of registers so
that the user may specify device operation. The contents of nine 28-bit wide registers implemented in static RAM
determine device configuration at all times. On power-up, the CDCE62005 copies the contents of the EEPROM
into the RAM and the device begins operation based on the default configuration stored in the EEPROM.
Systems that do not have a host system to communicate with the CDCE62005 use this method for device
configuration. The CDCE62005 provides the ability to lock the EEPROM; enabling the designer to implement a
fault tolerant design. After power-up, the host system may overwrite the contents of the RAM via the SPI (Serial
Peripheral Interface) port. This enables the configuration and reconfiguration of the CDCE62005 during system
operation. Finally, the device offers the ability to copy the contents of the RAM into EEPROM, if the EEPROM is
unlocked.
Static RAM (Device Registers)
Register 8
Register 7
Register 6
REF_SELECT
/Power_Down
/SYNC
SPI_LE
SPI_CLK
SPI_MISO
SPI_MOSI
Register 5
Interface
&
Control
Device
Hardware
Register 4
Register 3
Register 2
Register 1
Register 0
EEPROM (Default Configuration)
Register 7
Register 6
Register 5
Register 4
Register 3
Register 2
Register 1
Register 0
Figure 4. CDCE62005 Interface and Control Block
6
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Input Block
The Input Block includes a pair of Universal Input Buffers and an Auxiliary Input. The Input Block buffers the
incoming signals and facilitates signal routing to the Internal Clock Distribution bus and the Synthesizer Block via
the smart multiplexer (called the Smart MUX). The Internal Clock Distribution Bus connects to all output blocks
discussed in the next section. Therefore, a clock signal present on the Internal Clock Distribution bus can appear
on any or all of the device outputs. The CDCE62005 routes the PRI_IN and SEC_IN inputs directly to the Internal
Clock Distribution Bus. Additionally, it can divide these signals via the dividers present on the inputs and output
of the first stage of the Smart MUX.
1500 MHz
PRI_IN
LVPECL: 1500 MHz
LVDS: 800 MHz
LVCMOS: 250 MHz
Smart MUX
Control
REF_SEL
/1:/2:HiZ
Smart
MUX1
Reference Divider
/1 - /8
Smart
MUX2
Internal Clock Distribution Bus
1500 MHz
SEC_IN
/1:/2:HiZ
Crystal: 2 MHz - 40 MHz
XTAL/
AUX_IN
Figure 5. CDCE62005 Input Block
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Output Block
Each of the five identical output blocks incorporates an output multiplexer, a clock divider module, and a
universal output array as shown.
Internal Clock Distribution Bus
Output
MUX
Control
Sync
Pulse
Digital Phase Adjust
PRI_IN
Output Buffer Control
Enable
(7 -bits )
UxP
SEC_IN
/1,2,3,4,5Clock Divider
/1 - /8 Module 0/2- 4
SMART_MUX
LVDS
UxN
SYNTH
LVPECL
Figure 6. CDCE62005 Output Block (1 of 5)
Clock Divider Module 0–4
The following shows a simplified version of a Clock Divider Module (CDM). If an individual clock output channel
is not used, then the user should disable the CDM and Output Buffer for the unused channel to save device
power. Each channel includes two 7-bit registers to control the divide ratio used and the clock phase for each
output. The output divider supports divide ratios from divide by 1 (bypass the divider) to divide by 80; the divider
does not support all integer values between 1 and 80. Refer to for a complete list of divide ratios supported.
Enable
Sync Pulse
(internally generated)
From
Output
MUX
Digital Phase Adjust (7-bits)
Output Divider
To
Output
Buffer
(7-bits)
Figure 7. CDCE62005 Output Divider Module (1 of 5)
8
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Synthesizer Block
Internal Clock Distribution Bus
SMART_MUX
1.750 GHz –
2.356 GHz
Input Divider
/1 - /256
PFD/
CP
Feedback Divider
/1, /2, /5, /8, /10, /15, /20
Prescaler
/2,/3,/4,/5
50 kHz –
400 kHz
/8 - /1280
Feedback Divider
Feedback Bypass Divider
SYNTH
Internal Clock Distribution Bus
Figure 8 presents a high-level overview of the Synthesizer Block on the CDCE62005.
Figure 8. CDCE62005 Synthesizer Block
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COMPUTING THE OUTPUT FREQUENCY
Figure 9 presents the block diagram of the CDCE62005 in synthesizer mode highlighting the clock path for a
single output. It also identifies the following regions containing dividers comprising the complete clock path
• R: Includes the cumulative divider values of all dividers included from the Input Ports to the output of the
Smart Multiplexer (see Input Block for more details)
• O: The output divider value (see Output Block for more details)
• I: The input divider value (see Synthesizer Block for more details)
• P: The Prescaler divider value (see Synthesizer Block of more details)
• F: The cumulative divider value of all dividers falling within the feedback divider (see Synthesizer Block for
more details)
O
Output
Divider 0
FIN
F OUT
U0N
R
/1:/2:HiZ
/1:/2:HiZ
U0P
Reference
Divider
Output
Divider 1
EXT_LFP
EXT_LFN
Output
Divider 2
U1P
U1N
U2P
U2N
I
Input
Divider
Feedback
Divider
P
PFD /
CP
Prescaler
Output
Divider 3
U3P
U3N
F
Output
Divider 4
U4P
U4N
AUX
OUT
Figure 9. CDCE62005 Clock Path – Synthesizer Mode
With respect to Figure 9, any output frequency generated by the CDCE62005 relates to the input frequency
connected to the Synthesizer Block by Equation 1.
F
FOUT = FIN ´
R ´I´ O
(1)
Equation 1 holds true when subject to the following constraints:
1.750 Ghz < O x P x FOUT< 2.356 GHz
(2)
And the comparison frequency FCOMP,
40 kHz ≤ FCOMP < 40 MHz
Where:
FCOMP =
FIN
R ´I
Note: This device cannot output the frequencies between 780 MHz to 880 MHz
10
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ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VALUE
UNIT
-0.5 to 4.6
V
Input voltage range (3)
–0.5 to VCC + 0.5
V
Output voltage range (3)
–0.5 to VCC + 0.5
V
Input Current (VI < 0, VI > VCC)
±20
mA
Output current for LVPECL/LVCMOS Outputs (0 < VO < VCC)
±50
mA
TJ
Maximum junction temperature
125
°C
Tstg
Storage temperature range
–65 to 150
°C
VCC
Supply voltage range (2)
VI
VO
(1)
(2)
(3)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All supply voltages have to be supplied simultaneously.
The input and output negative voltage ratings may be exceeded if the input and output clamp–current ratings are observed.
THERMAL CHARACTERISTICS
Package Thermal Resistance for QFN (RGZ) Package
(1) (2)
AIRFLOW (lfm)
(1)
(2)
(3)
qJP (°C/W) (3)
qJA (°C/W)
0
JEDEC Compliant Board (6X6 VIAs on PAD)
2
28.9
100
JEDEC Compliant Board (6X6 VIAs on PAD)
2
20.4
0
Recommended Layout (7X7 VIAs on PAD)
2
27.3
100
Recommended Layout (7X7 VIAs on PAD)
2
20.3
The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
Connected to GND with 36 thermal vias (0,3 mm diameter).
qJP (Junction – Pad) is used for the QFN Package, because the main heat flow is from the Junction to the GND-Pad of the QFN.
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ELECTRICAL CHARACTERISTICS OPERATING CONDITIONS
recommended operating conditions for the CDCE62005 device for under the specified Industrial temperature range of –40°C
to 85°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
3
3.3
3.6
3
3.3
3.6
UNIT
POWER SUPPLY
VCC
Supply voltage
VCC_PLL,
VCC_IN,
Analog supply voltage
VCC_VCO &
VCCA
PLVPECL
REF at 30.72,MHz, Outputs are LVPECL
PLVDS
REF at 30.72 MHz, Outputs are LVDS
PLVCMOS
REF at 30.72 MHz, Outputs are LVCMOS
POFF
REF at 30.72 MHz
Output 1 = 491.52 MHz
Output 2 = 245.76 MHz
Output 3 = 122.88 MHz
Output 4 = 61.44 MHz
Output 5 = 30.72 MHz
In case of LVCMOS
Outputs = 245.76 MHz
Dividers are disabled. Outputs are
disabled.
PPD
Device is powered down
V
1.9
W
1.65
W
1.8
W
0.75
W
20
mW
DIFFERENTIAL INPUT MODE (PRI_IN, SEC_IN)
VINPP
Input amplitude (V_IN – V/IN) (1)
0.1
1.3
V
VIC
Common-mode input voltage
1.0
VCC–0.3
V
IIH
Differential input current high (no internal
termination)
VI = VCC, VCC = 3.6 V
20
mA
IIL
Differential input current low (no internal
termination)
VI = 0 V, VCC = 3.6 V
20
mA
–20
Input Capacitance on PRI_IN, SEC_IN
3
pF
CRYSTAL INPUT SPECIFICATIONS
Crystal load capacitance
8
Equivalent series resistance (ESR)
10
pF
50
Ω
LVCMOS INPUT MODE (SPI_CLK,SPI_MOSI,SPI_LE,PD,SYNC,REF_SEL, PRI_IN, SEC_IN )
Low-level input voltage LVCMOS,
0
0.3 x VCC
V
High-level input voltage LVCMOS
0.7 x VCC
VCC
V
–1.2
V
20
mA
–40
mA
10
mA
VIK
LVCMOS input clamp voltage
VCC = 3 V, II = –18 mA
IIH
LVCMOS input current
VI = VCC, VCC = 3.6 V
IIL
LVCMOS input (Except PRI_IN and
SEC_IN)
VI = 0 V, VCC = 3.6 V
–10
IIL
LVCMOS input (PRI_IN and SEC_IN)
VI = 0 V, VCC = 3.6 V
–10
CI
Input capacitance (LVCMOS signals)
VI = 0 V or VCC
(1)
12
3
pF
VINPP minimum and maximum is required to maintain ac specifications; the actual device function tolerates at a minimum VINPP of
100mV.
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ELECTRICAL CHARACTERISTICS OPERATING CONDITIONS (Continued)
recommended operating conditions for the CDCE62005 device for under the specified Industrial temperature range of –40°C
to 85°C
PARAMETER
TEST CONDITIONS
MIN
TYP (1) MAX
UNIT
SPI OUTPUT (MISO) / PLL DIGITAL (OUTPUT MODE)
IOH
High-level output current
VCC = 3.3 V,
VO = 1.65 V
–30
mA
IOL
Low-level output current
VCC = 3.3 V,
VO = 1.65 V
33
mA
VOH
High-level output voltage for LVCMOS outputs
VCC = 3 V,
IOH = −100 mA
VOL
Low-level output voltage for LVCMOS outputs
VCC = 3 V,
IOL = 100 mA
CO
Output capacitance on MISO
VCC = 3.3 V; VO = 0 V or VCC
3
3-state output current
VO = VCC
VO = 0 V
5
–5
IOZH
IOZL
VCC–0.5
V
0.3
V
pF
mA
PLL ANALOG ( INPUT MODE)
IOZH
LOCK
High-impedance state output current for PLL
LOCK output (2)
VO = 3.6 V (PD is set low)
22
mA
IOZL
LOCK
High-impedance state output current for PLL
LOCK output
VO = 0 V (PD is set low)
–1
mA
VT+
Positive input threshold voltage VCC = min to
max
VCC×0.55
V
VT–
Negative input threshold voltage VCC c= min to
max
VCC×0.35
V
VBB
VBB
Termination voltage for reference inputs.
IBB = –0.2 mA, Depending on the
setting.
0.9
1.9
V
INPUT BUFFERS INTERNAL TERMINATION RESISTORS (PRI_IN and SEC_IN)
Termination resistance
Single ended
Ω
50
PHASE DETECTOR
fCPmax
(1)
(2)
Charge pump frequency
0.04
40
MHz
All typical values are at VCC = 3.3 V, temperature = 25°C
Lock output has a 80kΩ pull-down resistor.
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ELECTRICAL CHARACTERISTICS OPERATING CONDITIONS (Continued)
recommended operating conditions for the CDCE62005 device for under the specified Industrial temperature range of –40°C
to 85°C
PARAMETER
TEST CONDITIONS
MIN
TYP (1) MAX
UNIT
0
250
MHz
0.3
V
LVCMOS OUTPUT OR AUXILIARY OUTPUT
fclk
Output frequency, see Figure Below
Load = 5 pF to GND
VOH
High-level output voltage for LVCMOS
outputs
VCC = min to max
IOH = –100 mA
VOL
Low-level output voltage for LVCMOS
outputs
VCC = min to max
IOL =100 µA
IOH
High-level output current
VCC = 3.3 V
VO = 1.65 V
–30
mA
IOL
Low-level output current
VCC = 3.3 V
VO = 1.65 V
33
mA
tpho
Reference (PRI_IN or SEC_IN) to Output
Phase offset
Outputs are set to 122.88 MHz, Reference
at 30.72 MHz
0.35
ns
tpd(LH)/
tpd(HL)
Propagation delay from PRI_IN or SEC_IN
to Outputs
Crosspoint to VCC/2, load In Bypass Mode
4
ns
tsk(o)
Skew, output to output For Y0 to Y4
All Outputs set at 200 MHz in bypass mode
only, Reference = 200 MHz
75
ps
CO
Output capacitance on Y0 to Y4
VCC = 3.3 V; VO = 0 V or VCC
5
pF
VO = VCC
5
mA
VO = 0 V
–5
mA
IOZH
3-State LVCMOS output current
IOZL
IOPDH
IOPDL
Power Down output current
VO = VCC
25
mA
VO = 0 V
5
mA
Duty cycle LVCMOS
tslew-rate
(1)
45%
Output rise/fall slew rate
3.6
55%
5.2
V/ns
All typical values are at VCC = 3.3 V, temperature = 25°C
LVCMOS
14
VCC –0.5
5 pF
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ELECTRICAL CHARACTERISTICS OPERATING CONDITIONS (Continued) (1)
(2) (3) (4)
recommended operating conditions for the CDCE62005 device for under the specified Industrial temperature range of –40°C
to 85°C
PARAMETER
MIN TYP (5)
TEST CONDITIONS
MAX
UNIT
0
800
MHz
270
550
mV
50
mV
LVDS OUTPUT
fclk
Output frequency
Configuration Load
|VOD|
Differential output voltage
RL = 100 Ω
ΔVOD
LVDS VOD magnitude change
VOS
Offset Voltage
ΔVOS
VOS magnitude change
tpho
–40°C to 85°C
1.24
V
40
Short circuit Vout+ to ground
VOUT = 0
Short circuit Vout– to ground
VOUT = 0
Reference (PRI_IN or SEC_IN) to output
phase offset
Outputs are set to 491.52 MHz
Reference at 30.72 MHz
tpd(LH)/tpd(HL) Propagation delay from PRI_IN or SEC_IN to
outputs
Crosspoint to Crosspoint, load In Bypass
Mode
mV
27
mA
27
mA
1.65
ns
3.1
ns
25
ps
Skew, output to output For Y0 to Y4
All Outputs set at 200 MHz
In Bypass Mode Only
Reference = 200 MHz
CO
Output capacitance on Y0 to Y4
VCC = 3.3 V; VO = 0 V or VCC
IOPDH
Power down output current
VO = VCC
25
mA
IOPDL
Power down output current
VO = 0 V
5
mA
tsk(o)
(6)
5
Duty cycle
tr / tf
45%
Rise and fall time
pF
55%
20% to 80% of VOUT(PP)
110
160
190
ps
VCC/2 to Crosspoint
0.9
1.4
1.9
ns
LVCMOS-TO-LVDS
tskP_c
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Output skew between LVCMOS and LVDS
outputs (7)
This is valid only for same REF_IN clock and Y output clock frequency
VINPP minimum and maximum is required to maintain ac specifications; the actual device function tolerates at a minimum VINPP of
100mV.
Lock output has a 80 kΩ pull-down resistor.
The phase of LVCMOS is lagging in reference to the phase of LVDS.
All typical values are at VCC = 3.3 V, temperature = 25°C
The tsk(o) specification is only valid for equal loading of all outputs.
Operating the LVCMOS or LVDS output above the maximum frequency will not cause a malfunction to the device, but the output signal
swing might no longer meet the output specification
LVDS DC Termination Test
100 Ω
Oscilloscope
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ELECTRICAL CHARACTERISTICS OPERATING CONDITIONS (Continued)
recommended operating conditions for the CDCE62005 device for under the specified Industrial temperature range of –40°C
to 85°C
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
MHz
LVPECL OUTPUT
fclk
Output frequency, Configuration load
0
1500
VOH
LVPECL high-level output voltage load
VCC –1.06
VCC –0.88
VOL
LVPECL low-level output voltage load
VCC–2.02
VCC–1.58
|VOD|
Differential output voltage
610
970
tpho
Reference to Output Phase offset
Outputs are set to 491.52 MHz,
Reference at 30.72 MHz
1.47
ns
tpd(LH)/
tpd(HL)
Propagation delay from PRI_IN or SEC_IN to outputs
Crosspoint to Crosspoint, load In
Bypass Mode
3.4
ns
tsk(o)
Skew, output to output For Y0 to Y4
All Outputs set at 200 MHz
In Bypass Mode Only
Reference = 200MHz
25
ps
CO
Output capacitance on Y0 to Y4
VCC = 3.3 V; VO = 0 V or VCC
IOPDH
IOPDL
Power Down output current
5
pF
25
mA
VO = 0 V
5
mA
45%
Rise and fall time
V
mV
VO = VCC
Duty Cycle
tr / tf
V
55%
20% to 80% of VOUT(PP)
55
75
135
ps
Crosspoint to Crosspoint
0.9
1.1
1.3
ns
–150
260
700
ps
V
LVDS-TO-LVPECL
tskP_C
Output skew between LVDS and LVPECL outputs
LVCMOS-TO-LVPECL
tskP_C
Output skew between LVCMOS and LVPECL outputs
VCC/2 to Crosspoint
LVPECL HI-PERFORMANCE OUTPUT
VOH
LVPECL high-level output voltage load
VCC –1.11
VCC –0.87
VOL
LVPECL low-level output voltage load
VCC –2.06
VCC –1.73
|VOD|
Differential output voltage
760
1160
mV
tr / tf
Rise and fall time
135
ps
(1)
20% to 80% of VOUT(PP)
55
75
V
All typical values are at VCC = 3.3 V, temperature = 25°C
LVPECL AC Termination Test
LVPECL DC Termination Test
50 Ω
Oscilloscope
50 Ω
150 Ω
150 Ω
50 Ω
Oscilloscope
16
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50 Ω
Vcc-2
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LVPECL OUTPUT SWING
vs
FREQUENCY
HI SWING LVPECL OUTPUT SWING
vs
FREQUENCY
V
Figure 10.
Figure 11.
LVDS OUTPUT SWING
vs
FREQUENCY
LVCMOS OUTPUT SWING
vs
FREQUENCY
Figure 12.
Figure 13.
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TIMING REQUIREMENTS
over recommended ranges of supply voltage, load and operating free air temperature (unless otherwise noted)
PARAMETER
MIN
TYP
MAX
UNIT
PRI_IN/SEC_IN_IN REQUIREMENTS
Maximum Clock Frequency Applied to PRI_IN & SEC_IN in fan-out mode
fmax
1500
MHz
Maximum Clock Frequency Applied to Smart Multiplexer input Divider
500
MHz
Maximum Clock Frequency Applied to Reference Divider
250
MHz
For Single ended Inputs ( LVCMOS) on PRI_IN and SEC_IN
250
MHz
Single duty cycle of PRI_IN or SEC_IN at VCC / 2
40%
60%
Differential duty cycle of PRI_IN or SEC_IN at VCC / 2
40%
60%
2
42
MHz
4
ns
AUXILARY_IN REQUIREMENTS
fREF
Crystal single ended Inputs (AT-Cut Crystal Input)
PD, SYNC, REF_SEL REQUIREMENTS
tr/ tf
18
Rise and fall time of the PD, SYNC, REF_SEL signal from 20% to 80% of VCC
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PHASE NOISE ANALYSIS
Table 1. Device Output Phase Noise for 30.72 MHz External Reference
Phase Noise Specifications under following configuration: VCO = 1966.08 MHz, REF = 30.72 MHz,
PFD Frequency = 30.72 MHz, Charge Pump Current = 1.5 mA Loop BW = 400 kHz at 3.3 V and 25°C
Phase Noise
Reference 30.72
MHz
LVPECL 491.52
MHz
LVDS
491.52 MHz
LVCMOS
122.88
MHz
Unit
10 Hz
-108
–81
100 Hz
-130
–94
–81
–92
dBc/Hz
–96
–108
1 kHz
-134
dBc/Hz
–106
–106
–118
10 kHz
dBc/Hz
-152
–119
–119
–132
dBc/Hz
100 kHz
-156
–121
–122
–134
dBc/Hz
1 MHz
-157
–131
–131
–143
dBc/Hz
10 MHz
—
–145
–144
–150
dBc/Hz
—
–145
–144
–150
dBc/Hz
193
307
315
377
fs
20 MHz
Jitter(RMS)
10k~20 MHz
Table 2. Device Output Phase Noise for 25 MHz Crystal Reference
Phase Noise Specifications under following configuration: VCO = 2000.00 MHz, AUX-REF = 25.00
MHz,
PFD Frequency = 25.00 MHz, Charge Pump Current = 1.5 mA Loop BW = 400 kHz at 3.3 V and 25°C
Phase Noise
Referenc
e 25 MHz
LVPECL 500 MHz
LVDS 250 MHz
LVCMOS 125 MHz
Unit
10 Hz
—
-57
100 Hz
—
-90
-62
-68
dBc/Hz
-95
-102
dBc/Hz
1 kHz
—
10 kHz
—
-107
-113
-119
dBc/Hz
-115
-122
-128
100 kHz
dBc/Hz
—
-118
-124
-130
dBc/Hz
1 MHz
—
-130
-137
-143
dBc/Hz
10 MHz
—
-145
-147
-150
dBc/Hz
20 MHz
—
-145
-147
-150
dBc/Hz
389
405
437
fs
Jitter(RMS)
10k~20 MHz
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OUTPUT TO OUTPUT ISOLATION
Measurement Method
1. Connect output 2 to a spectrum analyzer. Disable Outputs 0, 1, 3, 4.
2. Measure spurious on Output 2.
3. Enable aggressor channels individually per Table 3.
4. Measure spurious on Output 2.
5. The difference between the spurious levels of Output 2 before and after enabling the aggressor channels
determine the output-to-output isolation performance recorded.
Table 3. Output to Output Isolation
M SPUR
Unit
The Output to Output Isolation was tested under following settings are 25°C
20
Output 2
Measured Channel
In LVPECL Signaling 15.5 MHz
–67
db
Output 2
Measured Channel
In LVPECL Signaling 93 MHz
–60
db
Output 2
Measured Channel
In LVPECL Signaling 930 MHz
–59
db
Output 0
Aggressor Channel
LVPECL 22.14 MHz
Output 1
Aggressor Channel
LVPECL 22.14 MHz
Output 3
Aggressor Channel
LVPECL 22.14 MHz
Output 4
Aggressor Channel
LVPECL 22.14 MHz
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SPI CONTROL INTERFACE TIMING
t1
t4
t5
SPI _ CLK
t2
Bit0
SPI _ MOSI
t3
Bit1
Bit29
Bit30
Bit31
t7
SPI _ LE
t6
Figure 14. Timing Diagram for SPI Write Command
t4
t5
SPI _ CLK
t2
SPI _ MOSI
Bit30
t3
Bit31
t9
Bit0
SPI _ MISO
Bit1
Bit2
t7
SPI _ LE
t6
t8
Figure 15. Timing Diagram for SPI Read Command
Table 4. SPI Bus Timing Characteristics
PARAMETER
MIN
TYP
MAX
UNIT
20
MHz
fClock
Clock Frequency for the SPI_CLK
t1
SPI_LE to SPI_CLK setup time
10
ns
t2
SPI_MOSI to SPI_CLK setup time
10
ns
t3
SPI_MOSI to SPI_CLK hold time
10
ns
t4
SPI_CLK high duration
25
ns
t5
SPI_CLK low duration
25
ns
t6
SPI_CLK to SPI_LE Setup time
10
ns
t7
SPI_LE Pulse Width
20
ns
t8
SPI_MISO to SPI_CLK Data Valid (First Valid Bit after LE)
10
ns
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DEVICE CONFIGURATION
The Functional Description Section described four different functional blocks contained within the CDCE62005.
Figure 16 depicts these blocks along with a high-level functional block diagram of the circuit elements comprising
each block. The balance of this section focuses on a detailed discussion of each functional block from the
perspective of how to configure them.
Output Blocks
Synthesizer
Block
Output
Channel 0
Smart
MUX
Frequency
Synthesizer
Output
Channel 1
Input
Block
Interface
&
Control
Device
Registers
Output
Channel 2
Interface
&
Control
Block
Output
Channel 3
Output
Channel 4
EEPROM
Figure 16. CDCE62005 Circuit Blocks
Throughout this section, references to Device Register memory locations follow the following convention:
Register 5
Register Number (s)
5
4
3
RAM Bit Number (s)
2
5.2
Figure 17. Device Register Reference Convention
22
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INTERFACE AND CONTROL BLOCK
The Interface & Control Block includes a SPI interface, four control pins, a non-volatile memory array in which
the device stores default configuration data, and an array of device registers implemented in Static RAM. This
RAM, also called the device registers, configures all hardware within the CDCE62005.
Static RAM (Device Registers)
Register 8
Register 7
Register 6
REF_SELECT
/Power_Down
/SYNC
SPI_LE
SPI_CLK
SPI_MISO
SPI_MOSI
Register 5
Interface
&
Control
Device
Hardware
Register 4
Register 3
Register 2
Register 1
Register 0
EEPROM (Default Configuration)
Register 7
Register 6
Register 5
Register 4
Register 3
Register 2
Register 1
Register 0
Figure 18. CDCE62005 Interface and Control Block
SPI (Serial Peripheral Interface)
The serial interface of CDCE62005 is a simple bidirectional SPI interface for writing and reading to and from the
device registers. It implements a low speed serial communications link in a master/slave topology in which the
CDCE62005 is a slave. The SPI consists of four signals:
• SPI_CLK: Serial Clock (Output from Master) – the CDCE62005 clocks data in and out on the rising edge of
SPI_CLK. Data transitions therefore occur on the falling edge of the clock.
• SPI_MOSI: Master Output Slave Input (Output from Master) .
• SPI_MISO: Master Input Slave Output (Output from Slave)
• SPI_LE: Latch Enable (Output from Master). The falling edge of SPI_LE initiates a transfer. If SPI_LE is high,
no data transfer can take place.
The CDCE62005 implements data fields that are 28-bits wide. In addition, it contains 9 registers, each
comprising a 28 bit data field. Therefore, accessing the CDCE62005 requires that the host program append a
4-bit address field to the front of the data field as follows:
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Device Register N
27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9
8
7
6
5
4
3
2
1
0
SPI Register
Address
Bits
(4)
Data Bits (28)
Last in /
Last out
SPI Master (Host)
SPI_CLK
First In /
First Out
27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9
8
7
6
5
4
3
2
1
0
3
2
1
0
SPI Slave (CDCE62005)
SPI_LE
SPI_CLK
SPI_MOSI
SPI_MOSI
SPI_MISO
SPI_MISO
SPI_LE
SPI_LE
SPI_CLK
SPI_MOSI
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
3
2
1
0
SPI_MISO
Figure 19. CDCE62005 SPI Communications Format
CDCE62005 SPI Command Structure
The CDCE62005 supports four commands issued by the Master via the SPI:
• Write to RAM
• Read Command
• Copy RAM to EEPROM – unlock
• Copy RAM to EEPROM – lock
Table 5 provides a summary of the CDCE62005 SPI command structure. The host (master) constructs a Write to
RAM command by specifying the appropriate register address in the address field and appends this value to the
beginning of the data field. Therefore, a valid command stream must include 32 bits, transmitted LSB first. The
host must issue a Read Command to initiate a data transfer from the CDCE62005 back to the host. This
command specifies the address of the register of interest in the data field.
Table 5. CDCE62005 SPI Command Structure
Data Field (28 Bits)
Register
Addr Field
(4 Bits)
Operation
NVM
2
7
2
6
2
5
2
4
2
3
2
2
2
1
2
0
1
9
1
8
1
7
1
6
1
5
1
4
1
3
1
2
1
1
1
0
9
8
7
6
5
4
3
2
1
0
3
2
1
0
0
Write to RAM
Yes
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
0
0
1
Write to RAM
Yes
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
0
1
2
Write to RAM
Yes
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
1
0
3
Write to RAM
Yes
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
1
1
4
Write to RAM
Yes
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
1
0
0
5
Write to RAM
Yes
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
1
0
1
6
Write to RAM
Yes
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
1
1
0
7
Write to RAM
Yes
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
1
1
1
8
Status/Control
No
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
0
0
0
Instruction
Read Command
No
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
A
A
A
A
1
1
1
0
Instruction
RAM EEPROM
Unlock
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
Instruction
RAM EEPROM
Lock
(1)
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
0
0
0
0
0
0
1
1
1
1
1
1
(1)
24
CAUTION: After execution of this command, the EEPROM is permanently locked. After locking the EEPROM, device configuration can
only be changed via Write to RAM after power-up; however, the EEPROM can no longer be changed
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The CDCE62005 on-board EEPROM has been factory preset to the default settings listed in the table below.
REGISTER
DEFAULT SETTING
REG0000
8184032
REG0001
8184030
REG0002
8186030
REG0003
EB86030
REG0004
0186031
REG0005
101C0BE
REG0006
04BE19A
REG0007
BD0037F
REG0008 (RAM)
80005DD
The Default configurations programmed in the device is set to: Primary and Secondary are set to LVPECL AC
termination and the Auxiliary input is enabled. The Smart Mux is set to auto select among Primary, Secondary
and Auxiliary. Reference is set at 25MHz and the dividers are selected to run the VCO at 1875MHz.
Output 0 & 1 are set to output 156.25MHz with LVPECL signaling
Output 2 is set to output 125MHz/ LVPECL
Output 3 is set to output 125MHz/ LVDS
Output 4 is set to output 125MHz/ LVCMOS
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CDCE62005
SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
www.ti.com
Writing to the CDCE62005
Figure 20 illustrates a Write to RAM operation. Notice that the latching of the first data bit in the data stream (Bit
0) occurs on the first rising edge of SPI_CLK after SPI_LE transitions from a high to a low. For the CDCE62005,
data transitions occur on the falling edge of SPI_CLK. A rising edge on SPI_LE signals to the CDCE62005 that
the transmission of the last bit in the stream (Bit 31) has occurred.
SPI_CLK
SPI_MOSI
Bit0
Bit1
Bit29
Bit30
Bit31
SPI_LE
Figure 20. CDCE62005 SPI Write Operation
Reading from the CDCE62005
Figure 21 shows how the CDCE62005 executes a Read Command. The SPI master first issues a Read
Command to initiate a data transfer from the CDCE62005 back to the host (see Table 6). This command
specifies the address of the register of interest. By transitioning SPI_LE from a low to a high, the CDCE62005
resolves the address specified in the appropriate bits of the data field. The host drives SPI_LE low and the
CDCE62005 presents the data present in the register specified in the Read Command on SPI_MISO.
SPI_ CLK
SPI_ MOSI
Bit30
SPI_ MISO
Bit31
Bit0
Bit1
Bit2
SPI_LE
Figure 21. CDCE62005 Read Operation
Writing to EEPROM
After the CDCE62005 detects a power-up and completes a reset cycle, it copies the contents of the on-board
EEPROM into the Device Registers. Therefore, the CDCE62005 initializes into a known state pre-defined by the
user. The host issues one of two special commands shown in Table 6 to copy the contents of Device Registers 0
through 7 (a total of 184 bits) into EERPOM. They include:
• Copy RAM to EEPROM – Unlock, Execution of this command can happen many times.
• Copy RAM to EEPROM – Lock: Execution of this command can happen only once; after which the EEPROM
is permanently locked.
After either command is initiated, power must remain stable and the host must not access the CDCE62005 for at
least 50 ms to allow the EEPROM to complete the write cycle and to avoid the possibility of EEPROM corruption.
26
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Device Registers: Register 0
Table 6. CDCE62005 Register 0 Bit Definitions
SPI
BIT
RAM
BIT
BIT NAME
RELATED
BLOCK
DESCRIPTION/FUNCTION
0
A0
Address 0
0
1
A1
Address 1
0
2
A2
Address 2
0
3
A3
Address 3
Pre-Divider Selection for the Primary Reference
(X,Y)=00:3-state, 01:Divide by “1”, 10:Divide by “2”, 11:Reserved
EEPROM
0
4
0
DIV2PRIX
5
1
DIV2PRIY
6
2
RESERVED
Used in Test Mode
EEPROM
7
3
RESERVED
Used in Test Mode
EEPROM
8
4
OUTMUX0SELX
Output 0
OUTPUT MUX “0” Select. Selects the Signal driving Output Divider”0”
(X,Y) = 00: PRI_IN, 01:SEC_IN, 10:SMART_MUX, 11:VCO_CORE
EEPROM
Primary
Reference
EEPROM
9
5
OUTMUX0SELY
Output 0
10
6
PH0ADJC0
Output 0
EEPROM
11
7
PH0ADJC1
Output 0
EEPROM
12
8
PH0ADJC2
Output 0
13
9
PH0ADJC3
Output 0
14
10
PH0ADJC4
Output 0
EEPROM
15
11
PH0ADJC5
Output 0
EEPROM
16
12
PH0ADJC6
Output 0
EEPROM
17
13
OUT0DIVRSEL0
Output 0
EEPROM
18
14
OUT0DIVRSEL1
Output 0
EEPROM
19
15
OUT0DIVRSEL2
Output 0
20
16
OUT0DIVRSEL3
Output 0
21
17
OUT0DIVRSEL4
Output 0
EEPROM
22
18
OUT0DIVRSEL5
Output 0
EEPROM
23
19
OUT0DIVRSEL6
Output 0
EEPROM
Coarse phase adjust select for output divider “0”
EEPROM
EEPROM
OUTPUT DIVIDER “0” Ratio Select
EEPROM
EEPROM
24
20
OUT0DIVSEL
Output 0
When set to “0”, the divider is disabled
When set to “1”, the divider is enabled
25
21
HiSWINGLVPECL0
Output 0
High Swing LVPECL When set to “1” and Normal Swing when set to “0”
– If LVCMOS or LVDS is selected the Output swing will stay at the same level.
– If LVPECL buffer is selected the Output Swing will be 30% higher if this bit is set to “1”
and Normal LVPECL if it is set to “0”.
26
22
CMOSMODE0PX
Output 0
27
23
CMOSMODE0PY
Output 0
28
24
CMOSMODE0NX
Output 0
29
25
CMOSMODE0NY
Output 0
30
26
OUTBUFSEL0X
Output 0
31
27
OUTBUFSEL0Y
Output 0
EEPROM
EEPROM
EEPROM
LVCMOS mode select for OUTPUT “0” Positive Pin.
(X,Y)=00:Active, 10:Inverting, 11:Low, 01:3-State
EEPROM
LVCMOS mode select for OUTPUT “0” Negative Pin.
(X,Y)=00:Active, 10:Inverting, 11:Low, 01:3-State
EEPROM
OUTPUT TYPE
EEPROM
EEPROM
RAM BITS
EEPROM
22
23
24
25
26
27
LVPECL
0
0
0
0
0
1
LVDS
0
1
0
1
1
1
LVCMOS
See Settings Above*
0
0
Output Disabled
0
1
0
1
0
1
EEPROM
* Use Description for Bits 22,23,24 and 25 for setting the LVCMOS Outputs
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CDCE62005
SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
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Device Registers: Register 1
Table 7. CDCE62005 Register 1 Bit Definitions
SPI
BIT
RA
M
BIT
BIT NAME
RELATED
BLOCK
DESCRIPTION/FUNCTION
0
A0
Address 0
1
1
A1
Address 1
0
2
A2
Address 2
0
3
A3
Address 3
0
4
0
DIV2SECX
Secondary Pre-Divider Selection for the Secondary Reference
Reference (X,Y)=00:3-state, 01:Divide by “1”, 10:Divide by “2”, 11:Reserved
EEPROM
5
1
DIV2SECY
6
2
RESERVED
Used in Test Mode
EEPROM
7
3
RESERVED
Used in Test Mode
EEPROM
8
4
OUTMUX1SELX
Output 1
OUTPUT MUX “1” Select. Selects the Signal driving Output Divider”1”
(X,Y) = 00: PRI_IN, 01:SEC_IN, 10:SMART_MUX, 11:VCO_CORE
EEPROM
EEPROM
9
5
OUTMUX1SELY
Output 1
10
6
PH1ADJC0
Output 1
EEPROM
11
7
PH1ADJC1
Output 1
EEPROM
12
8
PH1ADJC2
Output 1
13
9
PH1ADJC3
Output 1
14
10
PH1ADJC4
Output 1
EEPROM
15
11
PH1ADJC5
Output 1
EEPROM
16
12
PH1ADJC6
Output 1
EEPROM
17
13
OUT1DIVRSEL0
Output 1
EEPROM
18
14
OUT1DIVRSEL1
Output 1
EEPROM
19
15
OUT1DIVRSEL2
Output 1
20
16
OUT1DIVRSEL3
Output 1
21
17
OUT1DIVRSEL4
Output 1
EEPROM
22
18
OUT1DIVRSEL5
Output 1
EEPROM
23
19
OUT1DIVRSEL6
Output 1
EEPROM
Coarse phase adjust select for output divider “1”
EEPROM
EEPROM
OUTPUT DIVIDER “1” Ratio Select
EEPROM
EEPROM
24
20
OUT1DIVSEL
Output 1
When set to “0”, the divider is disabled
When set to “1”, the divider is enabled
25
21
HiSWINGLVPECL1
Output 1
High Swing LVPECL When set to “1” and Normal Swing when set to “0”
– If LVCMOS or LVDS is selected the Output swing will stay at the same level.
– If LVPECL buffer is selected the Output Swing will be 30% higher if this bit is set to “1”
and Normal LVPECL if it is set to “0”.
26
22
CMOSMODE1PX
Output 1
27
23
CMOSMODE1PY
Output 1
28
24
CMOSMODE1NX
Output 1
29
25
CMOSMODE1NY
Output 1
30
26
OUTBUFSEL1X
Output 1
31
27
OUTBUFSEL1Y
Output 1
EEPROM
EEPROM
EEPROM
LVCMOS mode select for OUTPUT “1” Positive Pin.
(X,Y)=00:Active, 10:Inverting, 11:Low, 01:3-State
EEPROM
LVCMOS mode select for OUTPUT “1” Negative Pin.
(X,Y)=00:Active, 10:Inverting, 11:Low, 01:3-State
EEPROM
OUTPUT TYPE
EEPROM
EEPROM
RAM BITS
EEPROM
22
23
24
25
26
27
LVPECL
0
0
0
0
0
1
LVDS
0
1
0
1
1
1
LVCMOS
See Settings Above*
0
0
Output Disabled
0
1
0
1
0
1
EEPROM
* Use Description for Bits 22,23,24 and 25 for setting the LVCMOS Outputs
28
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SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
Device Registers: Register 2
Table 8. CDCE62005 Register 2 Bit Definitions
SPI
BIT
RA
M
BIT
BIT NAME
RELATED
BLOCK
DESCRIPTION/FUNCTION
0
A0
Address 0
0
1
A1
Address 1
1
2
A2
Address 2
0
3
A3
Address 3
Reference Divider Bit “0”
EEPROM
0
4
0
REFDIV0
5
1
REFDIV1
Reference Divider Bit “1”
EEPROM
6
2
RESERVED
Used in Test Mode
EEPROM
7
3
RESERVED
Used in Test Mode
EEPROM
8
4
OUTMUX2SELX
Output 2
OUTPUT MUX “2” Select. Selects the Signal driving Output Divider”2”
(X,Y) = 00: PRI_IN, 01:SEC_IN, 10:SMART_MUX, 11:VCO_CORE
EEPROM
Reference
Divider
9
5
OUTMUX2SELY
Output 2
10
6
PH2ADJC0
Output 2
EEPROM
11
7
PH2ADJC1
Output 2
EEPROM
12
8
PH2ADJC2
Output 2
13
9
PH2ADJC3
Output 2
14
10
PH2ADJC4
Output 2
EEPROM
15
11
PH2ADJC5
Output 2
EEPROM
16
12
PH2ADJC6
Output 2
EEPROM
17
13
OUT2DIVRSEL0
Output 2
EEPROM
18
14
OUT2DIVRSEL1
Output 2
EEPROM
19
15
OUT2DIVRSEL2
Output 2
20
16
OUT2DIVRSEL3
Output 2
21
17
OUT2DIVRSEL4
Output 2
EEPROM
22
18
OUT2DIVRSEL5
Output 2
EEPROM
23
19
OUT2DIVRSEL6
Output 2
EEPROM
Coarse phase adjust select for output divider “2”
EEPROM
EEPROM
OUTPUT DIVIDER “2” Ratio Select
EEPROM
EEPROM
24
20
OUT2DIVSEL
Output 2
When set to “0”, the divider is disabled
When set to “1”, the divider is enabled
25
21
HiSWINGLVPEC2
Output 2
High Swing LVPECL When set to “1” and Normal Swing when set to “0”
– If LVCMOS or LVDS is selected the Output swing will stay at the same level.
– If LVPECL buffer is selected the Output Swing will be 30% higher if this bit is set to “1”
and Normal LVPECL if it is set to “0”.
26
22
CMOSMODE2PX
Output 2
27
23
CMOSMODE2PY
Output 2
28
24
CMOSMODE2NX
Output 2
29
25
CMOSMODE2NY
Output 2
30
26
OUTBUFSEL2X
Output 2
31
27
OUTBUFSEL2Y
Output 2
EEPROM
EEPROM
EEPROM
LVCMOS mode select for OUTPUT “2” Positive Pin.
(X,Y)=00:Active, 10:Inverting, 11:Low, 01:3-State
EEPROM
LVCMOS mode select for OUTPUT “2” Negative Pin.
(X,Y)=00:Active, 10:Inverting, 11:Low, 01:3-State
EEPROM
OUTPUT TYPE
EEPROM
EEPROM
RAM BITS
EEPROM
22
23
24
25
26
27
LVPECL
0
0
0
0
0
1
LVDS
0
1
0
1
1
1
0
0
1
0
LVCMOS
Output Disabled
See Settings Above*
0
1
0
1
EEPROM
* Use Description for Bits 22,23,24 and 25 for setting the LVCMOS Outputs
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CDCE62005
SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
www.ti.com
Device Registers: Register 3
Table 9. CDCE62005 Register 3 Bit Definitions
SPI
BIT
RAM
BIT
BIT NAME
RELATED
BLOCK
DESCRIPTION/FUNCTION
0
A0
Address 0
1
1
A1
Address 1
1
2
A2
Address 2
0
3
A3
Address 3
0
Reference
Divider
4
0
REFDIV2
Reference Divider Bit “2”
EEPROM
5
1
RESERVED
6
2
RESERVED
Used in Test Mode
EEPROM
7
3
RESERVED
Used in Test Mode
EEPROM
8
4
OUTMUX3SELX
Output 3
OUTPUT MUX “3” Select. Selects the Signal driving Output Divider”3”
(X,Y) = 00: PRI_IN, 01:SEC_IN, 10:SMART_MUX, 11:VCO_CORE
EEPROM
EEPROM
9
5
OUTMUX3SELY
Output 3
10
6
PH3ADJC0
Output 3
EEPROM
11
7
PH3ADJC1
Output 3
EEPROM
12
8
PH3ADJC2
Output 3
13
9
PH3ADJC3
Output 3
14
10
PH3ADJC4
Output 3
EEPROM
15
11
PH3ADJC5
Output 3
EEPROM
16
12
PH3ADJC6
Output 3
EEPROM
17
13
OUT3DIVRSEL0
Output 3
EEPROM
18
14
OUT3DIVRSEL1
Output 3
EEPROM
19
15
OUT3DIVRSEL2
Output 3
20
16
OUT3DIVRSEL3
Output 3
21
17
OUT3DIVRSEL4
Output 3
EEPROM
22
18
OUT3DIVRSEL5
Output 3
EEPROM
23
19
OUT3DIVRSEL6
Output 3
EEPROM
Coarse phase adjust select for output divider “3”
EEPROM
EEPROM
OUTPUT DIVIDER “3” Ratio Select
EEPROM
EEPROM
24
20
OUT3DIVSEL
Output 3
When set to “0”, the divider is disabled
When set to “1”, the divider is enabled
25
21
HiSWINGLVPEC3
Output 3
High Swing LVPECL When set to “1” and Normal Swing when set to “0”
– If LVCMOS or LVDS is selected the Output swing will stay at the same level.
– If LVPECL buffer is selected the Output Swing will be 30% higher if this bit is set to “1”
and Normal LVPECL if it is set to “0”.
26
22
CMOSMODE3PX
Output 3
27
23
CMOSMODE3PY
Output 3
28
24
CMOSMODE3NX
Output 3
29
25
CMOSMODE3NY
Output 3
30
26
OUTBUFSEL3X
Output 3
31
27
OUTBUFSEL3Y
Output 3
EEPROM
EEPROM
EEPROM
LVCMOS mode select for OUTPUT “3” Positive Pin.
(X,Y)=00:Active, 10:Inverting, 11:Low, 01:3-State
EEPROM
LVCMOS mode select for OUTPUT “3” Negative Pin.
(X,Y)=00:Active, 10:Inverting, 11:Low, 01:3-State
EEPROM
OUTPUT TYPE
EEPROM
EEPROM
RAM BITS
EEPROM
22
23
24
25
26
27
LVPECL
0
0
0
0
0
1
LVDS
0
1
0
1
1
1
0
0
1
0
LVCMOS
Output Disabled
See Settings Above*
0
1
0
1
EEPROM
* Use Description for Bits 22,23,24 and 25 for setting the LVCMOS Outputs
30
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SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
Device Registers: Register 4
Table 10. CDCE62005 Register 4 Bit Definitions
SPI
BIT
RAM
BIT
BIT NAME
RELATED
BLOCK
DESCRIPTION/FUNCTION
0
A0
Address 0
0
1
A1
Address 1
0
2
A2
Address 2
1
3
A3
Address 3
4
0
RESERVED
—
5
1
ATETEST
6
2
7
3
8
4
OUTMUX4SELX
Output 4
0
This bit must be set to a “1”
EEPROM
0 (default): normal operation,
1: outputs have deterministic delay relative to low-to-high pulse of SYNC pin when the
SYNC signal is synchronized with the reference input
EEPROM
RESERVED
Used in Test Mode
EEPROM
RESERVED
Used in Test Mode
EEPROM
OUTPUT MUX “4” Select. Selects the Signal driving Output Divider”4”
(X,Y) = 00: PRI_IN, 01:SEC_IN, 10:SMART_MUX, 11:VCO_CORE
EEPROM
TI Test Bit
9
5
OUTMUX4SELY
Output 4
10
6
PH4ADJC0
Output 4
EEPROM
11
7
PH4ADJC1
Output 4
EEPROM
12
8
PH4ADJC2
Output 4
13
9
PH4ADJC3
Output 4
14
10
PH4ADJC4
Output 4
EEPROM
15
11
PH4ADJC5
Output 4
EEPROM
16
12
PH4ADJC6
Output 4
EEPROM
17
13
OUT4DIVRSEL0
Output 4
EEPROM
18
14
OUT4DIVRSEL1
Output 4
EEPROM
19
15
OUT4DIVRSEL2
Output 4
20
16
OUT4DIVRSEL3
Output 4
21
17
OUT4DIVRSEL4
Output 4
EEPROM
22
18
OUT4DIVRSEL5
Output 4
EEPROM
23
19
OUT4DIVRSEL6
Output 4
EEPROM
Coarse phase adjust select for output divider “4”
EEPROM
EEPROM
OUTPUT DIVIDER “4” Ratio Select
EEPROM
EEPROM
24
20
OUT4DIVSEL
Output 4
When set to “0”, the divider is disabled
When set to “1”, the divider is enabled
25
21
HiSWINGLVPEC4
Output 4
High Swing LVPECL When set to “1” and Normal Swing when set to “0”
– If LVCMOS or LVDS is selected the Output swing will stay at the same level.
– If LVPECL buffer is selected the Output Swing will be 30% higher if this bit is set to “1”
and Normal LVPECL if it is set to “0”.
26
22
CMOSMODE4PX
Output 4
27
23
CMOSMODE4PY
Output 4
28
24
CMOSMODE4NX
Output 4
29
25
CMOSMODE4NY
Output 4
30
26
OUTBUFSEL4X
Output 4
31
27
OUTBUFSEL4Y
Output 4
EEPROM
EEPROM
EEPROM
LVCMOS mode select for OUTPUT “4” Positive Pin.
(X,Y)=00:Active, 10:Inverting, 11:Low, 01:3-State
EEPROM
LVCMOS mode select for OUTPUT “3” Negative Pin.
(X,Y)=00:Active, 10:Inverting, 11:Low, 01:3-State
EEPROM
OUTPUT TYPE
EEPROM
EEPROM
RAM BITS
EEPROM
22
23
24
25
26
27
LVPECL
0
0
0
0
0
1
LVDS
0
1
0
1
1
1
0
0
1
0
LVCMOS
Output Disabled
See Settings Above*
0
1
0
1
EEPROM
* Use Description for Bits 22,23,24 and 25 for setting the LVCMOS Outputs
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CDCE62005
SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
www.ti.com
Device Registers: Register 5
Table 11. CDCE62005 Register 5 Bit Definitions
SPI
BIT
RAM
BIT
BIT NAME
RELATED
BLOCK
DESCRIPTION/FUNCTION
0
A0
Address 0
1
1
A1
Address 1
0
2
A2
Address 2
1
3
A3
Address 3
0
Input Buffer Select (LVPECL,LVDS or LVCMOS)
XY(01 ) LVPECL, (11) LVDS, (00) LVCMOS- Input is Positive Pin
4
0
INBUFSELX
INBUFSELX
5
1
INBUFSELY
INBUFSELY
6
2
PRISEL
7
3
SECSEL
Smart MUX
EEPROM
EEPROM
WHEN EECLKSEL = 1;
Bit (6,7,8) 100 – PRISEL, 010 – SECSEL , 001 – AUXSEL
110 – Auto Select ( PRI then SEC)
111 – Auto Select ( PRI then SEC and then AUX)
When EECLKSEL = 0, REF_SEL pin determines the Reference Input to the Smart Mux
circuitry.
EEPROM
EEPROM
8
4
AUXSEL
EEPROM
9
5
EECLKSEL
Smart MUX
If EEPROM Clock Select Input is set to “1” The Clock selections follows internal EEPROM
settings and ignores REF_SEL Pin status, when Set to “0” REF_SEL is used to control
the Mux, Auto Select Function is not available and AUXSEL is not available.
EEPROM
10
6
ACDCSEL
Input Buffers
If Set to “1” DC Termination, If set to “0” AC Termination
EEPROM
Input Buffers
If Set to “1” Input Buffers Hysteresis Enabled. It is not recommended that Hysteresis be
disabled.
EEPROM
7
HYSTEN
8
PRI_TERMSEL
Input Buffers
If Set to “0” Primary Input Buffer Internal Termination Enabled
If set to “1” Primary Internal Termination circuitry Disabled
EEPROM
13
9
PRIINVBB
Input Buffers
If Set to “1” Primary Input Negative Pin Biased with Internal VBB Voltage.
EEPROM
14
10
SECINVBB
Input Buffers
If Set to “1” Secondary Input Negative Pin Biased with Internal VBB Voltage
EEPROM
15
11
FAILSAFE
Input Buffers
If Set to “1” Fail Safe is Enabled for all Input Buffers configured as LVDS, DC Coupling
only.
EEPROM
16
12
RESERVED
Must be set to “0”
EEPROM
17
13
RESERVED
--------
Must be set to “0”
EEPROM
18
14
SELINDIV0
VCO Core
EEPROM
19
15
SELINDIV1
VCO Core
EEPROM
20
16
SELINDIV2
VCO Core
EEPROM
21
17
SELINDIV3
VCO Core
22
18
SELINDIV4
VCO Core
23
19
SELINDIV5
VCO Core
EEPROM
24
20
SELINDIV6
VCO Core
EEPROM
25
21
SELINDIV7
VCO Core
26
22
LOCKW(0)
PLL Lock
27
23
LOCKW(1)
28
24
LOCKW(2)
29
25
LOCKW(3)
11
12
EEPROM
INPUT DIVIDER Settings
EEPROM
EEPROM
LOCKW(3:0): Lock-detect Window Width
= 0000 (narrow window),
= 0001,0010,0100,0101 …..
= 1110 (widest window)
= XX11 (RESERVED)
EEPROM
EEPROM
EEPROM
EEPROM
30
26
LOCKDET
PLL Lock
Number of coherent lock events. If set to “0” it triggers after the first lock detection if set to
“1” it triggers lock after 64 cycles of lock detections.
31
27
ADLOCK
PLL Lock
Selects Digital PLL_LOCK “0” ,Selects Analog PLL_LOCK “1”
32
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EEPROM
EEPROM
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CDCE62005
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SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
Device Registers: Register 6
Table 12. CDCE62005 Register 6 Bit Definitions
SPI
BIT
RAM
BIT
BIT NAME
RELATED
BLOCK
DESCRIPTION/FUNCTION
0
A0
Address 0
0
1
A1
Address 1
1
2
A2
Address 2
1
3
A3
Address 3
0
4
0
SELVCO
VCO Core
VCO Select, 0:VCO1(low range), 1:VCO2(high range)
EEPROM
5
1
SELPRESCA
VCO Core
6
2
SELPRESCB
VCO Core
7
3
SELFBDIV0
VCO Core
EEPROM
8
4
SELFBDIV1
VCO Core
EEPROM
EEPROM
EEPROM
PRESCALER Setting.
EEPROM
9
5
SELFBDIV2
VCO Core
10
6
SELFBDIV3
VCO Core
11
7
SELFBDIV4
VCO Core
12
8
SELFBDIV5
VCO Core
EEPROM
13
9
SELFBDIV6
VCO Core
EEPROM
14
10
SELFBDIV7
VCO Core
15
11
RESERVED
—
Input Buffers
EEPROM
FEEDBACK DIVIDER Setting
EEPROM
EEPROM
Must be set to “0”
EEPROM
If Set to “0” Secondary Input Buffer Internal Termination Enabled
If set to “1” Secondary Internal Termination circuitry Disabled
EEPROM
16
12
SEC_TERMSEL
17
13
SELBPDIV0
VCO Core
18
14
SELBPDIV1
VCO Core
19
15
SELBPDIV2
VCO Core
EEPROM
20
16
ICPSEL0
VCO Core
EEPROM
21
17
ICPSEL1
VCO Core
22
18
ICPSEL2
VCO Core
23
19
ICPSEL3
VCO Core
24
20
RESERVED
VCO Core
When set to "0", outputs are synchronized to the reference input on the low-to-high
pulse on SYNC pin or bit. When set to "1", outputs are synchronized to the SYNC
low-to-high pulse
EEPROM
25
21
CPPULSEWIDTH
VCO Core
If set to 1=wide pulse, 0=narrow pulse
EEPROM
VCO Core
Enable VCO Calibration Command. To execute this command a rising edge must be
generated (i.e. Write a LOW followed by a high to this bit location). This will initiate a
VCO calibration sequence only if Calibration Mode = Manual Mode (i.e. Register 6 bit 27
is HIGH).
EEPROM
EEPROM
BYPASS DIVIDER Setting ( 6 settings + Disable + Enable)
EEPROM
EEPROM
CHARGE PUMP Current Select
EEPROM
EEPROM
26
22
ENCAL
27
23
RESERVED
—
Must be set to “0”
EEPROM
28
24
AUXOUTEN
Output AUX
Enable Auxiliary Output when set to “1”.
EEPROM
Output AUX
Select the Output that will driving the AUX Output;
Low for Selecting Output Divider “2” and High for Selecting Output Divider “3”
EEPROM
29
25
AUXFEEDSEL
30
26
EXLFSEL
VCO Core
When Set to “1” External Loop filter is used.
When Set to “0” Internal Loop Filter is used.
EEPROM
31
27
ENCAL_MODE
PLL
Calibration
1: Calibration Mode = Manual Mode. In this mode, a calibration will be initiated if a rising
edge is asserted on ENCAL (Register 6 Bit 22).
0: Calibration Mode = Startup Mode.
EEPROM
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Device Registers: Register 7
Table 13. CDCE62005 Register 7 Bit Definitions
SPI
BIT
RAM BIT NAME
BIT
RELATED
BLOCK
DESCRIPTION/FUNCTION
0
A0
Address 0
1
1
A1
Address 1
1
2
A2
Address 2
1
3
A3
Address 3
0
4
0
LFRCSEL0
VCO Core
Loop Filter Control Setting
EEPROM
5
1
LFRCSEL1
VCO Core
Loop Filter Control Setting
EEPROM
6
2
LFRCSEL2
VCO Core
Loop Filter Control Setting
EEPROM
7
3
LFRCSEL3
VCO Core
Loop Filter Control Setting
EEPROM
8
4
LFRCSEL4
VCO Core
Loop Filter Control Setting
EEPROM
9
5
LFRCSEL5
VCO Core
Loop Filter Control Setting
EEPROM
10
6
LFRCSEL6
VCO Core
Loop Filter Control Setting
EEPROM
11
7
LFRCSEL7
VCO Core
Loop Filter Control Setting
EEPROM
12
8
LFRCSEL8
VCO Core
Loop Filter Control Setting
EEPROM
13
9
LFRCSEL9
VCO Core
Loop Filter Control Setting
EEPROM
14
10
LFRCSEL10
VCO Core
Loop Filter Control Setting
EEPROM
15
11
LFRCSEL11
VCO Core
Loop Filter Control Setting
EEPROM
16
12
LFRCSEL12
VCO Core
Loop Filter Control Setting
EEPROM
17
13
LFRCSEL13
VCO Core
Loop Filter Control Setting
EEPROM
18
14
LFRCSEL14
VCO Core
Loop Filter Control Setting
EEPROM
19
15
LFRCSEL15
VCO Core
Loop Filter Control Setting
EEPROM
20
16
LFRCSEL16
VCO Core
Loop Filter Control Setting
EEPROM
21
17
LFRCSEL17
VCO Core
Loop Filter Control Setting
EEPROM
22
18
LFRCSEL18
VCO Core
Loop Filter Control Setting
EEPROM
23
19
LFRCSEL19
VCO Core
Loop Filter Control Setting
EEPROM
24
20
LFRCSEL20
VCO Core
Loop Filter Control Setting
EEPROM
25
21
RESERVED
—
Must be set to "0"
EEPROM
26
22
TESTMUX1
Diagnostics Set to “1”
27
23
SEL_DEL2
Smart Mux
28
24
TEXTMUX2
Diagnostics Set to “1”
29
25
SEL_DEL1
Smart Mux
30
26
EPLOCK
31
27
RESERVED
34
EEPROM
If set to “0” it enables short delay for fast operation
If Set to “1” Long Delay recommended for Input References below 150MHz.
EEPROM
EEPROM
If set to “0” it enables short delay for fast operation
If Set to “1” Long Delay recommended for Input References below 150MHz.
EEPROM
Status
Read Only
If EPLOCK reads “0” EEPROM is unlocked. If EPLOCK reads “1”, then the
EEPROM is locked (see Table 5 for how to lock the EEPROM – this can only
be executed once after which the EEPROM is locked permanently).
EEPROM
Status
Read Only Always reads “1”
EEPROM
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Device Registers: Register 8
Table 14. CDCE62005 Register 8 Bit Definitions
SPI
BIT
RAM BIT NAME
BIT
RELATED
BLOCK
DESCRIPTION/FUNCTION
0
A0
Address 0
0
1
A1
Address 1
0
2
A2
Address 2
0
3
A3
Address 3
1
4
0
CALWORD0
Status
RAM
5
1
CALWORD1
Status
RAM
6
2
CALWORD2
Status
7
3
CALWORD3
Status
8
4
CALWORD4
Status
RAM
9
5
CALWORD5
Status
RAM
10
6
PLLLOCKPIN
Status
Read Only: Status of the PLL Lock Pin Driven by the device.
RAM
11
7
/SLEEP
Status
Set Device Sleep mode On when set to “0”, Normal Mode when set to “1”
RAM
Status
If set to “0” this bit forces “/SYNC ; Set to “1” to exit the Synchronization
State.
RAM
12
“VCO Calibration Word” read back from device
RAM
RAM
8
/SYNC
13
9
RESERVED
14
10
VERSION0
Silicon Revision
RAM
15
11
VERSION1
Silicon Revision
RAM
16
12
VERSION2
Silicon Revision
RAM
17
13
RESERVED
Must be set to “0”
RAM
18
14
CALWORD_IN0
Diagnostics
RAM
19
15
CALWORD_IN1
Diagnostics
RAM
20
16
CALWORD_IN2
Diagnostics
21
17
CALWORD_IN3
Diagnostics
22
18
CALWORD_IN4
Diagnostics
23
19
CALWORD_IN5
Diagnostics
24
20
RESERVED
—
25
21
TITSTCFG0
Diagnostics
26
22
TITSTCFG1
Diagnostics
27
23
TITSTCFG2
Diagnostics
28
24
TITSTCFG3
Diagnostics
29
25
PRIACTIVITY
Status
30
26
SECACTIVITY
Status
31
27
AUXACTIVITY
Status
RAM
—
RAM
TI Test Registers. For TI Use Only
RAM
RAM
RAM
Must be set to “0”
RAM
RAM
RAM
TI Test Registers. For TI Use Only
RAM
RAM
Synthesizer Source Indicator (27:25)
0 0 1 Primary Input
0 1 0 Secondary Input
1 0 0 Auxiliary Input
RAM
RAM
RAM
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Device Control
Figure 22 provides a conceptual explanation of the CDCE62005 Device operation. Table 15 defines how the
device behaves in each of the operational states.
Power
Applied
Power ON
Reset
Device
OFF
Delay Finished
Sleep
Sleep = OFF
Calibration
Hold
Power Down = OFF
Power Down = ON
CAL_Enabled
Sleep = ON
VCO
CAL
CAL Done
Manual
Recalibration = ON
Sync = ON
Power Down
Power Down = ON
Active Mode
Sync
Sync = OFF
Figure 22. CDCE62005 Device State Control Diagram
Table 15. CDCE62005 Device State Definitions
Status
State
Device Behavior
Entered Via
Exited Via
SPI Port
PLL
Output
Divider
Output
Buffer
After device power supply reaches
approximately 2.35 V, the contents
of EEPROM are copied into the
Device Registers, thereby initializing
the device hardware.
Power applied to the device or upon
exit from Power Down State via the
Power_Down pin set HIGH.
Power On Reset and EEPROM loading
delays are finished OR the Power_Down
pin is set LOW.
OFF
Disabled
Disabled
OFF
Power-On
Reset
Delay process in the Power-On Reset
State is finished or Sleep Mode (Sleep
bit is in Register 8 bit 7) is turned OFF
while in the Sleep State. Power Down
must be OFF to enter the Calibration
Hold State.
The device waits until either
ENCAL_MODE (Device Register 6 bit 27)
is low (Start up calibration enabled) or
both ENCAL_MODE is high (Manual
Calibration Enabled) AND ENCAL (Device
Register 6 bit 22) transitions from a low to
a high signaling the device
ON
Enabled
Disabled
OFF
Calibration
Hold
The device waits until either
ENCAL_MODE (Device Register 6
bit 27) is low (Start up calibration
enabled) or both ENCAL_MODE is
high (Manual Calibration Enabled)
AND ENCAL (Device Register 6 bit
22) transitions from a low to a high
signaling the device.
The voltage controlled oscillator is
calibrated based on the PLL settings
and the incoming reference clock.
After the VCO has been calibrated,
the device enters Active Mode
automatically.
Calibration Hold: CAL Enabled
becomes true when either
ENCAL_MODE (Device Register 6 bit
27) is low or both ENCAL_MODE is
high AND ENCAL (Device Register 6
bit 22) transitions from a low to a high.
Active Mode: A Manual Recalibration
is requested. This is initiated by
setting ENCAL_MODE to HIGH
(Manual Calibration Enabled) AND
initiating a calibration sequence by
applying a LOW to HIGH transition on
ENCAL.
Calibration Process in completed
ON
Enabled
Disabled
OFF
Normal Operation
CAL Done (VCO calibration process
finished) or Sync = OFF (from Sync
State).
Sync, Power Down, Sleep, or Manual
Recalibration activated.
ON
Enabled
Disabled
or
Enabled
Disabled
or
Enabled
VCO CAL
Active Mode
36
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Table 15. CDCE62005 Device State Definitions (continued)
Status
State
Device Behavior
Entered Via
Exited Via
SPI Port
PLL
Output
Divider
Output
Buffer
Power_Down pin is pulled LOW.
Power_Down pin is pulled HIGH.
ON
Disabled
Disabled
Disabled
Power
Down
Used to shut down all hardware and
Resets the device after exiting the
Power Down State. Therefore, the
EEPROM contents will eventually be
copied into RAM after the Power
Down State is exited.
Identical to the Power Down State
except the EEPROM contents are
not copied into RAM.
Sleep bit in device register 8 bit 7 is
set LOW.
Sleep bit in device register 8 bit 7 is set
HIGH.
ON
Disabled
Disabled
Disabled
Sleep
Sync Bit in device register 8 bit 8 is
set LOW or Sync pin is pulled LOW
Sync Bit in device register 8 bit 8 is set
HIGH or Sync pin is pulled HIGH
ON
Enabled
Disabled
Disabled
Sync
Sync synchronizes all output
dividers so that they begin counting
at the same time. Note: this
operation is performed automatically
each time a divider register is
accessed.
External Control Pins
REF_SEL
REF_SEL provides a way to switch between the primary and secondary reference inputs (PRI_IN and SEC_IN)
via an external signal. It works in conjunction with the smart multiplexer discussed in the Input Block section.
Power_Down
The Power_Down pin places the CDCE62005 into the power down state . Additionally, the CDCE62005 loads
the contents of the EEPROM into RAM after the Power_Down pin is de-asserted; therefore, it is used to initialize
the device after power is applied. SPI_LE signal has to be HIGH in order for EEPROM to load correctly during
the rising edge of Power_Down.
SYNC
The SYNC pin (Active LOW) has a complementary register location located in Device Register 8 bit 8. When
enabled, Sync synchronizes all output dividers so that they begin counting simultaneously. Further, SYNC
disables all outputs when in the active state. NOTE: The output synchronization does not work for reference input
frequencies less than 1 MHz.
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INPUT BLOCK
The Input Block includes two Universal Input Buffers, an Auxiliary Input, and a Smart Multiplexer. The Input Block
drives three different clock signals onto the Internal Clock Distribution Bus: buffered versions of both the primary
and secondary inputs (PRI_IN and SEC_IN) and the output of the Smart Multiplexer.
Universal Input Buffers
1500 MHz
PRI_IN
Register 6
12
SEC_IN
9
8
Register 5
6 1 0
1 MHz - 250 MHz
Register 5
5 4 3
2
Smart MUX
Control
REF _SEL
Register 0
1
Smart Multiplexer
0
/1:/2:HiZ
250 MHz
Reference Divider
/1 - /8
Register 1
Auxiliary Input
1
/1:/2:HiZ
Crystal : 2 MHz – 42 MHz
Smart
MUX 1
Smart
MUX2
Internal Clock Distribution Bus
LVPECL : 1 MHz - 1500 MHz
LVDS : 1 MHz - 800 MHz
LVCMOS : 250 MHz
0
250 MHz
Register 3 Register 2
0
1 0
XTAL /
AUX _IN
Figure 23. CDCE62005 Input Block With References to Registers
38
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Universal Input Buffers (UIB)
Figure 24 shows the key elements of a universal input buffer. A UIB supports multiple formats along with different
termination and coupling schemes. The CDCE62005 implements the UIB by including on board switched
termination, a programmable bias voltage generator, and an output multiplexer. The CDCE62005 provides a high
degree of configurability on the UIB to facilitate most existing clock input formats.
PRI_IN
PINV
PN
PP
50 Ω
50 Ω
50 Ω
50 Ω
SN
SP
Register 6
12
Vbb
Register 5
10 9 8
Vbb
1 mF
Settings
5.1
5.0
5.6
Nominal
INBUFSELY INBUFSELX ACDCSEL
Vbb
1
0
0
1.9V
1
0
1
1.2V
1
1
0
1.2V
1
1
1
1.2V
Universal Input Control
7
6
1
0
SINV
5.0
INBUFSELX
0
X
X
X
SEC_IN
Settings
5.1
5.8, 6.12
INBUFSELY
TERMSEL
0
X
X
1
1
0
1
0
SWITCH Status
5.9,5.10
INVBB
X
X
0
1
P
OFF
OFF
ON
ON
N
OFF
OFF
ON
ON
INV
OFF
OFF
ON
OFF
Figure 24. CDCE62005 Universal Input Buffer
Table 16 lists several settings for many possible clock input scenarios. Note that the two universal input buffers
share the Vbb generator. Therefore, if both inputs use internal termination, they must use the same configuration
mode (LVDS, LVPECL, or LVCMOS). If the application requires different modes (e.g. LVDS and LVPECL) then
one of the two inputs must implement external termination.
Table 16. CDCE62005 Universal Input Buffer Configuration Matrix
PRI_IN CONFIGURATION MATRIX
SETTINGS
Register.Bit →
Bit Name →
CONFIGURATION
5.7
5.1
5.0
5.8
5.9
5.6
HYSTEN
INBUFSELY
INBUFSELX
PRI_TERMSEL
PRIINVBB
ACDCSEL
Hysteresis
Mode
Coupling
Termination
1
0
0
X
X
X
ENABLED
LVCMOS
DC
N/A
—
1
1
0
0
0
0
ENABLED
LVPECL
AC
Internal
1.9V
1
1
0
0
0
1
ENABLED
LVPECL
DC
Internal
1.2V
1
1
0
1
X
X
ENABLED
LVPECL
—
External
—
1
1
1
0
0
0
ENABLED
LVDS
AC
Internal
1.2V
1
1
1
0
0
1
ENABLED
LVDS
DC
Internal
1.2V
1
1
1
1
X
X
ENABLED
LVDS
—
External
—
0
X
X
X
X
X
OFF
—
—
—
—
1
X
X
X
X
X
ENABLED
—
—
—
—
5.7
5.1
5.0
6.12
5.10
5.6
HYSTEN
INBUFSELY
INBUFSELX
SEC_TERMSEL
SECINVBB
ACDCSEL
Hysteresis
Mode
Coupling
Termination
Vbb
1
0
0
X
X
X
ENABLED
LVCMOS
DC
N/A
—
Vbb
SEC_IN CONFIGURATION MATRIX
SETTINGS
Register.Bit →
Bit Name →
CONFIGURATION
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Table 16. CDCE62005 Universal Input Buffer Configuration Matrix (continued)
PRI_IN CONFIGURATION MATRIX
SETTINGS
Register.Bit →
Bit Name →
CONFIGURATION
5.7
5.1
5.0
5.8
5.9
5.6
HYSTEN
INBUFSELY
INBUFSELX
PRI_TERMSEL
PRIINVBB
ACDCSEL
Hysteresis
Mode
Coupling
Termination
Vbb
1
1
0
0
0
0
ENABLED
LVPECL
AC
Internal
1.9V
1
1
0
0
0
1
ENABLED
LVPECL
DC
Internal
1.2V
1
1
0
1
X
X
ENABLED
LVPECL
—
External
—
1
1
1
0
0
0
ENABLED
LVDS
AC
Internal
1.2V
1
1
1
0
0
1
ENABLED
LVDS
DC
Internal
1.2V
1
1
1
1
X
X
ENABLED
LVDS
—
External
—
0
X
X
X
X
X
OFF
—
—
—
—
1
X
X
X
X
X
ENABLED
—
—
—
—
LVDS Fail Safe Mode
Differential data line receivers can switch on noise in the absence of an input signal. This occurs when the bus
driver is turned off or the interconnect is damaged or missing. Traditionally the solution to this problem involves
incorporating an external resistor network on the receiver input. This network applies a steady-state bias voltage
to the input pins. The additional cost of the external components notwithstanding, the use of such a network
lowers input signal magnitude and thus reduces the differential noise margin. The CDCE62005 provides internal
failsafe circuitry on all LVDS inputs if enabled as shown in Table 17 for DC termination only.
Table 17. LVDS Failsafe Settings
Bit Name →
Register.Bit →
FAILSAFE
5.11
LVDS Failsafe
0
Disabled for all inputs
1
Enabled for all inputs
Smart Multiplexer Controls
The smart multiplexer implements a configurable switching mechanism suitable for many applications in which
fault tolerance is a design consideration. It includes the multiplexer itself along with three dividers. With respect to
the multiplexer control, Table 18 provides an overview of the configurations supported by the CDCE62005.
Table 18. CDCE62005 Smart Multiplexer Settings
REGISTER 5 SETTINGS
EECLKSEL
AUXSEL
SECSEL
PRISEL
5.5
5.4
5.3
5.2
1
0
0
1
Manual Mode: PRI_IN selected
1
0
1
0
Manual Mode: SEC_IN selected
1
1
0
0
Manual Mode: AUX_IN selected
1
0
1
1
Auto MOde: PRI_IN then SEC_IN
1
1
1
1
Auto Mode: PRI_IN then SEC_IN then AUX_IN
0
X
1
1
REF_SEL pin selects PRI_IN or SEC_IN
40
SMART MULTIPLEXER MODE
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Smart Multiplexer Auto Mode
Smart Multiplexer Auto Mode switches automatically between clock inputs based on a prioritization scheme
shown in Table 18. If using the Smart Multiplexer Auto Mode, the frequencies of the clock inputs may differ by up
to 20%. The phase relationship between clock inputs has no restriction.
Upon the detection of a loss of signal on the highest priority clock, the smart multiplex switches its output to the
next highest priority clock on the first incoming rising edge of the next highest priority clock. During this switching
operation, the output of the smart multiplexer is low. Upon restoration of the higher priority clock, the smart
multiplexer waits until it detects four complete cycles from the higher priority clock prior to switching the output of
the smart multiplexer back to the higher priority clock. During this switching operation, the output of the smart
multiplexer remains high until the next falling edge as shown in Figure 25.
PRI _ REF
SEC _ REF
Internal
Reference Clock
Secondary Clock
Primary Clock
Primary Clock
Figure 25. CDCE62005 Smart Multiplexer Timing Diagram
Smart Multiplexer Dividers
Register 5
5 4 3
2
Smart MUX
Control
Register 0
1 0
/1:/2:HiZ
PRI_IN
Register 1
1 0
Universal Input Buffers
/1:/2:HiZ
SEC_IN
Smart Multiplexer
Smart
MUX1
Smart
MUX2
Reference Divider
/1 - /8
Internal Clock Distribution Bus
REF_SEL
Register 3 Register 2
0
1 0
XTAL /
AUX_IN
Auxiliary Input
Figure 26. CDCE62005 Smart Multiplexer
The CDCE62005 Smart Multiplexer Block provides the ability to divide the primary and secondary UIB or to
disconnect a UIB from the first state of the smart multiplexer altogether.
Table 19. CDCE62005 Pre-Divider Settings
Primary Pre-Divider
Bit Name →
Register.Bit →
Secondary Pre-Divider
DIV2PRIY
0.1
DIV2PRIX
0.0
Divide Ratio
0
0
0
1
1
1
Bit Name →
Register.Bit →
DIV2SECY
1.1
DIV2SECX
1.0
Divide Ratio
Hi-Z
0
0
Hi-Z
/2
0
1
/2
0
/1
1
0
/1
1
Reserved
1
1
Reserved
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The CDCE62005 provides a Reference Divider that divides the clock exiting the first multiplexer stage; thus
dividing the primary (PRI_IN) or the secondary input (SEC_IN).
Table 20. CDCE62005 Reference Divider Settings
Reference Divider
Bit Name →
Register.Bit →
REFDIV2
3.0
REFDIV1
2.1
REFDIV0
2.0
Divide Ratio
0
0
0
/1
0
0
1
/2
0
1
0
/3
0
1
1
/4
1
0
0
/5
1
0
1
/6
1
1
0
/7
1
1
1
/8
Auxiliary Input Port
The auxiliary input on the CDCE62005 is designed to connect to an AT-Cut Crystal with a load capacitance of 8
to 10pF. One side of the crystal connects to Ground while the other side connects to the Auxiliary input of the
device. The circuit works optimally between 20 to 40MHz but it can accept crystals from 2 to 42MHz.
8 pF
Figure 27. CDCE62005 Auxiliary Input Port
42
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SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
OUTPUT BLOCK
The output block includes five identical output channels. Each output channel comprises an output multiplexer, a
clock divider module, and a universal output buffer as shown in Figure 28.
Registers 0 - 4
5
4
27 26 25 24 23 22 21
Output
MUX
Control
Internal Clock Distribution Bus
Registers 0 - 4
Sync
Pulse
Output Buffer Control
Enable
PRI_IN
UxP
SEC_IN
Clock Divider Module 0 - 4
SMART _MUX
LVDS
UxN
SYNTH
LVPECL
Figure 28. CDCE62005 Output Channel
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Output Multiplexer Control
The Clock Divider Module receives the clock selected by the output multiplexer. The output multiplexer selects
from one of four clock sources available on the Internal Clock Distribution. For a description of PRI_IN, SEC_IN,
and SMART_MUX, see Figure 23. For a description of SYNTH, see Figure 34.
Table 21. CDCE62005 Output Multiplexer Control Settings
OUTPUT MULTIPLEXER CONTROL
Register n (n = 0,1,2,3,4)
OUTMUXnSELX
n.4
OUTMUXnSELY
n.5
0
0
PRI_IN
0
1
SEC_IN
1
0
SMART_MUX
1
1
SYNTH
CLOCK SOURCE SELECTED
Output Buffer Control
Each of the five output channels includes a programmable output buffer; supporting LVPECL, LVDS, and
LVCMOS modes. Table 22 lists the settings required to configure the CDCE62005 for each output type.
Registers 0 through 4 correspond to Output Channels 0 through 4 respectively.
Table 22. CDCE62005 Output Buffer Control Settings
OUTPUT BUFFER CONTROL
Register n (n = 0,1,2,3,4)
OUTPUT TYPE
CMOSMODEnPX
CMOSMODEnPY
CMOSMODEnNX
CMOSMODEnNY
OUTBUFSELnX
OUTBUFSELnY
n.22
n.23
n.24
n.25
n.26
n.27
0
0
0
0
0
1
0
1
0
1
1
1
LVDS
0
0
LVCMOS
1
0
OFF
See LVCMOS Output Buffer Configuration Settings
0
1
0
1
LVPECL
Output Buffer Control – LVCMOS Configurations
A LVCMOS output configuration requires additional configuration data. In the single ended configuration, each
Output Channel provides a pair of outputs. The CDCE62005 supports four modes of operation for single ended
outputs as listed in Table 23.
Table 23. LVCMOS Output Buffer Configuration Settings
OUTPUT BUFFER CONTROL – LVCMOS CONFIGURATION
Register n (n = 0,1,2,3,4)
Output
Type
Pin
0
LVCMOS
Negative
Active – Non-inverted
0
LVCMOS
Negative
Hi-Z
0
0
LVCMOS
Negative
Active – Non-inverted
1
0
0
LVCMOS
Negative
Low
X
X
0
0
LVCMOS
Positive
Active – Non-inverted
1
X
X
0
0
LVCMOS
Positive
Hi-Z
1
0
X
X
0
0
LVCMOS
Positive
Active – Non-inverted
1
1
X
X
0
0
LVCMOS
Positive
Low
CMOSMODEnPX
CMOSMODEnPY
CMOSMODEnNX
CMOSMODEnNY
OUTBUFSELnX
OUTBUFSELnY
n.22
n.23
n.24
n.25
n.26
n.27
X
X
0
0
0
X
X
0
1
0
X
X
1
0
X
X
1
0
0
0
44
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Output Mode
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Output Dividers
Figure 29 shows that each output channel provides a 7-bit divider and digital phase adjust block. The Output
Divider Settings lists the divide ratios supported by the output divider for each output channel. Figure 30
illustrates the output divider architecture in detail. The Prescaler provides an array of low noise dividers with duty
cycle correction. The Integer Divider includes a final divide by two stage which is used to correct the duty cycle of
the /1–/8 stage. The output divider’s maximum input frequency is limited to 1.175GHz. If the divider is bypassed
(divide ratio = 1) then the maximum frequency of the output channel is 1.5GHz.
Registers 0 - 4
Registers 0 - 4
12 11 10 9
8
7
6
20
Enable
Sync
Pulse
(internally generated )
Digital Phase Adjust (7-bits)
From
Output
MUX
To
Output
Buffer
Output Divider (7-bits)
Registers 0 - 4
19 18 17 16 15 14 13
Figure 29. CDCE62005 Output Divider and Phase Adjust
Registers 0 - 4
Registers 0 - 4
14 13
From
Output
MUX
Registers 0 - 4
19 18
17 16 15
/2-/5
/1 - /8
Prescaler
/2
00
To
Output
Buffer
Integer Divider
10
01
Figure 30. CDCE62005 Output Divider Architecture
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CDCE62005 Output Divider Settings
OUTPUT DIVIDER n SETTINGSRegister n (n = 0,1,2,3,4)
Output Phase*
Output Divide Ratio
n.19
n.18
n.17
n.16
n.15
n.14
n.13
n.20
Prescaler Setting
Integer Divider Setting
OUTnDIVSEL
OutnDIVSEL0
OUTnDIVSEL1
Prescaler
OUTnDIVSEL2
OUTnDIVSEL3
Integer Divider
OUTnDIVSEL4
OUTnDIVSEL5
OUTnDIVSEL6
Multiplexer
X
X
X
X
X
X
X
0
0
1
0
0
0
0
0
1
–
–
1
0
0
0
0
0
0
1
2
1
0
0
0
0
0
1
1
1
0
0
0
0
1
0
1
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Output
Channels
Auxiliary
Cycles
Degree
0-4
Output
OFF
OFF
OFF
OFF
0
0
1
OFF
–
0.5
180
2**
4
3
–
0
0
3**
6
1
4
–
0.5
180
4
8
1
5
–
0
0
5
10
1
1
3
2
21
7560
6
6
1
0
1
4
2
28.5
10260
8
8
1
1
1
5
2
35
12500
10
10
1
0
1
1
3
4
24
8640
12
12
0
1
1
0
1
4
4
32.5
11700
16
16
0
1
1
1
1
5
4
40
14400
20
20
0
1
0
0
1
1
3
6
27
9720
18
18
0
0
1
0
1
0
1
4
6
36.5
13140
24
24
0
0
0
1
0
1
1
1
5
6
45
16200
30
30
0
0
0
1
1
1
0
1
4
8
40.5
14580
32
32
0
0
0
1
1
1
1
1
5
8
50
18000
40
40
0
0
1
0
0
1
1
1
5
10
55
19800
50
50
0
0
1
0
1
0
1
1
3
12
36
12960
36
36
0
0
1
0
1
1
0
1
4
12
48.5
17460
48
48
0
0
1
0
1
1
1
1
5
12
60
21600
60
60
0
0
1
1
0
0
0
1
2
14
25.5
9540
28
28
0
0
1
1
0
0
1
1
3
14
39
14040
42
42
0
0
1
1
0
1
0
1
4
14
52.5
18900
56
56
0
0
1
1
0
1
1
1
5
14
65
23400
70
70
0
0
1
1
1
1
0
1
4
16
56.5
20340
64
64
0
0
1
1
1
1
1
1
5
16
70
25200
80
80
*These columns show that the output divider generates a unique phase lag in the output clock (relative to the clock from the output multiplexer) determined by the
divide ratio used.
**Output channel 2 or 3 determine the auxiliary output divide ratio. For example, if the auxiliary output is programmed to drive via output 2 and output 2 divider is
programmed to divide by 3, then the divide ratio for the auxiliary output will be 6.
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Digital Phase Adjust
Figure 31 provides an overview of the Digital Phase Adjust feature. The output divider includes a coarse phase
adjust that shifts the divided clock signal that drives the output buffer. Essentially, the Digital Phase Adjust timer
delays when the output divider starts dividing; thereby shifting the phase of the output clock. The phase adjust
resolution is a function of the divide function. Coarse phase adjust parameters include:
• Number of Phase Delay Steps – the number of phase delay steps available is equal to the divide ratio
selected. For example, if a Divide by 4 is selected, then the Digital Phase Adjust can be programmed to
select when the output divider changes state based upon selecting one of the four counts on the input.
Figure 31 shows an example of divide by 16 in which there are 16 rising edges of Clock IN at which the
output divider changes state (this particular example shows the fourth edge shifting the output by one fourth
of the period of the output).
• Phase Delay Step Size – the step size is determined by the number of phase delay steps according to the
following equations:
360 degrees
Stepsize(deg) =
OutputDivideRatio
(4)
1
f ClockIN
Stepsize (sec ) =
OutputDivideRatio
Clock
IN
(from Smart MUX )
(5)
Digital Phase Adjust (7-bits)
Start Divider
To Output Buffer
/1 - /80
Clock IN
Output Divider (no adjust )
Output Divider (phase adjust )
Figure 31. CDCE62005 Phase Adjust
Phase Adjust example
Given:
Output Frequency: 30.72 MHz
VCO Operating Frequency: 1966.08 MHz
Prescaler Divider Setting: 2
Output Divider Setting: 32
360
Stepsize(deg) =
= 11.25° / Step
32
(6)
The tables that follow provide a list of valid register settings for the digital phase adjust blocks.
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48
18
20
24
Phase Delay
(radian)
0
0
(2π/2)
0
(2π/3)
2(2π/3)
0
(2π/4)
2(2π/4)
3(2π/4)
0
(2π/5)
2(2π/5)
3(2π/5)
4(2π/5)
0
(2π/6)
2(2π/6)
3(2π/6)
4(2π/6)
5(2π/6)
0
(2π/8)
2(2π/8)
3(2π/8)
4(2π/8)
5(2π/8)
6(2π/8)
7(2π/8)
0
(2π/10)
2(2π/10)
3(2π/10)
4(2π/10)
5(2π/10)
6(2π/10)
7(2π/10)
8(2π/10)
9(2π/10)
0
(2π/12)
2(2π/12)
3(2π/12)
4(2π/12)
5(2π/12)
6(2π/12)
7(2π/12)
8(2π/12)
9(2π/12)
10(2π/12)
11(2π/12)
0
(2π/16)
2(2π/16)
3(2π/16)
4(2π/16)
5(2π/16)
6(2π/16)
7(2π/16)
8(2π/16)
9(2π/16)
10(2π/16)
11(2π/16)
12(2π/16)
13(2π/16)
14(2π/16)
15(2π/16)
PHnADGC0
n.6
0
0
1
0
1
0
0
1
0
1
0
1
0
1
0
0
1
0
0
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
0
1
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
PHnADGC1
n.7
0
0
0
0
0
1
0
0
1
1
0
0
1
1
0
0
0
1
0
0
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
1
1
0
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
PHnADGC2
n.8
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PHnADGC3
n.9
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
PHnADGC4
n.10
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
Divide Ratio
n.11
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PHnADGC5
16
n.12
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PHnADGC6
12
Phase Delay
10
PHnADGC0
8
PHnADGC1
6
PHnADGC2
5
PHnADGC3
4
PHnADGC4
3
PHnADGC5
1
2
PHnADGC6
Divide Ratio
Table 24. CDCE62005 Output Coarse Phase Adjust Settings (1)
n.12
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
n.11
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
n.10
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
n.9
0
0
0
1
1
1
0
0
0
1
1
1
0
0
0
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
n.8
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
n.7
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
n.6
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
(radian)
0
(2π/18)
2(2π/18)
3(2π/18)
4(2π/18)
5(2π/18)
6(2π/18)
7(2π/18)
8(2π/18)
9(2π/18)
10(2π/18)
11(2π/18)
12(2π/18)
13(2π/18)
14(2π/18)
15(2π/18)
16(2π/18)
17(2π/18)
0
(2π/20)
2(2π/20)
3(2π/20)
4(2π/20)
5(2π/20)
6(2π/20)
7(2π/20)
8(2π/20)
9(2π/20)
10(2π/20)
11(2π/20)
12(2π/20)
13(2π/20)
14(2π/20)
15(2π/20)
16(2π/20)
17(2π/20)
18(2π/20)
19(2π/20)
0
(2π/24)
2(2π/24)
3(2π/24)
4(2π/24)
5(2π/24)
6(2π/24)
7(2π/24)
8(2π/24)
9(2π/24)
10(2π/24)
11(2π/24)
12(2π/24)
13(2π/24)
14(2π/24)
15(2π/24)
16(2π/24)
17(2π/24)
18(2π/24)
19(2π/24)
20(2π/24)
21(2π/24)
22(2π/24)
23(2π/24)
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32
36
Phase Delay
(radian)
0
(2π/28)
2(2π/28)
3(2π/28)
4(2π/28)
5(2π/28)
6(2π/28)
7(2π/28)
8(2π/28)
9(2π/28)
10(2π/28)
11(2π/28)
12(2π/28)
13(2π/28)
14(2π/28)
15(2π/28)
16(2π/28)
17(2π/28)
18(2π/28)
19(2π/28)
20(2π/28)
21(2π/28)
22(2π/28)
23(2π/28)
24(2π/28)
25(2π/28)
26(2π/28)
27(2π/28)
0
(2π/30)
2(2π/30)
3(2π/30)
4(2π/30)
5(2π/30)
6(2π/30)
7(2π/30)
8(2π/30)
9(2π/30)
10(2π/30)
11(2π/30)
12(2π/30)
13(2π/30)
14(2π/30)
15(2π/30)
16(2π/30)
17(2π/30)
18(2π/30)
19(2π/30)
20(2π/30)
21(2π/30)
22(2π/30)
23(2π/30)
24(2π/30)
25(2π/30)
26(2π/30)
27(2π/30)
28(2π/30)
29(2π/30)
PHnADGC0
n.6
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
PHnADGC1
n.7
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
PHnADGC2
Phase Delay
n.8
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
PHnADGC3
PHnADGC0
n.9
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
PHnADGC4
PHnADGC1
n.10
0
0
0
0
1
1
1
1
0
0
0
0
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
PHnADGC5
PHnADGC2
n.11
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
PHnADGC6
PHnADGC3
n.12
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Divide Ratio
PHnADGC4
30
PHnADGC5
28
PHnADGC6
Divide Ratio
Table 25. CDCE62005 Output Coarse Phase Adjust Settings (2)
n.12
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
n.11
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
n.10
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
n.9
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
1
1
1
0
0
0
1
1
1
0
0
0
1
1
1
0
0
0
1
1
1
0
0
0
1
1
1
0
0
0
1
1
1
n.8
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
n.7
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
n.6
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
(radian)
0
(2π/32)
2(2π/32)
3(2π/32)
4(2π/32)
5(2π/32)
6(2π/32)
7(2π/32)
8(2π/32)
9(2π/32)
10(2π/32)
11(2π/32)
12(2π/32)
13(2π/32)
14(2π/32)
15(2π/32)
16(2π/32)
17(2π/32)
18(2π/32)
19(2π/32)
20(2π/32)
21(2π/32)
22(2π/32)
23(2π/32)
24(2π/32)
25(2π/32)
26(2π/32)
27(2π/32)
28(2π/32)
29(2π/32)
30(2π/32)
31(2π/32)
0
(2π/36)
2(2π/36)
3(2π/36)
4(2π/36)
5(2π/36)
6(2π/36)
7(2π/36)
8(2π/36)
9(2π/36)
10(2π/36)
11(2π/36)
12(2π/36)
13(2π/36)
14(2π/36)
15(2π/36)
16(2π/36)
17(2π/36)
18(2π/36)
19(2π/36)
20(2π/36)
21(2π/36)
22(2π/36)
23(2π/36)
24(2π/36)
25(2π/36)
26(2π/36)
27(2π/36)
28(2π/36)
29(2π/36)
30(2π/36)
31(2π/36)
32(2π/36)
33(2π/36)
34(2π/36)
35(2π/36)
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49
CDCE62005
SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
www.ti.com
50
48
Phase Delay
(radian)
0
(2π/40)
2(2π/40)
3(2π/40)
4(2π/40)
5(2π/40)
6(2π/40)
7(2π/40)
8(2π/40)
9(2π/40)
10(2π/40)
11(2π/40)
12(2π/40)
13(2π/40)
14(2π/40)
15(2π/40)
16(2π/40)
17(2π/40)
18(2π/40)
19(2π/40)
20(2π/40)
21(2π/40)
22(2π/40)
23(2π/40)
24(2π/40)
25(2π/40)
26(2π/40)
27(2π/40)
28(2π/40)
29(2π/40)
30(2π/40)
31(2π/40)
32(2π/40)
33(2π/40)
34(2π/40)
35(2π/40)
36(2π/40)
37(2π/40)
38(2π/40)
39(2π/40)
0
(2π/42)
2(2π/42)
3(2π/42)
4(2π/42)
5(2π/42)
6(2π/42)
7(2π/42)
8(2π/42)
9(2π/42)
10(2π/42)
11(2π/42)
12(2π/42)
13(2π/42)
14(2π/42)
15(2π/42)
16(2π/42)
17(2π/42)
18(2π/42)
19(2π/42)
20(2π/42)
21(2π/42)
22(2π/42)
23(2π/42)
24(2π/42)
25(2π/42)
26(2π/42)
27(2π/42)
28(2π/42)
29(2π/42)
30(2π/42)
31(2π/42)
32(2π/42)
33(2π/42)
34(2π/42)
35(2π/42)
36(2π/42)
37(2π/42)
38(2π/42)
39(2π/42)
40(2π/42)
41(2π/42)
PHnADGC0
n.6
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
PHnADGC1
n.7
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
0
0
1
PHnADGC2
Phase Delay
n.8
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PHnADGC3
PHnADGC0
n.9
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
1
1
1
0
0
0
1
1
1
0
0
0
1
1
1
0
0
0
0
0
0
1
1
1
0
0
0
1
1
1
0
0
0
1
1
1
0
0
0
PHnADGC4
PHnADGC1
n.10
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
1
1
1
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
1
1
1
PHnADGC5
PHnADGC2
n.11
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
PHnADGC6
PHnADGC3
n.12
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Divide Ratio
PHnADGC4
42
PHnADGC5
40
PHnADGC6
Divide Ratio
Table 26. CDCE62005 Output Coarse Phase Adjust Settings (3)
n.12
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
n.11
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
n.10
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
n.9
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
n.8
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
n.7
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
n.6
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
(radian)
0
(2π/48)
2(2π/48)
3(2π/48)
4(2π/48)
5(2π/48)
6(2π/48)
7(2π/48)
8(2π/48)
9(2π/48)
10(2π/48)
11(2π/48)
12(2π/48)
13(2π/48)
14(2π/48)
15(2π/48)
16(2π/48)
17(2π/48)
18(2π/48)
19(2π/48)
20(2π/48)
21(2π/48)
22(2π/48)
23(2π/48)
24(2π/48)
25(2π/48)
26(2π/48)
27(2π/48)
28(2π/48)
29(2π/48)
30(2π/48)
31(2π/48)
32(2π/48)
33(2π/48)
34(2π/48)
35(2π/48)
36(2π/48)
37(2π/48)
38(2π/48)
39(2π/48)
40(2π/48)
41(2π/48)
42(2π/48)
43(2π/48)
44(2π/48)
45(2π/48)
46(2π/48)
47(2π/48)
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CDCE62005
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SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
56
Phase Delay
(radian)
0
(2π/50)
2(2π/50)
3(2π/50)
4(2π/50)
5(2π/50)
6(2π/50)
7(2π/50)
8(2π/50)
9(2π/50)
10(2π/50)
11(2π/50)
12(2π/50)
13(2π/50)
14(2π/50)
15(2π/50)
16(2π/50)
17(2π/50)
18(2π/50)
19(2π/50)
20(2π/50)
21(2π/50)
22(2π/50)
23(2π/50)
24(2π/50)
25(2π/50)
26(2π/50)
27(2π/50)
28(2π/50)
29(2π/50)
30(2π/50)
31(2π/50)
32(2π/50)
33(2π/50)
34(2π/50)
35(2π/50)
36(2π/50)
37(2π/50)
38(2π/50)
39(2π/50)
40(2π/50)
41(2π/50)
42(2π/50)
43(2π/50)
44(2π/50)
45(2π/50)
46(2π/50)
47(2π/50)
48(2π/50)
49(2π/50)
PHnADGC0
n.6
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
PHnADGC1
Phase Delay
n.7
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
PHnADGC2
PHnADGC0
n.8
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
PHnADGC3
PHnADGC1
n.9
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
PHnADGC4
PHnADGC2
n.10
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
PHnADGC5
PHnADGC3
n.11
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
PHnADGC6
PHnADGC4
n.12
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Divide Ratio
PHnADGC5
50
PHnADGC6
Divide Ratio
Table 27. CDCE62005 Output Coarse Phase Adjust Settings (4)
n.12
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
n.11
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
n.10
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
n.9
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
n.8
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
n.7
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
n.6
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
(radian)
0
(2π/56)
2(2π/56)
3(2π/56)
4(2π/56)
5(2π/56)
6(2π/56)
7(2π/56)
8(2π/56)
9(2π/56)
10(2π/56)
11(2π/56)
12(2π/56)
13(2π/56)
14(2π/56)
15(2π/56)
16(2π/56)
17(2π/56)
18(2π/56)
19(2π/56)
20(2π/56)
21(2π/56)
22(2π/56)
23(2π/56)
24(2π/56)
25(2π/56)
26(2π/56)
27(2π/56)
28(2π/56)
29(2π/56)
30(2π/56)
31(2π/56)
32(2π/56)
33(2π/56)
34(2π/56)
35(2π/56)
36(2π/56)
37(2π/56)
38(2π/56)
39(2π/56)
40(2π/56)
41(2π/56)
42(2π/56)
43(2π/56)
44(2π/56)
45(2π/56)
46(2π/56)
47(2π/56)
48(2π/56)
49(2π/56)
50(2π/56)
51(2π/56)
52(2π/56)
53(2π/56)
54(2π/56)
55(2π/56)
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Product Folder Link(s) :CDCE62005
51
CDCE62005
SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
www.ti.com
52
64
Phase Delay
(radian)
0
(2π/60)
2(2π/60)
3(2π/60)
4(2π/60)
5(2π/60)
6(2π/60)
7(2π/60)
8(2π/60)
9(2π/60)
10(2π/60)
11(2π/60)
12(2π/60)
13(2π/60)
14(2π/60)
15(2π/60)
16(2π/60)
17(2π/60)
18(2π/60)
19(2π/60)
20(2π/60)
21(2π/60)
22(2π/60)
23(2π/60)
24(2π/60)
25(2π/60)
26(2π/60)
27(2π/60)
28(2π/60)
29(2π/60)
30(2π/60)
31(2π/60)
32(2π/60)
33(2π/60)
34(2π/60)
35(2π/60)
36(2π/60)
37(2π/60)
38(2π/60)
39(2π/60)
40(2π/60)
41(2π/60)
42(2π/60)
43(2π/60)
44(2π/60)
45(2π/60)
46(2π/60)
47(2π/60)
48(2π/60)
49(2π/60)
50(2π/60)
51(2π/60)
52(2π/60)
53(2π/60)
54(2π/60)
55(2π/60)
56(2π/60)
57(2π/60)
58(2π/60)
59(2π/60)
PHnADGC0
n.6
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
PHnADGC1
Phase Delay
n.7
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
PHnADGC2
PHnADGC0
n.8
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
PHnADGC3
PHnADGC1
n.9
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
PHnADGC4
PHnADGC2
n.10
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
PHnADGC5
PHnADGC3
n.11
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
PHnADGC6
PHnADGC4
n.12
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Divide Ratio
PHnADGC5
60
PHnADGC6
Divide Ratio
Table 28. CDCE62005 Output Coarse Phase Adjust Settings (5)
n.12
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
n.11
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
n.10
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
n.9
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
n.8
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
n.7
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
n.6
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
(radian)
0
(2π/64)
2(2π/64)
3(2π/64)
4(2π/64)
5(2π/64)
6(2π/64)
7(2π/64)
8(2π/64)
9(2π/64)
10(2π/64)
11(2π/64)
12(2π/64)
13(2π/64)
14(2π/64)
15(2π/64)
16(2π/64)
17(2π/64)
18(2π/64)
19(2π/64)
20(2π/64)
21(2π/64)
22(2π/64)
23(2π/64)
24(2π/64)
25(2π/64)
26(2π/64)
27(2π/64)
28(2π/64)
29(2π/64)
30(2π/64)
31(2π/64)
32(2π/64)
33(2π/64)
34(2π/64)
35(2π/64)
36(2π/64)
37(2π/64)
38(2π/64)
39(2π/64)
40(2π/64)
41(2π/64)
42(2π/64)
43(2π/64)
44(2π/64)
45(2π/64)
46(2π/64)
47(2π/64)
48(2π/64)
49(2π/64)
50(2π/64)
51(2π/64)
52(2π/64)
53(2π/64)
54(2π/64)
55(2π/64)
56(2π/64)
57(2π/64)
58(2π/64)
59(2π/64)
60(2π/64)
61(2π/64)
62(2π/64)
63(2π/64)
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CDCE62005
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SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
80
Phase Delay
(radian)
0
(2π/70)
2(2π/70)
3(2π/70)
4(2π/70)
5(2π/70)
6(2π/70)
7(2π/70)
8(2π/70)
9(2π/70)
10(2π/70)
11(2π/70)
12(2π/70)
13(2π/70)
14(2π/70)
15(2π/70)
16(2π/70)
17(2π/70)
18(2π/70)
19(2π/70)
20(2π/70)
21(2π/70)
22(2π/70)
23(2π/70)
24(2π/70)
25(2π/70)
26(2π/70)
27(2π/70)
28(2π/70)
29(2π/70)
30(2π/70)
31(2π/70)
32(2π/70)
33(2π/70)
34(2π/70)
35(2π/70)
36(2π/70)
37(2π/70)
38(2π/70)
39(2π/70)
40(2π/70)
41(2π/70)
42(2π/70)
43(2π/70)
44(2π/70)
45(2π/70)
46(2π/70)
47(2π/70)
48(2π/70)
49(2π/70)
50(2π/70)
51(2π/70)
52(2π/70)
53(2π/70)
54(2π/70)
55(2π/70)
56(2π/70)
57(2π/70)
58(2π/70)
59(2π/70)
60(2π/70)
61(2π/70)
62(2π/70)
63(2π/70)
64(2π/70)
65(2π/70)
66(2π/70)
67(2π/70)
68(2π/70)
69(2π/70)
PHnADGC0
n.6
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
PHnADGC1
Phase Delay
n.7
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
PHnADGC2
PHnADGC0
n.8
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
PHnADGC3
PHnADGC1
n.9
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
PHnADGC4
PHnADGC2
n.10
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
PHnADGC5
PHnADGC3
n.11
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
PHnADGC6
PHnADGC4
n.12
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Divide Ratio
PHnADGC5
70
PHnADGC6
Divide Ratio
Table 29. CDCE62005 Output Coarse Phase Adjust Settings (6)
n.12
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
n.11
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
n.10
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
n.9
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
n.8
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
n.7
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
0
0
1
1
0
n.6
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
1
0
1
0
(radian)
0
(2π/80)
2(2π/80)
3(2π/80)
4(2π/80)
5(2π/80)
6(2π/80)
7(2π/80)
8(2π/80)
9(2π/80)
10(2π/80)
11(2π/80)
12(2π/80)
13(2π/80)
14(2π/80)
15(2π/80)
16(2π/80)
17(2π/80)
18(2π/80)
19(2π/80)
20(2π/80)
21(2π/80)
22(2π/80)
23(2π/80)
24(2π/80)
25(2π/80)
26(2π/80)
27(2π/80)
28(2π/80)
29(2π/80)
30(2π/80)
31(2π/80)
32(2π/80)
33(2π/80)
34(2π/80)
35(2π/80)
36(2π/80)
37(2π/80)
38(2π/80)
39(2π/80)
40(2π/80)
41(2π/80)
42(2π/80)
43(2π/80)
44(2π/80)
45(2π/80)
46(2π/80)
47(2π/80)
48(2π/80)
49(2π/80)
50(2π/80)
51(2π/80)
52(2π/80)
53(2π/80)
54(2π/80)
55(2π/80)
56(2π/80)
57(2π/80)
58(2π/80)
59(2π/80)
60(2π/80)
61(2π/80)
62(2π/80)
63(2π/80)
64(2π/80)
65(2π/80)
66(2π/80)
67(2π/80)
68(2π/80)
69(2π/80)
70(2π/80)
71(2π/80)
72(2π/80)
73(2π/80)
74(2π/80)
75(2π/80)
76(2π/80)
77(2π/80)
78(2π/80)
79(2π/80)
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Output Synchronization
Reference Input
Loop Filter
Output
Divider
Ya
Output
Divider
Yb
VCO
Input
Divider
Prescaler
Divider
PFD
Feedback
Divider
~ 6us delay
f(ref clk)
0
/SYNC
D
MUX
F(ref clk)
SET
Q
1
0
Reg 4, SPI Bit 5
1
Reg 6, SPI Bit 24
CLR
Q
Phase Error(on edge transition of reference input)
Reference Input Clock
VCO Clock after Prescaler Divider
Propagation delay of SYNC inside device
SYNC synchronized to reference input
Reg 4 SPI Bit 5 = “1”, Reg 6 SPI Bit 24 = “0”
Divider delay
Output Clock (output divider= 2)
When Reg 6, SPI Bit 24 = “0”, Reg 4 SPI Bit 5 = “1” and the SYNC pulse low-to-high transition is synchronized to the reference input, the delay of the SYNC low-to-high pulse to the toggling
of synchronized outputs is equal to the propagation delay of SYNC signal inside device + phase error (on reference input edge transition after SYNC signal) + divider delay (2.5 clock cycles of
VCO clock after prescaler) + delay between SYNC and input transition. Total uncertainty is 1 clock cycle of VCO clock after prescaler (uncertainty irrespective of output divide value)
.
Figure 32. CDCE62005 SYNC to Output delay variation
Output Synchronization Timing
Synchronization of the outputs is edecuted in several ways:
•
The SYNC pin is forced low and then released (manual sync).
•
By setting and then resetting Register 8, SPI Bit 12.
•
Whenever the output dividers are changed.
The most common way to execute the output synchronization is to toggle the SYNC pin where the outputs are
aligned on a low-to-high pulse on the SYNC after a delay as explained in Figure 32. For having tight control on
the delay variation of the outputs synchronization after a low-to-high pulse on the SYNC pin, the Register 4, SPI
Bit 5 needs to be set to “1”. When Reg 6, SPI Bit 24 = "0", the outputs are synchronized to each other and to the
reference input. In this case, the total delay from SYNC low-to-high pulse to toggling of synchronized outputs is
given in Figure 32.
When Reg 6, SPI Bit 24 = "1", the outputs are synchronized to each other and to the SYNC low-to-high pulse. In
this case, the total delay from SYNC low-to-high pulse to toggling of synchronized outputs is equal to the
propagation delay of SYNC signal inside device + divider delay. Total uncertainty is 1 cycle of VCO clock after
prescaler (uncertainty irrespective of output divide value).
54
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Auxiliary Output
Figure 33 shows the auxiliary output port. Table 30 lists how the auxiliary output port is controlled. The output
buffer supports a maximum output frequency of 250 MHz and drives at LVCMOS levels. Refer to for the list of
divider settings that establishes the output frequency.
Output Divider 2
AUX
OUT
Output Divider 3
Register 6
25
Register 6
24
Figure 33. CDCE62005 Auxiliary Output
Table 30. CDCE62005 Auxiliary Output Settings
Bit Name →
AUXFEEDSEL
AUXOUTEN
Register.Bit →
6.25
6.24
X
0
OFF
0
1
Divider 2
1
1
Divider 3
AUX OUTPUT SOURCE
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SYNTHESIZER BLOCK
Figure 34 provides an overview of the CDCE62005 synthesizer block. The Synthesizer Block provides a Phase
Locked Loop, a partially integrated programmable loop filter, and two Voltage Controlled Oscillators (VCO). The
synthesizer block generates an output clock called “SYNTH” and drives it onto the Internal Clock Distribution
Bus.
Charge Pump Current
Register 6
Input Divider Settings
Register 7
19 18 17 16
Register 5
Loop Filter Settings
7
21 20 19 18 17 16 15 14
1
0
15 14 13 12 11 10 9
6
5
4
3
2
8
20 19 18 17 16
Prescaler
Register 6
Internal Clock Distribution Bus
SMART _MUX
1
Input Divider
/1 - /256
PFD/
CP
Feedback Divider
Prescaler
/2,/3,/4,/5
SYNTH
50 kHz –
400 kHz
/1,/2,/5,/8,/10,/16,/20
/8 - /1280
Register 6
0
Register 6
10 9
8
VCO Select
Register 6
7
6
5
4
3
Feedback Divider
Internal Clock Distribution Bus
2
1.75 GHz –
2.356 GHz
15 14 13
Feedback Bypass Divider
Figure 34. CDCE62005 Synthesizer Block
Input Divider
The Input Divider divides the clock signal selected by the Smart Multiplexer (see Table 18) and presents the
divided signal to the Phase Frequency Detector / Charge Pump of the frequency synthesizer.
Table 31. CDCE62005 Input Divider Settings
INPUT DIVIDER SETTINGS
DIVIDE
RATIO
SELINDIV7
SELINDIV6
SELINDIV5
SELINDIV4
SELINDIV3
SELINDIV2
SELINDIV1
SELINDIV0
5.21
5.20
5.19
5.18
5.17
5.16
5.15
5.14
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
1
2
0
0
0
0
0
0
1
0
3
0
0
0
0
0
0
1
1
4
0
0
0
0
0
1
0
0
5
0
0
0
0
0
1
0
1
6
•
•
•
•
•
•
•
•
•
56
•
•
•
•
•
•
•
•
•
1
1
1
1
1
1
1
1
256
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Feedback and Feedback Bypass Divider
Table 32 shows how to configure the Feedback divider for various divide values
Table 32. CDCE62005 Feedback Divider Settings
FEEDBACK DIVIDER
DIVIDE
RATIO
SELFBDIV7
SELFBDIV6
SELFBDIV5
SELFBDIV4
SELFBDIV3
SELFBDIV2
SELFBDIV1
SELFBDIV0
6.10
6.9
9.8
6.7
6.6
6.5
6.4
6.3
0
0
0
0
0
0
0
0
8
0
0
0
0
0
0
0
1
12
0
0
0
0
0
0
1
0
16
0
0
0
0
0
0
1
1
20
0
0
0
0
0
1
0
1
24
0
0
0
0
0
1
1
0
32
0
0
0
0
1
0
0
1
36
0
0
0
0
0
1
1
1
40
0
0
0
0
1
0
1
0
48
0
0
0
1
1
0
0
0
56
0
0
0
0
1
0
1
1
60
0
0
0
0
1
1
1
0
64
0
0
0
1
0
1
0
1
72
0
0
0
0
1
1
1
1
80
0
0
0
1
1
0
0
1
84
0
0
0
1
0
1
1
0
96
0
0
0
1
0
0
1
1
100
0
1
0
0
1
0
0
1
108
0
0
0
1
1
0
1
0
112
0
0
0
1
0
1
1
1
120
0
0
0
1
1
1
1
0
128
0
0
0
1
1
0
1
1
140
0
0
1
1
0
1
0
1
144
0
0
0
1
1
1
1
1
160
0
0
1
1
1
0
0
1
168
0
1
0
0
1
0
1
1
180
0
0
1
1
0
1
1
0
192
0
0
1
1
0
0
1
1
200
0
1
0
1
0
1
0
1
216
0
0
1
1
1
0
1
0
224
0
0
1
1
0
1
1
1
240
0
1
0
1
1
0
0
1
252
0
0
1
1
1
1
1
0
256
0
0
1
1
1
0
1
1
280
0
1
0
1
0
1
1
0
288
0
1
0
1
0
0
1
1
300
0
0
1
1
1
1
1
1
320
0
1
0
1
1
0
1
0
336
0
1
0
1
0
1
1
1
360
0
1
0
1
1
1
1
0
384
1
1
0
1
1
0
0
0
392
0
1
1
1
0
0
1
1
400
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Table 32. CDCE62005 Feedback Divider Settings (continued)
FEEDBACK DIVIDER
DIVIDE
RATIO
SELFBDIV7
SELFBDIV6
SELFBDIV5
SELFBDIV4
SELFBDIV3
SELFBDIV2
SELFBDIV1
SELFBDIV0
6.10
6.9
9.8
6.7
6.6
6.5
6.4
6.3
0
1
0
1
1
0
1
1
420
1
0
1
1
0
1
0
1
432
0
1
1
1
1
0
1
0
448
0
1
0
1
1
1
1
1
480
1
0
0
1
0
0
1
1
500
1
0
1
1
1
0
0
1
504
0
1
1
1
1
1
1
0
512
0
1
1
1
1
0
1
1
560
1
0
1
1
0
1
1
0
576
1
1
0
1
1
0
0
1
588
1
0
0
1
0
1
1
1
600
0
1
1
1
1
1
1
1
640
1
0
1
1
1
0
1
0
672
1
0
0
1
1
0
1
1
700
1
0
1
1
0
1
1
1
720
1
0
1
1
1
1
1
0
768
1
1
0
1
1
0
1
0
784
1
0
0
1
1
1
1
1
800
1
0
1
1
1
0
1
1
840
1
1
0
1
1
1
1
0
896
1
0
1
1
1
1
1
1
960
1
1
0
1
1
0
1
1
980
1
1
1
1
1
1
1
0
1024
1
1
0
1
1
1
1
1
1120
1
1
1
1
1
1
1
1
1280
Table 33 shows how to configure the Feedback Bypass Divider.
Table 33. CDCE62005 Feedback Bypass Divider Settings
FEEDBACK BYPASS DIVIDER
58
SELBPDIV2
SELBPDIV1
SELBPDIV0
6.15
6.14
6.13
0
0
0
2
0
0
1
5
0
1
0
8
0
1
1
10
1
0
0
16
1
0
1
20
1
1
0
RESERVED
1
1
1
1(bypass)
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VCO Select
Table 34 illustrates how to control the dual voltage controlled oscillators.
Table 34. CDCE62005 VCO Select
Bit Name →
Register.Bit →
VCO Select
SELVCO
VCO CHARACTERISTICS
6.0
VCO Range
Fmin (MHz)
Fmax (MHz)
0
Low
1750
2046
1
High
2040
2356
Prescaler
Table 35 shows how to configure the prescaler.
Table 35. CDCE62005 Prescaler Settings
SETTINGS
SELPRESCB
SELPRESCA
DIVIDE RATIO
6.2
6.1
0
0
5
1
0
4
0
1
3
1
1
2
Charge Pump Current Settings
Table 36 provides the settings for the charge pump:
Table 36. CDCD62005 Charge Pump Settings
CHARGE PUMP SETTINGS
Bit Name →
Register.Bit →
CHARGE PUMP
CURRENT
ICPSEL3
ICPSEL2
ICPSEL1
ICPSEL0
6.19
6.18
6.17
6.16
0
0
0
0
50 mA
0
0
0
1
100 mA
0
0
1
0
150 mA
0
0
1
1
200 mA
0
1
0
0
300 mA
0
1
0
1
400 mA
0
1
1
0
600 mA
0
1
1
1
750 mA
1
0
0
0
1 mA
1
0
0
1
1.25 mA
1
0
1
0
1.5 mA
1
0
1
1
2 mA
1
1
0
0
2.5 mA
1
1
0
1
3 mA
1
1
1
0
3.5 mA
1
1
1
1
3.75 mA
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Loop Filter
Figure 35 depicts the loop filter topology of the CDCE62005. It facilitates both internal and external
implementations providing optimal flexibility.
C2
R2
C1
EXT_LFP
internal
EXT_LFN
external
internal
external
VB
+
PFD/
CP
R3
C3
C1
C2
R2
Figure 35. CDCE62005 Loop Filter Topology
Internal Loop Filter Component Configuration
Figure 35 contains five different loop filter components with programmable values: C1, C2, R2, R3, and C3.
Table 37 shows that the CDCE62005 uses one of four different types of circuit implementation (shown in
Figure 36) for each of the internal loop filter components.
Table 37. CDCE62005 Loop Filter Component Implementation Type
Component
Control Bits Used
Implementation Type
(see Figure 36)
C1
5
a
C2
5
a
R2
5
c
R3
2
d
C3
4
b
Ceq
Ceq
c.4
c.3
c.2
c.1
c.3
c.0
(a)
c.1
c.0
(b)
R eq
R eq
r.4
c.2
r.3
r.2
r.1
r.0
r.base
(c)
r.1
r.0
(d)
Figure 36. CDCE62005 Internal Loop Filter Component Schematics
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Table 38. CDCE62005 Internal Loop Filter – C1 Settings
C1 SETTINGS
Bit Name →
Capacitor Value →
Register.Bit →
EXLFSEL
LFRCSEL14
LFRCSEL13
LFRCSEL12
LFRCSEL11
LFRCSEL10
—
37.5 pF
21.5 pF
10 pF
6.5 pF
1.5 pF
6.26
7.14
7.13
7.12
7.11
7.10
Capacitor Value
1
X
X
X
X
X
External Loop Filter
0
0
0
0
0
0
0 pF
0
0
0
0
0
1
1.5 pF
0
0
0
0
1
0
6.5 pF
0
0
0
0
1
1
8 pF
0
0
0
1
0
0
10 pF
0
0
0
1
0
1
11.5 pF
0
0
0
1
1
0
16.5 pF
0
0
0
1
1
1
18 pF
0
0
1
0
0
0
21.5 pF
0
0
1
0
0
1
23 pF
0
•
•
•
•
•
•
0
1
1
1
0
0
69 pF
0
1
1
1
0
1
70.5 pF
0
1
1
1
1
0
75.5 pF
0
1
1
1
1
1
77 pF
Table 39. CDCE62005 Internal Loop Filter – C2 Settings
C2 SETTINGS
Bit Name →1
Capacitor Value →
Register.Bit 1→
EXLFSEL
LFRCSEL4
LFRCSEL3
LFRCSEL2
LFRCSEL1
LFRCSEL0
—
226 pF
123 pF
87 pF
25 pF
12.5 pF
6.26
7.4
7.3
7.2
7.1
7.0
Capacitor Value
1
0
0
0
0
0
External Loop Filter
0
0
0
0
0
0
0 pF
0
0
0
0
0
1
12.5 pF
0
0
0
0
1
0
25 pF
0
0
0
0
1
1
37.5 pF
0
0
0
1
0
0
87 pF
0
0
0
1
0
1
99.5 pF
0
0
0
1
1
0
112 pF
0
0
0
1
1
1
124.5 pF
0
0
1
0
0
0
123 pF
0
0
1
0
0
1
135.5 pF
0
•
•
•
•
•
•
0
1
1
1
0
0
436 pF
0
1
1
1
0
1
448.5 pF
0
1
1
1
1
0
461 pF
0
1
1
1
1
1
473.5 pF
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Table 40. CDCE62005 Internal Loop Filter – R2 Settings
R2 SETTINGS
Bit Name →
Resistor Value →
Register.Bit →
EXLFSEL
LFRCSEL9
LFRCSEL8
LFRCSEL7
LFRCSEL6
LFRCSEL5
—
56.4 k
38.2 k
20 k
9k
4k
6.26
7.9
7.8
7.7
7.6
7.5
Resistor Value (kΩ)
1
X
X
X
X
X
External Loop Filter
0
0
0
0
0
0
127.6
0
0
0
0
0
1
123.6
0
0
0
0
1
0
118.6
0
0
0
0
1
1
114.6
0
0
0
1
0
0
107.6
0
0
0
1
0
1
103.6
0
0
0
1
1
0
98.6
0
0
0
1
1
1
94.6
0
0
1
0
0
0
89.4
0
0
1
0
0
1
85.4
0
•
•
•
•
•
•
0
1
1
1
0
0
13
0
1
1
1
0
1
9
0
1
1
1
1
0
4
0
1
1
1
1
1
0
Table 41. CDCE62005 Internal Loop Filter – C3 Settings
C3 SETTINGS
Bit Name →
Capacitor Value →
Register.Bit →
62
EXLFSEL
LFRCSEL18
LFRCSEL17
LFRCSEL16
LFRCSEL15
—
85 pF
19.5 pF
5.5 pF
2.5 pF
6.26
7.18
7.17
7.16
7.15
Capacitor Value
1
X
X
X
X
External Loop Filter
0
0
0
0
0
0 pF
0
0
0
0
1
2.5 pF
0
0
0
1
0
5.5 pF
0
0
0
1
1
8 pF
0
0
1
0
0
19.5 pF
0
0
1
0
1
22 pF
0
0
1
1
0
25 pF
0
0
1
1
1
27.5 pF
0
1
0
0
0
85 pF
0
1
0
0
1
87.5 pF
0
•
•
•
•
•
0
1
1
1
0
104.5 pF
0
1
1
1
1
107 pF
0
1
1
1
0
110 pF
0
1
1
1
1
112.5 pF
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Table 42. CDCE62005 Internal Loop Filter – R3 Settings
R3 SETTINGS
Bit Name →
EXLFSEL
LFRCSEL20
—
10 k
5k
6.26
7.20
7.19
Resistor Value (kΩ)
1
X
X
External Loop Filter
0
0
0
20
0
0
1
15
0
1
0
10
0
1
1
5
Resistor Value →
Register.Bit →
LFRCSEL19
External Loop Filter Component Configuration
To implement an external loop filter, set EXLFSEL bit (6.26) high. Setting all of the control switches low that
control capacitors C1 and C2 (see Table 40) remove them from the loop filter circuit. This is necessary for an
external loop filter implementation.
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Lock Detect
Digital Lock Detect
The CDCE62005 provides both an analog and a digital lock detect circuit. With respect to lock detect, two signals
whose phase difference is less than a prescribed amount are ‘locked’ otherwise they are ‘unlocked’. The phase
frequency detector / charge pump compares the clock provided by the input divider and the feedback divider;
using the input divider as the phase reference. The digital lock detect circuit implements a programmable lock
detect window. Table 43 shows an overview of how to configure the digital lock detect feature. When selecting
the digital PLL lock option, the PLL_LOCK pin will possibly jitter several times between lock and out of lock until
the PLL achieves a stable lock. If desired, choosing a wide loop bandwidth and a high number of successive
clock cycles virtually eliminates this characteristic. PLL_LOCK will return to out of lock, if just one cycle is outside
the lock detect window or if a cycle slip occurs.
Lock Detect Window (Max)
From Input Divider
Locked
From Feedback Divider
Unlocked
From Input Divider
From Feedback Divider
From Input Divider
PFD/
CP
From Digital
Lock Detector
Lock Detect Window Adjust
To Loop Filter
PLL_LOCK
Register 5
27 26 25 24 23 22
From Feedback Divider
(a)
1 = Locked
O = Unlocked
(b)
(c)
Figure 37. CDCE62005 Digital Lock Detect
Table 43. CDCE62005 Digital Lock Detect Control
DIGITAL LOCK DETECT
Bit Name →
Register.Bit →
64
ADLOCK
LOCKDET
LOCKW(3)
LOCKW(2)
LOCKW(1)
LOCKW(0)
5.27
5.26
5.25
5.24
5.23
5.22
1
X
X
X
X
X
Analog Lock
X
0
X
X
X
X
1 cycle in lock window triggers a lock
X
1
X
X
X
X
64 continuous cycles in lock window triggers a
lock
0
X
0
0
0
0
Narrow Window
0
X
0
0
0
1
One step wider than narrow window
0
X
0
0
1
0
Two steps wider than narrow window
0
X
0
1
0
0
Three steps wider than narrow window
0
X
0
1
0
1
Four steps wider than narrow window
•
•
•
•
•
•
0
X
1
1
1
0
Widest Window
0
X
X
X
1
1
Reserved
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•
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Analog Lock Detect
Figure 38 shows the Analog Lock Detect circuit. Depending upon the phase relationship of the two signals
presented at the PFD/CP inputs, the lock detect circuit either charges (if the PLL is locked) or discharges (if PLL
is unlocked) the circuit shown via 100mA current sources. An external capacitor determines the sensitivity of the
lock detect circuit. The value of the capacitor determines the rate of change of the voltage presented on the
output pin PLL_LOCK and hence how quickly the PLL_LOCK output toggles based on a change of PLL locked
status. The PLL_LOCK pin is an analog output in analog lock detect mode.
1
´ i´ t
C
(7)
Solving for t yields:
V ´C
t = out
i
(8)
Vout =
VH = 0.55 × VCC
VL = 0.35 × VCC
For Example, let:
C = 10 nF
Vcc = 3.3 V \ VH @ 1.8 V = VOut
t=
1.8 ´ 10n
@ 164 μs
110 μ
(9)
Vcc
110 uA
Locked
PLL_LOCK
Lock_I
To Host
Unlocked
80k
5 pF
C
From Input Divider
PFD/
CP
110 uA
From Feedback Divider
Figure 38. CDCE62005 Analog Lock Detect
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DEVICE POWER CALCULATION AND THERMAL MANAGEMENT
The CDCE62005 is a high performance device, therefore careful attention must be paid to device configuration
and printed circuit board layout with respect to power consumption. Table 44 provides the power consumption for
the individual blocks within the CDCE62005. To estimate total power consumption, calculate the sum of the
products of the number of blocks used and the power dissipated of each corresponding block.
Table 44. CDCE62005 Power Consumption
Internal Block (Power at 3.3V)
Power Dissipated per Block
Number of Blocks per Device
Input Circuit
250 mW
1
PLL and VCO Core
500 mW
1
Output Divider
185 mW
5
Output Buffer ( LVPECL)
116 mW
5
Output Buffer (LVDS)
76 mW
5
Output Buffer (LVCMOS)
86 mW
10
This power estimate determines the degree of thermal management required for a specific design. Employing the
thermally enhanced printed circuit board layout shown in Figure 40 insures that the thermal performance curves
shown in Figure 39 apply. Observing good thermal layout practices enables the thermal pad on the backside of
the QFN-48 package to provide a good thermal path between the die contained within the package and the
ambient air. This thermal pad also serves as the ground connection the device; therefore, a low inductance
connection to the ground plane is essential.
Figure 40 shows a layout optimized for good thermal performance and a good power supply connection as well.
The 7×7 filled via patter facilitates both considerations. Finally, the recommended layout achieves qJA =
27.3°C/W in still air and 20.3°C/W in an environment with 100 LFM airflow if implemented on a JEDEC compliant
thermal test board..
Die Temperature vs Total Device Power
RL 0 LFM 85 C
125
JEDEC 0 LFM 25 C
JEDEC 100 LFM 25 C
RL 0 LFM 25 C
JDEC 0 LFM 85 C
JEDEC 0 LFM 25 C
100
JEDEC 100 LFM 25 C
Die Temp (C)
RL 100 LFM 85 C
RL 0 LFM 25 C
75
JEDEC 100 LFM 85 C
RL 100 LFM 25 C
RL 100 LFM 25 C
JEDEC 0 LFM 85 C
50
JEDEC 100 LFM 85 C
RL 0 LFM 85 C
25
RL 100 LFM 85 C
0
0
1
2
3
4
Power (W)
Figure 39. CDCE62005 Die Temperature vs Device Power
66
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Component Side
QFN-48
Thermal Slug
(package bottom)
Solder Mask
Internal
Ground
Plane
Internal
Power
Plane
Thermal
Dissipation
Pad (back side)
Thermal Vias
No Solder Mask
Back Side
Figure 40. CDCE62005 Recommended PCB Layout
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CDCE62005 Power Supply Bypassing – Recommended Layout
Figure 41 shows two conceptual layouts detailing recommended placement of power supply bypass capacitors. If
the capacitors are mounted on the back side, 0402 components can be employed; however, soldering to the
Thermal Dissipation Pad can be difficult. For component side mounting, use 0201 body size capacitors to
facilitate signal routing. Keep the connections between the bypass capacitors and the power supply on the
device as short as possible. Ground the other side of the capacitor using a low impedance connection to the
ground plane.
Component Side
Back Side
Figure 41. CDCE62005 Power Supply Bypassing
68
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APPLICATION INFORMATION AND GENERAL USAGE HINTS
Fan-out Buffer
Each output of the CDCE62005 can be configured as a fan-out buffer (divider bypassed) or fan-out buffer with
divide and skew control functionality.
PRI_IN
Divide by 1: Up to 1500 MHz
Otherwise : Up to 1175 MHz
U0P
/1 - /80
U0N
SEC_IN
Up to 5 Outputs :
LVPECL or LVDS
Up to 10 Outputs:
LVCMOS
U4P
/1 - /80
U4N
Figure 42. CDCE62005 Fan-out Buffer Mode
Clock Generator
The CDCE62005 can generate 5–10 low noise clocks from a single crystal as follows:
Feedback
Divider
XTAL /
AUX_IN
Smart
MUX
Input
Divider
PFD/
CP
U0P
Output
Divider 0
Prescaler
U0N
U4P
Output
Divider 4
U4N
Figure 43. CDCE62005 Clock Generator Mode
Jitter Cleaner – Mixed Mode (1)
The following table presents a common scenario. The CDCE62005 must generate several integer-related clocks
from a reference that has traversed a backplane. In order for jitter cleaning to take place, the phase noise of the
on-board clock path must be better than that of the incoming clock. The designer must pay attention to the
optimization of the loop bandwidth of the synthesizer and understand the phase noise profiles of the oscillators
involved. Further, other devices on the card require clocks at frequencies not related to the backplane clock. The
system requires combinations of differential and single-ended clocks in specific formats with specific phase
relationships. (1)
CLOCK FREQUENCY
INPUT/OUTPUT
FORMAT
NUMBER
CDCE62005 PORT
Input
LVDS
1
SEC_IN
Low end crystal oscillator
30.72 MHz
Input
LVDS
1
PRI_IN
Reference from backplane
122.88 MHz
Output
LVDS
1
U0
SERDES Clock
491.52 MHz
Output
LVPECL
1
U1
ASIC
10.000 MHz
COMMENT
245.76 MHz
Output
LVPECL
1
U2
FPGA
30.72 MHz
Outputs
LVCMOS
2
U3
ASIC
10.000 MHz
Outputs
LVCMOS
2
U4
CPU, DSP
(1)
Pay special attention when using the universal inputs with two different clock sources. Two clocks derived from the same source may
use the internal bias generator and internal termination network without jitter performance degradation. However, if their origin is from
different sources (e.g. two independent oscillators) then sharing the internal bias generator can degrade jitter performance significantly.
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30.72 MHz
Output
Divider 0
122 .88 MHz
Output
Divider 1
491 .52 MHz
Output
Divider 2
245 .76 MHz
10.00 MHz
/1:/2:HiZ
/1:/2:HiZ
Input
Divider
Feedback
Divider
PFD/
CP
Reference
Divider
Prescaler
Output
Divider 3
Output
Divider 4
30.72 MHz
30.72 MHz
10 MHz
10 MHz
Figure 44. CDCE62005 Jitter Cleaner Example
Clocking ADCs with the CDCE62005
High-speed analog to digital converters incorporate high input bandwidth on both the analog port and the sample
clock port. Often the input bandwidth far exceeds the sample rate of the converter. Engineers regularly
implement receiver chains that take advantage of the characteristics of bandpass sampling. This implementation
trend often causes engineers working in communications system design to encounter the term clock limited
performance. Therefore, it is important to understand the impact of clock jitter on ADC performance. Equation 10
shows the relationship of data converter signal to noise ratio (SNR) to total jitter.
é
ù
1
SNR jitter = 20 log10 ê
ú
ë 2 πfin jittertotal û
(10)
Total jitter comprises two components: the intrinsic aperture jitter of the converter and the jitter of the sample
clock:
jittertotal =
(jitterADC )2 + (jitterCLK )2
(11)
With respect to an ADC with N-bits of resolution, ignoring total jitter, DNL, and input noise, the following equation
shows the relationship between resolution and SNR:
SNR ADC = 6.02N + 1.76
(12)
Figure 45 plots Equation 10 and Equation 12 for constant values of total jitter. When used in conjunction with
most ADCs, the CDCE62005 supports a total jitter performance value of <1 ps.
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SNR (dB)
Data Converter Jitter Requirements
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
26
24
22
20
18
100 fs
50 fs
16
14
12
10
8
1 ps
6
350 fs
4
2
1
10
100
0
10000
1000
Figure 45. Data Converter Jitter Requirements
CDCE62005 SERDES Startup Mode
A common scenario involves a host communicating to a satellite system via a high-speed wired communications
link. Typical communications media might be a cable, backplane, or fiber. The reference clock for the satellite
system is embedded in the high speed link. This reference clock must be recovered by the SERDES, however,
the recovered clock contains unacceptable levels of jitter due to a degradation of SNR associated with
transmission over the media. At system startup, the satellite system must self-configure prior to the recovery and
cleanup of the reference clock provided by the host. Furthermore, upon loss of the communication link with the
host, the satellite system must continue to operate albeit with limited functionality. Figure 46 shows a block
diagram of an optical based system with such a mechanism that takes advantage of the features of the
CDCE62005:
Data
SERDES
Cleaned Clock
ASIC
ASIC Clock
Recovered Clock
CDCE62005
Figure 46. CDCE62005 SERDES Startup Overview
The functionality provided by the Smart Multiplexer provides a straightforward implementation of a SERDES
clock link. The Auxiliary Input provides a startup clock because it connects to a crystal. The on-chip EEPROM
determines the default configuration at power-up; therefore, the CDCE62005 requires no host communication to
begin cleaning the recovered clock once it is available. The CDCE62005 immediately begins clocking the
satellite components including the SERDES using the crystal as a clock source and a frequency reference. After
the SERDES recovers the clock, the CDCE62005 removes the jitter via the on-chip synthesizer/loop filter. The
recovered clock from the communications link becomes the frequency reference for the satellite system after the
smart multiplexer automatically switches over to it. The CDCE62005 applies the cleaned clock to the recovered
clock input on the SERDES; thereby establishing a reliable communications link between host and satellite
systems.
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Cleaned Clock
SERDES
Synthesizer
Block
Recovered Clock
Output Blocks
Output
Channel 0
Smart
MUX
Start-up/
Back -up
Clock
Frequency
Synthesizer
Output
Channel 1
Input
Block
Interface
&
Control
Device
Registers
Interface
&
Control
Block
EEPROM
Output
Channel 2
Output
Channel 3
To Satellite
System
Components
Output
Channel 4
Figure 47. CDCE62005 SERDES Startup Mode
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CDCE62005
www.ti.com
SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (July, 2009) to Revision C
Page
•
Deleted features involving single-ended clock sources and crystal auxiliary inputs ............................................................ 1
•
Deleted LVCMOS INPUT MODE (AUX_IN) section from Electrical Characteristics table ................................................. 12
•
Deleted fREF Single-ended Inputs .. from AUXILARY_IN REQUIREMENTS in the TIMING REQUIREMENTS table ....... 18
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Product Folder Link(s) :CDCE62005
73
PACKAGE OPTION ADDENDUM
www.ti.com
6-Feb-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CDCE62005RGZR
ACTIVE
VQFN
RGZ
48
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
CDCE62005RGZT
ACTIVE
VQFN
RGZ
48
250
CU NIPDAU
Level-3-260C-168 HR
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Feb-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CDCE62005RGZR
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
CDCE62005RGZT
VQFN
RGZ
48
250
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Feb-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CDCE62005RGZR
VQFN
RGZ
48
2500
333.2
345.9
28.6
CDCE62005RGZT
VQFN
RGZ
48
250
333.2
345.9
28.6
Pack Materials-Page 2
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