Numonyx JS28F640J3D-75 Numonyxâ ¢ embedded flash memory (j3 v. d) Datasheet

Numonyx™ Embedded Flash Memory
(J3 v. D)
32, 64, 128, and 256 Mbit
Datasheet
Product Features
„
„
„
„
Architecture
— High-density symmetrical 128-Kbyte blocks
— 256 Mbit (256 blocks)
— 128 Mbit (128 blocks)
— 64 Mbit (64 blocks)
— 32 Mbit (32 blocks)
Performance
— 75 ns Initial Access Speed (128/64/32
-Mbit densities)
— 95 ns Initial Access Speed (256 Mbit only)
— 25 ns 8-word and 4-word Asynchronous
page-mode reads
— 32-Byte Write buffer
— 4 µs per Byte Effective programming time
„
System Voltage and Power
— VCC = 2.7 V to 3.6 V
— VCCQ = 2.7 V to 3.6 V
Packaging
— 56-Lead TSOP package (32, 64, 128 Mbit
only)
— 64-Ball Numonyx Easy BGA package (32,
42, 128 and 256 Mbit)
„
„
Security
— Enhanced security options for code
protection
— 128-bit Protection Register
— 64-bit Unique device identifier
— 64-bit User-programmable OTP cells
— Absolute protection with VPEN = GND
— Individual block locking
— Block erase/program lockout during power
transitions
Software
— Program and erase suspend support
— Flash Data Integrator (FDI), Common Flash
Interface (CFI) Compatible
Quality and Reliability
— Operating temperature:
-40 °C to +85 °C
— 100K Minimum erase cycles per block
— 0.13 µm ETOX™ VIII Process
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November 2007
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH NUMONYX™ PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN NUMONYX'S TERMS AND
CONDITIONS OF SALE FOR SUCH PRODUCTS, NUMONYX ASSUMES NO LIABILITY WHATSOEVER, AND NUMONYX DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY, RELATING TO SALE AND/OR USE OF NUMONYX PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A
PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Numonyx
products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.
Numonyx B.V. may make changes to specifications and product descriptions at any time, without notice.
Numonyx B.V. may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented
subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or
otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Numonyx reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
Contact your local Numonyx sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Numonyx literature may be obtained by visiting
Numonyx's website at http://www.numonyx.com.
Numonyx, the Numonyx logo, and StrataFlash are trademarks or registered trademarks of Numonyx B.V. or its subsidiaries in other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007, Numonyx B.V., All Rights Reserved.
Datasheet
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Numonyx™ Embedded Flash Memory (J3 v. D)
Contents
1.0
Introduction .............................................................................................................. 6
1.1
Nomenclature ..................................................................................................... 6
1.2
Acronyms........................................................................................................... 6
1.3
Conventions ....................................................................................................... 7
2.0
Functional Overview .................................................................................................. 8
2.1
Block Diagram .................................................................................................. 10
2.2
Memory Map..................................................................................................... 11
3.0
Package Information ............................................................................................... 12
3.1
56-Lead TSOP Package (32, 64, 128 Mbit) ............................................................ 12
3.2
Easy BGA Package (32, 64, 128 and 256 Mbit) ...................................................... 13
4.0
Ballouts and Signal Descriptions.............................................................................. 15
4.1
Easy BGA Ballout (32/64/128 Mbit) ..................................................................... 15
4.2
56-Lead TSOP Package Pinout (32/64/128 Mbit).................................................... 17
4.3
Signal Descriptions ............................................................................................ 17
5.0
Maximum Ratings and Operating Conditions............................................................ 19
5.1
Absolute Maximum Ratings................................................................................. 19
5.2
Operating Conditions ......................................................................................... 19
5.3
Power Up/Down ................................................................................................ 19
5.3.1 Power-Up/Down Characteristics................................................................ 20
5.3.2 Power Supply Decoupling ........................................................................ 20
5.4
Reset............................................................................................................... 20
6.0
Electrical Characteristics ......................................................................................... 21
6.1
DC Current Specifications ................................................................................... 21
6.2
DC Voltage specifications.................................................................................... 22
6.3
Capacitance...................................................................................................... 22
7.0
AC Characteristics ................................................................................................... 23
7.1
Read Specifications............................................................................................ 23
7.2
Write Specifications ........................................................................................... 27
7.3
Program, Erase, Block-Lock Specifications ............................................................ 29
7.4
Reset Specifications........................................................................................... 29
7.5
AC Test Conditions ............................................................................................ 30
8.0
Bus Interface........................................................................................................... 31
8.1
Bus Reads ........................................................................................................ 32
8.1.1 Asynchronous Page Mode Read ................................................................ 32
8.1.2 Output Disable ....................................................................................... 33
8.2
Bus Writes........................................................................................................ 33
8.3
Standby ........................................................................................................... 34
8.3.1 Reset/Power-Down ................................................................................. 34
8.4
Device Commands............................................................................................. 34
9.0
Flash Operations ..................................................................................................... 36
9.1
Status Register ................................................................................................. 36
9.1.1 Clearing the Status Register .................................................................... 37
9.2
Read Operations ............................................................................................... 37
9.2.1 Read Array ............................................................................................ 37
9.2.2 Read Status Register .............................................................................. 38
9.2.3 Read Device Information ......................................................................... 38
9.2.4 CFI Query ............................................................................................. 38
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Datasheet
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Numonyx™ Embedded Flash Memory (J3 v. D)
9.3
9.4
9.5
9.6
9.7
Programming Operations ....................................................................................38
9.3.1 Single-Word/Byte Programming................................................................39
9.3.2 Buffered Programming ............................................................................39
Block Erase Operations .......................................................................................40
Suspend and Resume .........................................................................................41
Status Signal (STS)............................................................................................42
Security and Protection.......................................................................................43
9.7.1 Normal Block Locking ..............................................................................43
9.7.2 Configurable Block Locking.......................................................................44
9.7.3 OTP Protection Registers..........................................................................44
9.7.4 Reading the OTP Protection Register..........................................................44
9.7.5 Programming the OTP Protection Register ..................................................44
9.7.6 Locking the OTP Protection Register ..........................................................45
9.7.7 VPP/ VPEN Protection ..............................................................................46
10.0 Device Command Codes ...........................................................................................47
11.0 Device ID Codes.......................................................................................................48
12.0 Flow Charts..............................................................................................................49
13.0 Common Flash Interface ..........................................................................................58
13.1 Query Structure Output ......................................................................................58
13.2 Query Structure Overview...................................................................................59
13.3 Block Status Register .........................................................................................60
13.4 CFI Query Identification String ............................................................................60
13.5 System Interface Information ..............................................................................61
13.6 Device Geometry Definition .................................................................................61
13.7 Primary-Vendor Specific Extended Query Table ......................................................62
A
Additional Information.............................................................................................66
B
Ordering Information ...............................................................................................67
Datasheet
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Numonyx™ Embedded Flash Memory (J3 v. D)
Revision History
Date
Revision
Description
July 2005
001
Initial release
002
Changed Marketing name from 28FxxxJ3 to J3 v. D.
Updated the following:
• Table 18, “Command Bus Operations” on page 35
• Section 9.2.2, “Read Status Register” on page 38
• Section 9.3.2, “Buffered Programming” on page 39
• Table 24, “Valid Commands During Suspend” on page 41
Added Table 25, “STS Configuration Register” on page 42.
February 2006
003
Section 5.3.1, “Power-Up/Down Characteristics” on page 20 was modified.
Notes on Table 8, “DC Voltage Characteristics” on page 22 were updated
Table 10, “Read Operations” on page 23 was updated with R16 value
Table 12, “Configuration Performance” on page 29 was updated
Note 1 of Table 26, “STS Configuration Coding Definitions” on page 43 was updated.
February 2007
004
Added 256-Mbit; Updated format.
November 2007
05
September 2005
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Applied Numonyx branding.
Datasheet
5
Numonyx™ Embedded Flash Memory (J3 v. D)
1.0
Introduction
This document contains information pertaining to the Numonyx™ Embedded Flash
Memory (J3 v. D) device features, operation, and specifications.
The Numonyx™ Embedded Flash Memory J3 Version D (J3 v. D) provides improved
mainstream performance with enhanced security features, taking advantage of the
high quality and reliability of the NOR-based Intel* 0.13 µm ETOX™ VIII process
technology. Offered in 128-Mbit (16-Mbyte), 64-Mbit, and 32-Mbit densities, the
Numonyx™ Embedded Flash Memory (J3 v. D) device brings reliable, low-voltage
capability (3 V read, program, and erase) with high speed, low-power operation. The
Numonyx™ Embedded Flash Memory (J3 v. D) device takes advantage of the proven
manufacturing experience and is ideal for code and data applications where high
density and low cost are required, such as in networking, telecommunications, digital
set top boxes, audio recording, and digital imaging. Numonyx Flash Memory
components also deliver a new generation of forward-compatible software support. By
using the Common Flash Interface (CFI) and Scalable Command Set (SCS), customers
can take advantage of density upgrades and optimized write capabilities of future
Numonyx Flash Memory devices.
1.1
AMIN:
AMAX:
Nomenclature
All Densities
AMIN = A0 for x8
All Densities
AMIN = A1 for x16
32 Mbit
AMAX = A21
64 Mbit
AMAX = A22
128 Mbit
AMAX = A23
Block:
A group of flash cells that share common erase circuitry and erase simultaneously
Clear:
Indicates a logic zero (0)
Program:
To write data to the flash array
Set:
Indicates a logic one (1)
VPEN:
Refers to a signal or package connection name
VPEN :
Refers to timing or voltage levels
1.2
Acronyms
CUI:
Command User Interface
OTP:
One Time Programmable
PLR:
Protection Lock Register
PR:
Protection Register
PRD:
Protection Register Data
RFU:
Reserved for Future Use
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Numonyx™ Embedded Flash Memory (J3 v. D)
SR:
Status Register
SRD:
Status Register Data
WSM:
Write State Machine
ECR:
Enhanced Configuration Register
1.3
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Conventions
h:
Hexadecimal Affix
k (noun):
1,000
M (noun):
1,000,000
Nibble
4 bits
Byte:
8 bits
Word:
16 bits
Kword:
1,024 words
Kb:
1,024 bits
KB:
1,024 bytes
Mb:
1,048,576 bits
MB:
1,048,576 bytes
Brackets:
Square brackets ([]) will be used to designate group membership or to
define a group of signals with similar function (i.e. A[21:1], SR[4,1]
and D[15:0]).
00FFh:
Denotes 16-bit hexadecimal numbers
00FF 00FFh:
Denotes 32-bit hexadecimal numbers
DQ[15:0]:
Data I/O signals
Datasheet
7
Numonyx™ Embedded Flash Memory (J3 v. D)
2.0
Functional Overview
The Numonyx™ Embedded Flash Memory (J3 v. D) family contains high-density
memory organized in any of the following configurations:
• 32 Mbytes or 16 Mword (256-Mbit), organized as two-hundred-fifty-six 128-Kbyte
(131,072 bytes) erase blocks- Users should be aware that this density is not
offered in a monolithic part and the device is made up of 2x128-Mb devices.
• 16 Mbytes or 8 Mword (128-Mbit), organized as one-hundred-twenty-eight 128Kbyte erase blocks
• 8 Mbytes or 4 Mword (64-Mbit), organized as sixty-four 128-Kbyte erase blocks
• 4 Mbytes or 2 Mword (32-Mbit), organized as thirty-two 128-Kbyte erase blocks
These devices can be accessed as 8- or 16-bit words. See Figure 1, “Memory Block
Diagram (32, 64 and 128 Mbit)” on page 10 for further details.
A 128-bit Protection Register has multiple uses, including unique flash device
identification.
The Numonyx™ Embedded Flash Memory (J3 v. D) device includes new security
features that were not available on the (previous) 0.25µm and 0.18µm versions of the
J3 family. These new security features prevent altering of code through different
protection schemes that can be implemented, based on user requirements.
The Numonyx™ Embedded Flash Memory (J3 v. D) device optimized architecture and
interface dramatically increases read performance by supporting page-mode reads.
This read mode is ideal for non-clock memory systems.
A Common Flash Interface (CFI) permits software algorithms to be used for entire
families of devices. This allows device-independent, JEDEC ID-independent, and
forward- and backward-compatible software support for the specified flash device
families. Flash vendors can standardize their existing interfaces for long-term
compatibility.
Scalable Command Set (SCS) allows a single, simple software driver in all host systems
to work with all SCS-compliant flash memory devices, independent of system-level
packaging (e.g., memory card, SIMM, or direct-to-board placement). Additionally, SCS
provides the highest system/device data transfer rates and minimizes device and
system-level implementation costs.
A Command User Interface (CUI) serves as the interface between the system processor
and internal operation of the device. A valid command sequence written to the CUI
initiates device automation. An internal Write State Machine (WSM) automatically
executes the algorithms and timings necessary for block erase, program, and lock-bit
configuration operations.
A block erase operation erases one of the device’s 128-Kbyte blocks typically within one
second, independent of other blocks. Each block can be independently erased 100,000
times. Block erase suspend mode allows system software to suspend block erase to
read or program data from any other block. Similarly, program suspend allows system
software to suspend programming (byte/word program and write-to-buffer operations)
to read data or execute code from any other block that is not being suspended.
Each device incorporates a Write Buffer of 32 bytes (16 words) to allow optimum
programming performance. By using the Write Buffer, data is programmed in buffer
increments.
Datasheet
8
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Numonyx™ Embedded Flash Memory (J3 v. D)
Blocks are selectively and individually lockable in-system. Individual block locking uses
block lock-bits to lock and unlock blocks. Block lock-bits gate block erase and program
operations. Lock-bit configuration operations set and clear lock-bits (using the Set
Block Lock-Bit and Clear Block Lock-Bits commands).
The Status Register indicates when the WSM’s block erase, program, or lock-bit
configuration operation is finished.
The STS (STATUS) output gives an additional indicator of WSM activity by providing
both a hardware signal of status (versus software polling) and status masking
(interrupt masking for background block erase, for example). Status indication using
STS minimizes both CPU overhead and system power consumption. When configured in
level mode (default mode), it acts as a RY/BY# signal. When low, STS indicates that the
WSM is performing a block erase, program, or lock-bit configuration. STS-high indicates
that the WSM is ready for a new command, block erase is suspended (and
programming is inactive), program is suspended, or the device is in reset/power-down
mode. Additionally, the configuration command allows the STS signal to be configured
to pulse on completion of programming and/or block erases.
Three CE signals are used to enable and disable the device. A unique CE logic design
reduces decoder logic typically required for multi-chip designs. External logic is not
required when designing a single chip, a dual chip, or a 4-chip miniature card or SIMM
module.
The BYTE# signal allows either x8 or x16 read/writes to the device:
• BYTE#-low enables 8-bit mode; address A0 selects between the low byte and high
byte.
• BYTE#-high enables16-bit operation; address A1 becomes the lowest order
address and address A0 is not used (don’t care).
Figure 1, “Memory Block Diagram (32, 64 and 128 Mbit)” on page 10 shows a device
block diagram.
When the device is disabled, with CEx at VIH and RP# at VIH, the standby mode is
enabled. When RP# is at VIL, a further power-down mode is enabled which minimizes
power consumption and provides write protection during reset. A reset time (tPHQV) is
required from RP# going high until data outputs are valid. Likewise, the device has a
wake time (tPHWL) from RP#-high until writes to the CUI are recognized. With RP# at
VIL, the WSM is reset and the Status Register is cleared. (see Table 15, “Chip Enable
Truth Table” on page 31).
November 2007
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Datasheet
9
Numonyx™ Embedded Flash Memory (J3 v. D)
2.1
Block Diagram
Figure 1:
Memory Block Diagram (32, 64 and 128 Mbit)
DQ0 - DQ15
Output
Buffer
Input Buffer
Query
A0 - A2
32-Mbit: A0 - A21
64-Mbit: A0 - A22
128-Mbit: A0 - A23
Input Buffer
Address
Latch
Status
Register
Data
Comparator
Y-Decoder
Write Buffer
Identifier
Register
VCC
I/O Logic
Data
Registe r
Output
Latch/Multi pl exer
VCCQ
Command
User
Interface
BYTE#
CE
Logic
Multiplexer
Y-Gating
Write State
Machine
32-Mbit: Thirty-two
64-Mbit: Sixty-four
128-Mbit: One-hundred
twenty -eight
X-Decoder
CE0
CE1
CE2
WE#
OE#
RP#
STS
Program/Erase
Voltage Switch
V PEN
VCC
GND
Address
Counter
Figure 2:
128-Kbyte Blocks
Numonyx™ Embedded Flash Memory (J3 v. D) Memory Block Diagram (256
Mbit)
Vcc
A24
28F128J3
CE1
CE#
Upper Address
CE0 Device
D[15-0]
A[23-A0]
A[23-A0]
D[15-0]
CE2
28F128J3
CE1
Lower Address
CE0 Device
D[15-0]
A[23-A0]
Datasheet
10
CE2
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Numonyx™ Embedded Flash Memory (J3 v. D)
2.2
Memory Map
Numonyx™ Embedded Flash Memory (J3 v. D) Memory Map
0FFFFFF
0FE0000
07FFFFF
07E0000
03FFFFF
03E0000
003FFFF
0020000
001FFFF
0000000
FFFFFF
255
7FFFFF
128-Kbyte Block
127
128-Kbyte Block
63
128-Kbyte Block
31
128-Kbyte Block
1
128-Kbyte Block
0
7F0000
3FFFFF
3F0000
1FFFFF
1F0000
01FFFF
010000
00FFFF
Byte-Wide (x8) Mode
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FF0000
000000
64-Kword Block
255
64-Kword Block
127
64-Kword Block
63
64-Kword Block
31
64-Kword Block
1
64-Kword Block
0
256-Mbit
1FE0000
128-Kbyte Block
1 28-Mbit
1FFFFFF
A[24-1]: 256 Mbit
A [23-1]: 128 Mbit
A [22-1]: 64 Mbit
A [21-1]: 32 Mbit
64-Mbit
A[24-0]: 256 Mbit
A [23-0]:128 Mbit
A [22-0]: 64 Mbit
A [21-0]: 32 Mbit
32-Mbit
Figure 3:
Word Wide (x16) Mode
Datasheet
11
Numonyx™ Embedded Flash Memory (J3 v. D)
3.0
Package Information
3.1
56-Lead TSOP Package (32, 64, 128 Mbit)
Figure 4:
56-Lead TSOP Package Mechanical
Z
See Notes 1 and 3
A2
See Note 2
Pin 1
e
See Detail B
E
Y
D1
A1
D
Seating
Plane
See Detail A
A
Detail A
Detail B
C
0
b
L
Notes:
1.
One dimple on package denotes Pin 1.
2.
If two dimples, then the larger dimple denotes Pin 1.
3.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
Table 1:
56-Lead TSOP Dimension Table
Millimeters
Parameter
Inches
Symbol
Min
Nom
Max
Min
Nom
A
Standoff
A1
0.050
Package Body Thickness
A2
0.965
0.995
1.025
0.038
0.039
0.040
Lead Width
b
0.100
0.150
0.200
0.004
0.006
0.008
Lead Thickness
1.200
Max
Package Height
0.047
0.002
c
0.100
0.150
0.200
0.004
0.006
0.008
Package Body Length
D1
18.200
18.400
18.600
0.717
0.724
0.732
Package Body Width
E
13.800
14.000
14.200
0.543
0.551
0.559
Lead Pitch
e
Terminal Dimension
D
19.800
20.00
20.200
0.780
0.787
0.795
Lead Tip Length
L
0.500
0.600
0.700
0.020
0.024
0.028
Datasheet
12
0.500
0.0197
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Numonyx™ Embedded Flash Memory (J3 v. D)
Table 1:
56-Lead TSOP Dimension Table
Millimeters
Parameter
Min
Lead Count
N
Lead Tip Angle
q
Seating Plane Coplanarity
Y
Lead to Package Offset
Z
3.2
Figure 5:
Inches
Symbol
Nom
Max
Min
Nom
56
0°
56
3°
5°
0°
3°
5°
0.100
0.150
Max
0.250
0.004
0.350
0.006
0.010
0.014
Easy BGA Package (32, 64, 128 and 256 Mbit)
Easy BGA Mechanical Specifications
Ball A1
Corner
Ball A1
Corner
D
1
2
3
4
S1
5
6
7
8
8
A
A
B
B
C
C
D
7
6
5
4
3
2
1
S2
D
E
E
E
F
F
G
G
H
H
e
b
Bottom View - Ball Side Up
Top View - Plastic Backside
Complete Ink Mark Not Shown
A1
A2
A
Seating
Y
Plane
Table 2:
Easy BGA Package Dimensions Table (Sheet 1 of 2)
Millimeters
Parameter
Package Height (32, 64, 128- Mbit)
Symb
ol
Nom
A
Package Height (256- Mbit)
A
Ball Height
A1
Package Body Thickness (32, 64, 128- Mbit)
A2
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Min
Max
Inches
Note
s
Min
Nom
1.200
0.0472
1.300
0.250
Max
0.0512
0.0098
0.780
0.0307
Datasheet
13
Numonyx™ Embedded Flash Memory (J3 v. D)
Table 2:
Easy BGA Package Dimensions Table (Sheet 2 of 2)
Millimeters
Parameter
Symb
ol
Min
Nom
Max
Inches
Note
s
Min
0.910
Nom
Max
Package Body Thickness (256- Mbit)
A2
0.0358
Ball (Lead) Width
b
0.330
0.430
0.530
0.0130
0.0169
0.0209
Package Body Width
D
9.900
10.000
10.100
1
0.3898
0.3937
0.3976
Package Body Length
E
12.900
13.000
13.100
1
0.5079
0.5118
0.5157
Pitch
[e]
1.000
Ball (Lead) Count
N
64
Seating Plane Coplanarity
Y
Corner to Ball A1 Distance Along D (32/64/128
Mb)
S1
1.400
1.500
1.600
1
0.0551
0.0591
0.0630
Corner to Ball A1 Distance Along E (32/64/128
Mb)
S2
2.900
3.000
3.100
1
0.1142
0.1181
0.1220
0.0394
64
0.100
0.0039
Notes:
1.
For Daisy Chain Evaluation Unit information refer to the Numonyx Flash Memory Packaging Technology Web page at:
www.Numonyx.com/design/packtech/index.htm
2.
For Packaging Shipping Media information refer to the Numonyx Flash Memory Packaging Technology Web page at:
www.Numonyx.com/design/packtech/index.htm
Datasheet
14
November 2007
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Numonyx™ Embedded Flash Memory (J3 v. D)
4.0
Ballouts and Signal Descriptions
Numonyx™ Embedded Flash Memory (J3 v. D) is available in two package types. All
densities of the Numonyx™ Embedded Flash Memory (J3 v. D) are supported on both
64-ball Easy BGA and 56-lead Thin Small Outline Package (TSOP) packages, except the
256 Mbit density that is available only in Easy BGA. Figure 6, Figure 7 and Figure 8
show the ballouts.
4.1
Easy BGA Ballout (32/64/128 Mbit)
Figure 6:
Easy BGA Ballout (32/64/128 Mbit)
1
2
3
4
5
6
7
8
8
7
6
5
4
3
2
1
A1
A6
A8
VPEN
A13
VCC
A18
A22
A22
A18
VCC
A13
VPEN
A8
A6
A1
A2
VSS
A9
CE0#
A14
RFU
A19
CE1#
CE1#
A19
RFU
A14
CE0#
A9
VSS
A2
A3
A7
A10
A12
A15
RFU
A20
A21
A21
A20
RFU
A15
A12
A10
A7
A3
A4
A5
A11
RP#
RFU
RFU
A16
A17
A17
A16
RFU
RFU
RP#
A11
A5
A4
D8
D1
D9
D3
D4
RFU
D15
STS
STS
D15
RFU
D4
D3
D9
D1
D8
BYTE#
D0
D10
D11
D12
RFU
RFU
OE#
OE#
RFU
RFU
D12
D11
D10
D0
BYTE#
A23
A0
D2
VCCQ
D5
D6
D14
WE#
WE#
D14
D6
D5
VCCQ
D2
A0
A23
CE2#
RFU
VCC
VSS
D13
VSS
D7
RFU
RFU
D7
VSS
D13
VSS
VCC
RFU
CE2#
A
A
B
B
C
C
D
D
E
E
F
F
G
G
H
H
Intel® Embedded Flash Memory (J3 v. D)
Easy BGA
Top View- Ball side down
32/64/128 Mbit
Intel® Embedded Flash Memory (J3 v. D)
Easy BGA
Bottom View- Ball side up
32/64/128 Mbit
Notes:
1.
Address A22 is only valid on 64-Mbit densities and above, otherwise, it is a no connect (NC).
2.
Address A23 is only valid on 128-Mbit densities and above, otherwise, it is a no connect (NC).
November 2007
308551-05
Datasheet
15
Numonyx™ Embedded Flash Memory (J3 v. D)
Figure 7:
Easy BGA Ballout (256 Mbit)
1
2
3
4
5
6
7
8
8
7
6
5
4
3
2
1
A1
A6
A8
VPEN
A13
VCC
A18
A22
A22
A18
VCC
A13
VPEN
A8
A6
A1
A2
VSS
A9
CE#
A14
RFU
A19
NC
NC
A19
RFU
A14
CE#
A9
VSS
A2
A3
A7
A10
A12
A15
RFU
A20
A21
A21
A20
RFU
A15
A12
A10
A7
A3
A4
A5
A11
RP#
RFU
RFU
A16
A17
A17
A16
RFU
RFU
RP#
A11
A5
A4
D8
D1
D9
D3
D4
RFU
D15
STS
STS
D15
RFU
D4
D3
D9
D1
D8
D0
D10
D11
D12
RFU
RFU
OE#
OE#
RFU
RFU
D12
D11
D10
D0
BYTE#
A23
A0
D2
VCCQ
D5
D6
D14
WE#
WE#
D14
D6
D5
VCCQ
D2
A0
A23
NC
RFU
VCC
VSS
D13
VSS
D7
A24
A24
D7
VSS
D13
VSS
VCC
RFU
NC
A
A
B
B
C
C
D
D
E
E
F
F
BYTE#
G
G
H
H
Intel® Embedded Flash Memory (J3 v. D)
Easy BGA
Top View- Ball side down
256 Mbit
Datasheet
16
Intel® Embedded Flash Memory (J3 v. D)
Easy BGA
Bottom View- Ball side up
256 Mbit
November 2007
308551-05
Numonyx™ Embedded Flash Memory (J3 v. D)
4.2
Figure 8:
56-Lead TSOP Package Pinout (32/64/128 Mbit)
56-Lead TSOP Package Pinout (32/64/128 Mbit)
A22
CE1
A21
A20
A19
A18
A17
A16
VCC
A15
A14
A13
A12
CE0
VPEN
RP#
A11
A10
A9
A8
GND
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Intel® Embedded Flash Memory
(28FXXXJ3D)
56-Lead TSOP
Standard Pinout
14 mm x 20 mm
Top View
32/64/128 Mbit
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
RFU
WE#
OE#
STS
DQ15
DQ7
DQ14
DQ6
GND
DQ13
DQ5
DQ12
DQ4
VCCQ
GND
DQ11
DQ3
DQ10
DQ2
VCC
DQ9
DQ1
DQ8
DQ0
A0
BYTE#
A23
CE2
Notes:
1.
A22 exists on 64- and 128- densities. On 32-Mbit density this signal is a no-connect (NC).
2.
A23 exists on 128-Mbit densities. On 32- and 64-Mbit densities this signal is a no-connect (NC)
4.3
Signal Descriptions
Table 3 lists the active signals used on Numonyx™ Embedded Flash Memory (J3 v. D)
and provides a description of each.
Table 3:
Signal Descriptions for Numonyx™ Embedded Flash Memory (J3 v. D) (Sheet 1
of 2)
Symbol
Type
Name and Function
A0
Input
BYTE-SELECT ADDRESS: Selects between high and low byte when the device is in x8 mode. This
address is latched during a x8 program cycle. Not used in x16 mode (i.e., the A0 input buffer is
turned off when BYTE# is high).
A[MAX:1]
Input
ADDRESS INPUTS: Inputs for addresses during read and program operations. Addresses are
internally latched during a program cycle:
32-Mbit — A[21:1]
64-Mbit— A[22:1]
128-Mbit — A[23:1]
256-Mbit — A[24:1] A24 acts as a virtual CE for the two devices. A24 at VIL selects the lower die
and A24 at VIH selects the upper die.
D[7:0]
Input/
Output
November 2007
308551-05
LOW-BYTE DATA BUS: Inputs data during buffer writes and programming, and inputs commands
during CUI writes. Outputs array, CFI, identifier, or status data in the appropriate read mode. Data
is internally latched during write operations.
Datasheet
17
Numonyx™ Embedded Flash Memory (J3 v. D)
Table 3:
Signal Descriptions for Numonyx™ Embedded Flash Memory (J3 v. D) (Sheet 2
of 2)
Symbol
Type
D[15:8]
Input/
Output
Name and Function
HIGH-BYTE DATA BUS: Inputs data during x16 buffer writes and programming operations.
Outputs array, CFI, or identifier data in the appropriate read mode; not used for Status Register
reads. Data is internally latched during write operations in x16 mode. D[15-8] float in x8 mode
CE[2:0]
Input
CHIP ENABLE: Activate the 32-, 64- and 128 Mbit devices’ control logic, input buffers, decoders,
and sense amplifiers. When the device is de-selected, power reduces to standby levels.
All timing specifications are the same for these three signals. Device selection occurs with the first
edge of CE0, CE1, or CE2 that enables the device. Device deselection occurs with the first edge of
CE0, CE1, or CE2 that disables the device.
CE#
Input
CHIP ENABLE: Activates the 256Mbit devices’ control logic, input buffers, decoders, and sense
amplifiers.
Device selection occurs with the first edge of CE# that enables the device. Device deselection
occurs with the first edge of CE# that disables the device.s
RP#
Input
RESET: RP#-low resets internal automation and puts the device in power-down mode. RP#-high
enables normal operation. Exit from reset sets the device to read array mode. When driven low,
RP# inhibits write operations which provides data protection during power transitions.
OE#
Input
OUTPUT ENABLE: Activates the device’s outputs through the data buffers during a read cycle.
OE# is active low.
WE#
Input
WRITE ENABLE: Controls writes to the CUI, the Write Buffer, and array blocks. WE# is active low.
Addresses and data are latched on the rising edge of WE#.
STS
Open Drain
Output
BYTE#
Input
BYTE ENABLE: BYTE#-low places the device in x8 mode; data is input or output on D[7:0], while
D[15:8] is placed in High-Z. Address A0 selects between the high and low byte. BYTE#-high places
the device in x16 mode, and turns off the A0 input buffer. Address A1 becomes the lowest-order
address bit.
VPEN
Input
ERASE / PROGRAM / BLOCK LOCK ENABLE: For erasing array blocks, programming data, or
configuring lock-bits.
With VPEN ≤ VPENLK, memory contents cannot be altered.
VCC
Power
CORE Power Supply: Core (logic) source voltage. Writes to the flash array are inhibited when VCC
≤ VLKO .
Caution: Device operation at invalid Vcc voltages should not be attempted.
VCCQ
Power
I/O Power Supply: Power supply for Input/Output buffers.This ball can be tied directly to VCC .
GND
Supply
Ground: Ground reference for device logic voltages. Connect to system ground.
NC
—
No Connect: Lead is not internally connected; it may be driven or floated.
RFU
—
Reserved for Future Use: Balls designated as RFU are reserved by Numonyx for future device
functionality and enhancement.
Datasheet
18
STATUS: Indicates the status of the internal state machine. When configured in level mode
(default), it acts as a RY/BY# signal. When configured in one of its pulse modes, it can pulse to
indicate program and/or erase completion. STS is to be tied to VCCQ with a pull-up resistor.
November 2007
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Numonyx™ Embedded Flash Memory (J3 v. D)
5.0
Maximum Ratings and Operating Conditions
5.1
Absolute Maximum Ratings
Warning:
Stressing the device beyond the “Absolute Maximum Ratings” may cause permanent
damage. These are stress ratings only.
NOTICE: This document contains information available at the time of its release. The specifications
are subject to change without notice. Verify with your local Numonyx sales office that you have the
latest datasheet before finalizing a design.
Table 4:
Absolute Maximum Ratings
Parameter
Min
Max
Unit
Notes
Temperature under Bias Expanded (TA, Ambient)
–40
+85
°C
—
Storage Temperature
–65
+125
°C
—
VCC Voltage
–2.0
+5.6
V
2
VCCQ
–2.0
+5.6
V
2
Voltage on any input/output signal (except VCC, VCCQ)
–2.0
VCCQ (max) + 2.0
V
1
—
100
mA
3
ISH Output Short Circuit Current
Notes:
1.
Voltage is referenced to VSS. During infrequent non-periodic transitions, the voltage potential between VSS and input/
output pins may undershoot to –2.0 V for periods < 20 ns or overshoot to VCCQ (max) + 2.0 V for periods < 20 ns.
2.
During infrequent non-periodic transitions, the voltage potential between VCC and the supplies may undershoot to –2.0
V for periods < 20 ns or VSUPPLY (max) + 2.0 V for periods < 20 ns.
3.
Output shorted for no more than one second. No more than one output shorted at a time
5.2
Operating Conditions
Warning:
Operation beyond the “Operating Conditions” is not recommended and extended
exposure beyond the “Operating Conditions” may affect device reliability
Table 5:
Temperature and VCC Operating Condition of Numonyx™ Embedded Flash
Memory (J3 v. D)
Symbol
Parameter
TA
Min
Max
Unit
Test Condition
-40.0
+85
°C
Ambient Temperature
VCC
VCC Supply Voltage
2.70
3.6
V
—
VCCQ
VCCQ Supply Voltage
2.70
3.6
V
5.3
—
Power Up/Down
This section provides an overview of system level considerations with regards to the
flash device. It includes a brief description of power-up, power-down and decoupling
design considerations.
November 2007
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Datasheet
19
Numonyx™ Embedded Flash Memory (J3 v. D)
5.3.1
Power-Up/Down Characteristics
To prevent conditions that could result in spurious program or erase operations, the
power-up/power-down sequence shown in here is recommended. Note that each power
supply must reach its minimum voltage range before applying/removing the next
supply voltage.
Table 6:
Power-Up/Down Sequence
Power Supply
Voltage
VCC(min)
Power-UpSequence
1st
VCCQ(min)
2nd
VPEN(min)
3rd
Note:
1st
2nd†
1st†
Power-Down Sequence
3rd
Sequencing not
required†
2nd
2nd
1st
2nd
1st†
2nd†
Sequencing not
required†
1st
† Power supplies connected or sequenced together.
Device inputs must not be driven until all supply voltages reach their minimum range.
RP# should be low during power transitions.
5.3.2
Power Supply Decoupling
When the device is enabled, many internal conditions change. Circuits are energized,
charge pumps are switched on, and internal voltage nodes are ramped. All of this
internal activities produce transient signals. The magnitude of the transient signals
depends on the device and system loading. To minimize the effect of these transient
signals, a 0.1 µF ceramic capacitor is required across each VCC/VSS and VCCQ signal.
Capacitors should be placed as close as possible to device connections.
Additionally, for every eight flash devices, a 4.7 µF electrolytic capacitor should be
placed between VCC and VSS at the power supply connection. This 4.7 µF capacitor
should help overcome voltage slumps caused by PCB (printed circuit board) trace
inductance.
5.4
Reset
By holding the flash device in reset during power-up and power-down transitions,
invalid bus conditions may be masked. The flash device enters reset mode when RP# is
driven low. In reset, internal flash circuitry is disabled and outputs are placed in a highimpedance state. After return from reset, a certain amount of time is required before
the flash device is able to perform normal operations. After return from reset, the flash
device defaults to asynchronous page mode. If RP# is driven low during a program or
erase operation, the program or erase operation will be aborted and the memory
contents at the aborted block or address are no longer valid. See Figure 16, “AC
Waveform for Reset Operation” on page 29 for detailed information regarding reset
timings.
Datasheet
20
November 2007
308551-05
Numonyx™ Embedded Flash Memory (J3 v. D)
6.0
Electrical Characteristics
6.1
DC Current Specifications
Table 7:
DC Current Characteristics
Symbol
VCCQ
2.7 - 3.6V
V CC
2.7 - 3.6V
Parameter
Typ
ILI
Input and VPEN Load Current
ILO
Output Leakage Current
32, 64, 128 Mbit
ICCS
ICCD
VCC Standby Current
Test Conditions
Max
Unit
±1
μA
VCC = VCC Max; VCCQ = VCCQ Max
VIN = VCCQ or VSS
1
±10
μA
VCC = VCC Max; VCCQ = VCCQ Max
VIN = VCCQ or VSS
1
μA
CMOS Inputs, VCC = VCC Max; Vccq =
VccqMax
Device is disabled RP# = VCCQ ± 0.2 V
mA
TTL Inputs, VCC = VCC Max,
Vccq = VccqMax
Device is disabled, RP# = VIH
50
120
256 Mbit
100
240
32, 64, 128 Mbit
0.71
2
256 Mbit
1.42
4
50
120
μA
RP# = GND ± 0.2 V, IOUT (STS) = 0 mA
15
20
mA
CMOS Inputs, VCC = VCC Max, VCCQ = VCCQ
Max
Device is enabled f = 5 MHz, IOUT = 0 mA
24
29
mA
CMOS Inputs,VCC = VCC Max, VCCQ = VCCQ
Max
Device is enabled f = 33 MHz, IOUT = 0 mA
10
15
mA
CMOS Inputs, VCC = VCC Max, VCCQ = VCCQ
Max using standard 8 word page mode
reads.
Device is enabled f = 5 MHz, IOUT = 0 mA
30
54
mA
CMOS Inputs,VCC = VCC Max, VCCQ = VCCQ
Max using standard 8 word page mode
reads.
Device is enabled f = 33 MHz, IOUT = 0 mA
VCC Power-Down Current
4-Word
Page
ICCR
VCC Page Mode Read Current
8-Word Page
ICCW
VCC Program or Set
Lock-Bit Current
ICCE
VCC Block Erase or
Clear Block Lock-Bits
Current
ICCWS
ICCES
VCC Program
Suspend or Block
Erase Suspend
Current
Notes
35
60
mA
CMOS Inputs, VPEN = VCC
40
70
mA
TTL Inputs, VPEN = VCC
35
70
mA
CMOS Inputs, VPEN = VCC
40
80
mA
TTL Inputs, VPEN = VCC
10
mA
Device is enabled
1,2,3
1,3
1,4
1,4
1,5
Notes:
1.
All currents are in RMS unless otherwise noted. These currents are valid for all product versions (packages and
speeds). Contact Numonyx’s Application Support Hotline or your local sales office for information about typical
specifications.
2.
Includes STS.
3.
CMOS inputs are either VCC ± 0.2 V or GND ± 0.2 V. TTL inputs are either VIL or VIH.
4.
Sampled, not 100% tested.
5.
ICCWS and ICCES are specified with the device selected. If the device is read or written while in erase suspend
mode, the device’s current draw is ICCR and ICCWS.
November 2007
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Datasheet
21
Numonyx™ Embedded Flash Memory (J3 v. D)
6.2
DC Voltage specifications
Table 8:
DC Voltage Characteristics
Symbol
VCCQ
2.7 - 3.6 V
V CC
2.7 - 3.6 V
Parameter
Test Conditions
Min
Max
Unit
VIL
Input Low Voltage
–0.5
0.8
V
VIH
Input High Voltage
2.0
VCCQ + 0.5V
V
0.4
2, 5, 6
2, 5, 6
V
VCC = VCC Min
VCCQ = VCCQ Min
IOL = 2 mA
V
VCC = VCC Min
VCCQ = VCCQ Min
IOL = 100 µA
V
VCC = VCCMIN
VCCQ = VCCQ Min
IOH = –2.5 mA
V
VCC = VCCMIN
VCCQ = VCCQ Min
IOH = –100 µA
Output Low Voltage
VOL
0.2
0.85 × VCCQ
Output High Voltage
VOH
VCCQ – 0.2
VPENLK
VPEN Lockout during Program,
Erase and Lock-Bit Operations
VPENH
VPEN during Block Erase, Program,
or Lock-Bit Operations
2.7
VLKO
VCC Lockout Voltage
2.0
Notes
1, 2
1, 2
2.2
V
2, 3
3.6
V
3
V
4
Notes:
1.
Includes STS.
2.
Sampled, not 100% tested.
3.
Block erases, programming, and lock-bit configurations are inhibited when VPEN ≤ VPENLK, and not guaranteed
in the range between VPENLK (max) and VPENH (min), and above VPENH (max).
4.
Block erases, programming, and lock-bit configurations are inhibited when VCC < VLKO, and not guaranteed in
the range between VLKO (min) and VCC (min), and above VCC (max).
5.
Includes all operational modes of the device including standby and power-up sequences
6.
Input/Output signals can undershoot to -1.0v referenced to VSS and can overshoot to VCCQ = 1.0v for
duration of 2ns or less, the VCCQ valid range is referenced to VSS.
6.3
Capacitance
Table 9:
Numonyx™ Embedded Flash Memory (J3 v. D) Capacitance
Parameter1
Symbol
CIN
Input Capacitance
COUT
Output Capacitance
Type
Max
Unit
32, 64, 128 Mb
6
8
pF
256 Mb
12
16
32, 64, 128 Mb
8
12
256 Mb
16
24
pF
Condition2
VIN = 0.0 V
VOUT = 0.0 V
Notes:
1.
sampled. not 100% tested.
2.
TA = +25 °C, f = 1 MHZ
Datasheet
22
November 2007
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Numonyx™ Embedded Flash Memory (J3 v. D)
7.0
AC Characteristics
Timing symbols used in the timing diagrams within this document conform to the
following convention:
Figure 9:
Timing Signal Naming Convention
t
E L Q V
Source Signal
Source State
Target State
Target Signal
Figure 10: Timing Signal Name Decoder
Signal
Address
Code
State
Code
A
High
Data - Read
Q
Low
L
Data - Write
D
High-Z
Z
Chip Enable (CE#)
E
Low-Z
X
Output Enable (OE#)
G
Valid
V
Write Enable (WE#)
W
Invalid
I
Address Valid (ADV#)
V
Reset (RST#)
P
Clock (CLK)
C
WAIT
T
H
Note:
Exceptions to this convention include tACC and tAPA. tACC is a generic timing symbol
that refers to the aggregate initial-access delay as determined by tAVQV, tELQV, and
tGLQV (whichever is satisfied last) of the flash device. tAPA is specified in the flash
device’s data sheet, and is the address-to-data delay for subsequent page-mode reads.
7.1
Read Specifications
Table 10: Read Operations (Sheet 1 of 2)
Asynchronous Specifications VCC = 2.7 V–3.6 V (3) and VCCQ = 2.7 V–3.6 V(3)
#
R1
Sym
tAVAV
November 2007
308551-05
Parameter
Read/Write Cycle Time
Density
Min
32 Mbit
75
64 Mbit
75
128 Mbit
75
256 Mbit
95
Max
Unit
Notes
1,2
ns
1,2
1,2
1,2
Datasheet
23
Numonyx™ Embedded Flash Memory (J3 v. D)
Table 10: Read Operations (Sheet 2 of 2)
Asynchronous Specifications VCC = 2.7 V–3.6 V (3) and VCCQ = 2.7 V–3.6 V(3)
#
Sym
Parameter
Density
Min
32 Mbit
R2
tAVQV
Address to Output Delay
R3
tELQV
CEX to Output Delay
R4
tGLQV
OE# to Non-Array Output Delay
R5
tPHQV
RP# High to Output Delay
Max
Unit
75
64 Mbit
75
128 Mbit
75
Notes
1,2
ns
1,2
1,2
256 Mbit
95
1,2
32 Mbit
75
1,2
64 Mbit
75
128 Mbit
75
256 Mbit
95
25
32 Mbit
150
64 Mbit
180
128 Mbit
210
256 Mbit
210
ns
1,2
1,2
1,2
ns
1,2,4
1,2
ns
1,2
1,2
1,2
R6
tELQX
CEX to Output in Low Z
0
ns
1,2,5
R7
tGLQX
OE# to Output in Low Z
0
ns
1,2,5
R8
tEHQZ
CEX High to Output in High Z
25
ns
1,2,5
R9
tGHQZ
OE# High to Output in High Z
15
ns
1,2,5
R10
tOH
Output Hold from Address, CEX, or OE#
Change, Whichever Occurs First
ns
1,2,5
R11
tELFL/tELFH
CEX Low to BYTE# High or Low
ns
1,2,5
R12
tFLQV/tFHQV
BYTE# to Output Delay
1
µs
1,2
R13
tFLQZ
BYTE# to Output in High Z
1
µs
1,2,5
R14
tEHEL
CEx High to CEx Low
R15
tAPA
Page Address Access Time
R16
tGLQV
OE# to Array Output Delay
All
0
10
All
All
0
ns
1,2,5
25
ns
5, 6
25
ns
1,2,4
Notes:
1.
CEX low is defined as the first edge of CE0, CE1, CE2 or CE# that enables the device. CEX high is defined at the first edge
of CE0, CE1, CE2 or CE# that disables the device.
2.
See AC Input/Output Reference Waveforms for the maximum allowable input slew rate.
3.
OE# may be delayed up to tELQV-tGLQV after the first edge of CE0, CE1, CE2 or CE# that enables the device without impact
on tELQV.
4.
See Figure 17, “AC Input/Output Reference Waveform” on page 30 and Figure 18, “Transient
Equivalent Testing Load Circuit” on page 30 for testing characteristics.
5.
Sampled, not 100% tested.
6.
For devices configured to standard word/byte read mode, R15 (tAPA) will equal R2 (tAVQV).
Datasheet
24
November 2007
308551-05
Numonyx™ Embedded Flash Memory (J3 v. D)
Figure 11: Single Word Asynchronous Read Waveform
R1
R2
Address [A]
R3
R8
CEx [E]
R9
OE# [G]
WE# [W]
R4
R16
R7
R6
R10
Data [D/Q]
R12
R11
R13
BYTE#[F]
R5
RP# [P]
Notes:
1.
CEX low is defined as the last edge of CE0, CE1, or CE2 that enables the device. CEX high is defined at the first edge of
CE0, CE1, or CE2 that disables the device.
2.
When reading the flash array a faster tGLQV (R16) applies. For non-array reads, R4 applies (i.e., Status Register reads,
query reads, or device identifier reads).
Figure 12: 4-Word Asynchronous Page Mode Read Waveform
R1
R2
A[MAX:3] [A]
A[2:1] [A]
00
01
10
11
R3
CEx [E]
R4
OE# [G]
WE# [W]
R6
R7
D[15:0] [Q]
R8
R10
R9
R10
R15
1
2
3
4
R5
RP# [P]
Note:
CEX low is defined as the last edge of CE0, CE1, or CE2 that enables the device. CEX high is defined at the first edge of
CE0, CE1, or CE2 that disables the device.
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Numonyx™ Embedded Flash Memory (J3 v. D)
Figure 13: 8-Word Asynchronous Page Mode Read
R1
R2
A[MAX:4] [A]
A[3:1] [A]
R3
CEx [E]
R4
OE# [G]
WE# [W]
R6
R7
D[15:0] [Q]
R10
R8
R9
R10
1
R15
2
7
8
R5
RP# [P]
BYTE#
Notes:
1.
CEX low is defined as the last edge of CE0, CE1, or CE2 that enables the device. CEX high is defined at the first edge of
CE0, CE1, or CE2 that disables the device.
2.
In this diagram, BYTE# is asserted high
Datasheet
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7.2
Write Specifications
Table 11: Write Operations
#
Symbol
Parameter
Density
Valid for All
Speeds
Min
W1
tPHWL (tPHEL)
RP# High Recovery to WE# (CE X) Going Low
W2
tELWL (tWLEL)
CEX (WE#) Low to WE# (CEX) Going Low
W3
tWP
W4
tDVWH (tDVEH)
32 Mbit
150
64 Mbit
180
128 Mbit
210
Unit
Notes
Max
1,2,3
0
1,2,4
Write Pulse Width
60
1,2,4
Data Setup to WE# (CE X) Going High
50
1,2,5
55
W5
tAVWH (tAVEH)
Address Setup to WE# (CE X) Going High
W6
tWHEH (tEHWH)
CEX (WE#) Hold from WE# (CE X) High
W7
tWHDX (tEHDX)
Data Hold from WE# (CEX) High
W8
tWHAX (tEHAX)
Address Hold from WE# (CEX) High
W9
tWPH
W11
tVPWH (tVPEH)
W12
tWHGL (tEHGL)
Write Recovery before Read
W13
tWHRL (tEHRL)
WE# (CEX) High to STS Going Low
W15
tQVVL
Write Pulse Width High
VPEN Setup to WE# (CEX) Going High
VPEN Hold from Valid SRD, STS Going High
1,2,5
0
All
ns
1,2,
0
1,2,
0
1,2,
30
1,2,6
0
1,2,3
35
1,2,7
500
0
1,2,8
1,2,3,8,9
Notes:
CEX low is defined as the first edge of CE0, CE1, or CE2 that enables the device. CE X high is defined at the first edge of CE0, CE1, or CE2 that disables the device.
1.
Read timing characteristics during block erase, program, and lock-bit configuration operations are the same as during
read-only operations. Refer to AC Characteristics–Read-Only Operations.
2.
A write operation can be initiated and terminated with either CEX or WE#.
3.
Sampled, not 100% tested.
4.
Write pulse width (tWP) is defined from CEX or WE# going low (whichever goes low last) to CEX or WE# going high
(whichever goes high first). Hence, tWP = tWLWH = tELEH = tWLEH = tELWH.
5.
Refer to Table 16, “Enhanced Configuration Register” on page 33 for valid AIN and DIN for block erase,
program, or lock-bit configuration.
6.
Write pulse width high (tWPH) is defined from CEX or WE# going high (whichever goes high first) to CE X or WE# going
low (whichever goes low first). Hence, tWPH = tWHWL = tEHEL = tWHEL = tEHWL.
7.
For array access, tAVQV is required in addition to tWHGL for any accesses after a write.
8.
STS timings are based on STS configured in its RY/BY# default mode.
9.
VPEN should be held at VPENH until determination of block erase, program, or lock-bit configuration success (SR[1,3,4,5]
= 0).
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Numonyx™ Embedded Flash Memory (J3 v. D)
Figure 14: Asynchronous Write Waveform
W5
W8
ADDRESS [A]
W6
CEx (WE#) [E (W)]
W2
W3
W9
WE# (CEx) [W (E)]
OE# [G]
W4
DATA [D/Q]
W7
D
W13
STS[R]
W1
RP# [P]
W11
VPEN [V]
Figure 15: Asynchronous Write to Read Waveform
W5
W8
Address [A]
W6
CE# [E]
W2
W3
WE# [W]
W12
OE# [G]
W4
Data [D/Q]
W7
D
W1
RST #/ RP# [P]
W11
VPEN [V]
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7.3
Program, Erase, Block-Lock Specifications
Table 12: Configuration Performance
#
Max (8)
Unit
Notes
128
654
µs
1,2,3,4,5,6,7
40
175
µs
1,2,3,4
Block Program Time (Using Write to Buffer Command)
0.53
2.4
sec
1,2,3,4
Parameter
Write Buffer Byte Program Time
(Time to Program 32 bytes/16 words)
W16
W16
Typ
Symbol
tWHQV3
tEHQV3
Byte Program Time (Using Word/Byte Program Command)
W16
tWHQV4
tEHQV4
Block Erase Time
1.0
4.0
sec
1,2,3,4
W16
tWHQV5
tEHQV5
Set Lock-Bit Time
50
60
µs
1,2,3,4,9
W16
tWHQV6
tEHQV6
Clear Block Lock-Bits Time
0.5
0.70
sec
1,2,3,4,9
W16
tWHRH1
tEHRH1
Program Suspend Latency Time to Read
15
20
µs
1,2,3,9
W16
tWHRH
tEHRH
Erase Suspend Latency Time to Read
15
20
µs
1,2,3,9
ns
1
WY
tSTS
STS Pulse Width Low Time
500
Notes:
1.
Typical values measured at TA = +25 °C and nominal voltages. Assumes corresponding lock-bits are not
set. Subject to change based on device characterization.
2.
These performance numbers are valid for all speed versions.
3.
Sampled but not 100% tested.
4.
Excludes system-level overhead.
5.
These values are valid when the buffer is full, and the start address is aligned on a 32-byte boundary.
6.
Effective per-byte program time (tWHQV1, tEHQV1) is 4µs/byte (typical).
7.
Effective per-word program time (tWHQV2, tEHQV2) is 8µs/word (typical).
8.
Max values are measured at worst case temperature, data pattern and VCC corner after 100k cycles
(except as noted).
9.
Max values are expressed at 25 °C/-40 °C.
7.4
Reset Specifications
Figure 16: AC Waveform for Reset Operation
STS (R)
P1
P2
RP# (P)
P3
Vcc
Note:
STS is shown in its default mode (RY/BY#)
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Numonyx™ Embedded Flash Memory (J3 v. D)
Table 13: Reset Specifications
#
Symbol
Parameter
Min
P1
tPLPH
RP# Pulse Low Time
(If RP# is tied to VCC , this specification is not applicable)
P2
tPHRH
RP# High to Reset during Block Erase, Program, or Lock-Bit
Configuration
P3
tVCCPH
Vcc Power Valid to RP# de-assertion (high)
Max
25
100
60
Unit
Notes
µs
1,2
ns
1,3
µs
Notes:
1.
These specifications are valid for all product versions (packages and speeds).
2.
If RP# is asserted while a block erase, program, or lock-bit configuration operation is not executing then the
minimum required RP# Pulse Low Time is 100 ns.
3.
A reset time, tPHQV, is required from the latter of STS (in RY/BY# mode) or RP# going high until outputs are
valid.
7.5
AC Test Conditions
Figure 17: AC Input/Output Reference Waveform
VCCQ
Input VCCQ/2
Test Points
VCCQ/2
Output
0.0
Note:
AC test inputs are driven at VCCQ for a Logic "1" and 0.0 V for a Logic "0." Input timing begins, and output timing ends, at
VCCQ/2 V (50% of VCCQ). Input rise and fall times (10% to 90%) < 5 ns.
Figure 18: Transient Equivalent Testing Load Circuit
Device
Under Test
Note:
CL
Out
CL Includes Jig Capacitance
Figure 19: Test Configuration
Datasheet
30
Test Configuration
CL (pF)
VCCQ = VCCQMIN
30
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8.0
Bus Interface
This section provides an overview of Bus operations. Basically, there are three operations you can
do with flash memory: Read, Program (Write), and Erase.The on-chip Write State Machine
(WSM) manages all erase and program algorithms. The system CPU provides control of all in-system read,
write, and erase operations through the system bus. All bus cycles to or from the flash memory
conform to standard microprocessor bus cycles. Table 14 summarizes the necessary
states of each control signal for different modes of operations.
Table 14: Bus Operations
DQ15:0(
3)
STS
(Default
Mode)
Notes
X
DOUT
High Z
4,6
VIH
X
High Z
High Z
X
X
X
High Z
High Z
X
X
X
X
High Z
High Z
VIH
Enabled
VIH
VIL
X
DIN
High Z
6,7
VIH
Enabled
VIH
VIL
VPENH
X
VIL
8,5
RP#
CEx(1)
OE#(2)
WE#(2)
V PEN
Async., Status, Query and Identifier
Reads
VIH
Enabled
VIL
VIH
Output Disable
VIH
Enabled
VIH
Standby
VIH
Disable
d
Reset/Power-down
VIL
Command Writes
Array Writes(8)
Mode
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
See Table 15 for valid CEx Configurations.
OE# and WE# should never be asserted simultaneously. If done so, OE# overrides WE#.
DQ refers to DQ[7:0} when BYTE# is low and DQ[15:0] if BYTE# is high.
≤ VPENLK, memory contents can be read but not altered.
Refer to DC characteristics. When VPEN
X should be VIL or VIH for the control pins and VPENLK or VPENH for VPEN. For outputs, X should be VOL or VOH.
In default mode, STS is VOL when the WSM is executing internal block erase, program, or a lock-bit configuration
algorithm. It is VOH (pulled up by an external pull up resistance ~= 10k) when the WSM is not busy, in block erase
suspend mode (with programming inactive), program suspend mode, or reset power-down mode.
See Table 18, “Command Bus Operations” on page 35 for valid DIN (user commands) during a Write
operation
Array writes are either program or erase operations. /
Table 15: Chip Enable Truth Table
Note:
CE2
CE1
CE0
DEVICE
VIL
VIL
VIL
Enabled
VIL
VIL
VIH
Disabled
VIL
VIH
VIL
Disabled
VIL
VIH
VIH
Disabled
VIH
VIL
VIL
Enabled
VIH
VIL
VIH
Enabled
VIH
VIH
VIL
Enabled
VIH
VIH
VIH
Disabled
For single-chip applications, CE2 and CE1 can be connected to
GND.
The next few sections detail each of the basic flash operations and some of the
advanced features available on flash memory.
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Numonyx™ Embedded Flash Memory (J3 v. D)
8.1
Bus Reads
Reading from flash memory outputs stored information to the processor or chipset, and
does not change any contents. Reading can be performed an unlimited number of
times. Besides array data, other types of data such as device information and device
status is available from the flash.
To perform a bus read operation, CEx and OE# must be asserted. CEx is the deviceselect control; when active, it enables the flash memory device. OE# is the data-output
control; when active, the addressed flash memory data is driven onto the I/O bus. For
all read states, WE# and RP# must be de-asserted.
8.1.1
Asynchronous Page Mode Read
There are two Asynchronous Page mode configurations available on Numonyx™
Embedded Flash Memory (J3 v. D), depending on the system design requirements:
• Four-Word Page mode: This is the default mode on power-up or reset. Array data
can be sensed up to four words (8 Bytes) at a time.
• Eight-Word Page mode: Array data can be sensed up to eight words (16 Bytes) at a
time. This mode must be enabled on power-up or reset by using the command
sequence described in Table 18, “Command Bus Operations” on page 35. Address
bits A[3:1] determine which word is output during a read operation, and A[3:0]
determine which byte is output for a x8 bus width.
After the initial access delay, the first word out of the page buffer corresponds to the
initial address. In Four-Word Page mode, address bits A[2:1] determine which word is
output from the page buffer for a x16 bus width, and A[2:0] determine which byte is
output from the page buffer for a x8 bus width. Subsequent reads from the device
come from the page buffer. These reads are output on D[15:0] for a x16 bus width and
D[7:0] for a x8 bus width after a minimum delay as long as A[2:0] (Four-Word Page
mode) or A[3:0] (Eight-Word Page mode).
Data can be read from the page buffer multiple times, and in any order. In Four-Word
Page mode, if address bits A[MAX:3] (A[MAX:4] for Eight-Word Page Mode) change at
any time, or if CE# is toggled, the device will sense and load new data into the page
buffer. Asynchronous Page mode is the default read mode on power-up or reset.
To perform a Page mode read after any other operation, the Read Array command must
be issued to read from the flash array. Asynchronous Page mode reads are permitted in
all blocks and are used to access register information. During register access, only one
word is loaded into the page buffer.
8.1.1.1
Enhanced Configuration Register (ECR)
The Enhanced Configuration Register (ECR) is a volatile storage register that when
addressed by the Set Enhanced Configuration Register command can select between
Four-Word Page mode and Eight-Word Page mode. The ECR is volatile; all bits will be
reset to default values when RP# is deasserted or power is removed from the device.
To modify ECR settings, use the Set Enhanced Configuration Register command. The
Set Enhanced Configuration Register command is written along with the configuration
register value, which is placed on the lower 16 bits of the address bus A[15:0]. This is
followed by a second write that confirms the operation and again presents the
Enhanced Configuration Register data on the address bus. After executing this
command, the device returns to Read Array mode.
The ECR is shown in Table 16. 8-word page mode Command Bus-Cycle is captured in
Table 17.
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Note:
For forward compatibility reasons, if the 8-word Asynchronous Page mode is used on
Numonyx™ Embedded Flash Memory (J3 v. D), a Clear Status Register command must
be executed after issuing the Set Enhanced Configuration Register command. See
Table 17 for further details.
Table 16: Enhanced Configuration Register
Reserved
ECR
15
Page
Length
ECR
14
ECR
13
Reserved
ECR
12
ECR
11
BITS
ECR
10
ECR
9
ECR
8
ECR
7
ECR
6
ECR
5
ECR
4
DESCRIPTION
ECR[15:14]
RFU
ECR[13]
•
•
ECR[12:0]
RFU
ECR
3
ECR
2
ECR
1
ECR
0
NOTES
All bits should be set to 0.
“1” = 8 Word Page mode
“0” = 4 Word Page mode
All bits should be set to 0.
Table 17: Asynchronous 8-Word Page Mode Command Bus-Cycle Definition
Command
Set Enhanced Configuration
Register (Set ECR)
First Bus Cycle
Second Bus Cycle
Bus
Cycles
Required
Oper
Addr(1)
Data
Oper
Addr(1)
Data
2
Write
ECD
0060h
Write
ECD
0004h
1. X = Any valid address within the device. ECD = Enhanced Configuration Register Data
8.1.2
Output Disable
With CEx asserted, and OE# at a logic-high level (VIH), the device outputs are disabled.
Output signals D[15:0] are placed in a high-impedance state.
8.2
Bus Writes
Writing or Programming to the device, is where the host writes information or data into
the flash device for non-volatile storage. When the flash device is programmed, ‘ones’
are changed to ‘zeros’. ‘Zeros’ cannot be programed back to ‘ones’. To do so, an erase
operation must be performed. Writing commands to the Command User Interface (CUI)
enables various modes of operation, including the following:
• Reading of array data
• Common Flash Interface (CFI) data
• Identifier codes, inspection, and clearing of the Status Register
• Block Erasure, Program, and Lock-bit Configuration (when VPEN = VPENH)
Erasing is performed on a block basis – all flash cells within a block are erased together.
Any information or data previously stored in the block will be lost. Erasing is typically
done prior to programming. The Block Erase command requires appropriate command
data and an address within the block to be erased. The Byte/Word Program command
requires the command and address of the location to be written. Set Block Lock-Bit
commands require the command and block within the device to be locked. The Clear
Block Lock-Bits command requires the command and address within the device to be
cleared.
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Numonyx™ Embedded Flash Memory (J3 v. D)
The CUI does not occupy an addressable memory location. It is written when the device
is enabled and WE# is active. The address and data needed to execute a command are
latched on the rising edge of WE# or the first edge of CE0, CE1, or CE2 that disables
the device (see Table 15 on page 31). Standard microprocessor write timings are used.
8.3
Standby
CE0, CE1, and CE2 can disable the device (see Table 15 on page 31) and place it in
standby mode. This manipulation of CEx substantially reduces device power
consumption. D[15:0] outputs are placed in a high-impedance state independent of
OE#. If deselected during block erase, program, or lock-bit configuration, the WSM
continues functioning, and consuming active power until the operation completes.
8.3.1
Reset/Power-Down
RP# at VIL initiates the reset/power-down mode.
In read modes, RP#-low deselects the memory, places output drivers in a highimpedance state, and turns off numerous internal circuits. RP# must be held low for a
minimum of tPLPH. Time tPHQV is required after return from reset mode until initial
memory access outputs are valid. After this wake-up interval, normal operation is
restored. The CUI is reset to read array mode and Status Register is set to 0080h.
During Block Erase, Program, or Lock-Bit Configuration modes, RP#-low will abort the
operation. In default mode, STS transitions low and remains low for a maximum time
of tPLPH + tPHRH until the reset operation is complete. Memory contents being altered
are no longer valid; the data may be partially corrupted after a program or partially
altered after an erase or lock-bit configuration. Time tPHWL is required after RP# goes to
logic-high (VIH) before another command can be written.
As with any automated device, it is important to assert RP# during system reset. When
the system comes out of reset, it expects to read from the flash memory. Automated
flash memories provide status information when accessed during Block Erase, Program,
or Lock-Bit Configuration modes. If a CPU reset occurs with no flash memory reset,
proper initialization may not occur because the flash memory may be providing status
information instead of array data. Numonyx Flash memories allow proper initialization
following a system reset through the use of the RP# input. In this application, RP# is
controlled by the same RESET# signal that resets the system CPU.
8.4
Device Commands
When the VPEN voltage ≤ VPENLK, only read operations from the Status Register, CFI,
identifier codes, or blocks are enabled. Placing VPENH on VPEN additionally enables block
erase, program, and lock-bit configuration operations. Device operations are selected
by writing specific commands to the Command User Interface (CUI). The CUI does not
occupy an addressable memory location. It is the mechanism through which the flash
device is controlled.
A command sequence is issued in two consecutive write cycles - a Setup command
followed by a Confirm command. However, some commands are single-cycle
commands consisting of a setup command only. Generally, commands that alter the
contents of the flash device, such as Program or Erase, require at least two write cycles
to guard against inadvertent changes to the flash device. Flash commands fall into two
categories: Basic Commands and Extended Commands. Basic commands are
recognized by all Numonyx Flash devices, and are used to perform common flash
operations such as selecting the read mode, programming the array, or erasing blocks.
Extended commands are product-dependant; they are used to perform additional
features such as software block locking. Table 18 describes all applicable commands on
Numonyx™ Embedded Flash Memory (J3 v. D).
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Table 18: Command Bus Operations
Setup Write Cycle
Command
Data
Bus
Address Bus3
Data Bus
1,2
0060h
Register Data
0004h
Program OTP Register
Device Address
1
00C0h
Register Offset
Register Data
Clear Status Register
Device Address2
0050h
---
---
Program and Erase
Read Modes
Registers
Address Bus
Security
Confirm Write Cycle
Program Enhanced Configuration Register
Register Data
Program STS Configuration Register
Device Address
2
00B8h
Device Address
Register Data
Read Array
Device Address
2
00FFh
---
---
Read Status Register
Device Address
2
0070h
---
---
Read Identifier Codes (Read Device Information)
Device Address2
0090h
---
---
Device Address
2
0098h
---
Device Address
1
0040h/
0010h
Device Address
Array Data
CFI Query
Word/Byte Program
--4
Buffered Program
Word Address1
00E8h
Device Address
00D0h
Block Erase
Block Address 1
0020h
Block Address
00D0h
Address1
00B0h
---
---
1
00D0h
---
---
0060h
Block Address
0001h
0060h
Device Address
00D0h
Program/Erase Suspend
Program/Erase Resume
Lock Block
Unlock Block
Notes:
1.
In case of 256
2.
In case of 256
3.
In case of 256
cycle)
4.
In case of 256
programmed
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Device
Device Address
Block Address
1
Device Address2
Mb device (2x128), the command should be issued to the base address of the die
Mb device (2x128), the command sequence must be repeated for each die at its base address
Mb device (2x128), keep the second cycle to the same address. (i.e. Do not toggle A24 for the second
Mb device (2x128), the second cycle must be writtne to the Block Address and Offset address to be
Datasheet
35
Numonyx™ Embedded Flash Memory (J3 v. D)
9.0
Flash Operations
This section describes the operational features of flash memory. Operations are
command-based, wherein command codes are first issued to the device, then the
device performs the desired operation. All command codes are issued to the device
using bus-write cycles. A complete list of available command codes can be found in
Section 10.0, “Device Command Codes” on page 47.
9.1
Status Register
The Status Register (SR) is an 8-bit, read-only register that indicates device status and
operation errors. To read the Status Register, issue the Read Status Register command.
Subsequent reads output Status Register information on DQ[7:0], and 00h on
DQ[15:8].
SR status bits are set and cleared by the device. SR error bits are set by the device, but
must be cleared using the Clear Status Register command. Upon power-up or exit from
reset, the Status Register defaults to 80h. Page-mode reads are not supported in this
read mode. Status Register contents are latched on the falling edge of OE# or the first
edge of CEx that enables the device. OE# must toggle to VIH or the device must be
disabled before further reads to update the Status Register latch. The Read Status
Register command functions independently of VPEN voltage.
Table 19: Status Register Bit Definitions
Status Register (SR)
Default Value = 80h
Ready
Status
Erase
Suspend
Status
Erase
Error
Program
Error
Program/
Erase
Voltage
Error
Program
Suspend
Status
Block-Locked
Error
7
6
5
4
3
2
1
Bit
Name
Description
7
Ready Status
0 = Device is busy; SR[6:] are invalid (Not driven);
1 = Device is ready; SR[6:0] are valid.
6
Erase Suspend Status
0 = Erase suspend not in effect.
1 = Erase suspend in effect.
5
Erase Error
4
Program
Error
3
Error
Command
Sequence
Error
0
SR5 SR4
0 0 =
0 1 =
1 0 =
1 1 =
Program or erase operation successful.
Program error - operation aborted.
Erase error - operation aborted.
Command sequence error - command aborted.
0 = within acceptable limits during program or erase operation.
1 = not within acceptable limits during program or erase operation. Operation
aborted.
2
Program Suspend Status
0 = Program suspend not in effect.
1 = Program suspend in effect.
1
Block-Locked Error
0 = Block NOT locked during program or erase - operation successful.
1 = Block locked during program or erase - operation aborted.
0
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9.1.1
Clearing the Status Register
The Status Register (SR) contain status and error bits which are set by the device. SR
status bits are cleared by the device, however SR error bits are cleared by issuing the
Clear Status Register command. Resetting the device also clears the Status Register.
Table 20: Clear Status Register Command Bus-Cycle
Setup Write Cycle
Command
Clear Status Register
Confirm Write Cycle
Address Bus
Data Bus
Address Bus
Data Bus
Device Address
0050h
---
---
In case of 256 Mb device (2x128), the command sequence must be repeated for each die at its base address.
Issuing the Clear Status Register command places the device in Read Status Register
mode.
Note:
Care should be taken to avoid Status Register ambiguity. If a command sequence error
occurs while in an Erase Suspend condition, the Status Register will indicate a
Command Sequence error by setting SR4 and SR5. When the erase operation is
resumed (and finishes), any errors that may have occurred during the erase operation
will be masked by the Command Sequence error. To avoid this situation, clear the
Status Register prior to resuming a suspended erase operation. The Clear Status
Register command functions independent of the voltage level on VPEN.
9.2
Read Operations
Four types of data can be read from the device: array data, device information, CFI
data, and device status. Upon power-up or return from reset, the device defaults to Read Array mode.
To change the device’s read mode, the appropriate command must be issued to the device. Table 21 shows
the command codes used to configure the device for the desired read mode. The
following sections describe each read mode.
Table 21: Read Mode Command Bus-Cycles
Command
Setup Write Cycle
Address Bus
Data Bus
Confirm Write Cycle
Address Bus
Data Bus
Read Array
Device Address
00FFh
---
---
Read Status Register
Device Address
0070h
---
---
Read Device Information
Device Address
0090h
---
---
CFI Query
Device Address
0098h
---
---
In case of 256 Mb device (2x128), the command sequence must be repeated for each die at its base address.
9.2.1
Read Array
Upon power-up or return from reset, the device defaults to Read Array mode. Issuing the Read Array
command places the device in Read Array mode. Subsequent reads output array data
on DQ[15:0]. The device remains in Read Array mode until a different read command is
issued, or a program or erase operation is performed, in which case, the read mode is
automatically changed to Read Status.
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To change the device to Read Array mode while it is programming or erasing, first issue
the Suspend command. After the operation has been suspended, issue the Read Array
command. When the program or erase operation is subsequently resumed, the device
will automatically revert back to Read Status mode.
Note:
Issuing the Read Array command to the device while it is actively programming or
erasing causes subsequent reads from the device to output invalid data. Valid array
data is output only after the program or erase operation has finished.
The Read Array command functions independent of the voltage level on VPEN.
9.2.2
Read Status Register
Issuing the Read Status Register command places the device in Read Status Register
mode. Subsequent reads output Status Register information on DQ[7:0], and 00h on
DQ[15:8]. The device remains in Read Status Register mode until a different readmode command is issued. Performing a program, erase, or block-lock operation also
changes the device’s read mode to Read Status Register mode.
The Status Register is updated on the falling edge of CE#, or OE# when CE# is low.
Status Register contents are valid only when SR7 = 1. When WSM is active, SR7
indicates the WSM’s state and SR[6:0] are in high-Z state.
The Read Status Register command functions independent of the voltage level on
VPEN.
9.2.3
Read Device Information
Issuing the Read Device Information command places the device in Read Device
Information mode. Subsequent reads output device information on DQ[15:0]. In the
case of the 256 Mbit device (2 x 128), the command should be issued to the base
address of the die.
The device remains in Read Device Information mode until a different read command is
issued. Also, performing a program, erase, or block-lock operation changes the device
to Read Status Register mode.
The Read Device Information command functions independent of the voltage level on
VPEN.
9.2.4
CFI Query
The query table contains an assortment of flash product information such as block size,
density, allowable command sets, electrical specifications, and other product
information. The data contained in this table conforms to the Common Flash Interface
(CFI) protocol.
Issuing the CFI Query command places the device in CFI Query mode. Subsequent
reads output CFI information on DQ[15:0] .The device remains in CFI Query mode until
a different read command is issued, or a program or erase operation is performed,
which changes the read mode to Read Status Register mode.
The CFI Query command functions independent of the voltage level on VPEN.
9.3
Programming Operations
Note:
All programming operations require the addressed block to be unlocked, and a valid
VPEN voltage applied throughout the programming operation. Otherwise, the
programming operation will abort, setting the appropriate Status Register error bit(s).
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The following sections describe each programming method.
9.3.1
Single-Word/Byte Programming
Array programming is performed by first issuing the Single-Word/Byte Program
command. This is followed by writing the desired data at the desired array address. The
read mode of the device is automatically changed to Read Status Register mode, which
remains in effect until another read-mode command is issued.
During programming, STS and the Status Register indicate a busy status (SR7 = 0).
Upon completion, STS and the Status Register indicate a ready status (SR7 = 1). The
Status Register should be checked for any errors (SR4), then cleared.
Note:
Issuing the Read Array command to the device while it is actively programming causes
subsequent reads from the device to output invalid data. Valid array data is output only
after the program operation has finished.
Standby power levels are not be realized until the programming operation has finished.
Also, asserting RP# aborts the programming operation, and array contents at the
addressed location are indeterminate. The addressed block should be erased, and the
data re-programmed. If a Single-Word/Byte program is attempted when the
corresponding block lock-bit is set, SR1 and SR4 will be set.
9.3.2
Buffered Programming
Buffered programming operations simultaneous program multiple words into the flash
memory array, significantly reducing effective word-write times. User-data is first
written to a write buffer, then programmed into the flash memory array in buffer-size
increments. Appendix , “Flow Charts” contains a flow chart of the bufferedprogramming operation.
Note:
Optimal performance and power consumption is realized only by aligning the start
address on 32-word boundaries (i.e., A[4:0] = 0b00000). Crossing a 32-word boundary
during a buffered programming operation can cause programming time to double.
To perform a buffered programming operation, first issue the Buffered Program setup
command at the desired starting address. The read mode of the device/addressed
partition is automatically changed to Read Status Register mode.
Polling SR7 determines write-buffer availability (0 = not available, 1 = available). If the
write buffer is not available, re-issue the setup command and check SR7; repeat until
SR7 = 1.
Next, issue the word count at the desired starting address. The word count represents
the total number of words to be written into the write buffer, minus one. This value can
range from 00h (one word) to a maximum of 1Fh (32 words). Exceeding the allowable
range causes an abort.
Following the word count, the write buffer is filled with user-data. Subsequent buswrite cycles provide addresses and data, up to the word count. All user-data addresses
must lie between <starting address> and <starting address + word count>, otherwise
the WSM continues to run as normal but, user may advertently change the content in
unexpected address locations.
Note:
User-data is programmed into the flash array at the address issued when filling the
write buffer.
After all user-data is written into the write buffer, issue the confirm command. If a
command other than the confirm command is issued to the device, a command
sequence error occurs and the operation aborts.
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Note:
After issuing the confirm command, write-buffer contents are programmed into the
flash memory array. The Status Register indicates a busy status (SR7 = 0) during array
programming.Issuing the Read Array command to the device while it is actively
programming or erasing causes subsequent reads from the device to output invalid
data. Valid array data is output only after the program or erase operation has finished.
Upon completion of array programming, the Status Register indicates ready (SR7 = 1).
A full Status Register check should be performed to check for any programming errors,
then cleared by using the Clear Status Register command.
Additional buffered programming operations can be initiated by issuing another setup
command, and repeating the buffered programming bus-cycle sequence. However, any
errors in the Status Register must first be cleared before another buffered
programming operation can be initiated.
9.4
Block Erase Operations
Erasing a block changes ‘zeros’ to ‘ones’. To change ones to zeros, a program operation must be performed
(see Section 9.3, “Programming Operations”). Erasing is performed on a block basis - an
entire block is erased each time an erase command sequence is issued. Once a block is
fully erased, all addressable locations within that block read as logical ones (FFFFh).
Only one block-erase operation can occur at a time, and is not permitted during a program suspend.
To perform a block-erase operation, issue the Block Erase command sequence at the
desired block address. Table 22, “Block-Erase Command Bus-Cycle” on page 40 shows
the two-cycle Block Erase command sequence.
Table 22: Block-Erase Command Bus-Cycle
Command
Block Erase
Setup Write Cycle
Confirm Write Cycle
Address Bus
Data Bus
Address Bus
Data Bus
Device Address
0020h
Block Address
00D0h
In case of 256 Mb device (2x128), the command should be issued to the base address of the die
Note:
A block-erase operation requires the addressed block to be unlocked, and a valid
voltage applied to VPEN throughout the block-erase operation. Otherwise, the
operation will abort, setting the appropriate Status Register error bit(s).
The Erase Confirm command latches the address of the block to be erased. The
addressed block is preconditioned (programmed to all zeros), erased, and then verified.
The read mode of the device is automatically changed to Read Status Register mode,
and remains in effect until another read-mode command is issued.
During a block-erase operation, STS and the Status Register indicates a busy status
(SR7 = 0). Upon completion, STS and the Status Register indicates a ready status (SR7
= 1). The Status Register should be checked for any errors, then cleared. If any errors
did occur, subsequent erase commands to the device are ignored unless the Status
Register is cleared.
The only valid commands during a block erase operation are Read Array, Read Device
Information, CFI Query, and Erase Suspend. After the block-erase operation has
completed, any valid command can be issued.
Note:
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Issuing the Read Array command to the device while it is actively erasing causes
subsequent reads from the device to output invalid data. Valid array data is output only
after the block-erase operation has finished.
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Standby power levels are not be realized until the block-erase operation has finished.
Also, asserting RP# aborts the block-erase operation, and array contents at the
addressed location are indeterminate. The addressed block should be erased before
programming within the block is attempted.
9.5
Suspend and Resume
An erase or programming operation can be suspended to perform other operations, and
then subsequently resumed. Table 23 shows the Suspend and Resume command buscycles.
Note:
All erase and programming operations require the addressed block to remain unlocked
with a valid voltage applied to VPEN throughout the suspend operation. Otherwise, the
block-erase or programming operation will abort, setting the appropriate Status
Register error bit(s). Also, asserting RP# aborts suspended block-erase and
programming operations, rendering array contents at the addressed location(s)
indeterminate.
Table 23: Suspend and Resume Command Bus-Cycles
Command
Setup Write Cycle
Confirm Write Cycle
Address Bus
Data Bus
Address Bus
Data Bus
Suspend
Device Address
00B0h
---
---
Resume
Device Address
00D0h
---
---
In case of 256 Mb device (2x128), the command should be issued to the base address of the die
To suspend an on-going erase or program operation, issue the Suspend command to
any device address. The program or erase operation suspends at pre-determined points
during the operation after a delay of tSUSP. Suspend is achieved whenSTS (in RY/BY#
mode) goes high, SR[7,6] = 1 (erase-suspend) or SR[7,2] = 1 (program-suspend).
Note:
Issuing the Suspend command does not change the read mode of the device. The
device will be in Read Status Register mode from when the erase or program command
was first issued, unless the read mode was changed prior to issuing the Suspend
command.
Not all commands are allowed when the device is suspended. Table 24 shows which
device commands are allowed during Program Suspend or Erase Suspend.
Table 24: Valid Commands During Suspend (Sheet 1 of 2)
Device Command
Program Suspend
Erase Suspend
STS Configuration
Allowed
Allowed
Read Array
Allowed
Allowed
Read Status Register
Allowed
Allowed
Clear Status Register
Allowed
Allowed
Read Device Information
Allowed
Allowed
CFI Query
Allowed
Allowed
Word Program
Not Allowed
Allowed
Buffered Program
Not Allowed
Allowed
Block Erase
Not Allowed
Not Allowed
Program Suspend
Not Allowed
Allowed
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Table 24: Valid Commands During Suspend (Sheet 2 of 2)
Device Command
Erase Suspend
Program/Erase Resume
Program Suspend
Erase Suspend
Not Allowed
Not Allowed
Allowed
Allowed
Lock Block
Not Allowed
Not Allowed
Unlock Block
Not Allowed
Not Allowed
Program OTP Register
Not Allowed
Not Allowed
During Suspend, array-read operations are not allowed in blocks being erased or
programmed.
A block-erase under program-suspend is not allowed. However, word-program under
erase-suspend is allowed, and can be suspended. This results in a simultaneous erasesuspend/ program-suspend condition, indicated by SR[7,6,2] = 1.
To resume a suspended program or erase operation, issue the Resume command to
any device address. The read mode of the device is automatically changed to Read
Status Register. The operation continues where it left off, STS (in RY/BY# mode) goes
low, and the respective Status Register bits are cleared.
When the Resume command is issued during a simultaneous erase-suspend/ programsuspend condition, the programming operation is resumed first. Upon completion of the
programming operation, the Status Register should be checked for any errors, and
cleared. The resume command must be issued again to complete the erase operation.
Upon completion of the erase operation, the Status Register should be checked for any
errors, and cleared.
9.6
Status Signal (STS)
The STATUS (STS) signal can be configured to different states using the STS
Configuration command (Table 25). Once the STS signal has been configured, it
remains in that configuration until another Configuration command is issued or RP# is
asserted low. Initially, the STS signal defaults to RY/BY# operation where RY/BY# low
indicates that the WSM is busy. RY/BY# high indicates that the state machine is ready
for a new operation or suspended. Table 26 displays possible STS configurations.
Table 25: STS Configuration Register
Setup Write Cycle
Confirm Write Cycle
Command
Address Bus
STS Configuration
Device Address
1
Data Bus
00B8h
Address Bus
Device Address
2
Data Bus
Register Data
Notes:
1.
In case of 256 Mb device (2x128), the command sequence must be repeated for each die at its base address
2.
In case of 256 Mb device (2x128), keep the second cycle to the same address. (ie. Do not toggle A24 for the second cycle)
To reconfigure the STATUS (STS) signal to other modes, the Configuration command is
given followed by the desired configuration code. The three alternate configurations are
all pulse mode for use as a system interrupt as described in the following paragraphs.
For these configurations, bit 0 controls Erase Complete interrupt pulse, and bit 1
controls Program Complete interrupt pulse. Supplying the 0x00 configuration code with
the Configuration command resets the STS signal to the default RY/BY# level mode.
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The Configuration command may only be given when the device is not busy or
suspended. Check SR.7 for device status. An invalid configuration code will result in
SR.4 and SR.5 being set.
Note:
STS Pulse mode is not supported in the Clear Lock Bits and Set Lock Bit commands.
Table 26: STS Configuration Coding Definitions
D7
D6
D5
D4
D3
D2
Reserved
D[1:0] = STS Configuration
Codes
D1
D0
Pulse on
Program
Complete (1)
Pulse on Erase
Complete (1)
Notes
00 = default, level mode; device
ready indication
Controls HOLD to a memory controller to prevent accessing a flash memory subsystem
while any flash device's WSM is busy.
01 = pulse on Erase Complete
Generates a system interrupt pulse when any flash device in an array has completed a
block erase. Helpful for reformatting blocks after file system free space reclamation or
“cleanup.”
10 = pulse on Program Complete
Not supported on this device.
11 = pulse on Erase or Program
Complete
Generates system interrupts to trigger servicing of flash arrays when either erase or
program operations are completed, when a common interrupt service routine is desired.
Notes:
1.
When configured in one of the pulse modes, STS pulses low with a typical pulse width of 500 ns.
2.
An invalid configuration code will result in both SR4 and SR5 being set.
3.
Reserved bits are invalid should be ignored.
9.7
Security and Protection
Numonyx™ Embedded Flash Memory (J3 v. D) device offer both hardware and software
security features. Block lock operations, PRs and VPEN allow users to implement
various levels of data protection.
9.7.1
Normal Block Locking
Numonyx™ Embedded Flash Memory (J3 v. D) has the unique capability of Flexible
Block Locking (locked blocks remain locked upon reset or power cycle): All blocks are
unlocked at the factory. Blocks can be locked individually by issuing the Set Block Lock
Bit command sequence to any address within a block. Once locked, blocks remain
locked when power is removed, or when the device is reset.
All locked blocks are unlocked simultaneously by issuing the Clear Block Lock Bits
command sequence to any device address. Locked blocks cannot be erased or
programmed. Table 27 summarizes the command bus-cycles.
Table 27: Block Locking Command Bus-Cycles
Setup Write Cycle
Confirm Write Cycle
Command
Address Bus
Set Block Lock Bit
Clear Block Lock Bits
Block
Address1
Device Address2
Data Bus
Address Bus
Data Bus
0060h
Block Address
0001h
0060h
Device Address
00D0h
Notes:
1.
In case of 256 Mb device (2x128), the command should be issued to the base address of the die
2.
In case of 256 Mb device (2x128), the command sequence must be repeated for each die at its base address
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After issuing the Set Block Lock Bit setup command or Clear Block Lock Bits setup
command, the device’s read mode is automatically changed to Read Status Register
mode. After issuing the confirm command, completion of the operation is indicated by
STS (in RY/BY# mode) going high and SR7 = 1.
Blocks cannot be locked or unlocked while programming or erasing, or while the device
is suspended. Reliable block lock and unlock operations occur only when VCC and VPEN
are valid. When VPEN ≤ VPENLK, block lock-bits cannot be changed.
When the set lock-bit operation is complete, SR4 should be checked for any error.
When the clear lock-bit operation is complete, SR5 should be checked for any error.
Errors bits must be cleared using the Clear Status Register command.
Block lock-bit status can be determined by first issuing the Read Device Information
command, and then reading from <block base address> + 02h. DQ0 indicates the lock
status of the addressed block (0 = unlocked, 1 = locked).
9.7.2
Configurable Block Locking
One of the unique new features on the Numonyx™ Embedded Flash Memory (J3 v. D),
non-existent on the previous generations of this product family, is the ability to protect
and/or secure the user’s system by offering multiple level of securities: Non-Volatile
Temporary; Non-Volatile Semi-Permanently or Non-Volatile Permanently. For additional
information and collateral request, please contact your filed representative.
9.7.3
OTP Protection Registers
Numonyx™ Embedded Flash Memory (J3 v. D) includes a 128-bit Protection Register
(PR) that can be used to increase the security of a system design. For example, the
number contained in the PR can be used to “match” the flash component with other
system components such as the CPU or ASIC, hence preventing device substitution.
The 128-bits of the PR are divided into two 64-bit segments:
• One segment is programmed at the Numonyx factory with a unique unalterable 64bit number.
• The other segment is left blank for customer designers to program as desired. Once
the customer segment is programmed, it can be locked to prevent further
programming.
9.7.4
Reading the OTP Protection Register
The Protection Register is read in Identification Read mode. The device is switched to
this mode by issuing the Read Identifier command (0090h). Once in this mode, read
cycles from addresses shown in Table 28 or Table 29 retrieve the specified information.
To return to Read Array mode, write the Read Array command (00FFh).
9.7.5
Programming the OTP Protection Register
Protection Register bits are programmed using the two-cycle Protection Program
command. The 64-bit number is programmed 16 bits at a time for word-wide
configuration and eight bits at a time for byte-wide configuration. First write the
Protection Program Setup command, 00C0h. The next write to the device will latch in
address and data and program the specified location. The allowable addresses are
shown in Table 28, “Word-Wide Protection Register Addressing” on page 45 or Table 29,
“Byte-Wide Protection Register Addressing” on page 46. Any attempt to address
Protection Program commands outside the defined PR address space will result in a
Status Register error (SR.4 will be set). Attempting to program a locked PR segment
will result in a Status Register error (SR.4 and SR.1 will be set).
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9.7.6
Locking the OTP Protection Register
The user-programmable segment of the Protection Register is lockable by programming
Bit 1 of the Protection Lock Register (PLR) to 0. Bit 0 of this location is programmed to
0 at the Numonyx factory to protect the unique device number. Bit 1 is set using the
Protection Program command to program “0xFFFD” to the PLR. After these bits have
been programmed, no further changes can be made to the values stored in the
Protection Register. Protection Program commands to a locked section will result in a
Status Register error (SR.4 and SR.1 will be set). PR lockout state is not reversible.
Figure 20: Protection Register Memory Map
Word
Address
0x88
A[24:1]: 256 Mbit
A[22:1]: 64 Mbit
A[23:1]: 128 Mbit
A[21:1]: 32 Mbit
64-bit Segment
(User-Programmable)
0x85
0x84
128-Bit Protection Register 0
64-bit Segment
(Factory-Programmed)
0x81
Lock Register 0
0x80
15 14 13 12 11 10 9
8
7
6
5
4
3
2
1
0
A0 is not used in x16 mode when accessing the protection register map. See Table
is used, see Table 29 for x8 addressing.
Note:
28 for x16 addressing. If x8 mode A0
Table 28: Word-Wide Protection Register Addressing
Word
Use
A8
A7
A6
A5
A4
A3
A2
A1
LOCK
Both
1
0
0
0
0
0
0
0
0
Factory
1
0
0
0
0
0
0
1
1
Factory
1
0
0
0
0
0
1
0
2
Factory
1
0
0
0
0
0
1
1
3
Factory
1
0
0
0
0
1
0
0
4
User
1
0
0
0
0
1
0
1
5
User
1
0
0
0
0
1
1
0
6
User
1
0
0
0
0
1
1
1
7
User
1
0
0
0
1
0
0
0
Note:
All address lines not specified in the above table must be 0 when accessing the Protection Register (i.e., A[MAX:9] = 0.)
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Table 29: Byte-Wide Protection Register Addressing
Byte
Use
A8
A7
A6
A5
A4
A3
A2
A1
A0
LOCK
Both
1
0
0
0
0
0
0
0
0
LOCK
Both
1
0
0
0
0
0
0
0
1
0
Factory
1
0
0
0
0
0
0
1
0
1
Factory
1
0
0
0
0
0
0
1
1
2
Factory
1
0
0
0
0
0
1
0
0
3
Factory
1
0
0
0
0
0
1
0
1
4
Factory
1
0
0
0
0
0
1
1
0
5
Factory
1
0
0
0
0
0
1
1
1
6
Factory
1
0
0
0
0
1
0
0
0
7
Factory
1
0
0
0
0
1
0
0
1
8
User
1
0
0
0
0
1
0
1
0
9
User
1
0
0
0
0
1
0
1
1
A
User
1
0
0
0
0
1
1
0
0
B
User
1
0
0
0
0
1
1
0
1
C
User
1
0
0
0
0
1
1
1
0
D
User
1
0
0
0
0
1
1
1
1
E
User
1
0
0
0
1
0
0
0
0
User
1
0
0
0
1
0
0
0
1
F
Note:
All address lines not specified in the above table must be 0 when accessing the Protection Register, i.e., A[MAX:9] = 0.
9.7.7
VPP/ VPEN Protection
When it’s necessary to protect the entire array, global protection can be achieved using
a hardware mechanism. using VPP or VPEN. Whenever a valid voltage is present on VPP
or VPEN, blocks within the main flash array can be erased or programmed. By
grounding VPP or VPEN, blocks within the main array cannot be altered – attempts to
program or erase blocks will fail resulting in the setting of the appropriate error bit in
the Status Register. By holding VPP or VPEN low, absolute write protection of all blocks
in the array can be achieved.
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10.0
Device Command Codes
The list of all applicable commands are included here one more time for the
convenience.
Table 30: Command Bus Operations for Numonyx™ Embedded Flash Memory (J3 v. D)
Setup Write Cycle
Command
Data Bus
Address Bus3
Data Bus
1,2
0060h
Register Data
0004h
Program OTP Register
Device Address
1
00C0h
Register Offset
Register Data
Clear Status Register
Device Address2
0050h
---
---
Address2
00B8h
Device Address
Register Data
2
00FFh
---
---
Read Status Register
Device
Address2
0070h
---
---
Read Identifier Codes (Read Device Information)
Device Address2
0090h
---
---
Address2
0098h
---
1
0040h/
0010h
Device Address
Program and Erase
Read Modes
Registers
Address Bus
Security
Confirm Write Cycle
Program Enhanced Configuration Register
Register Data
Program STS Configuration Register
Device
Read Array
Device Address
CFI Query
Device
Word/Byte Program
Device Address
--4
Array Data
Buffered Program
Word Address1
00E8h
Device Address
00D0h
Block Erase
Block Address1
0020h
Block Address
00D0h
1
00B0h
---
---
Address1
00D0h
---
---
0060h
Block Address
0001h
0060h
Device Address
00D0h
Program/Erase Suspend
Program/Erase Resume
Lock Block
Unlock Block
Notes:
1.
In case of 256
2.
In case of 256
3.
In case of 256
cycle)
4.
In case of 256
programmed
November 2007
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Device Address
Device
Block Address
1
Device Address2
Mb device (2x128), the command should be issued to the base address of the die
Mb device (2x128), the command sequence must be repeated for each die at its base address
Mb device (2x128), keep the second cycle to the same address. (i.e. Do not toggle A24 for the second
Mb device (2x128), the second cycle must be writtne to the Block Address and Offset address to be
Datasheet
47
Numonyx™ Embedded Flash Memory (J3 v. D)
11.0
Device ID Codes
Table 31: Read Identifier Codes
Code
Device Code
Datasheet
48
Address
Data
32-Mbit
00001
0016
64-Mbit
00001
0017
128-Mbit
00001
0018
256- Mbit
00001
001D
November 2007
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Numonyx™ Embedded Flash Memory (J3 v. D)
12.0
Flow Charts
Figure 21: Write to Buffer Flowchart
Start
Setup
- Write 0xE8
- Block Address
Check Buffer Status
- Perform read operation
- Read Ready Status on signal SR7
SR7 = 1?
No
Yes
Word Count
- Address = block address
- Data = word count minus 1
(Valid range = 0x00 to0x1F)
Load Buffer
- Fill write buffer up to word count
- Address = within buffer range
- Data = user data
Confirm
- Write 0xD0
- Block address
Read Status
Register (SR)
SR7 = 1?
No
Yes
Full Status Register
Check
(if desired)
End
November 2007
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Datasheet
49
Numonyx™ Embedded Flash Memory (J3 v. D)
Figure 22: Status Register Flowchart
Start
Command Cycle
- Issue Status Register Command
- Address = any dev ice address
- Data = 0x70
Data Cycle
- Read Status Register SR[7:0]
SR7 = '1'
No
Y es
- Set/Reset
by WSM
SR6 = '1'
Y es
Erase Suspend
See Suspend/Resume Flowchart
Y es
Program Suspend
See Suspend/Resume Flowchart
No
SR2 = '1'
No
SR5 = '1'
Y es
SR4 = '1'
Y es
Error
Command Sequence
No
No
Error
Erase Failure
SR4 = '1'
- Set by WSM
- Reset by user
- See Clear Status
Register
Command
Y es
Error
Program Failure
Y es
Error
V PEN < V PENLK
Y es
Error
Block Locked
No
SR3 = '1'
No
SR1 = '1'
No
End
Datasheet
50
November 2007
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Numonyx™ Embedded Flash Memory (J3 v. D)
Figure 23: Byte/Word Program Flowchart
Start
Write 40H,
Address
Write Data and
Address
Read Status
Register
Command
Comments
Write
Setup Byte/
Word Program
Data = 40H
Addr = Location to Be Programmed
Write
Byte/Word
Program
Data = Data to Be Programmed
Addr = Location to Be Programmed
Read
(Note 1)
Status Register Data
Standby
Check SR.7
1 = WSM Ready
0 = WSM Busy
1. Toggling OE# (low to high to low) updates the status register. This
can be done in place of issuing the Read Status Register command.
Repeat for subsequent programming operations.
0
SR.7 =
Bus
Operation
SR full status check can be done after each program operation, or
after a sequence of programming operations.
1
Full Status
Check if Desired
Write FFH after the last program operation to place device in read
array mode.
Byte/Word
Program Complete
FULL STATUS CHECK PROCEDURE
Bus
Operation
Read Status
Register Data
(See Above)
Check SR.3
1 = Programming to Voltage Error
Detect
Standby
Check SR.1
1 = Device Protect Detect
RP# = V IH, Block Lock-Bit Is Set
Only required for systems
implemeting lock-bit configuration.
Standby
Check SR.4
1 = Programming Error
Voltage Range Error
0
1
SR.1 =
Device Protect Error
0
1
SR.4 =
Programming Error
0
Byte/Word
Program
Successful
November 2007
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Comments
Standby
1
SR.3 =
Command
Toggling OE# (low to high to low) updates the status register. This can
be done in place of issuing the Read Status Register command.
Repeat for subsequent programming operations.
SR.4, SR.3 and SR.1 are only cleared by the Clear Status Register
command in cases where multiple locations are programmed before
full status is checked.
If an error is detected, clear the status register before attempting retry
or other error recovery.
Datasheet
51
Numonyx™ Embedded Flash Memory (J3 v. D)
Figure 24: Program Suspend/Resume Flowchart
Start
Write B0H
Bus
Operation
Command
Write
Program
Suspend
0
Standby
Check SR.7
1 - WSM Ready
0 = WSM Busy
Standby
Check SR.6
1 = Programming Suspended
0 = Programming Completed
SR.7 =
Write
Read Array
1
SR.2 =
Programming Completed
Write
Data = FFH
Addr = X
Read array locations other
than that being programmed.
Read
0
Data = B0H
Addr = X
Status Register Data
Addr = X
Read
Read Status Register
Comments
Program
Resume
Data = D0H
Addr = X
1
Write FFH
Read Data Array
No
Done Reading
Yes
Datasheet
52
Write D0H
Write FFH
Programming Resumed
Read Array Data
November 2007
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Numonyx™ Embedded Flash Memory (J3 v. D)
Figure 25: Block Erase Flowchart
Start
Issue Single Block Erase
Command 20H, Block
Address
Command
Write
Erase Block
Write (Note 1)
Erase
Confirm
Read
Standby
Write Confirm D0H
Block Address
Comments
Data = 20H
Addr = Block Address
Data = D0H
Addr = Block Address
Status register data
With the device enabled,
OE# low updates SR
Addr = X
Check SR.7
1 = WSM Ready
0 = WSM Busy
1. The Erase Confirm byte must follow Erase Setup.
This device does not support erase queuing. Please see
Application note AP-646 For software erase queuing
compatibility.
Read
Status Register
Full status check can be done after all erase and write
sequences complete. Write FFH after the last operation to
reset the device to read array mode.
No
SR.7 =
Bus
Operation
0
Suspend Erase
Yes
Suspend
Erase Loop
1
Full Status
Check if Desired
Erase Flash
Block(s) Complete
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Datasheet
53
Numonyx™ Embedded Flash Memory (J3 v. D)
Figure 26: Block Erase Suspend/Resume Flowchart
Start
Bus
Operation
Command
Write
Erase Suspend
Write B0H
0
Standby
Check SR.7
1 - WSM Ready
0 = WSM Busy
Standby
Check SR.6
1 = Block Erase Suspended
0 = Block Erase Completed
SR.7 =
Write
1
Data = B0H
Addr = X
Status Register Data
Addr = X
Read
Read Status Register
Comments
Erase Resume
Data = D0H
Addr = X
0
SR.6 =
Block Erase Completed
1
Program
Read
Read or Program?
Read Array
Data
No
Program
Loop
Done?
Yes
Datasheet
54
Write D0H
Write FFH
Block Erase Resumed
Read Array Data
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Numonyx™ Embedded Flash Memory (J3 v. D)
Figure 27: Set Block Lock-Bit Flowchart
Start
Write 60H,
Block Address
Write 01H,
Block Address
Bus
Operation
Command
Write
Set Block Lock-Bit
Setup
Data = 60H
Addr =Block Address
Write
Set Block Lock-Bit
Confirm
Data = 01H
Addr = Block Address
Read
Read Status Register
Status Register Data
Check SR.7
1 = WSM Ready
0 = WSM Busy
Standby
Repeat for subsequent lock-bit operations.
0
SR.7 =
Comments
Full status check can be done after each lock-bit set operation or after
a sequence of lock-bit set operations.
1
Write FFH after the last lock-bit set operation to place device in read
array mode.
Full Status
Check if Desired
Set Lock-Bit Complete
FULL STATUS CHECK PROCEDURE
Read Status Register
Data (See Above)
Bus
Operation
1
SR.3 =
0
1
Command Sequence
Error
0
1
SR.4 =
0
Set Lock-Bit Error
Comments
Standby
Check SR.3
1 = Programming Voltage Error
Detect
Standby
Check SR.4, 5
Both 1 = Command Sequence
Error
Standby
Check SR.4
1 = Set Lock-Bit Error
Voltage Range Error
SR.4,5 =
Command
SR.5, SR.4 and SR.3 are only cleared by the Clear Status Register
command, in cases where multiple lock-bits are set before full status is
checked.
If an error is detected, clear the status register before attempting retry
or other error recovery.
Set Lock-Bit
Successful
November 2007
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Datasheet
55
Numonyx™ Embedded Flash Memory (J3 v. D)
Figure 28: Clear Lock-Bit Flowchart
Start
Write 60H
Bus
Operation
Command
Write
Clear Block
Lock-Bits Setup
Data = 60H
Addr = X
Write
Clear Block or
Lock-Bits Confirm
Data = D0H
Addr = X
Write D0H
Read
Read Status Register
Status Register Data
Check SR.7
1 = WSM Ready
0 = WSM Busy
Standby
0
SR.7 =
Comments
Write FFH after the clear lock-bits operation to place device in read
array mode.
1
Full Status
Check if Desired
Clear Block Lock-Bits
Complete
FULL STATUS CHECK PROCEDURE
Bus
Operation
Read Status Register
Data (See Above)
1
SR.3 =
1
SR.4,5 =
Command Sequence
Error
0
1
SR.5 =
0
Comments
Standby
Check SR.3
1 = Programming Voltage Error
Detect
Standby
Check SR.4, 5
Both 1 = Command Sequence
Error
Standby
Check SR.5
1 = Clear Block Lock-Bits Error
Voltage Range Error
0
Command
SR.5, SR.4, and SR.3 are only cleared by the Clear Status Register
command.
Clear Block Lock-Bits
Error
If an error is detected, clear the status register before attempting retry
or other error recovery.
Clear Block Lock-Bits
Successful
Datasheet
56
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Numonyx™ Embedded Flash Memory (J3 v. D)
Figure 29: Protection Register Programming Flowchart
Start
Bus Operation
Command
Write C0H
(Protection Reg.
Program Setup)
Write
Protection Program
Setup
Data = C0H
Write
Protection Program
Data = Data to Program
Addr = Location to Program
Write Protect. Register
Address/Data
Read
Check SR.7
1 = WSM Ready
0 = WSM Busy
Protection Program operations can only be addressed within the protection
register address space. Addresses outside the defined space will return an
error.
No
SR.7 = 1?
Status Register Data Toggle
CE# or OE# to Update Status
Register Data
Standby
Read Status Register
Comments
Repeat for subsequent programming operations.
Yes
Full Status
Check if Desired
SR Full Status Check can be done after each program or after a sequence of
program operations.
Write FFH after the last program operation to reset device to read array mode.
Program Complete
FULL STATUS CHECK PROCEDURE
Bus Operation
Read Status Register
Data (See Above)
VPEN Range Error
0,1
SR.1, SR.4 =
1,1
SR.1, SR.4 =
Program Successful
November 2007
308551-05
Protection Register
Programming Error
Attempted Program to
Locked Register Aborted
Comments
Standby
SR.1 SR.3 SR.4
0
1
1
V PEN Low
Standby
0
0
1
Prot. Reg.
Prog. Error
1
0
1
Register
Locked:
Aborted
1, 1
SR.3, SR.4 =
Command
Standby
SR.3 MUST be cleared, if set during a program attempt, before further
attempts are allowed by the Write State Machine.
SR.1, SR.3 and SR.4 are only cleared by the Clear Staus Register Command,
in cases of multiple protection register program operations before full status is
checked.
If an error is detected, clear the status register before attempting retry or other
error recovery.
Datasheet
57
Numonyx™ Embedded Flash Memory (J3 v. D)
13.0
Common Flash Interface
The Common Flash Interface (CFI) specification outlines device and host system
software interrogation handshake which allows specific vendor-specified software
algorithms to be used for entire families of devices. This allows device independent,
JEDEC ID-independent, and forward- and backward-compatible software support for
the specified flash device families. It allows flash vendors to standardize their existing
interfaces for long-term compatibility.
This appendix defines the data structure or “database” returned by the Common Flash
Interface (CFI) Query command. System software should parse this structure to gain
critical information such as block size, density, x8/x16, and electrical specifications.
Once this information has been obtained, the software will know which command sets
to use to enable flash writes, block erases, and otherwise control the flash component.
The Query is part of an overall specification for multiple command set and control
interface descriptions called Common Flash Interface, or CFI.
13.1
Query Structure Output
The Query “database” allows system software to gain information for controlling the
flash component. This section describes the device’s CFI-compliant interface that allows
the host system to access Query data.
Query data are always presented on the lowest-order data outputs (D[7:0]) only. The
numerical offset value is the address relative to the maximum bus width supported by
the device. On this family of devices, the Query table device starting address is a 10h,
which is a word address for x16 devices.
For a word-wide (x16) device, the first two bytes of the Query structure, “Q” and “R” in
ASCII, appear on the low byte at word addresses 10h and 11h. This CFI-compliant
device outputs 00H data on upper bytes. Thus, the device outputs ASCII “Q” in the low
byte (D[7:0]) and 00h in the high byte (D[15:8]).
At Query addresses containing two or more bytes of information, the least significant
data byte is presented at the lower address, and the most significant data byte is
presented at the higher address.
In all of the following tables, addresses and data are represented in hexadecimal
notation, so the “h” suffix has been dropped. In addition, since the upper byte of wordwide devices is always “00h,” the leading “00” has been dropped from the table
notation and only the lower byte value is shown. Any x16 device outputs can be
assumed to have 00h on the upper byte in this mode.
Table 32: Summary of Query Structure Output as a Function of Device and Mode
Device
Type/
Mode
x16 device
x16 mode
x16 device
Datasheet
58
Query start location in
maximum device bus
width addresses
10h
Query data with maximum device
bus width addressing
Query data with byte addressing
Hex
Offset
Hex Code
ASCII
Value
Hex
Offset
Hex Code
10:
0051
“Q”
20:
51
“Q”
11:
0052
“R”
21:
00
“Null”
12:
0059
“Y”
ASCII
Value
22:
52
“R”
20:
51
“Q”
November 2007
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Numonyx™ Embedded Flash Memory (J3 v. D)
Table 32: Summary of Query Structure Output as a Function of Device and Mode
Device
Type/
Mode
Query start location in
maximum device bus
width addresses
Hex
Offset
N/A(1)
x8 mode
Note:
1.
Query data with maximum device
bus width addressing
Query data with byte addressing
ASCII
Value
Hex Code
N/A(1)
Hex
Offset
Hex Code
ASCII
Value
21:
51
“Q”
22:
52
“R”
The system must drive the lowest order addresses to access all the device's array data when the device is configured in
x8 mode. Therefore, word addressing, where these lower addresses are not toggled by the system, is "Not Applicable"
for x8-configured devices.
Table 33: Example of Query Structure Output of a x16- and x8-Capable Device
Word Addressing
Offset
Byte Addressing
Hex Code
A15–A0
Value
Offset
D15–D0
Hex Code
A7–A0
Value
D7–D0
0010h
0051
“Q”
20h
51
“Q”
0011h
0052
“R”
21h
51
“Q”
0012h
0059
“Y”
22h
52
“R”
0013h
P_IDLO
PrVendor
23h
52
“R”
0014h
P_IDHI
ID #
24h
59
“Y”
0015h
PLO
PrVendor
25h
59
“Y”
0016h
PHI
TblAdr
26h
P_IDLO
PrVendor
0017h
A_IDLO
AltVendor
27h
P_IDLO
ID #
0018h
A_IDHI
ID #
28h
P_IDHI
ID #
...
...
...
...
...
...
13.2
Query Structure Overview
The Query command causes the flash component to display the Common Flash
Interface (CFI) Query structure or “database.” The structure sub-sections and address
locations are summarized below. See AP-646 Common Flash Interface (CFI) and
Command Sets (order number 292204) for a full description of CFI.
The following sections describe the Query structure sub-sections in detail.
Table 34: Query Structure
Offset
Sub-Section Name
Description
Notes
00h
Manufacturer Code
1
01h
Device Code
1
(BA+2)h(2)
Block Status Register
Block-Specific Information
Reserved
Reserved for Vendor-Specific Information
1
10h
CFI Query Identification String
Reserved for Vendor-Specific Information
1
1Bh
System Interface Information
Command Set ID and Vendor Data Offset
1
04-0Fh
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1,2
Datasheet
59
Numonyx™ Embedded Flash Memory (J3 v. D)
Table 34: Query Structure
Offset
Sub-Section Name
Description
Notes
27h
Device Geometry Definition
Flash Device Layout
P(3)
Primary Numonyx-Specific Extended
Query Table
Vendor-Defined Additional Information Specific to
the Primary Vendor Algorithm
1
1,3
Notes:
1.
Refer to the Query Structure Output section and offset 28h for the detailed definition of offset address as a function of
device bus width and mode.
2.
BA = Block Address beginning location (i.e., 02000h is block 2’s beginning location when the block size is 128 Kbyte).
3.
Offset 15 defines “P” which points to the Primary Numonyx-Specific Extended Query Table.
13.3
Block Status Register
The Block Status Register indicates whether an erase operation completed successfully
or whether a given block is locked or can be accessed for flash program/erase
operations.
Table 35: Block Status Register
Offset
Length
(BA+2)h (1)
1
Note:
1.
Description
Address
Value
Block Lock Status Register
BA+2:
--00 or --01
BSR.0 Block Lock Status
0 = Unlocked
1 = Locked
BA+2:
(bit 0): 0 or 1
BSR 1–15: Reserved for Future Use
BA+2:
(bit 1–15): 0
BA = The beginning location of a Block Address (i.e., 008000h is block 1’s (64-KB block) beginning location in word
mode).
13.4
CFI Query Identification String
The CFI Query Identification String provides verification that the component supports
the Common Flash Interface specification. It also indicates the specification version and
supported vendor-specified command set(s).
Table 36: CFI Identification
Offset
Length
10h
3
Query-unique ASCII string “QRY”
13h
2
Primary vendor command set and control interface ID code.
15h
2
17h
2
Alternate vendor command set and control interface ID code.
19h
2
Datasheet
60
Description
Add.
Hex
Code
Value
10
--51
“Q”
11:
--52
“R”
12:
--59
“Y”
13:
--01
16-bit ID code for vendor-specified algorithms
14:
--00
Extended Query Table primary algorithm address
15:
--31
16:
--00
17:
--00
0000h means no second vendor-specified algorithm exists
18:
--00
Secondary algorithm Extended Query Table address.
19:
--00
0000h means none exists
1A:
--00
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Numonyx™ Embedded Flash Memory (J3 v. D)
13.5
System Interface Information
The following device information can optimize system interface software.
Table 37: System Interface Information
Add.
Hex
Code
Value
VCC logic supply minimum program/erase voltage
bits 0–3 BCD 100 mV
bits 4–7 BCD volts
1B:
--27
2.7 V
1
VCC logic supply maximum program/erase voltage
bits 0–3 BCD 100 mV
bits 4–7 BCD volts
1C:
--36
3.6 V
1Dh
1
VPP [programming] supply minimum program/erase voltage
bits 0–3 BCD 100 mV
bits 4–7 HEX volts
1D:
--00
0.0 V
1Eh
1
VPP [programming] supply maximum program/erase voltage
bits 0–3 BCD 100 mV
bits 4–7 HEX volts
1E:
--00
0.0 V
1Fh
1
“n” such that typical single word program time-out = 2n µs
1F:
--06
64 µs
20h
1
“n” such that typical max. buffer write time-out = 2 n µs
20:
--07
128 µs
21h
1
“n” such that typical block erase time-out = 2n ms
21:
--0A
1s
22h
1
“n” such that typical full chip erase time-out = 2 n ms
22:
--00
NA
n
Offset
Length
1Bh
1
1Ch
Description
23h
1
“n” such that maximum word program time-out = 2 times typical
23:
--02
256 µs
24h
1
“n” such that maximum buffer write time-out = 2n times typical
24:
--03
1024 µs
25h
1
“n” such that maximum block erase time-out = 2n times typical
25:
--02
4s
26h
1
“n” such that maximum chip erase time-out = 2 n times typical
26:
--00
NA
13.6
Device Geometry Definition
This field provides critical details of the flash device geometry.
Table 38: Device Geometry Definition
Offset
Length
Description
Code See Table Below
n
27h
1
“n” such that device size = 2 in number of bytes
27:
28h
2
Flash device interface:
28:
2Ah
2
“n” such that maximum number of bytes in write buffer = 2 n
1
Number of erase block regions within device:
1. x = 0 means no erase blocking; the device erases in “bulk”
2. x specifies the number of device or partition regions with one or more
contiguous same-size erase blocks
3. Symmetrically blocked partitions have one blocking region
4. Partition size = (total blocks) x (individual block size)
Erase Block Region 1 Information
2D:
bits 0–15 = y, y+1 = number of identical-size erase blocks
2E:
x8 async
x16 async
x8/x16 async
28:00,29:00 28:01,29:00 28:02,29:00
2Ch
2Dh
4
bits 16–31 = z, region erase block(s) size are z x 256 bytes
--02
29:
--00
2A:
--05
2B:
--00
2C:
--01
x8/
x16
32
1
2F:
30:
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Numonyx™ Embedded Flash Memory (J3 v. D)
Table 39: Device Geometry: Address Codes
Address
32 Mbit
64 Mbit
128 Mbit
27:
--16
--17
--18
28:
--02
--02
--02
29:
--00
--00
--00
2A:
--05
--05
--05
13.7
2B:
--00
--00
--00
2C:
--01
--01
--01
2D:
--1F
--3F
--7F
2E:
--00
--00
--00
2F:
--00
--00
--00
30:
--02
--02
--02
Primary-Vendor Specific Extended Query Table
Certain flash features and commands are optional. The Primary Vendor-Specific
Extended Query table specifies this and other similar information.
Table 40: Primary Vendor-Specific Extended Query (Sheet 1 of 2)
Offset(1)
P = 31h
Length
(P+0)h
3
(P+1)h
Description
(Optional Flash Features and Commands)
Primary extended query table
Unique ASCII string “PRI”
(P+2)h
Add.
Hex
Code
Value
31:
--50
“P”
32:
--52
“R”
33:
--49
“I”
(P+3)h
1
Major version number, ASCII
34:
--31
“1”
(P+4)h
1
Minor version number, ASCII
35:
--31
“1”
Datasheet
62
November 2007
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Numonyx™ Embedded Flash Memory (J3 v. D)
Table 40: Primary Vendor-Specific Extended Query (Sheet 2 of 2)
Offset(1)
P = 31h
Length
Description
(Optional Flash Features and Commands)
Optional feature and command support (1=yes, 0=no)
Undefined bits are “0.” If bit 31 is
“1” then another 31 bit field of optional features follows at
the end of the bit-30 field.
(P+5)h
(P+6)h
(P+7)h
(P+8)h
4
--00
38:
--00
39:
--00
No
bit 1 = 1
Yes
bit 2 Suspend program supported
bit 2 = 1
bit 3 Legacy lock/unlock supported
bit 3 = 1(1)
Yes
Yes (1)
bit 4 Queued erase supported
bit 4 = 0
No
bit 5 Instant Individual block locking supported
bit 5 = 0
No
bit 6 Protection bits supported
bit 6 = 1
Yes
bit 7 Page-mode read supported
bit 7 = 1
Yes
bit 8 Synchronous read supported
bit 8 = 0
No
bit9 Simultaneous Operation Supported
bit 9 = 0
No
Supported functions after suspend: read Array, Status, Query
Other supported operations are:
bits 1–7 reserved; undefined bits are “0”
bit 0 Program supported after erase suspend
2
--CE
37:
bit 0 = 0
bit 31 Another “Optional Feature” field to follow
(P+A)h
(P+B)h
36:
Value
bit 1 Suspend erase supported
bit 30 CFI Link(s) to follow (256 Mb)
1
Hex
Code
bit 0 Chip erase supported
bit 30 CFI Link(s) to follow (32, 64, 128- Mb)
(P+9)h
Add.
bit 30 = 0
No
bit 30 = 0
No
bit 30 = 1
Yes
bit 31 = 0
No
3A:
--01
bit 0 = 1
Yes
Block Status Register mask
3B:
--01
bits 2–15 are Reserved; undefined bits are “0”
3C:
--00
bit 0 Block Lock-Bit Status register active
bit 0 = 1
Yes
bit 1 Block Lock-Down Bit Status active
bit 1 = 0
No
(P+C)h
1
VCC logic supply highest performance program/erase voltage
bits 0–3 BCD value in 100 mV
bits 4–7 BCD value in volts
3D:
--33
3.3 V
(P+D)h
1
VPP optimum program/erase supply voltage
bits 0–3 BCD value in 100 mV
bits 4–7 HEX value in volts
3E:
--00
0.0 V
Note:
1.
2.
Future devices may not support the described “Legacy Lock/Unlock” function. Thus bit 3 would have a value of “0.”
Setting this bit, will lead to the extension of the CFI table. Please refer to Table 43.
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Numonyx™ Embedded Flash Memory (J3 v. D)
Table 41: Protection Register Information
Offset(1)
P = 31h
Length
(P+E)h
1
Number of Protection register fields in JEDEC ID space.
“00h,” indicates that 256 protection bytes are available
4
Protection Field 1: Protection Description
This field describes user-available One Time Programmable (OTP)
protection register bytes. Some are pre-programmed with deviceunique serial numbers. Others are user-programmable. Bits 0-15 point
to the protection register lock byte, the section’s first byte. The
following bytes are factory pre-programmed and user-programmable.
bits 0-7 = Lock/bytes JEDEC-plane physical low address
bits 8-15 = Lock/bytes JEDEC-plane physical high address
bits 16-23 = “n” such that 2n = factory pre-programmed bytes
bits 24-31 = “n” such that 2n = user-programmable bytes
(P+F)h
(P+10)h
(P+11)h
(P+12)h
Note:
1.
Description
(Optional Flash Features and Commands)
Add.
Hex
Code
Value
3F:
--01
01
40:
41:
42:
43:
--80
--00
--03
--03
80h
00h
8bytes
8bytes
Add.
Hex
Code
Value
The variable P is a pointer which is defined at CFI offset 15h.
Table 42: Burst Read Information
Offset(1)
P = 31h
Length
(P+13)h
1
Page Mode Read capability
bits 0–7 = “n” such that 2n HEX value represents the number of readpage bytes. See offset 28h for device word width to determine pagemode data output width. 00h indicates no read page buffer.
44:
--03
8 byte
(P+14)h
1
Number of synchronous mode read configuration fields that follow. 00h
indicates no burst capability.
45:
--00
0
Reserved for future use
46:
(P+15)h
Note:
1.
Description
(Optional Flash Features and Commands)
The variable P is a pointer which is defined at CFI offset 15h.
The following table is the extended CFI used for the lower die of 256 Mb (2x128)
device.
Table 43: Additional CFI link for the lower die of the stacked device (256 Mb only)
Offset(1)
P = 31h
Length
Description
(Optional Flash Features and Commands)
Link Field Bit Information
(P+15)h
(P+16)h
(P+17)h
(P+18)h
Datasheet
64
4
Add.
Hex Code
46:
--10
47:
--10
48:
--00
49:
--00
Value
Bits[9:0] = Address offset (within 32 Mbit segment) of reference
CFI table
bit [9:0] = 10h
10
Bits [27:10] = nth 32 Mbit segment of referenced CFI table
bits[27:10] = 04h
4
Bits [30:28] = Memory type:
• 000b = CSD Flash
• 100b = LD Flash
bits[30:28] = 0h
0
bit 31 = Another CFI link field immediately follows
Bit 31 = 0h
No
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Table 43: Additional CFI link for the lower die of the stacked device (256 Mb only)
Offset (1)
P = 31h
Length
Description
(Optional Flash Features and Commands)
CFI Link Quantity Subfield Definition
Add.
04A
Hex Code
Value
--10
Bits [3:0] = Quantity field (n such that n+1 equals quantity
(P+19)h
1
Bit 4 = Table & die relative location
• 0b = Table & die on different CE#
• 1b = Table & die on same CE#
Bit 5 = Link field & table relative location
• 0b = Table & die on different CE#
• 1b = Table & die on same CE#
Bits [7:6] = RFU (Set to 00b)
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Numonyx™ Embedded Flash Memory (J3 v. D)
Appendix A Additional Information
Order Number
298130
1.
2.
3.
Document/Tool
Numonyx™ StrataFlash™ Memory (J3); 28F128J3, 28F640J3, 28F320J3 Specification Update
298136
Numonyx™ Persistent Storage Manager (IPSM) User’s Guide Software Manual
297833
Numonyx™ Flash Data Integrator (FDI) User’s Guide Software Manual
290606
5 Volt Numonyx™ StrataFlash™ MemoryI28F320J5 and 28F640J5 datasheet
292204
AP-646 Common Flash Interface (CFI) and Command Sets
253418
Numonyx™ Wireless Communications and Computing Package User’s Guide
Call the Numonyx Literature Center at (800) 548-4725 to request Numonyx documentation. International customers
should contact their local Numonyx or distribution sales office.
Visit the Numonyx home page http://www.Numonyx.com for technical documentation and tools.
For the most current information on Numonyx™ Embedded Flash Memory (J3 v. D), visit http://
developer.Numonyx.com/design/flash/isf.
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Appendix B Ordering Information
Figure 30: Decoder for Discrete Family (32, 64 and 128 Mbit)
l
P C2 8 F 3 2 0 J 3 D - 7 5
Package
Access Speed
75 ns
TE= 56-Lead TSOP (J3C, 803)
JS = Pb-Free 56-TSOP
RC = 64-Ball Easy BGA
D = Intel® 0.13
micron lithography
PC = 64-Ball Pb-Free Easy BGA
Voltage (Vcc/VPEN)
3 = 3 V/3 V
Product line designator
For all Intel® Flash Products
Product Family
J = Intel® Embedded Flash Memory
Device Density
128 = x8/x16 (128 Mbit)
640 = x8/x16 (64 Mbit)
320 = x8/x16 (32 Mbit)
Table 44: Valid Combinations for Discrete Family
32-Mbit
64-Mbit
128-Mbit
TE28F320J3D-75
TE28F640J3D-75
TE28F128J3D-75
JS28F320J3D-75
JS28F640J3D-75
JS28F128J3D-75
RC28F320J3D-75
RC28F640J3D-75
RC28F128J3D-75
PC28F320J3D-75
PC28F640J3D-75
PC28F128J3D-75
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Numonyx™ Embedded Flash Memory (J3 v. D)
Flash Family 3/4
Flash Family 1/2
Flash #4
Flash #3
Flash #2
Flash #1
Figure 31: Decoder for SCSP Family (256 Mbit Only)
RC4 8 F 3 3 0 0 J 0 Z 0 0 S
Package Designator
RC = 64-Ball Easy BGA, leaded
PC = 64-Ball Easy BGA, lead-free
Device Details
Third Generation – Character S
thru Z
Group Designator
48F = Flash Memory only
Ballout Designator
0 = Discrete ballout
Flash Density
0 = No die
3 = 128-Mbit
Parameter, Mux Configuration
0 = No boot Configuration
Product Family
J = Intel® Embedded Flash Memory
0 = No die
I/O Voltage, CE# Configuration
Z = 3.0 V, Individual Chip
Enable(s)
Table 45: Valid Line Item Combinations for SCSP Family
256-Mbit
RC48F3300J0Z00S
PC48F3300J0Z00S
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