CMOS, 1.8 V to 5.5 V/±2.5 V, 3 Ω Low Voltage 4-/8-Channel Multiplexers ADG708/ADG709 Data Sheet FEATURES FUNCTIONAL BLOCK DIAGRAMS 1.8 V to 5.5 V single supply ±2.5 V dual supply 3 Ω on resistance 0.75 Ω on resistance flatness 100 pA leakage currents 14 ns switching times Single 8-to-1 multiplexer ADG708 Differential 4-to-1 multiplexer ADG709 16-lead TSSOP package Low power consumption TTL-/CMOS-compatible inputs Qualified for automotive applications ADG708 S1 D S8 APPLICATIONS A1 A0 00041-001 1 OF 8 DECODER A2 EN Figure 1. Data acquisition systems Communication systems Relay replacement Audio and video switching Battery-powered systems ADG709 S1A DA GENERAL DESCRIPTION S4A The ADG708/ADG709 are low voltage, CMOS analog multiplexers comprising eight single channels and four differential channels, respectively. The ADG708 switches one of eight inputs (S1 to S8) to a common output, D, as determined by the 3-bit binary address lines A0, A1, and A2. The ADG709 switches one of four differential inputs to a common differential output as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices is used to enable or disable the device. When disabled, all channels are switched off. Low power consumption and an operating supply range of 1.8 V to 5.5 V make the ADG708/ADG709 ideal for batterypowered, portable instruments. All channels exhibit breakbefore-make switching action preventing momentary shorting when switching channels. These switches are designed on an enhanced submicron process that provides low power dissipation yet gives high switching speed, very low on resistance, and leakage currents. On resistance is in the region of a few ohms and is closely matched between switches and very flat over the full signal range. These parts can operate equally well as either multiplexers or demultiplexers and have an input signal range that extends to the supplies. S1B DB S4B A0 A1 EN 00041-002 1 OF 4 DECODER Figure 2. PRODUCT HIGHLIGHTS 1. 2. 3. 4. 5. Single-/dual-supply operation. The ADG708/ADG709 are fully specified and guaranteed with 3 V and 5 V single-supply and ±2.5 V dual-supply rails. Low RON (3 Ω typical). Low power consumption (<0.01 μW). Guaranteed break-before-make switching action. Small 16-lead TSSOP package. The ADG708/ADG709 are available in a 16-lead TSSOP. Rev. D Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks arethe property of their respectiveowners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. 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Technical Support www.analog.com ADG708/ADG709 Data Sheet TABLE OF CONTENTS Features .....................................................................................1 Truth Tables......................................................................... 11 Applications...............................................................................1 Typical Performance Characteristics ....................................... 12 General Description ..................................................................1 Test Circuits............................................................................. 15 Functional Block Diagrams .......................................................1 Terminology ............................................................................ 18 Product Highlights ....................................................................1 Applications Information ........................................................ 19 Revision History ........................................................................2 Power Supply Sequencing .................................................... 19 Specifications.............................................................................3 Outline Dimensions ................................................................ 20 Dual Supply ...........................................................................7 Ordering Guide ................................................................... 20 Absolute Maximum Ratings ......................................................9 Automotive Products........................................................... 20 ESD Caution ..........................................................................9 Pin Configurations and Function Descriptions .......................10 REVISION HISTORY 1/13−Rev. C to Rev. D 8/06−Rev. A to Rev. B Changes to Ordering Guide .....................................................20 Updated Format ...........................................................Universal Changes to Absolute Maximum Ratings Section....................... 9 Added Table 7 and Table 8....................................................... 10 Updated Outline Dimensions.................................................. 18 Changes to Ordering Guide..................................................... 18 4/09−Rev. B to Rev. C Changes to Table 1.....................................................................3 Changes to Table 2.....................................................................5 Changes to Table 3.....................................................................7 Moved Truth Tables Section ....................................................11 Changes to Figure 7, Figure 8, and Figure 9.............................12 Changes to Figure 13 and Figure 14.........................................13 Moved Terminology Section....................................................18 Changes to Ordering Guide .....................................................20 4/02—Rev. 0 to Rev. A Edits to Features and Product Highlights .................................. 1 Change to Specifications ....................................................... 2–4 Edits to Absolute Maximum Ratings Notes ............................... 5 Edits to TPCs 2, 5, 6–9, 11, and 15 ........................................ 7–9 Edits to Test Circuits 9 and 10 ................................................. 11 Addition of Test Circuit 11 ...................................................... 11 10/00—Revision 0: Initial Version Rev. D | Page 2 of 20 Data Sheet ADG708/ADG709 SPECIFICATIONS VDD = 5 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted. Table 1. Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On Resistance Match Between Channels (ΔRON) On Resistance Flatness (RFLAT (ON)) +25°C B Version −40°C to −40°C to +85°C +125°C 0 V to VDD 5 7 0.8 1.5 Drain Off Leakage, ID (Off ) ±0.01 Channel On Leakage, ID, IS (On) ±0.01 4.5 0.4 1.65 ±20 ±20 ±20 7 Ω max Ω typ 0.8 1.5 Ω max Ω typ 1.2 1.65 Ω max ±20 ±20 nA typ ±0.1 ±0.01 ±0.3 ±0.1 ±0.01 ±0.75 ±0.1 ±0.75 2.4 0.8 0.005 ±1 ±6 nA max nA typ nA max nA typ VIN = VINL or VINH RL = 300 Ω, CL = 35 pF; see Figure 24 VS1 = 3 V/0 V, VS8 = 0 V/3 V RL = 300 Ω, CL = 35 pF 14 14 ns typ Break-Before-Make Time Delay, tOPEN 8 tON (EN) 14 tOFF (EN) 7 Charge Injection ±3 Off Isolation −60 −80 25 25 ns max ns typ 1 1 25 25 12 12 ±3 ns min ns typ ns max ns typ ns max pC typ −60 −80 dB typ dB typ 8 14 25 25 7 12 12 Rev. D | Page 3 of 20 VD = VS = 1 V or 4.5 V; see Figure 23 ±0.1 2 1 VD = 4.5 V/1 V, VS = 1 V/4.5 V; see Figure 22 V min V max 2 1 VDD = 5.5 V VD = 4.5 V/1 V, VS = 1 V/4.5 V; see Figure 21 2.4 0.8 Digital Input Capacitance, CIN DYNAMIC CHARACTERISTICS1 tTRANSITION 25 VS = 0 V to VDD, IDS = 10 mA VS = 0 V to VDD, IDS = 10 mA nA max μA typ μA max pF typ 25 VS = 0 V to VDD, IDS = 10 mA; see Figure 20 ±6 0.005 ±0.1 Test Conditions/ Comments V 5 ±0.01 ±20 Unit Ω typ 0.75 1.2 ±0.01 0 V to VDD 3 0.75 LEAKAGE CURRENTS Source Off Leakage, IS (Off) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH 0 V to VDD 3 4.5 0.4 +25°C C Version −40°C to −40°C to +85°C +125°C VS = 3 V; see Figure 25 RL = 300 Ω, CL = 35 pF VS = 3 V; see Figure 26 RL = 300 Ω, CL = 35 pF VS = 3 V; see Figure 26 VS = 2.5 V, RS = 0 Ω, CL = 1 nF; See Figure 27 RL = 50 Ω, CL = 5 pF, f = 10 MHz RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 28 ADG708/ADG709 Data Sheet B Version −40°C to −40°C to +85°C +125°C C Version −40°C to −40°C to +85°C +125°C −80 −80 dB typ −3 dB Bandwidth 55 55 MHz typ CS (Off ) CD (Off ) ADG708 ADG709 CD, CS (On) ADG708 ADG709 POWER REQUIREMENTS IDD 13 13 pF typ Test Conditions/ Comments RL = 50 Ω, CL = 5 pF, f = 10 MHz RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 29 RL = 50 Ω, CL = 5 pF; see Figure 30 f = 1 MHz 85 42 85 42 pF typ pF typ f = 1 MHz f = 1 MHz 96 48 96 48 pF typ pF typ f = 1 MHz f = 1 MHz VDD = 5.5 V Digital inputs = 0 V or 5.5 V Parameter Channel-to-Channel Crosstalk +25°C −60 0.001 0.001 1.0 1 +25°C −60 1.0 1.0 Guaranteed by design, not subject to production test. Rev. D | Page 4 of 20 1.0 Unit dB typ μA typ μA max Data Sheet ADG708/ADG709 VDD = 3 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted. Table 2. Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On Resistance Match Between Channels (ΔRON) +25°C B Version −40°C to −40°C to +85°C +125°C 0 V to VDD 8 11 0.4 ±0.01 Drain Off Leakage, ID (Off ) ±0.01 Channel On Leakage, ID, IS (On) ±0.01 0 V to VDD 8 12 1.2 LEAKAGE CURRENTS Source Off Leakage, IS (Off ) 14 11 0.4 2 12 1.2 ±20 ±20 ±20 ±20 ±20 ±0.1 ±0.01 ±0.3 ±0.1 ±0.01 ±0.75 ±0.1 ±0.75 2 ±1 ±6 Ω max Ω typ nA max nA typ nA max nA typ VIN = VINL or VINH ±0.1 RL = 300 Ω, CL = 35 pF; see Figure 24 VS1 = 2 V/0 V, VS2 = 0 V/2 V RL = 300 Ω, CL = 35 pF 18 ns typ 30 30 ns max ns typ 1 1 30 30 15 15 Break-Before-Make Time Delay, tOPEN 8 8 tON (EN) 18 tOFF (EN) 8 Charge Injection ±3 ±3 ns min ns typ ns max ns typ ns max pC typ Off Isolation −60 −60 dB typ −80 −80 dB typ −60 −60 dB typ −80 −80 dB typ 55 55 MHz typ 18 30 8 15 Channel-to-Channel Crosstalk −3 dB Bandwidth 30 15 Rev. D | Page 5 of 20 VS = VD = 1 V or 3 V; see Figure 23 V min V max 18 1 VS = 3 V/1 V, VD = 1 V/3 V; see Figure 22 2.0 0.8 2 1 VDD = 3.3 V VS = 3 V/1 V, VD = 1 V/3 V; see Figure 21 nA max 2 30 VS = 0 V to VDD, IDS = 10 mA Ω max μA typ μA max pF typ 30 VS = 0 V to VDD, IDS = 10 mA; see Figure 20 ±6 0.005 ±0.1 Digital Input Capacitance, CIN DYNAMIC CHARACTERISTICS 1 tTRANSITION 14 Test Conditions/ Comments V nA typ 2.0 0.8 0.005 Unit Ω typ ±0.01 ±20 DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH +25°C C Version −40°C to −40°C to +85°C +125°C VS = 2 V; see Figure 25 RL = 300 Ω, CL = 35 pF VS = 2 V; see Figure 26 RL = 300 Ω, CL = 35 pF VS = 2 V; see Figure 26 VS = 1.5 V, RS = 0 Ω, CL = 1 nF; see Figure 27 RL = 50 Ω, CL = 5 pF, f = 10 MHz RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 28 RL = 50 Ω, CL = 5 pF, f = 10 MHz RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 29 RL = 50 Ω, CL = 5 pF; see Figure 30 ADG708/ADG709 Parameter CS (Off ) CD (Off ) ADG708 ADG709 CD, CS (On) ADG708 ADG709 POWER REQUIREMENTS IDD Data Sheet +25°C 13 B Version −40°C to −40°C to +85°C +125°C Unit pF typ Test Conditions/ Comments f = 1 MHz 85 42 85 42 pF typ pF typ f = 1 MHz f = 1 MHz 96 48 96 48 pF typ pF typ f = 1 MHz f = 1 MHz VDD = 3.3 V Digital inputs = 0 V or 3.3 V 0.001 0.001 1.0 1 +25°C 13 C Version −40°C to −40°C to +85°C +125°C 1.0 1.0 Guaranteed by design, not subject to production test. Rev. D | Page 6 of 20 1.0 μA typ μA max Data Sheet ADG708/ADG709 DUAL SUPPLY VDD = 2.5 V ± 10%, VSS = –2.5 V ± 10%, GND = 0 V, unless otherwise noted. Table 3. Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On Resistance Match Between Channels (ΔRON) On Resistance Flatness (RFLAT (ON)) +25°C B Version −40°C to −40°C to +85°C +125°C VSS to VDD 2.5 4.5 0.4 5 7 0.8 1.5 1.65 Channel On Leakage, ID, IS (On) ±0.01 ±20 ±20 ±20 ±20 ±20 Ω max Ω typ 0.8 1.5 1.0 1.65 Ω max Ω typ Ω max nA typ ±0.1 ±0.01 ±0.3 ±0.1 ±0.01 ±0.75 ±0.1 ±0.75 1.7 0.7 0.005 ±1 ±6 nA max nA typ nA max nA typ RL = 300 Ω, CL = 35 pF; see Figure 24 VS = 1.5 V/0 V; see Figure 24 RL = 300 Ω, CL = 35 pF ns typ 25 25 ns max ns typ 1 1 25 25 15 15 ±3 ns min ns typ ns max ns typ ns max pC typ −60 −60 dB typ −80 −80 dB typ 14 tOFF (EN) 8 Charge Injection ±3 Off Isolation 8 1 1 14 25 25 8 15 15 Rev. D | Page 7 of 20 VS = VD = +2.25 V/−1.25 V; see Figure 23 VIN = VINL or VINH 14 tON (EN) VS = +2.25 V/−1.25 V, VD = −1.25 V/+2.25 V; see Figure 22 ±0.1 14 25 VDD = +2.75 V, VSS = −2.75 V VS = +2.25 V/−1.25 V, VD = −1.25 V/+2.25 V; see Figure 21 V min V max 2 25 VS = VSS to VDD, IDS = 10 mA VS = VSS to VDD, IDS = 10 mA 1.7 0.7 2 8 VS = VSS to VDD, IDS = 10 mA; see Figure 20 nA max μA typ μA max pF typ Break-Before-Make Time Delay, tOPEN Test Conditions/ Comments ±6 0.005 ±0.1 Digital Input Capacitance, CIN DYNAMIC CHARACTERISTICS 1 tTRANSITION V Ω typ 7 ±0.01 ±20 Unit 5 0.6 ±0.01 ±0.01 DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH 4.5 0.4 0.6 Drain Off Leakage, ID (Off ) VSS to VDD 2.5 1.0 LEAKAGE CURRENTS Source Off Leakage, IS (Off ) +25°C C Version −40°C to −40°C to +85°C +125°C VS = 1.5 V; see Figure 25 RL = 300 Ω, CL = 35 pF VS = 1.5 V; see Figure 26 RL = 300 Ω, CL = 35 pF VS = 1.5 V; see Figure 26 VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 27 RL = 50 Ω, CL = 5 pF, f = 10 MHz RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 28 ADG708/ADG709 Data Sheet B Version −40°C to −40°C to +85°C +125°C C Version −40°C to −40°C to +85°C +125°C −80 −80 dB typ −3 dB Bandwidth 55 55 MHz typ CS (Off ) CD (Off ) ADG708 ADG709 CD, CS (On) ADG708 ADG709 POWER REQUIREMENTS IDD 13 13 pF typ Test Conditions/ Comments RL = 50 Ω, CL = 5 pF, f = 10 MHz RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 29 RL = 50 Ω, CL = 5 pF; see Figure 30 f = 1 MHz 85 42 85 42 pF typ pF typ f = 1 MHz f = 1 MHz 96 48 96 48 pF typ pF typ f = 1 MHz f = 1 MHz VDD = 2.75 V Digital inputs = 0 V or 2.75 V Parameter Channel-to-Channel Crosstalk ISS 1 +25°C −60 0.001 +25°C −60 0.001 1.0 1.0 1.0 1.0 0.001 1.0 1.0 1.0 1.0 0.001 Guaranteed by design not subject to production test. Rev. D | Page 8 of 20 Unit dB typ μA typ μA max μA typ μA max VSS = −2.75 V Digital inputs = 0 V or 2.75 V Data Sheet ADG708/ADG709 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 4. Parameter VDD to VSS VDD to GND VSS to GND Analog Inputs 1 Digital Inputs 1 Peak Current, S or D (Pulsed at 1 ms, 10% Duty Cycle Maximum) Continuous Current, S or D Operating Temperature Industrial Temperature Range Storage Temperature Range Junction Temperature TSSOP Package, Power Dissipation θJA Thermal Impedance θJC Thermal Impedance Lead Temperature, Soldering Vapor Phase (60 sec) Infrared (15 sec) Rating 7V −0.3 V to +7 V +0.3 V to −3.5 V VSS − 0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first −0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first 100 mA Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating can be applied at any one time. ESD CAUTION 30 mA −40°C to +125°C −65°C to +150°C 150°C 432 mW 150.4°C/W 27.6°C/W 215°C 220°C Overvoltages at A, EN, S, or D are clamped by internal codes. Current should be limited to the maximum ratings given. 1 Rev. D | Page 9 of 20 ADG708/ADG709 Data Sheet PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS A0 1 16 A1 A0 1 16 A1 EN 2 15 A2 EN 2 15 GND VSS 3 13 VDD S1A 4 ADG709 12 S5 S2A 5 TOP VIEW (Not to Scale) 6 11 S6 S3A 6 11 S3B S4 7 10 S7 S4A 7 10 S4B D 8 DA 8 4 ADG708 S2 5 TOP VIEW (Not to Scale) S3 9 S8 Figure 3. ADG708 Pin Configuration 14 V DD 13 S1B 12 S2B 9 DB 00041-004 3 S1 00041-003 14 GND VSS Figure 4. ADG709 Pin Configuration Table 5. ADG708 Pin Function Descriptions Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Mnemonic A0 EN VSS S1 S2 S3 S4 D S8 S7 S6 S5 VDD GND A2 A1 Description Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7). Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7). Most Negative Power Supply Pin in Dual-Supply Applications. For single-supply applications, it should be tied to GND. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Drain Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Most Positive Power Supply Pin. Ground (0 V) Reference. Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7). Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7). Table 6. ADG709 Pin Function Descriptions Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Mnemonic A0 EN VSS S1A S2A S3A S4A DA DB S4B S3B S2B S1B VDD GND A1 Description Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 8). Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 8). Most Negative Power Supply Pin in Dual-Supply Applications. For single-supply applications, it should be tied to GND. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Drain Terminal. Can be an input or output. Drain Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Source Terminal. Can be an input or output. Most Positive Power Supply Pin. Ground (0 V) Reference. Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 8). Rev. D | Page 10 of 20 Data Sheet ADG708/ADG709 TRUTH TABLES Table 7. ADG708 Truth Table A2 X1 0 0 0 0 1 1 1 1 1 A1 X1 0 0 1 1 0 0 1 1 A0 X1 0 1 0 1 0 1 0 1 EN 0 1 1 1 1 1 1 1 1 Switch Condition None 1 2 3 4 5 6 7 8 X = Don’t care. Table 8. ADG709 Truth Table A1 X1 0 0 1 1 1 A0 X1 0 1 0 1 EN 0 1 1 1 1 On Switch Pair None 1 2 3 4 X = Don’t care. Rev. D | Page 11 of 20 ADG708/ADG709 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 8 8 TA = 25°C VSS = 0V 7 VDD = 3V VSS = 0V 7 +125°C 6 5 VDD = 3.3V 4 VDD = 4.5V VDD = 5.5V 3 4 –40°C 3 2 2 1 1 0 1 2 3 4 VD OR VS – DRAIN OR SOURCE VOLTAGE (V) 5 +25°C 0 00041-005 0 +85°C 5 0 Figure 5. On Resistance as a Function of VD (VS) for Single Supply 0.5 1.0 1.5 2.0 2.5 VD OR VS – DRAIN OR SOURCE VOLTAGE (V) 3.0 00041-008 VDD = 2.7V ON RESISTANCE (Ω) ON RESISTANCE (Ω) 6 Figure 8. On Resistance as a Function of VD (VS) for Different Temperatures, Single Supply 6 8 VDD = +2.5V VSS = –2.5V TA = 25°C 7 5 ON RESISTANCE (Ω) 5 4 VDD = +2.25V VSS = –2.25V 3 +125°C 4 2 –40°C 2 1 VDD = +2.75V VSS = –2.75V 0 –3.0 –2.5 –2.0 –1.5 –1.0 –0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 VD OR VS – DRAIN OR SOURCE VOLTAGE (V) 0 –2.5 00041-006 1 Figure 6. On Resistance as a Function of VD (VS) for Dual Supply –2.0 –1.5 –1.0 –0.5 0 0.5 1.0 1.5 7 VDD = 5V VSS = 0V TA = 25°C 0.08 CURRENT (nA) 6 +125°C 4 +25°C –2.5 Figure 9. On Resistance as a Function of VD (VS) for Different Temperatures, Dual Supply VDD = 5V VSS = 0V 5 2.0 VD OR VS – DRAIN OR SOURCE VOLTAGE (V) 0.12 8 ON RESISTANCE (Ω) +25°C +85°C 3 00041-009 ON RESISTANCE (Ω) 6 +85°C 3 ID (ON) 0.04 0 IS (OFF) –0.04 2 ID (OFF) –0.08 –40°C 0 1 2 3 4 VD OR VS – DRAIN OR SOURCE VOLTAGE (V) 5 00041-007 –0.12 0 0 Figure 7. On Resistance as a Function of VD (VS) for Different Temperatures, Single Supply Rev. D | Page 12 of 20 1 3 2 VS, (VD = VDD – VS) (V) 4 Figure 10. Leakage Currents as a Function of VD (VS) 5 00041-010 1 Data Sheet ADG708/ADG709 0.08 VDD = 3V VSS = 0V TA = 25°C 0.04 ID (ON) 0.35 VDD = +3V 0.30 0.25 CURRENT (nA) CURRENT (nA) 0.12 0 IS (OFF) –0.04 ID (OFF) 0.20 0.15 ID (ON) 0.10 0 0.5 2.5 1.0 1.5 2.0 VD, (VS = VDD – VD) (V) 3.0 0 00041-011 –0.12 0 40 80 60 100 120 Figure 14. Leakage Currents as a Function of Temperature 0.12 10m VDD = +2.5V VSS = –2.5V TA = 25°C 0.08 TA = 25°C 1m CURRENT (A) 0 IS (OFF) –0.04 VDD = +2.5V VSS = –2.5V 100µ ID (ON), VS = VD 0.04 ID (OFF) 10µ VDD = +5V 1µ VDD = +3V 100n –0.08 1.5 2.0 2.5 1n 10 00041-012 –0.12 0.5 1.0 –3.0 –2.5 –2.0 –1.5 –1.0 –0.5 0 VS, (VD = VDD – VS) (V) 3.0 100 1k 10k 100k FREQUENCY (Hz) 1M 10M 00041-015 10n Figure 15. Supply Current vs. Input Switching Frequency Figure 12. Leakage Currents as a Function of VD (VS) 0 0.35 VDD = 5V TA = 25°C VDD = +5V VSS = 0V AND VDD = +2.5V VSS = –2.5V 0.25 –20 ATTENUATION (dB) 0.30 0.20 0.15 ID (OFF) 0.10 IS (OFF) ID (ON) 0.05 40 60 80 100 120 TEMPERATURE (°C) 00041-013 20 –60 –80 –100 0 0 –40 –120 30k 100k 1M FREQUENCY (Hz) 10M Figure 16. Off Isolation vs. Frequency Figure 13. Leakage Currents as a Function of Temperature Rev. D | Page 13 of 20 100M 00041-016 CURRENT (nA) 20 TEMPERATURE (°C) Figure 11. Leakage Currents as a Function of VD (VS) CURRENT (nA) ID (OFF) IS (OFF) 0.05 00041-014 –0.08 ADG708/ADG709 Data Sheet 20 0 TA = 25°C –40 0 –60 –20 –100 –30 100k 1M FREQUENCY (Hz) 10M 100M Figure 17. Crosstalk vs. Frequency VDD = 5V TA = 25°C –10 –15 1M FREQUENCY (Hz) 10M 100M 00041-018 ATTENUATION (dB) –5 100k –40 –3 VDD = +2.5V VSS = –2.5V –2 –1 0 1 2 VOLTAGE (V) 3 Figure 19. Charge Injection vs. Source Voltage 0 –20 30k VDD = +3V VSS = 0V –10 –80 –120 30k VDD = +5V VSS = 0V Figure 18. On Response vs. Frequency Rev. D | Page 14 of 20 4 5 00041-019 10 QINJ (pC) –20 00041-017 ATTENUATION (dB) VDD = 5V TA = 25°C Data Sheet ADG708/ADG709 TEST CIRCUITS IDS VDD VSS VDD VSS V1 S1 S D ID (OFF) S2 D A S8 RON = V1/IDS VD VS GND Figure 20. On Resistance IS(OFF) 0.8V EN Figure 22. ID (OFF) VDD VSS VDD VSS VDD VSS VDD VSS S1 A ID (ON) S1 D S2 VS 00041-022 00041-020 VS D A S8 VD S8 GND Figure 21. IS (OFF) VIN VSS VDD VSS 3V S1 A1 50Ω Figure 23. ID (ON) VDD A2 2.4V EN 00041-023 GND VS 00041-021 VD 0.8V EN ADDRESS DRIVE (VIN) VS1 50% 50% 0V S2 TO S7 A0 2.4V VS8 S8 VS1 EN CL 35pF RL 300Ω GND 90% VOUT D VOUT 90% VS8 tTRANSITION *SIMILAR CONNECTION FOR ADG709. tTRANSITION 00041-024 ADG708* Figure 24. Switching Time of Multiplexer, tTRANSITION VDD VSS VDD VIN 50Ω 3V A2 VSS S1 A1 S2 TO S7 ADDRESS DRIVE (VIN) VS 0V A0 2.4V S8 VOUT D EN GND RL 300Ω CL 35pF VOUT 80% 80% tOPEN *SIMILAR CONNECTION FOR ADG709. Figure 25. Break-Before-Make Delay, tOPEN Rev. D | Page 15 of 20 00041-025 ADG708* ADG708/ADG709 Data Sheet VDD VDD VSS 3V VSS ENABLE DRIVE (VIN) A2 VS S1 tOFF (EN) S2 TO S8 VO ADG708* EN VIN 50% 0V A1 A0 50% VOUT D CL 35pF RL 300Ω GND 50Ω 0.9VO 0.9VO OUTPUT 0V 00041-026 tON (EN) *SIMILAR CONNECTION FOR ADG709. Figure 26. Enable Delay, tON (EN), tOFF (EN) VDD A2 VDD VSS 3V VSS LOGIC INPUT (VIN) 0V A1 RS VS ADG708* D S CL VOUT 1nF EN VIN ΔVOUT VOUT QINJ = CL × ΔVOUT GND 00041-027 A0 *SIMILAR CONNECTION FOR ADG709. Figure 27. Charge Injection VDD VSS 0.1µF 0.1µF VDD NETWORK ANALYZER VSS A2 A1 S 50Ω 50Ω A0 VS D 2.4V EN RL 50Ω OFF ISOLATION = 20 log 00041-028 GND VOUT VOUT VS Figure 28. Off Isolation VSS VDD 0.1µF 0.1µF V A2 DD VSS EN A1 NETWORK ANALYZER 50Ω VS 50Ω NETWORK ANALYZER D S1 RL 50Ω S2 S8 VOUT GND *SIMILAR CONNECTION FOR ADG709. CHANNEL-TO-CHANNEL CROSSTALK = 20 log VOUT VS Figure 29. Channel-to-Channel Crosstalk Rev. D | Page 16 of 20 00041-029 A0 2.4V ADG708* Data Sheet ADG708/ADG709 VSS VDD 0.1µF 0.1µF NETWORK ANALYZER VSS VDD A2 A1 S 50Ω A0 VS D EN RL 50Ω GND INSERTION LOSS = 20 log VOUT WITH SWITCH VOUT WITHOUT SWITCH Figure 30. Bandwidth Rev. D | Page 17 of 20 VOUT 00041-030 2.4V ADG708/ADG709 Data Sheet TERMINOLOGY VDD Most positive power supply potential. VSS Most negative power supply in a dual-supply application. In single-supply applications, tie VSS to ground at the device. GND Ground (0 V) reference. tON (EN) Delay time between the 50% and 90% points of the EN digital input and the switch on condition. tOFF (EN) Delay time between the 50% and 90% points of the EN digital input and the switch off condition. S Source terminal. Can be an input or output. D Drain terminal. Can be an input or output. tOPEN Off time measured between the 80% points of both switches when switching from one address state to another. Ax Logic control input. Off Isolation A measure of unwanted signal coupling through an off switch. EN Active high enable. Crosstalk A measure of unwanted signal that is coupled through from one channel to another as a result of parasitic capacitance. RON Ohmic resistance between D and S. RFLAT (ON) Flatness is defined as the difference between the maximum and minimum value of on resistance as measured over the specified analog signal range. IS (Off) Source leakage current with the switch off. Charge A measure of the glitch impulse transferred from injection of the digital input to the analog output during switching. Bandwidth The frequency at which the output is attenuated by 3 dB. On Response The frequency response of the on switch. ID (Off) Drain leakage current with the switch off. On Loss The loss due to the on resistance of the switch. ID, IS (On) Channel leakage current with the switch on. VINL Maximum input voltage for Logic 0. VD (VS) Analog voltage on Terminal D and Terminal S. CS (Off) Off switch source capacitance. Measured with reference to ground. CD (Off) Off switch drain capacitance. Measured with reference to ground. CD, CS (On) On switch capacitance. Measured with reference to ground. CIN Digital input capacitance. tTRANSITION Delay time measured between the 50% and 90% points of the digital inputs and the switch on condition when switching from one address state to another. VINH Minimum input voltage for Logic 1. IINL (IINH) Input current of the digital input. IDD Positive supply current. ISS Negative supply current. Rev. D | Page 18 of 20 Data Sheet ADG708/ADG709 APPLICATIONS INFORMATION POWER SUPPLY SEQUENCING When using CMOS devices, take care to ensure correct power supply sequencing. Incorrect power supply sequencing can result in the device being subjected to stresses beyond the maximum ratings listed in Figure 4. Always apply digital and analog inputs after power supplies and ground. For single-supply operation, tie VSS to GND as close to the device as possible. Rev. D | Page 19 of 20 ADG708/ADG709 Data Sheet OUTLINE DIMENSIONS 5.10 5.00 4.90 16 9 4.50 4.40 4.30 6.40 BSC 1 8 PIN 1 1.20 MAX 0.15 0.05 0.20 0.09 0.30 0.19 0.65 BSC COPLANARITY 0.10 SEATING PLANE 0.75 0.60 0.45 8° 0° COMPLIANT TO JEDEC STANDARDS MO-153-AB Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters ORDERING GUIDE Model 1, 2 ADG708BRU ADG708BRU-REEL ADG708BRU-REEL7 ADG708BRUZ ADG708BRUZ-REEL ADG708BRUZ-REEL7 ADG708CRU ADG708CRU-REEL ADG708CRUZ ADG708CRUZ-REEL ADG708CRUZ-REEL7 ADW54008-0REEL7 ADG709BRU ADG709BRU-REEL ADG709BRU-REEL7 ADG709BRUZ ADG709BRUZ-REEL ADG709BRUZ-REEL7 ADG709CRU-REEL7 ADG709CRUZ ADG709CRUZ-REEL ADG709CRUZ-REEL7 1 2 Temperature Range −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C Package Description 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline 16-Lead Thin Shrink Small Outline Package Package Package Package Package Package Package Package Package Package Package Package Package Package Package Package Package Package Package Package Package Package [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] [TSSOP] Package Option RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 RU-16 Z = RoHS Compliant Part. W = Qualified for Automotive Applications. AUTOMOTIVE PRODUCTS The ADW54008 models are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models. ©2000–2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D00041-0-1/13(D) Rev. D | Page 20 of 20