HIGH CURRENT MOLDED POWER INDUCTORS L810HW SERIES 1. PART NO. EXPRESSION : L810HW-1R0MF(a) (b) (c) (d)(e) (f) (a) Series code (d) Tolerance code : M = ±20% (b) Type code (e) F : RoHS Compliant (c) Inductance code : 1R0 = 1.0uH (f) 11 ~ 99 : Internal controlled number 2. CONFIGURATION & DIMENSIONS : A' C' A C D L E B' B SWORLD R47 H G PCB Pattern Unit:m/m A' A B' B C' C D E G H L 13.9 Max. 12.7±0.3 13.5 Max. 12.7±0.3 3.7 Max. 3.5 Max. 2.5±0.5 3.0±0.5 7.0 Ref. 4.5 Ref. 15.0 Ref. 3. SCHEMATIC : 4. MATERIALS : a b (a) Core (b) Wire (c) Terminal c 5. FEATURES : a) Shielded Construction b) Frequency up to 5MHz NOTE : Specifications subject to change without notice. Please check our website for latest information. 25.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 HIGH CURRENT MOLDED POWER INDUCTORS L810HW SERIES 6. GENERAL SPECIFICATION : a) Test Freq. : Q : 100KHz/1.0V b) Ambient Temp. : 20°C c) Operating Temp. : -55°C to +125°C d) Storage Temp. : -55°C to +125°C e) Humidity Range : 50 ~ 60% RH f) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately ǻT=40°C without core loss. g) Saturation Current (Isat) : Will cause L 0 to drop approximately 20% typ. h) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions. 7. ELECTRICAL CHARACTERISTICS : Inductance L 0 ( µH ) ±20% @ 0 Adc Test Frequency ( Hz ) Irms (A) Typ. Isat (A) Typ. DCR ( mȍ ) Max. Q Min. L810HW-R47MF- 0.47 1.0V/100K 32 44 2.0 12 L810HW-R68MF- 0.68 1.0V/100K 28 40 2.5 12 L810HW-R82MF- 0.82 0.25V/100K 25 38 3.0 - L810HW-1R0MF- 1.00 1.0V/100K 24 36 3.5 20 L810HW-1R5MF- 1.50 1.0V/100K 19 28 5.5 20 L810HW-2R2MF- 2.20 1.0V/100K 16 20 8.0 20 L810HW-3R3MF- 3.30 1.0V/100K 12 18 12 20 L810HW-4R7MF- 4.70 1.0V/100K 10 16 15 20 L810HW-6R8MF- 6.80 1.0V/100K 9 13 22 20 L810HW-100MF- 10.0 1.0V/100K 7 9.5 34 20 Part No. NOTE : Specifications subject to change without notice. Please check our website for latest information. 25.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 HIGH CURRENT MOLDED POWER INDUCTORS L810HW SERIES 8. CHARACTERISTICS CURVES : INDUCTANCE VS. FREQUENCY Q VS. FREQUENCY INDUCTANCE VS. DC CURRENT TEMP. RISE VS. DC CURRENT NOTE : Specifications subject to change without notice. Please check our website for latest information. 25.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 HIGH CURRENT MOLDED POWER INDUCTORS L810HW SERIES 8. CHARACTERISTICS CURVES : L810HW-R47MFL810HW SMPI120 -R47MF 3HW-R4 7 L810HW-R68MFSML810HW PI12 03 -R68MF H W-R6 8 100 1.5 100 90 90 1.2 70 60 0.4 50 40 30 0.2 INDUCTANCE (uH) 0.6 TEMP. RISE( oC) INDUCTANCE (uH) 80 20 80 70 0.9 60 50 0.6 40 30 0.3 20 10 0 10 0 0 8.8 17.6 26.4 35.2 T EM P. RISE( oC) 0.8 0 44 0 0 DC CURRENT(A) 8.8 17.6 26 .4 35.2 44 DC CURR ENT(A ) -1R0MFLMPI1203HW-1R0 810H W -1R 0M F SL810HW L810HW-R82MFL810HW-R82MF 100 1.5 90 80 70 0.9 60 50 0.6 40 30 0.3 TEMP. RISE(oC) INDUCTANCE (uH) 1.2 20 10 0 0 0 8 16 24 32 40 DC CURRENT(A) L810HW -2R2MFL810HW -2R 2M F SMPI1 20 3HW-2R2 L810HW-1R5MFL810HW-1R5MF SMPI12 03HW-1R5 4 100 100 90 90 3.2 70 1.8 60 50 1.2 40 30 0.6 20 INDUCTANCE (uH) 80 T EM P. RISE( oC) INDUCTANCE (uH) 2.4 80 70 2.4 60 50 1.6 40 30 0.8 20 10 10 0 0 0 5.6 11.2 16.8 22.4 28 TEMP. RISE(oC) 3 0 0 0 4 DC CURRENT(A) 8 12 16 20 24 DC CURRENT (A) NOTE : Specifications subject to change without notice. Please check our website for latest information. 25.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 HIGH CURRENT MOLDED POWER INDUCTORS L810HW SERIES 8. CHARACTERISTICS CURVES : L810HW-4R7MFL810HW-4R7MF SMPI120 3HW-4R7 L810HW-3R3MFL810HW -3R3MF SMPI1203HW-3R3 100 100 8 90 90 80 3.6 60 50 2.4 40 30 1.2 INDUCTANCE (uH) 70 80 6.4 TEMP. RISE(oC) 20 70 60 4.8 50 40 3.2 30 20 1.6 10 0 10 0 0 4 8 12 16 0 20 0 0 4 DC CURRENT (A) 8 12 16 DC CURRENT(A) L810HW-100MF SL810HW-100MFMPI1203HW-100 L810HW-6R8MFL810HW-6R8MF SMPI1203HW-6R8 10 15 100 100 90 90 12 70 6 60 50 4 40 30 2 20 INDUCTANCE (uH) 80 TEMP. RISE(oC) INDUCTANCE (uH) 8 80 70 9 60 50 6 40 30 3 20 10 10 0 0 0 2.6 5.2 7.8 20 10.4 13 TEM P. RISE( oC) I NDUCTANCE (uH) 4.8 TEMP. RISE(oC) 6 0 0 0 2 .2 DC CURRENT (A) 4.4 6.6 8.8 11 DC CURRENT(A) NOTE : Specifications subject to change without notice. Please check our website for latest information. 25.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 HIGH CURRENT MOLDED POWER INDUCTORS L810HW SERIES 9. CORE LOSS : 100KHz and 500KHz 40000 material gauss loss K W /3m3 K W /m 30000 20000 500KHZ 10000 100KHZ 0 0 200 400 600 800 1000 gauss gauss 100KHz 500KHz 100 - 266 200 - 1,234 300 351.7 2,932 400 665.9 5,195 500 1,039 8,336 600 1,471 12,025 700 1,923 15,715 800 2,537 20,444 900 3,148 25,429 1000 3,902 31,002 100KHz 4000 material gauss loss KKW /3m3 W /m 3000 2000 1000 0 200 400 600 800 1000 gau ss gauss 100KHz 300 351.7 400 665.9 500 1,039 600 1,471 700 1,923 800 2,537 900 3,148 1000 3,902 500KHz 40000 KW W /m K /m 3 3 30000 20000 10000 0 0 200 400 600 800 1000 g au ss gauss NOTE : Specifications subject to change without notice. Please check our website for latest information. 25.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 HIGH CURRENT MOLDED POWER INDUCTORS L810HW SERIES 10. RELIABILITY AND TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Refer to standard electrical characteristics list Inductance HP4284A, CH11025, CH3302, CH1320, CH1320S LCR meter. DCR CH16502, Agilent33420A Micro-Ohm Meter. Heat Rated Current (Irms) Irms(A) will cause the coil temperature rise approximately ǻT=40°C without core loss 1. Applied the allowed DC current 2. Temperature measured by digital surface thermometer Saturation Current (Isat) Isat(A) will cause Lo to drop approximately 20% Mechanical Performance Test Solderability Test More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 245°C 150°C Solder Heat Resistance 60 seconds Natural cooling 4±1 seconds 1. Appearance : No significant abnormality 2. Inductance change : Within ±20% Preheating 260°C 150°C 60 seconds Preheat : 150°C, 60sec. Solder : Sn99.95-Cu0.05 Solder Temperature : 245±5°C Flux for lead free : rosin Dip Time : 4±1sec. Dipping Natural cooling Preheat : 150°C, 60sec. Solder : Sn99.95-Cu0.05 Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. 10±0.5 seconds Reliability Test High Temperature Life Test Temperature : 125±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Low Temperature Life Test 1. Appearance : No damage Thermal Shock 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : -55±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Conditions of 1 cycle. Step Temperature (°C) 1 -55±3 30±3 2 Room Temperature Within 3 Times (min.) 3 +125±3 30±3 4 Room Temperature Within 3 Total : 5 cycles Measure at room temperature after placing for 2 to 3 hrs. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Random Vibration Test Appearance : Cracking, shipping and any other defects harmful to the characteristics should not be allowed. Temperature : 40±5°C Humidity : 90% to 95% Applied Current : Rated Current Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). NOTE : Specifications subject to change without notice. Please check our website for latest information. 25.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 HIGH CURRENT MOLDED POWER INDUCTORS L810HW SERIES 11. SOLDERING AND MOUNTING : 11-1. Recommended PC Board Pattern 7.0 4.0 4.5 4.0 11-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 11-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 11-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. Soldering 10s max. Natural cooling 250~260 230 180 150 60~120s 30~60s Preheating TEMPERATURE °C TEMPERATURE °C Preheating 280 Soldering Natural cooling 260 150 Over 1min. Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 25.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 HIGH CURRENT MOLDED POWER INDUCTORS L810HW SERIES 12. PACKAGING INFORMATION : 12-1. Reel Dimension COVER TAPE ØC B D 2.0±0.5 A EMBOSSED CARRIER Type A(mm) B(mm) C(mm) D(mm) 13" x 24mm 24.0±0.5 100±2.0 13.5±0.5 330 Ø1.5+0.1 2.0±0.1 t P 0.15 MIN Bo W F 4.0±0.1 1.75±0.1 12-2 Tape Dimension Ko Ao Series Ao(mm) Bo(mm) Ko(mm) P(mm) W(mm) F(mm) t(mm) L810HW 13.5±0.1 13.9±0.1 4.5±0.1 16.0±0.1 24.0±0.3 11.5±0.1 0.35±0.05 12-3. Packaging Quantity Size L810HW Chip / Reel 600 Inner Box 1200 Carton 4800 NOTE : Specifications subject to change without notice. Please check our website for latest information. 25.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9 HIGH CURRENT MOLDED POWER INDUCTORS L810HW SERIES 12-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. F 165° to 180° Top cover tape Room Temp. (°C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5~35 45~85 860~1060 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 25.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 10