Infineon IFX9201SG 6 a h-bridge with spi Datasheet

IFX9201SG
6 A H-Bridge with SPI
Data Sheet
Rev. 1.1, 2015-02-15
Automotive Power
IFX9201SG
Table of Contents
Table of Contents
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
2.1
2.2
2.3
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Output Stages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Protection and Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Current Limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Short Circuit to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Short Circuit to Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Short Circuit over Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Overtemperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Undervoltage Shut-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Open Load Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5
5.1
5.2
5.3
General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
9
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Data Sheet
2
4
4
4
5
17
17
18
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6 A H-Bridge with SPI
1
IFX9201SG
Overview
Features
•
•
•
•
•
•
•
•
•
•
RDSon of 100 mΩ per switch typ. at Tj=25 °C
Logic inputs 3.3 V and 5.0 V TTL/CMOS-compatible
Low standby current
Chopper current limitation
Short circuit shut down with latch behavior
Overtemperature shut down with latch behavior
VS undervoltage shutdown
Open load detection in ON and OFF state
Detailed SPI diagnosis or simple error flag
Green product (RoHS compliant)
PG-DSO-12-17
Description
The IFX9201SG is a general purpose 6 A H-Bridge, designed for the control of DC motors or other inductive loads.
The outputs can be pulse width modulated at frequencies up to 20kHz. PWM/DIR control reduces the number of
PWM capable pins needed on the microcontroler side.
For load currents above the current limitation threshold (8A typ.) the H-Bridge goes into chopper current limitation
mode. It is protected against short circuits and overtemperature and provides extensive diagnosis via SPI or basic
feedback via error flag. Open load can be detected when the bridge is disabled or during PWM operation of
inductive loads.
The robust PG-DSO-12-17 package provides excellent thermal capabilites due to the thick copper heat slug.
Thanks to the protruding edges of the heatslug the package is well suited for automatic optical solder inspection.
The IFX9201SG is not qualified and manufactured according to the requirements of Infineon Technologies with
regards to automotive and/or transportation applications. For automotive applications please refer to the
TLE9201SG.
Type
Package
Marking
IFX9201SG
PG-DSO-12-17
IFX9201SG
Data Sheet
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IFX9201SG
Pin Configuration
2
Pin Configuration
2.1
Pin Assignment
(top view)
DIR
1
12
PWM
VSO
2
11
DIS
SO
3
10
SCK
VS
4
9
CSN
OUT1
5
8
SI
GND
6
7
OUT2
heat slug (GND)
Figure 1
Pin Assignment IFX9201SG
2.2
Pin Definitions and Functions
Pin
Symbol
Function
1
DIR
Direction input to define direction of the motor current
2
VSO
Supply pin for SO output. Connect to 5V or 3.3V depending on desired logic level
3
SO
SPI serial output
4
VS
Supply voltage
5
OUT1
Output 1
6
GND
Ground
7
OUT2
Output 2
8
SI
SPI serial input
9
CSN
SPI chip select (low active)
10
SCK
SPI clock input
11
DIS
Disable. Disables the outputs (all MOSFETS off)
12
PWM
Pulse width modulation input
Data Sheet
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IFX9201SG
Pin Configuration
2.3
Terms
IVS
I DIS
IDIR
VDIS
I PWM
VDIR
I SCK
I SI
I SO
IVSO
Figure 2
Data Sheet
VSCK
VSI
VS
VVS
DIR
PWM
VPWM
I CSN
VCSN
DIS
VSO
VVSO
OUT1
I OUT1
CSN
SCK
SI
OUT2
SO
IOUT2
VOUT2
VOUT1
VSO
GND
Terms IFX9201SG
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IFX9201SG
Block Diagram
3
Block Diagram
VS
internal
Supply
DIS
Charge
Pump
Gate Driver
DIR
PWM
Control
Logic
Current
Monitor
CSN
OUT1
OUT2
SCK
SI
Temperature
Monitor
SO
VSO
GND
Figure 3
Data Sheet
Block Diagram
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IFX9201SG
Block Description
4
Block Description
4.1
Power Supply
All internal supply voltages are derived from the pin VS. A charge pump provides the gate voltage for the high side
switches. The charge pump does not require an external capacitor.
The output buffer of the digital output SO is supplied by the pin VSO. Therefore the output level at SO can be easily
configured for 3.3 V or 5 V logic by connecting VSO to the respective voltage.
4.2
Sleep Mode
In order to minimize current consumption during inactive phases the device can be put into sleep mode by pulling
the VSO pin to GND. This functionality can also be used to provide a second switch off path for the outputs similar
to an enable pin, simply by driving VSO directly from a microcontroller output.
Since VSO is supplying also the output buffer of the SO signal it has to be ensured that the microcontroller output
can provide sufficient current. Alternatively an external mosfet or a driver stage could be used to switch the VSO
supply voltage. To account for dynamic switching currents it might be advisable to buffer VSO with a small
capacitor (see Figure 7 “Application Example VSO as Enable Input” on Page 24).
Please note that the push pull stage of the SO output provides a current return path to VSO via the bulk diode of
the highside mosfet. Therefore it has to be ensured that the voltage at SO never exceeds the voltage at VSO by
more than 0.3V.
sleep_mode
+
VSO
v_vso_sleep
SO
spi_serial_out
Figure 4-1 SO output buffer
Data Sheet
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IFX9201SG
Block Description
4.3
Output Stages
The output stages consist of four n-channel mosfets in H-bridge configuration. The outputs are protected against
short circuits and over temperature.
The bridge is controlled using the inputs PWM and DIR. The signal at DIR is defining the direction of the driven
DC motor whereas the PWM signal sets the duty cycle.
The outputs can be set tristate (i.e. high side and low side switches are turned off) by setting DIS to high level.
HS2
OFF
HS1
ON
HS1
ON
IL
HS2
OFF
IL
M
M
LS2
ON
LS1
OFF
LS2
OFF
LS1
OFF
DIR=1, PWM=1
DIR=1, PWM=0
Forward
Freewheeling Through HS 2
Body Diode (Forward)
HS1
OFF
HS2
ON
HS1
OFF
HS2
ON
IL
IL
M
M
LS2
OFF
LS1
ON
LS2
OFF
LS1
OFF
DIR=0, PWM=1
DIR=0, PWM=0
Reverse
Freewheeling Through HS 1
Body Diode (Reverse)
Figure 4-2 Operation Modes
Table 4-1
Output Truth Table
DIS
PWM
DIR
OUT1
OUT2
Comment
1
X
X
Z
Z
disabled, outputs tristate
0
1
1
H
L
forward / clockwise
0
1
0
L
H
reverse / counterclockwise
0
0
1
H
Z
freewheeling in HS (forward)
0
0
0
Z
H
freewheeling in HS (reverse)
Data Sheet
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IFX9201SG
Block Description
4.4
Protection and Diagnostics
Both output stages of the IFX9201SG are equipped with fault diagnostic functions:
•
•
•
•
Short to supply voltage (SCVS)
Short to ground (SCG)
Open load (OL)
Over-temperature (OT)
4.5
Current Limitation
To limit the output current a chopper current limitation is integrated. Current measurement for current limitation is
done in the high side path.
ttrans
tb
HS2
HS1
IL
I OUT
M
LS1
LS2
time
Figure 4-3 Chopper Current Limitation
Figure 4-3 shows the behavior of the current limitation for over current detection in HS1. It applies accordingly
also for HS2.
When the current in high-side switch of OUT1 (HS1) exceeds the limit IL longer than the blanking time tb, the low
side switch of OUT2 (LS2) is switched off, independent of the input signal at PWM. This leads to freewheeling
through the bulk diode of HS2 and therefore to a decrease of the load current. As soon as the current falls below
IL, OUT2 is switched back to normal operation, i.e. the outputs follow the inputs according to the truth table. To
avoid high switching frequencies in case of low inductive loads the minimum time between two transitions is limited
to ttrans.
Data Sheet
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IFX9201SG
Block Description
4.6
Short Circuit to Ground
short circuit detected
both outputs off
current
current limitation,
freewheeling in HS
ISC
current tracking
IL
t< tb
tb
tsdf
I OUT
time
Short
PWM
DIR
OUT1
OUT2
tristate
tristate
tristate
Figure 4-4 Short to Ground Detection
The short circuit to ground detection is activated when the current through one of the high side switches rises over
the threshold ISC and remains higher than ISC for at least the filter time tsdf within the blanking time tb. Both outputs
will be switched off and the failure will be reported in the SPI diagnosis register. The outputs can be re-activated
by disabling and enabling the bridge via the disable signal DIS, pulling VSO to GND or by a reset command via
SPI.
4.7
Short Circuit to Supply
A short circuit to the supply voltage VS is detected in the same way as a short circuit to ground, only in the low
side switch instead of the high side switch.
4.8
Short Circuit over Load
Short circuit over load will trigger the short circuit detection either of the high side or the low side switch (whichever
is faster).
4.9
Overtemperature
In case of high DC-currents, insufficient cooling or high ambient temperature, the chip temperature may rise above
the thermal shut-down temperature TjSD. In that case, all output transistors are turned off. Overtemperature
shutdown is latching.
The outputs can be re-activated as soon as the junction temperature has fallen below the switch-on temperature
TjSO.
Data Sheet
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IFX9201SG
Block Description
4.10
Undervoltage Shut-Down
If the supply voltage at the VS pins falls below the undervoltage detection threshold VUV_OFF, the outputs are turned
off. The undervoltage detection is not latching. That means that as soon as VS rises above VUV_ON again, the
device is returning to normal operation.
4.11
Open Load Detection
4.11.1
Open Load Detection in OFF state
When the bridge is disabled (DIS=high) the open load in OFF detection becomes active. Two diagnostic current
sources will then be connected to the outputs, a pull up current source at OUT1 and a pull down current source at
OUT2. The pull down current source is stronger than the pull up current source and therefore will pull down OUT1
if a load is present. If no load is present OUT1 will be pulled high by the pull up current source. This is detected
by a comparator and reported in the SPI diagnosis register.
Please note that capacitors that might be placed at the outputs for EMC reasons first have to be discharged by
the pull down current source at OUT2 for the open load detection to work properly.
Also, if current is flowing through the load at the time of disabling the freewheeling current will force the outputs
towards supply voltage VS. This may lead to an erroneous reporting of open load.
Therefore the first diagnostic reading after disabling should be discarded and a second reading should be taken
after the load is deenergized and the output capacitors are discharged completely.
The open load detection can be disabled by setting the OLDIS bit in the CTRL_REG register. This will disconnect
the diagnostic current sources and suppress the reporting of open load in the DIA_REG register.
5V int.
OUT1
Vref_OL
+
-
M
OUT2
OL
Figure 4-5 Open Load Detection in OFF state
4.11.2
Open Load Detection in ON state
The IFX9201SG contains an open load diagnosis during operation for inductive loads. It evaluates whether
freewheeling occurs in the switching phase. In order to avoid inadvertent triggering of the open load diagnosis a
failure counter is implemented. There have to be at least 5 occurances of the internal open load signal (i.e. 5 PWM
pulses without freewheeling detected) before open load is reported in the SPI diagnosis register.
Depending on the operation conditions and on external circuitry like the output capacitors it is possible that open
load is indicated although the load is present. This might be the case for example during a direction change or for
small load currents respectively small PWM duty cycles. Therefore it is recommended to evaluate the open load
diagnosis only in known suitable operating conditions and to ignore it otherwise.
The open load diagnosis is not latching.
Data Sheet
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Rev. 1.1, 2015-02-15
IFX9201SG
Block Description
4.12
Serial Peripheral Interface (SPI)
For diagnosis purposes the IFX9201SG is equipped with a “Serial Peripheral Interface“ (SPI).
The SPI of several IFX9201SGs can be connected in daisy chain configuration in order to save microcontroller
interface pins.
The IFX9201SG is configured as a “slave” device. This means that the µC as the master is providing the chip
select (CSN) and clock signal (SCK).
A data transfer on the SPI bus is initiaded with a falling edge on CSN and is terminated by a rising edge on CSN.
The data on the serial input pin SI is sampled with the falling edge of SCK, the serial data output at SO is
determined by the rising clock edge. The data is transferred “MSB first”.
The word length of the SPI is 8 bit. Please note that there is no check for the number of clocks within a SPI frame.
Any low pulse at CSN will be regarded as one frame.
4.12.1
Error Flag
Between the falling edge of CSN and the first rising edge of SCK an additional error flag signal is set
asynchronously at the SO pin. The error flag signal set to high whenever the output stages are shut down (tristate)
due to a failure or due to disabling of the output stages. Additionally the EF signal is OR’ed with the SI input signal.
By connecting the SO of one device to the SI of the next device the EF signal can be routed through similar to a
SPI daisy chain configuration.
This flag can be used for simple error feedback without SPI communication by connecting SCK and CSN to GND
permanently (see Figure 5 “Application Example H-Bridge with Error Flag” on Page 22).
CSN
1
9
3
SCK
10
5
7
SI
6
6
5
Command n
4
3
2
1
0
SI: Data will be accepted on the falling edge of SCK-Signal
4
SO
8
2
Z
EF
Answer to Command n-1
7
6
5
4
3
2
1
0
7
Z
EF
SO: State will change on the rising edge of SCK-Signal
Figure 4-6 SPI Timing Definition (drawing not to scale)
Data Sheet
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Rev. 1.1, 2015-02-15
IFX9201SG
Block Description
4.12.2
SPI Register Description
The IFX9201SG provides detailed diagnosis and the option to control the outputs via SPI. Following commands
are available (x=don’t care, d=data):
Table 4-2
SPI Command Set
Command
Input Byte
Description
RD_DIA
000x xxxx
Read Diagnosis Register
RES_DIA
100x xxxx
Reset Diagnosis Register
RD_REV
001x xxxx
Read Device Revision Number
RD_CTRL
011x xxxx
Read Control Register
WR_CTRL
111d dddd
Write Control - sets and returns Control Register values
WR_CTRL_RD_DIA
110d dddd
Write Control and Read Diagnosis- sets Control Register values and
returns Diagnosis Register values
The first SPI response provided after power up is the device revision number (RD_REV). For any unspecified
commands the device will respond with the content of the diagnosis register (RD_DIA).
The registers are addressed wordwise.
Data Sheet
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IFX9201SG
Block Description
4.12.2.1
Control Register
Control Register
CTRL_REG
Offset
ControlRegister
Reset Value
01H
7
5
00H
4
3
2
1
0
CMD
OLDIS
SIN
SEN
SDIR
SPWM
rw
rw
rw
rw
rw
rw
Field
Bits
Type
Description
CMD
7:5
rw
Command
011: RD_CTRL
110: WR_CTRL_RD_DIA
111: WR_CTRL
OLDIS
4
rw
Open Load Disconnect
1: Open load current source disconnected.
SIN
3
rw
SPI control
0: Control outputs via PWM/DIR inputs
1: Control outputs via SPI
Note: can only be set if DIS=0 and PWM=0 and DIR=0.
Any change of the DIS, PWM or DIR signals will reset
this bit and revert to standard control via PWM/DIR
SEN
2
rw
1: Enable outputs in case of SPI control (SIN=1)
0: Disable outputs in case of SPI control (SIN=1)
SDIR
1
rw
DIR Signal in case of SPI control (SIN=1)
SPWM
0
rw
PWM Signal in case of SPI control (SIN=1)
Data Sheet
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Rev. 1.1, 2015-02-15
IFX9201SG
Block Description
4.12.2.2
Diagnosis Register
Diagnosis Register
DIA_REG
Offset
Diagnosis Register
Reset Value
00H
DFH
7
6
5
4
3
2
1
0
EN
OT
TV
CL
DIA4
DIA3
DIA2
DIA1
r
r
r
r
r
r
r
r
Field
Bits
Type
Description
EN
7
r
1= outputs enabled by low signal on pin DIS
0 = outputs disabled by high signal on pin DIS
OT
6
r
0 = overtemperature shutdown
TV
5
r
Always 0 - used for transmission validation
CL
4
r
0 = current limitation active
DIA4
3
r
Diagnosis bit 4
DIA3
2
r
Diagnosis bit 3
DIA2
1
r
Diagnosis bit 2
DIA1
0
r
Diagnosis bit 1
Diagnosis Truth Table
The short circuit and VS undervoltage diagnosis is coded in the DIA bits according to the following truth table.
Together with transmission validation bit TV (always 0) it is ensured that there is always at least one 1->0 change
at SO during a valid transmission. Therefore a “stuck at” failure of the SO pin can be detected.
Table 4-3
Encoding of Diagnosis Bits (sorted by hex value, only listed combinations are valid)
Type
DIA4 DIA3 DIA2 DIA1 Hex Comment
No failure
1
1
1
1
0xF -
Short to GND at OUT1 (SCG1)
1
1
1
0
0xE latched
Short to VS at OUT1 (SCVS1)
1
1
0
1
0xD latched
Open Load (OL)
1
1
0
0
0xC not latched
Short to GND at OUT2 (SCG2)
1
0
1
1
0xB latched
Short to GND at OUT1 and OUT2 (SCG1, SCG2)
1
0
1
0
0xA latched
Short to VS at OUT1 and short to GND at OUT2 (SCVS1, SCG2) 1
0
0
1
0x9
latched
Short to Supply at OUT2 (SCVS2)
0
1
1
1
0x7
latched
Short to GND at OUT1 and short to VS at OUT2 (SCG1, SCVS2) 0
1
1
0
0x6
latched
Short to VS at OUT1 and OUT2 (SCVS1, SCVS2)
0
1
0
1
0x5
latched
VS Undervoltage (VS_UV)
0
0
1
1
0x3
not latched
Data Sheet
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Rev. 1.1, 2015-02-15
IFX9201SG
Block Description
Reset Behavior of Diagnosis Register
The diagnosis register is reset by the following events
Table 4-4
Diagnosis Reset Types
Name
Type
Comment
POR
Power On Reset
Reset due to power up, undervoltage or sleep mode
ENR
Enable Reset
Reset due to disabling/enabling of the outputs by DIS pin or bit SEN in CTRL_REG
SPIR
SPI Reset
Reset by sending the RES_DIA command via SPI
A change of the DIR signal will lead to a reset of current limitation (CL) or open load in on (OL) error messages.
The open load in on failure will also be reset automatically if the open load condition no longer persits, i.e.
freewheeling is detected for five or more consecutive pulses.
4.12.2.3
Revision Register
The Revision Register contains the device revision corresponding to the mask set.
Revision Register
REV_REG
Offset
Revision Register
Reset Value
01H
00H
7
6
5
4
3
0
0
0
1
0
REV
r
r
r
r
r
Field
Bits
Type
Description
0
7
r
fixed to 0
0
6
r
fixed to 0
1
5
r
fixed to 1
0
4
r
fixed to 0
REV
3:0
r
Device Revision corresponding to mask set
Data Sheet
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Rev. 1.1, 2015-02-15
IFX9201SG
General Product Characteristics
5
General Product Characteristics
5.1
Absolute Maximum Ratings
Table 1
Absolute Maximum Ratings1)
Tj = -40 °C to 125 °C; (unless specified otherwise)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note /
Test Condition
Number
Junction temperature
Tj
-40
–
150
°C
–
P_5.1.1
Storage temperature
Ts
-55
–
150
°C
–
P_5.1.2
Supply voltage
VVS
-0.3
–
40
V
–
P_5.1.4
Supply for logic output
VVSO
-0.3
–
5.5
V
–
P_5.1.5
Voltage at logic inputs
VIN
-0.3
–
5.5
V
–
P_5.1.6
Voltage at logic output SO
VSO
-0.3
–
VVSO
V
both conditions must P_5.1.7
be observed
+0.3
-0.3
–
5.5
ESD Susceptibility
ESD Susceptibility to GND
acc. HBM
VESD
-2
–
2
kV
HBM2)
P_5.1.8
ESD Susceptibility to GND
acc. CDM
VESD
-500
–
500
V
CDM3)
P_5.1.9
ESD Susceptibility to GND
acc. CDM, Corner Pins
VESD
-750
–
750
V
CDM3), Corner Pins
P_5.1.10
1) Not subject to production test, specified by design.
2) ESD susceptibility HBM according to EIA/JESD22-A114-B (1.5kΩ, 100pF)
3) ESD susceptibility, Charged Device Model “CDM” EIA/JESD22-C101
Notes
1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not
designed for continuous repetitive operation.
Data Sheet
17
Rev. 1.1, 2015-02-15
IFX9201SG
General Product Characteristics
5.2
Functional Range
Table 2
Functional Range1)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note /
Test Condition
Number
Supply voltage range
VS
VUV_OFF
–
36
V
–
P_5.2.1
VS supply voltage slew rate
dVS/dt
-10
–
10
V/µs
–
P_5.2.2
SO buffer supply voltage
VSO
2.9
–
5.5
V
–
P_5.2.3
Junction Temperature
Tj
-40
–
125
°C
–
P_5.2.4
1) Not subject to production test, specified by design.
Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the Electrical Characteristics table.
5.3
Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Table 3
Thermal Resistance1)
Parameter
Junction to Case
Junction to Ambient
Symbol
RthJC
RthJA
Values
Min.
Typ.
Max.
–
–
2
–
30
–
Unit
Note /
Test Condition
Number
K/W
–
P_5.3.1
K/W
2)
P_5.3.2
1) Not subject to production test, specified by design.
2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm board with 2 inner copper layers (2 × 70 µm Cu, 2 × 35 µm
Cu). Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
Data Sheet
18
Rev. 1.1, 2015-02-15
IFX9201SG
Electrical Characteristics
6
Electrical Characteristics
Table 4
Electrical Characteristics
VVS = 8 V to 36 V; VVSO = 5.0 V; Tj = -40 °C to 125 °C; (unless specified otherwise)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note / Test Condition
Number
fPWM = 2 kHz; IOUT = 0 A; P_6.0.1
VVS = 13.5 V;
VVS = 13.5 V; VVSO = 0 V; P_6.0.2
VOUTx = 0 V; Tj = 25 °C
Supply
Supply Current
IVS
–
5
13
mA
Supply Current Sleep Mode
IVS
–
19
30
µA
VSO Sleep Mode Threshold
VVSO_sleep 0.5
–
2.0
V
–
P_6.0.4
VSO Input Current, CSN high IVSO
–
–
100
µA
P_6.0.5
VSO Input Current, CSN low IVSO
–
–
1.0
mA
ISO = 0 A; VCSN > 2 V
ISO = 0 A; VCSN = 0 V
VUV OFF
VUV ON
VUV HY
tUV
3.5
4.2
5.0
V
Switch Off Threshold
P_6.0.7
3.6
4.4
5.2
V
Switch On Threshold
P_6.0.8
100
200
500
mV
Hysteresis
P_6.0.9
–
1
–
µs
–
P_6.0.10
Vinput_L
Vinput_H
Vinput_HYS
Iin_pd
Cin
–
–
0.8
V
–
P_6.0.11
2.0
–
–
V
–
P_6.0.12
0.1
0.3
–
V
–
P_6.0.13
9
38
85
µA
P_6.0.14
–
–
15
pF
Vin = 5.5 V
Vbias = 2 V;
Vtest = 20 mVpp;
P_6.0.6
VS Undervoltage
Undervoltage at VS
Undervoltage at VS
Undervoltage at VS
VS Undervoltage Detection
Filter Time 1)
Inputs PWM, DIR, SCK, SI
Low level
High level
Hysteresis
Pull Down Current
1)
Input Capacity
P_6.0.15
f = 1 MHz
Inputs DIS, CSN
Low level
High level
Hysteresis
Pull Up Current
1)
Input Capacity
Vinput_L
Vinput_H
Vinput_HYS
Iin_pu
Cin
–
–
0.8
V
–
P_6.0.16
2.0
–
–
V
–
P_6.0.17
0.1
0.3
–
V
–
P_6.0.18
9
38
85
µA
P_6.0.19
–
–
15
pF
Vin = 0 V
Vbias = 2 V;
Vtest = 20 mVpp;
P_6.0.20
f = 1 MHz
Data Sheet
19
Rev. 1.1, 2015-02-15
IFX9201SG
Electrical Characteristics
Table 4
Electrical Characteristics
VVS = 8 V to 36 V; VVSO = 5.0 V; Tj = -40 °C to 125 °C; (unless specified otherwise)
Parameter
Symbol
Values
Unit
Note / Test Condition
Number
ISO = -1 mA
ISO = 1 mA ;
2.9 V < VVSO < 5.5 V
0V < VSO < VVSO;
VVSO = 5.5 V
Vbias = 2 V;
Vtest = 20 mVpp;
P_6.0.21
Min.
Typ.
Max.
0.0
–
0.4
V
VVSO
V
Output SO
VSO_L
VSO_H
Low level
High level
VVSO- –
0.75
Tristage Leakage Current
ISO
-5
–
5
µA
Output Capacity1)
CSO
–
–
19
pF
P_6.0.22
P_6.0.23
P_6.0.24
f = 1 MHz
Power Outputs OUT1, OUT2
ROUTL
On resistance low side
ROUTH
On resistance high side
IOUT1(off)
IOUT2(off)
Leakage current
–
100
–
mΩ
–
–
200
mΩ
–
100
–
mΩ
–
–
200
mΩ
-25
–
25
µA
IOUT = 2 A; Tj = 25 °C
IOUT = 2 A; Tj = 125 °C
IOUT = 2 A; Tj = 25 °C
IOUT = 2 A; Tj = 125 °C
VVS = 13.5 V;
P_6.0.25
P_6.0.26
P_6.0.27
Outputs off; OLDIS high
-100
–
25
µA
VVS = 13.5 V;
Sleep Mode
Free-wheel diode forward
voltage
UD
–
0.9
1.0
V
ID = 2 A
P_6.0.28
dVOUT/dt
dVOUT/dt
0.20
–
1.62
V/µs
P_6.0.29
1.15
–
8.1
V/µs
VVS = 13.5 V;
RLoad = 6.8 Ω
fPWM
0
–
20
kHz
–
P_6.0.33
td_on(HS)
td_off(HS)
td_on(LS)
td_off(LS)
td_dis
td_en
tf_en
twu
–
–
80
µs
P_6.0.34
–
–
80
µs
VVS = 13.5 V;
RLoad = 6.8 Ω
–
–
10
µs
P_6.0.36
–
–
10
µs
P_6.0.37
–
–
80
µs
P_6.0.38
–
–
80
µs
P_6.0.39
0.4
–
3
µs
P_6.0.40
–
–
1
ms
VSO high --> OUT high
P_6.0.41
IL
tb
ttrans
6.0
8.0
10.0
A
VVS = 13.5 V
P_6.0.42
5
8
13
µs
–
P_6.0.43
–
95
–
µs
–
P_6.0.44
Output Switching Times 2)
Voltage Slew Rate HS
Voltage Slew Rate LS
1)
PWM Frequency
Output Delay Times
2)
Output on-delay HS
Output off-delay HS
Output on-delay LS
Output off-delay LS
Disable delay time
Enable delay time
1)
Disable/Enable filter time
Wake Up delay time
P_6.0.31
1)
P_6.0.35
Chopper Current Limitation
Current Limit
1)
Blanking time
1)
Minimum transition time
Data Sheet
20
Rev. 1.1, 2015-02-15
IFX9201SG
Electrical Characteristics
Table 4
Electrical Characteristics
VVS = 8 V to 36 V; VVSO = 5.0 V; Tj = -40 °C to 125 °C; (unless specified otherwise)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note / Test Condition
Number
VVS = 13.5 V
P_6.0.45
Short Circuit Detection
Short circuit detection
threshold high side switch
ISC_H
8.0
11.5
14.5
A
Short circuit detection
threshold low side switch
ISC_L
8.0
11.5
14.5
A
P_6.0.46
Current tracking high side
ISC_H - IL
ISC_L - IL
tsdf
2.0
4.0
5.2
A
P_6.0.47
1.8
3.5
5.2
A
P_6.0.48
–
2
–
µs
–
IOUT1_OL
IOUT2_OL
Ratio_IOL
tf_OL
60
140
200
µA
200
350
500
µA
VVS = 13.5 V; VOUT1 = 0V P_6.0.50
VVS = VOUT2 = 13.5 V
P_6.0.51
1.8
2.5
3.5
–
–
P_6.0.52
40
–
–
µs
–
P_6.0.53
tcyc
tlead
tlag
tv
490
–
–
ns
Referred to master
P_6.0.54
50
–
–
ns
Referred to master
P_6.0.55
150
–
–
ns
Referred to master
P_6.0.56
–
–
–
–
150
230
ns
CL = 200 pF
CL = 350 pF
Referred to IFX9201SG
P_6.0.57
40
–
–
ns
Referred to master
P_6.0.58
40
–
–
ns
Referred to master
P_6.0.59
–
–
100
ns
Referred to IFX9201SG
P_6.0.60
2
–
–
µs
Referred to master
P_6.0.61
250
–
–
ns
Referred to master
P_6.0.62
250
–
–
ns
Referred to master
P_6.0.63
TjSD
150
175
–
°C
–
P_6.0.64
Thermal Switch-On Junction TjSO
Temperature1)
125
–
–
°C
–
P_6.0.65
Current tracking low side
Short Circuit detection filter
time1)
P_6.0.49
Open Load Detection in OFF State
Pull up Current at OUT1
Pull down Current at OUT2
Ratio of current sources
Open load detection in OFF
filter time1)
SPI Timing (see Figure 4-6)1)
Cycle-time (1)
Enable Lead Time (2)
Enable Lag Time (3)
Data Valid (4)
3)
Data Setup Time (5)
Data Hold Time (6)
Disable Time (7)
Transfer Delay (8)
Disable Lead Time (9)
Disable Lag Time (10)
tsu
th
tdis
td
tdld
tdlg
Thermal Shutdown
Thermal Shutdown Junction
Temperature1)
1) Not subject to production test, specified by design.
2) Output switching times are measured between 20% and 80% of the output swing
3) VSO timing thresholds are 20% / 80% of VVSO for 4.5V<VVSO<5.5V and 30% / 70% of VVSO for 2.9V<VVSO<4.5V
Data Sheet
21
Rev. 1.1, 2015-02-15
IFX9201SG
Application Information
7
Application Information
Note: The following information is given as a hint for the implementation of the device only and shall not be
regarded as a description or warranty of a certain functionality, condition or quality of the device. The function
of the described circuits must be verified in the real application
Supply Voltage
Vs<
40V
100uF
100nF
VS
3.3 or 5V digital supply
VSO
OUT1
DIS
M
PWM
OUT2
DIR
µC
<33 nF
CSN
<33 nF
SCK
SI
SO
GND
Figure 4
Application Example H-Bridge with SPI interface
Supply Voltage
Vs<
40V
100uF
100nF
VS
3.3 or 5V digital supply
VSO
OUT1
DIS
M
PWM
OUT2
DIR
µC
<33 nF
CSN
<33 nF
SCK
SI
SO
GND
Figure 5
Data Sheet
Application Example H-Bridge with Error Flag
22
Rev. 1.1, 2015-02-15
IFX9201SG
Application Information
VS
VSO
OUT1
DIS
M
PWM
OUT2
DIR
µC
<33 nF
CSN
<33 nF
SCK
SI
SO
GND
VS
VSO
OUT1
DIS
M
PWM
OUT2
DIR
<33 nF
CSN
<33 nF
SCK
SI
SO
GND
Figure 6
Data Sheet
SPI Daisy Chain Konfiguration (other signals omitted for clarity)
23
Rev. 1.1, 2015-02-15
IFX9201SG
Application Information
Supply Voltage
Vs<
40V
100uF
100nF
VS
3.3 or 5V digital supply
OUT1
DIS
PWM
M
DIR
OUT2
CSN
µC
<33 nF
SCK
<33 nF
SI
SO
VSO (EN)
GND
1nF
Figure 7
Application Example VSO as Enable Input
Reverse polarity protection via main relay
VS
Vs < 40V
main
relay
power
switch
100µF
100nF
supply
Reverse polarity protection using P -FET
10V
10k
Vs < 40V
VS
100µF
100nF
supply
Figure 8
Examples for Reverse Polarity Protection
The IFX9201SG is not protected against reverse polarity. External measures have to be taken to ensure the right
polarity of the supply voltage.
Data Sheet
24
Rev. 1.1, 2015-02-15
IFX9201SG
Package Outlines
8
Package Outlines
Figure 9
PG-DSO-12-17
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website:
http://www.infineon.com/packages.
Data Sheet
25
Dimensions in mm
Rev. 1.1, 2015-02-15
IFX9201SG
Revision History
9
Revision History
Revision
Date
Changes
0.1
2014-04-16
Initial Product Proposal
0.2
2014-07-08
Target Data Sheet
0.3
2014-08-19
P_5.2.1: Supply voltage range max. changed to 36V
Table 4: Voltage range for electrical characteristics changed to VVS = 8V to 36V
1.0
2015-01-30
Data Sheet
1.1
2015-02-15
Device description updated in Overview page (page 3)
Disclaimer updated
Data Sheet
26
Rev. 1.1, 2015-02-15
Edition 2015-02-15
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2015 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
The Infineon Technologies component described in this data sheet may be used in life-support devices or systems
and/or automotive, aviation and aerospace applications or systems only with the express written approval of
Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport, automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device
or system. Life support devices or systems are intended to be implanted in the human body or to support and/or
maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user
or other persons may be endangered.