Production specification Surface Mount Fast Switching Diodes MMBD4448DW FEATURES Pb z Fast switching speed. z For general purpose switching application. z Ultra-small surface mount package. z High conductance. Lead-free APPLICATIONS z For general purpose switching application. SOT-363 ORDERING INFORMATION Type No. Marking Package Code MMBD4448DW KA3 SOT-363 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Symbol Characteristic Value Unit VRM Non-repetitive peak reverse Voltage 100 V VRRM VRWM VR Peak repetitive reverse Voltage Working peak reverse voltage DC reverse voltage 75 V VR(RMS) RMS Reverse voltage 53 V IFM Forward continuous current 500 mA IO Average rectified output current 250 mA IFSM Non-Repetitive peak forward surge current @t<1.0μs @t<1.0s 4 2 A PD Power Dissipation 200 mW RθJA Thermal Resistance, Junction to Ambient 625 ℃/W Tj,Tstg Junction and Storage Temperature -65 to +150 ℃ G020 Rev.A www.gmesemi.com 1 Production specification Surface Mount Fast Switching Diodes MMBD4448DW ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified Parameter Symbol Test conditions MIN V(BR)R IR=10μA 75 0.62 VF IF=5.0mA IF=10mA IF=50mA IF=150mA Reverse current Reverse breakdown voltage MAX UNIT V 0.720 0.855 1.0 1.25 V IR VR=75V VR=75V，Tj=150℃ VR=25V，Tj=150℃ VR=20V 2.5 50 30 25 μA μA μA nA Total Capacitance CT VCB=10V,f=1.0MHz,IE=0 4.0 pF Reverse Recovery time trr IF=IR=10mA,Irr=0.1*IR,RL=100Ω 4.0 ns Forward voltage TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified G020 Rev.A www.gmesemi.com 2 Production specification Surface Mount Fast Switching Diodes MMBD4448DW PACKAGE OUTLINE Plastic surface mounted package SOT-363 A SOT-363 E K B D J G H C Dim Min Max A 2.00 2.20 B 1.15 1.35 C 0.95 Typical D 0.25 Typical E 0.25 0.40 G 0.60 0.70 H 0.02 0.10 J K 0.10 Typical 2.2 2.4 All Dimensions in mm SOLDERING FOOTPRINT 0.40 0.65 0.65 0.50 Unit : mm 1.90 PACKAGE INFORMATION Device Package Shipping MMBD4448DW SOT-363 3000/Tape&Reel G020 Rev.A www.gmesemi.com 3