SCHS340B − MARCH 2003 - REVISED JUNE 2003 D Inputs Are TTL-Voltage Compatible D Speed of Bipolar F, AS, and S, With E, M, OR PW PACKAGE (TOP VIEW) Significantly Reduced Power Consumption A /B 1A 1B 1Y 2A 2B 2Y GND D Balanced Propagation Delays D ±24-mA Output Drive Current D D − Fanout to 15 F Devices SCR-Latchup-Resistant CMOS Process and Circuit Design Exceeds 2-kV ESD Protection Per MIL-STD-883, Method 3015 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC G 4A 4B 4Y 3A 3B 3Y description/ordering information This quadruple 2-line to 1-line data selector/multiplexer is designed for 4.5-V to 5.5-V VCC operation. The CD74ACT157 features a common strobe (G) input. When the strobe is high, all outputs are low. When the strobe is low, a 4-bit word is selected from one of two sources and is routed to the four outputs. The device provides true data. ORDERING INFORMATION PDIP − E −55°C −55 C to 125 125°C C ORDERABLE PART NUMBER PACKAGE† TA SOIC − M TSSOP − PW Tube CD74ACT157E Tube CD74ACT157M Tape and reel CD74ACT157M96 Tube CD74ACT157PW Tape and reel CD74ACT157PWR TOP-SIDE MARKING CD74ACT157E ACT157M HM157 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUTS G A/B A B OUTPUT Y H X X X L L L L X L L L H X H L H X L L L H X H H Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated ! "#$ ! %#&'" ($) (#"! " !%$""! %$ *$ $! $+! !#$! !(( ,-) (#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCHS340B − MARCH 2003 - REVISED JUNE 2003 logic diagram (positive logic) 1A 2 4 3 1Y 1B 2A 5 7 2B 3A 6 11 9 3B 4A 10 G A/B 3Y 14 12 4B 2Y 13 4Y 15 1 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6 V Input clamp current, IIK (VI < 0 V or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 V or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous output current, IO (VO > 0 V or VO < VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA Package thermal impedance, θJA (see Note 2): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCHS340B − MARCH 2003 - REVISED JUNE 2003 recommended operating conditions (see Note 3) −55°C to 125°C TA = 25°C −40°C to 85°C UNIT MIN MAX MIN MAX MIN MAX 4.5 5.5 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO IOH Output voltage 0 High-level output current −24 IOL ∆t/∆v Low-level output current 24 Input transition rise or fall rate 10 High-level input voltage 2 2 0.8 VCC VCC 2 0.8 0 0 V V 0.8 V VCC VCC V −24 −24 mA 24 24 mA 10 10 ns/V VCC VCC 0 0 V NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN VOH VI = VIH or VIL VOL VI = VIH or VIL II ICC VI = VCC or GND VI = VCC or GND, DICC‡ VI = VCC − 2.1 V −55°C to 125°C TA = 25°C VCC MAX MIN −40°C to 85°C MAX MIN UNIT MAX IOH = −50 µA IOH = −24 mA IOH = −50 mA† 4.5 V 4.4 4.4 4.4 4.5 V 3.94 3.7 3.8 IOH = −75 mA† IOL = 50 µA 5.5 V 4.5 V 0.1 0.1 0.1 IOL = 24 mA IOL = 50 mA† IOL = 75 mA† 4.5 V 0.36 0.5 0.44 5.5 V V 3.85 3.85 5.5 V 5.5 V IO = 0 V 1.65 1.65 5.5 V ±0.1 ±1 ±1 µA 5.5 V 8 160 80 µA 2.4 3 2.8 mA 10 10 10 4.5 V to 5.5 V Ci pF † Test one output at a time, not exceeding 1-second duration. Measurement is made by forcing indicated current and measuring voltage to minimize power dissipation. Test verifies a minimum 50-Ω transmission-line drive capability at 85°C and 75-Ω transmission-line drive capability at 125°C. ‡ Additional quiescent supply current per input pin, TTL inputs high, 1 unit load ACT INPUT LOADING TABLE INPUT UNIT LOAD A or B 0.37 G 0.83 A/B 1.33 Unit load is ∆ICC limit specified in electrical characteristics table (e.g., 2.4 mA at 25°C). POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCHS340B − MARCH 2003 - REVISED JUNE 2003 switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V, CL = 50 pF (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B Any Y tPLH tPHL A/B Any Y tPLH tPHL G Any Y PARAMETER −55°C to 125°C −40°C to 85°C MIN MAX MIN MAX 2.4 9.5 2.5 8.6 2.4 9.5 2.5 8.6 3.6 14.5 3.8 13.2 3.6 14.5 3.8 13.2 3.4 13.5 3.6 12.3 3.4 13.5 3.6 12.3 UNIT ns ns ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd 4 Power dissipation capacitance POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYP UNIT 156 pF SCHS340B − MARCH 2003 - REVISED JUNE 2003 PARAMETER MEASUREMENT INFORMATION S1 R1 = 500 Ω From Output Under Test 2 × VCC Open GND CL = 50 pF (see Note A) R2 = 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND tw 3V 1.5 V Input LOAD CIRCUIT 1.5 V 0V VOLTAGE WAVEFORMS PULSE DURATION CLR Input 3V Reference Input 3V 1.5 V 1.5 V 0V 0V trec Data Input 3V 1.5 V CLK th tsu 1.5 V 10% 90% 90% tr 0V VOLTAGE WAVEFORMS RECOVERY TIME 3V 1.5 V 10% 0 V tf VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES 3V Input 1.5 V 1.5 V 0V tPLH In-Phase Output 50% 10% 90% 90% tr 90% 1.5 V 1.5 V 0V tPHL tPHL Out-of-Phase Output 3V Output Control VOH 50% VCC 10% VOL tf tPLH 50% VCC 10% tf 50% 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES Output Waveform 1 S1 at 2 × VCC (see Note B) tPLZ tPZL 20% VCC tPHZ tPZH Output Waveform 2 S1 at GND (see Note B) ≈VCC 20% VCC VOL 80% VCC VOH 80% VCC ≈0 V VOLTAGE WAVEFORMS OUTPUT ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns. Phase relationships between waveforms are arbitrary. D. For clock inputs, fmax is measured with the input duty cycle at 50%. E. The outputs are measured one at a time with one input transition per measurement. F. tPLH and tPHL are the same as tpd. G. tPZL and tPZH are the same as ten. H. tPLZ and tPHZ are the same as tdis. I. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD74ACT157E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT157EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT157M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74ACT157M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74ACT157PWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74ACT157M96 SOIC D 16 2500 333.2 345.9 28.6 CD74ACT157PWR TSSOP PW 16 2000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD74ACT157E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT157EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT157M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT157PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2010 provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74ACT157M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74ACT157PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74ACT157M96 SOIC D 16 2500 333.2 345.9 28.6 CD74ACT157PWR TSSOP PW 16 2000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated