TI CDC2351DBG4 1-line to 10-line clock driver with 3-state output Datasheet

CDC2351
1-LINE TO 10-LINE CLOCK DRIVER
WITH 3-STATE OUTPUTS
SCAS442D – FEBRUARY 1994 – REVISED SEPTEMBER 2000
D
D
D
D
D
D
D
D
D
D
DB OR DW PACKAGE
(TOP VIEW)
Low Output Skew, Low Pulse Skew for
Clock-Distribution and Clock-Generation
Applications
Operates at 3.3-V VCC
LVTTL-Compatible Inputs and Outputs
Supports Mixed-Mode Signal Operation
(5-V Input and Output Voltages With 3.3-V
VCC)
Distributes One Clock Input to Ten Outputs
Outputs Have Internal Series Damping
Resistor to Reduce Transmission Line
Effects
Distributed VCC and Ground Pins Reduce
Switching Noise
State-of-the-Art EPIC-ΙΙB  BiCMOS Design
Significantly Reduces Power Dissipation
Package Options Include Plastic
Small-Outline (DW) and Shrink
Small-Outline (DB) Packages
Available in Q-Temp Automotive
High Reliability Automotive Applications
Configuration Control / Print Support
Qualification to Automotive Standards
GND
Y10
VCC
Y9
OE
A
P0
P1
Y8
VCC
Y7
GND
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
GND
Y1
VCC
Y2
GND
Y3
Y4
GND
Y5
VCC
Y6
GND
description
The CDC2351 is a high-performance clock-driver circuit that distributes one input (A) to ten outputs (Y) with
minimum skew for clock distribution. The output-enable (OE) input disables the outputs to a high-impedance
state. Each output has an internal series damping resistor to improve signal integrity at the load. The CDC2351
operates at nominal 3.3-V VCC.
The propagation delays are adjusted at the factory using the P0 and P1 pins. The factory adjustments ensure
that the part-to-part skew is minimized and is kept within a specified window. Pins P0 and P1 are not intended
for customer use and should be connected to GND.
The CDC2351 is characterized for operation from 0°C to 70°C. The CDC2351Q is characterized for operation
over the full automotive temperature range of – 40°C to 125°C.
FUNCTION TABLE
INPUTS
A
OE
OUTPUTS
In
L
H
Z
H
H
Z
L
L
L
H
L
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC-ΙΙΒ is a trademark of Texas Instruments.
Copyright  2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
CDC2351
1-LINE TO 10-LINE CLOCK DRIVER
WITH 3-STATE OUTPUTS
SCAS442D – FEBRUARY 1994 – REVISED SEPTEMBER 2000
logic symbol†
OE
5
EN
23
Y1
21
Y2
19
Y3
18
A
Y4
16
6
Y5
14
Y6
11
Y7
9
Y8
4
Y9
2
Y10
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
OE
5
23
21
19
18
Y1
Y2
Y3
Y4
6
A
16
7 8
P0 P1
14
11
9
4
2
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
Y5
Y6
Y7
Y8
Y9
Y10
CDC2351
1-LINE TO 10-LINE CLOCK DRIVER
WITH 3-STATE OUTPUTS
SCAS442D – FEBRUARY 1994 – REVISED SEPTEMBER 2000
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V
Voltage range applied to any output in the high state or power-off state,
VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 3.6 V
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA
Output clamp current, IOK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 50 mA
Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . . . . . . 0.65 W
DW package . . . . . . . . . . . . . . . . . . 1.7 W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.
For more information, refer to the Package Thermal Considerations application note in the 1994 ABT Advanced BiCMOS Technology
Data Book, literature number SCBD002B.
recommended operating conditions (see Note 3)
MIN
MAX
3.6
UNIT
VCC
VIH
Supply voltage
3
High-level input voltage
2
VIL
VI
Low-level input voltage
5.5
V
IOH
IOL
High-level output current
– 12
mA
Low-level output current
12
mA
fclock
Input clock frequency
100
MHz
TA
V
0.8
Input voltage
0
CDC2351
Operating free
free-air
air temperature
CDC2351Q
V
0
70
–40
125
V
°C
NOTE 3: Unused pins (input or I/O) must be held high or low.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
VOH
VCC = 3 V,
VCC = 3 V,
II = –18 mA
IOH = – 12 mA
VOL
II
IO‡
VCC = 3 V,
VCC = 3.6 V,
IOL = 12 mA
VI = VCC or GND
IOZ
VCC = 3.6 V,
VCC = 3.6 V,
VO = 2.5 V
VCC = 3 V or 0
ICC
VCC = 3.6 V,
IO = 0,
MIN
TYP
Ci
VI = VCC or GND,
VCC = 3.3 V,
V
V
–7
0.8
V
±1
µA
–70
mA
± 10
µA
0.3
Outputs low
15
Outputs disabled
0.3
f = 10 MHz
Co
VO = VCC or GND, VCC = 3.3 V,
f = 10 MHz
‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
POST OFFICE BOX 655303
UNIT
–1.2
2
Outputs high
VI = VCC or GND
MAX
• DALLAS, TEXAS 75265
mA
4
pF
6
pF
3
CDC2351
1-LINE TO 10-LINE CLOCK DRIVER
WITH 3-STATE OUTPUTS
SCAS442D – FEBRUARY 1994 – REVISED SEPTEMBER 2000
switching characteristics, CL = 50 pF (see Figures 1 and 2)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
CDC2351
CDC2351Q
CDC2351
VCC = 3.3 V,
TA = 25°C
VCC = 3 V to 3.6 V,
TA = –40°C to 125°C
VCC = 3 V to 3.6 V,
TA = 0°C to 70°C
MIN
TYP
MAX
MIN
MAX
MIN
3.8
4.3
4.8
1.1
11
3.6
4.1
4.6
1
9.7
2.4
4.9
6.0
1
12
1.8
6.9
2.4
4.3
6.0
1
11.1
1.8
6.9
2.2
4.4
6.3
1
11.1
2.1
7.1
2.2
4.6
6.3
1
11.5
2.1
7.3
UNIT
MAX
tPLH
tPHL
A
Y
tPZH
tPZL
OE
Y
tPHZ
tPLZ
OE
Y
tsk(o)
A
Y
0.3
0.5
2.5
0.5
ns
tsk(p)
A
Y
0.2
0.8
3
0.8
ns
tsk(pr)
tr
A
Y
1
ns
A
Y
2.5
2.5
ns
tf
A
Y
2.5
2.5
ns
ns
1
ns
ns
switching characteristics temperature and VCC coefficients over recommended operating free-air
temperature and VCC range (see Note 4)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
MIN
MAX
UNIT
ps/10°C
∝tPLH(T)
∝tPHL(T)
Average temperature coefficient of low to high propagation delay
A
Y
Average temperature coefficient of high to low propagation delay
A
Y
85†
50†
∝tPLH(VCC)
Average VCC coefficient of low to high propagation delay
A
Y
–145‡
ps/
100 mV
∝tPHL(VCC)
Average VCC coefficient of high to low propagation delay
A
Y
–100‡
ps/
100 mV
† ∝tPLH(T) and ∝tPHL(T) are virtually independent of VCC.
‡ ∝tPLH(VCC) and ∝tPHL(VCC) are virtually independent of temperature.
NOTE 4: This data was extracted from characterization material and are not tested at the factory.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
ps/10°C
CDC2351
1-LINE TO 10-LINE CLOCK DRIVER
WITH 3-STATE OUTPUTS
SCAS442D – FEBRUARY 1994 – REVISED SEPTEMBER 2000
PARAMETER MEASUREMENT INFORMATION
6V
S1
500 Ω
From Output
Under Test
TEST
tPLH /tPHL
tPLZ /tPZL
tPHZ /tPZH
Open
GND
CL = 50 pF
(see Note A)
S1
Open
6V
GND
500 Ω
tw
LOAD CIRCUIT
3V
Input
3V
1.5 V
1.5 V
0V
1.5 V
Timing Input
0V
tsu
VOLTAGE WAVEFORMS
th
3V
1.5 V
Data Input
1.5 V
0V
VOLTAGE WAVEFORMS
1.5 V
0V
tPHL
2V
0.8 V
tr
1.5 V
0V
tPLZ
1.5 V
tPLH
Output
1.5 V
tPZL
3V
Input
3V
Output
Control
(low-level
enabling)
1.5 V
VOH
2V
0.8 V
VOL
tf
3V
Output
Waveform 1
S1 at 6 V
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
1.5 V
tPZH
VOLTAGE WAVEFORMS
VOL + 0.3 V
VOL
tPHZ
VOH
1.5 V
VOH – 0.3 V
≈0V
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
CDC2351
1-LINE TO 10-LINE CLOCK DRIVER
WITH 3-STATE OUTPUTS
SCAS442D – FEBRUARY 1994 – REVISED SEPTEMBER 2000
PARAMETER MEASUREMENT INFORMATION
A
Y1
tPHL1
tPLH1
tPHL2
tPLH2
tPHL3
tPLH3
tPHL4
tPLH4
tPHL5
tPLH5
tPHL6
tPLH6
tPHL7
tPLH7
tPHL8
tPLH8
tPHL9
tPLH9
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
Y10
tPHL10
tPLH10
NOTES: A. Output skew, tsk(o), is calculated as the greater of:
– The difference between the fastest and slowest of tPLHn (n = 1, 2, 3, 4, 5, 6, 7, 8, 9, 10)
– The difference between the fastest and slowest of tPHLn (n = 1, 2, 3, 4, 5, 6, 7, 8, 9, 10)
B. Pulse skew, tsk(p), is calculated as the greater of | tPLHn – tPHLn | (n = 1, 2, 3, 4, 5, 6, 7, 8, 9, 10).
C. Process skew, tsk(pr), is calculated as the greater of:
– The difference between the fastest and slowest of tPLHn (n = 1, 2, 3, 4, 5, 6, 7, 8, 9, 10) across multiple devices under identical
operating conditions
– The difference between the fastest and slowest of tPHLn (n = 1, 2, 3, 4, 5, 6, 7, 8, 9, 10) across multiple devices under identical
operating conditions
Figure 2. Waveforms for Calculation of tsk(o), tsk(p), tsk(pr)
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
CDC2351DB
ACTIVE
SSOP
DB
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
CK2351
CDC2351DBG4
ACTIVE
SSOP
DB
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
CK2351
CDC2351DBLE
OBSOLETE
SSOP
DB
24
TBD
Call TI
Call TI
0 to 70
CDC2351DBR
ACTIVE
SSOP
DB
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
CK2351
CDC2351DBRG4
ACTIVE
SSOP
DB
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
CK2351
CDC2351DW
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
CDC2351
CDC2351DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
CDC2351
CDC2351DWR
ACTIVE
SOIC
DW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
CDC2351
CDC2351DWRG4
ACTIVE
SOIC
DW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
CDC2351
CDC2351PWR
OBSOLETE
TSSOP
PW
24
TBD
Call TI
Call TI
CDC2351PWRG4
OBSOLETE
TSSOP
PW
24
TBD
Call TI
Call TI
CDC2351QDB
ACTIVE
SSOP
DB
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
CK2351Q
CDC2351QDBG4
ACTIVE
SSOP
DB
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
CK2351Q
CDC2351QDBR
ACTIVE
SSOP
DB
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
CK2351Q
CDC2351QDBRG4
ACTIVE
SSOP
DB
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
CK2351Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CDC2351 :
• Enhanced Product: CDC2351-EP
NOTE: Qualified Version Definitions:
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CDC2351DBR
SSOP
DB
24
2000
330.0
16.4
8.2
8.8
2.5
12.0
16.0
Q1
CDC2351QDBR
SSOP
DB
24
2000
330.0
16.4
8.2
8.8
2.5
12.0
16.0
Q1
CDC2351QDBRG4
SSOP
DB
24
2000
330.0
16.4
8.2
8.8
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CDC2351DBR
SSOP
DB
24
2000
367.0
367.0
38.0
CDC2351QDBR
SSOP
DB
24
2000
367.0
367.0
38.0
CDC2351QDBRG4
SSOP
DB
24
2000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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