2 Pad Ceramic Package Quartz Crystal, 5 mm x 7 mm Product Features: Applications: Low Cost SMD Package Low ESR Compatible with Leadfree Processing Frequency ILCX10 Series Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 7.0 ±0.2 5.0 ±0.2 6 MHz to 100 MHz 1.3 Max. 1.25 ESR (Equivalent Series Resistance) 6.0 MHz – 40.0 MHz rd 36.0 MHz – 100.0 MHz (3 O.T.) 40 Ω Max. 40 Ω Max. 2.0 Shunt Capacitance (C0) 7 pF Max. Frequency Tolerance @ 25° C ±30 ppm Standard (see Part Number Guide for more options) Frequency Stability over Temperature ±50 ppm Standard (see Part Number Guide for more options) Crystal Cut AT Cut Load Capacitance 18 pF Standard Drive Level 100 µW Max. Aging ±5 ppm Max. / Year Standard 4.50 Connection Diagram Recommended Pad Layout 2.2 Temperature Operating 0° C to +70° C Standard (see Part Number Guide for more options) Storage -40° C to +85° C Standard 2.4 6.3 Dimension Units: mm Part Number Guide Package ILCX10 - Sample Part Number: ILCX10 - FB1F18 - 20.000 Tolerance (ppm) at Room Temperature Stability (ppm) over Operating Temperature Operating Temperature Range Mode (overtone) B = ±50 ppm B = ±50 ppm 0 = 0°C to +50°C F = Fundamental F = ±30 ppm F = ±30 ppm 1 = 0°C to +70°C 3 = 3rd overtone G = ±25 ppm G = ±25 ppm 2 = -10°C to +60°C H = ±20 ppm H = ±20 ppm 3 = -20°C to +70°C I = ±15 ppm I = ±15 ppm** 5 = -40°C to +85°C J = ±10 ppm* J = ±10 ppm** 9 = -10°C to +50°C Load Capacitance (pF) 18 pF Standard Or Specify * Not available at all frequencies. ** Not available for all temperature ranges. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 06/09_A Specifications subject to change without notice Page 1 Frequency - 20.000 MHz 2 Pad Ceramic Package Quartz Crystal, 5 mm x 7 mm Pb Free Solder Reflow Profile: ILCX10 Series Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per Reel A B C D E F 1000 16 +/-.3 8 +/-.2 7.5 +/-.2 17.5 +/-1 50 / 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI, Date Code (yww) Line 2: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 06/09_A Specifications subject to change without notice Page 2