Intersil ISL83384ECA ±15kv esd protected, 3v to 5.5v, 1 microamp, 250kbps, rs-232 transmitter/receiver Datasheet

ISL83384E
®
Data Sheet
April 2003
±15kV ESD Protected, +3V to +5.5V,
1 Microamp, 250Kbps, RS-232
Transmitter/Receiver
Features
• ESD Protection for RS-232 I/O Pins to ±15kV (IEC61000)
The Intersil ISL83384E contains 3.0V to 5.5V powered
RS-232 transmitters/receivers which meet ElA/TIA-232 and
V.28/V.24 specifications, even at VCC = 3.0V. Targeted
applications are PDAs, Palmtops, and notebook and laptop
computers where the low operational, and even lower
standby, power consumption is critical. Efficient on-chip
charge pumps, coupled with a manual powerdown function
reduces the standby supply current to a 1µA trickle. Small
footprint packaging, and the use of small, low value
capacitors ensure board space savings as well. Data rates
greater than 250Kbps are guaranteed at worst case load
conditions. This device is fully compatible with 3.3V only
systems, mixed 3.3V and 5.0V systems, and 5.0V only
systems.
The single pin powerdown function (SHDN = 0) disables all
the transmitters and receivers, while shutting down the
charge pump to minimize supply current drain.
Table 1 summarizes the features of the ISL83384E, while
Application Note AN9863 summarizes the features of each
device comprising the ICL32XX 3V family.
Ordering Information
TEMP.
PART NUMBER RANGE (oC)
PACKAGE
FN6017.1
PKG. NO.
ISL83384ECB
0 to 70
18 Ld SOIC
M18.3
ISL83384ECB-T
0 to 70
Tape and Reel
M18.3
ISL83384ECA
0 to 70
20 Ld SSOP
M20.209
ISL83384ECA-T
0 to 70
Tape and Reel
M20.209
ISL83384EIA
-40 to 85
20 Ld SSOP
M20.209
ISL83384EIA-T
-40 to 85
Tape and Reel
M20.209
• Drop In Replacement for MAX3384E, SP385E
• Low Power, Pin Compatible Upgrade for 5V MAX222,
SP310E, ADM222, and LT1780
• Single SHDN Pin Disables Transmitters and Receivers
• Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V
• RS-232 Compatible with VCC = 2.7V
• Latch-Up Free
• On-Chip Voltage Converters Require Only Four External
0.1µF Capacitors
• Receiver Hysteresis For Improved Noise Immunity
• Very Low Supply Current . . . . . . . . . . . . . . . . . . . . 0.3mA
• Guaranteed Minimum Data Rate . . . . . . . . . . . . 250Kbps
• Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/µs
• Wide Power Supply Range . . . . . . . Single +3V to +5.5V
• Low Supply Current in Powerdown State. . . . . . . . . < 1µA
Applications
• Any System Requiring RS-232 Communication Ports
- Battery Powered, Hand-Held, and Portable Equipment
- Laptop Computers, Notebooks, Palmtops
- Modems, Printers and other Peripherals
- Digital Cameras
- Cellular/Mobile Phones
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• AN9863, “3V to +5.5V, 250k-1Mbps, RS-232
Transmitters/Receivers”
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER
ISL83384E
NO. OF NO. OF
Tx.
Rx.
2
2
1
NO. OF
MONITOR Rx.
(ROUTB)
DATA
RATE
(Kbps)
Rx. ENABLE
FUNCTION?
READY
OUTPUT?
MANUAL
POWERDOWN?
AUTOMATIC
POWERDOWN
FUNCTION?
0
250
NO
NO
YES
NO
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Copyright © Intersil Americas Inc. 2003. All Rights Reserved
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ISL83384E
Pinouts
ISL83384E (SOIC)
TOP VIEW
ISL83384E (SSOP)
TOP VIEW
20 SHDN
NC 1
18 SHDN
NC 1
C1+ 2
17 VCC
C1+ 2
19 VCC
3
16 GND
V+
3
18 GND
C1- 4
15 T1OUT
C1- 4
17 T1OUT
C2+ 5
14 R1IN
C2+ 5
16 R1IN
C2- 6
13 R1OUT
C2- 6
15 R1OUT
V+
V- 7
12 T1IN
V- 7
14 T1IN
T2OUT 8
11 T2IN
T2OUT 8
13 T2IN
12 R2OUT
R2IN 9
10 R2OUT
R2IN 9
11 NC
NC 10
Pin Descriptions
PIN
VCC
FUNCTION
System power supply input (3.0V to 5.5V).
V+
Internally generated positive transmitter supply (+5.5V).
V-
Internally generated negative transmitter supply (-5.5V).
GND
Ground connection.
C1+
External capacitor (voltage doubler) is connected to this lead.
C1-
External capacitor (voltage doubler) is connected to this lead.
C2+
External capacitor (voltage inverter) is connected to this lead.
C2-
External capacitor (voltage inverter) is connected to this lead.
TIN
TTL/CMOS compatible transmitter Inputs.
TOUT
RIN
±15kV ESD Protected, RS-232 level (nominally ±5.5V) transmitter outputs.
±15kV ESD Protected, RS-232 compatible receiver inputs.
ROUT
TTL/CMOS level receiver outputs.
SHDN
Active low input to shut down transmitters, receivers, and on-board power supply, to place device in low power mode.
Typical Operating Circuits
ISL83384E (NOTE 2)
C3 (OPTIONAL CONNECTION, NOTE 1)
C1
0.1µF
C2
0.1µF
T1IN
TTL/CMOS
LOGIC LEVELS
T2IN
R1OUT
+
0.1µF
2
+
4
5
+
6
+
+3.3V to +5V
17
C1+
VCC
C1C2+
C2-
12
11
3
V+
V-
7
+
T1
15
T2
T1OUT
T2OUT
14
R1IN
5kΩ
R1
9
10
R2OUT
2
C4
0.1µF
8
13
NOTES:
1. The negative terminal of C3 can be connected to either VCC or GND.
2. Pin numbers refer to SOIC package.
+ C3
0.1µF
R2IN
R2
5kΩ
GND
SHDN
16
18
VCC
RS-232
LEVELS
ISL83384E
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
V- to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V
Input Voltages
TIN, SHDN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical, Note 3)
θJA (oC/W)
18 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
75
20 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
122
Moisture Sensitivity (see Technical Brief TB363)
All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(SOIC, SSOP - Lead Tips Only)
Operating Conditions
Temperature Range
ISL83384ECX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
ISL83384EIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF; Unless Otherwise Specified.
Typicals are at TA = 25oC
TEMP
(oC)
MIN
TYP
MAX
UNITS
25
-
0.1
5
µA
Full
-
1
50
µA
Full
-
0.3
3.0
mA
TIN, SHDN
Full
-
-
0.8
V
Input Logic Threshold High
TIN, SHDN
Full
2.4
-
-
V
Input Leakage Current
TIN, SHDN
Full
-
±0.01
±1.0
µA
Output Leakage Current
SHDN = GND
Full
-
±0.05
±10
µA
Output Voltage Low
IOUT = 3.2mA
Full
-
-
0.4
V
Output Voltage High
IOUT = -1.0mA
Full
-
V
PARAMETER
TEST CONDITIONS
DC CHARACTERISTICS
Supply Current, Powerdown
SHDN = GND
Supply Current, Enabled
All Outputs Unloaded, SHDN = VCC
LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold Low
VCC -0.6 VCC -0.1
RECEIVER INPUTS
Input Voltage Range
Input Threshold Low
Input Threshold High
Full
-25
-
25
V
VCC = 3.3V
25
0.6
1.2
-
V
VCC = 5.0V
Full
0.8
1.5
-
V
VCC = 3.3V
25
-
1.5
2.4
V
VCC = 5.0V
Full
-
1.8
2.4
V
Input Hysteresis
Full
0.2
0.5
1
V
Input Resistance
Full
3
5
7
kΩ
TRANSMITTER OUTPUTS
Output Voltage Swing
All Transmitter Outputs Loaded with 3kΩ to Ground
Full
±5.0
±5.4
-
V
Output Resistance
VCC = V+ = V- = 0V, Transmitter Output = ±2V
Full
300
10M
-
Ω
Full
±7
±35
-
mA
VOUT = ±12V, VCC = 0V or 3V to 5.5V, SHDN = GND
Full
-
-
±10
µA
RL = 3kΩ, CL = 1000pF, One Transmitter Switching
Full
250
500
-
Kbps
Output Short-Circuit Current
Output Leakage Current
TIMING CHARACTERISTICS
Maximum Data Rate
3
ISL83384E
Electrical Specifications
Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF; Unless Otherwise Specified.
Typicals are at TA = 25oC (Continued)
TEMP
(oC)
MIN
TYP
MAX
UNITS
tPHL
Full
-
0.6
3.5
µs
tPLH
Full
-
0.7
3.5
µs
tPHL
Full
-
0.2
1
µs
tPLH
Full
-
0.3
1
µs
From SHDN Rising Edge to TOUT = ±3V
25
-
50
-
µs
Transmitter Output Disable Time
From SHDN Falling Edge to TOUT = ±5V
25
-
600
-
ns
Transmitter Skew
tPHL - tPLH (Note 4)
25
-
100
-
ns
Receiver Skew
tPHL - tPLH
25
-
100
-
ns
Transition Region Slew Rate
VCC = 3.3V, CL = 150pF to
RL = 3kΩ to 7kΩ,
Measured From 3V to -3V or 2500pF
-3V to 3V
VCC = 4.5V, CL = 150pF to
2500pF
25
4
-
-
V/µs
25
6
-
-
V/µs
Human Body Model
25
-
±15
-
kV
IEC61000-4-2 Contact Discharge
25
-
±8
-
kV
IEC61000-4-2 Air Gap Discharge
25
-
±15
-
kV
Human Body Model
25
-
±3
-
kV
PARAMETER
TEST CONDITIONS
Transmitter Propagation Delay
Transmitter Input to
Transmitter Output,
CL = 1000pF
Receiver Propagation Delay
Receiver Input to Receiver
Output, CL = 150pF
Transmitter Output Enable Time
ESD PERFORMANCE
RS-232 Pins (TOUT, RIN)
All Other Pins
NOTE:
4. Transmitter skew is measured at the transmitter zero crossing points.
Detailed Description
The ISL83384E operates from a single +3V to +5.5V supply,
guarantees a 250Kbps minimum data rate, requires only four
small external 0.1µF capacitors, features low power
consumption, and meets all ElA RS-232C and V.28
specifications. The circuit is divided into three sections: The
charge pump, the transmitters, and the receivers.
Charge-Pump
Intersil’s new ISL83384E utilizes regulated on-chip dual
charge pumps as voltage doublers, and voltage inverters to
generate ±5.5V transmitter supplies from a VCC supply as
low as 3.0V. This allows these devices to maintain RS-232
compliant output levels over the ±10% tolerance range of
3.3V powered systems. The efficient on-chip power supplies
require only four small, external 0.1µF capacitors for the
voltage doubler and inverter functions over the full VCC
range. The charge pumps operate discontinuously (i.e., they
turn off as soon as the V+ and V- supplies are pumped up to
the nominal values), resulting in significant power savings.
All transmitter outputs disable and assume a high
impedance state when the device enters the powerdown
mode (see Table 2). These outputs may be driven to ±12V
when disabled.
All devices guarantee a 250Kbps data rate for full load
conditions (3kΩ and 1000pF), VCC ≥ 3.0V, with one
transmitter operating at full speed. Under more typical
conditions of VCC ≥ 3.3V, RL = 3kΩ, and CL = 250pF, one
transmitter easily operates at 900Kbps.
Transmitter inputs float if left unconnected (there are no pullup resistors), and may cause ICC increases. Connect
unused inputs to GND for the best performance.
TABLE 2. POWERDOWN AND ENABLE LOGIC TRUTH TABLE
SHDN TRANSMITTER RECEIVER
INPUT
OUTPUTS
OUTPUTS MODE OF OPERATION
H
Active
Active
Normal Operation
L
High-Z
High-Z
Manual Powerdown
Receivers
Transmitters
The transmitters are proprietary, low dropout, inverting
drivers that translate TTL/CMOS inputs to EIA/TIA-232
output levels. Coupled with the on-chip ±5.5V supplies,
these transmitters deliver true RS-232 levels over a wide
range of single supply system voltages.
4
The ISL83384E contains standard inverting receivers that
three-state via the SHDN control line. Receivers driving
powered down peripherals must be disabled to prevent
current flow through the peripheral’s protection diodes (see
Figures 2 and 3).
ISL83384E
All the receivers convert RS-232 signals to CMOS output
levels and accept inputs up to ±30V while presenting the
required 3kΩ to 7kΩ input impedance (see Figure 1) even if
the power is off (VCC = 0V). The receivers’ Schmitt trigger
input stage uses hysteresis to increase noise immunity and
decrease errors due to slow input signal transitions.
VCC
VCC
CURRENT
FLOW
VCC
VOUT = VCC
Rx
VCC
RXOUT
RXIN
-25V ≤ VRIN ≤ +25V
POWERED
DOWN
UART
GND ≤ VROUT ≤ VCC
5kΩ
GND
Tx
OLD
RS-232 CHIP
SHDN = GND
GND
FIGURE 1. INVERTING RECEIVER CONNECTIONS
Low Power Operation
This 3V device requires a nominal supply current of 0.3mA,
even at VCC = 5.5V, during normal operation (not in
powerdown mode). This is considerably less than the 11mA
current required by comparable 5V RS-232 devices,
allowing users to reduce system power simply by replacing
the old style device with the ISL83384E.
Low Power, Pin Compatible Replacement
Pin compatibility with existing 5V products (e.g., MAX222),
coupled with the wide operating supply range, make the
ISL83384E a potential lower power, higher performance
drop-in replacement for existing 5V applications. As long as
the ±5V RS-232 output swings are acceptable, and
transmitter pull-up resistors aren’t required, the ISL83384E
should work in most 5V applications.
When replacing a device in an existing 5V application, it is
acceptable to terminate C3 to VCC as shown on the “Typical
Operating Circuit”. Nevertheless, terminate C3 to GND if
possible, as slightly better performance results from this
configuration.
Powerdown Functionality
The already low current requirement drops significantly
when the device enters powerdown mode. In powerdown,
supply current drops to 1µA, because the on-chip charge
pump turns off (V+ collapses to VCC, V- collapses to GND),
and the transmitter and receiver outputs three-state. This
micro-power mode makes these devices ideal for battery
powered and portable applications.
Software Controlled (Manual) Powerdown
The ISL83384E may be forced into its low power, standby
state via a simple shutdown (SHDN) pin (see Figure 4).
Driving this pin high enables normal operation, while driving
it low forces the IC into it’s powerdown state. The time
required to exit powerdown, and resume transmission is less
than 50µs. Connect SHDN to VCC if the powerdown function
isn’t needed.
5
FIGURE 2. POWER DRAIN THROUGH POWERED DOWN
PERIPHERAL
VCC
TRANSITION
DETECTOR
TO
WAKE-UP
LOGIC
ISL83384E
V-
VCC
RX
POWERED
DOWN
UART
VOUT = HI-Z
TX
FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN
SHDN
PWR
MGT
LOGIC
ISL83384E
I/O
UART
CPU
FIGURE 4. CONNECTIONS FOR MANUAL POWERDOWN
ISL83384E
Capacitor Selection
High Data Rates
The charge pumps require 0.1µF or greater capacitors for
operation with 3.3V ≤ VCC ≤ 5.5V. Increasing the capacitor
values (by a factor of 2) reduces ripple on the transmitter
outputs and slightly reduces power consumption. C2, C3,
and C4 can be increased without increasing C1’s value,
however, do not increase C1 without also increasing C2, C3,
and C4 to maintain the proper ratios (C1 to the other
capacitors).
The ISL83384E maintains the RS-232 ±5V minimum
transmitter output voltages even at high data rates. Figure 6
details a transmitter loopback test circuit, and Figure 7
illustrates the loopback test result at 120Kbps. For this test,
all transmitters were simultaneously driving RS-232 loads in
parallel with 1000pF, at 120Kbps. Figure 8 shows the
loopback results for a single transmitter driving 1000pF and
an RS-232 load at 250Kbps. The static transmitter was also
loaded with an RS-232 receiver.
When using minimum required capacitor values, make sure
that capacitor values do not degrade excessively with
temperature. If in doubt, use capacitors with a larger nominal
value. The capacitor’s equivalent series resistance (ESR)
usually rises at low temperatures and it influences the
amount of ripple on V+ and V-.
VCC
+
0.1µF
+
C1+
VCC
V+
C1
C1-
Operation Down to 2.7V
ISL83384E
ISL83384E transmitter outputs meet RS-562 levels (±3.7V),
at the full data rate, with VCC as low as 2.7V. RS-562 levels
typically ensure inter operability with RS-232 devices.
+
V-
C2+
C2
TIN
In most circumstances a 0.1µF bypass capacitor is
adequate. In applications that are particularly sensitive to
power supply noise, decouple VCC to ground with a
capacitor of the same value as the charge-pump capacitor C1.
Connect the bypass capacitor as close as possible to the IC.
TOUT
RIN
ROUT
1000pF
5k
VCC
SHDN
FIGURE 6. TRANSMITTER LOOPBACK TEST CIRCUIT
Transmitter Outputs when Exiting
Powerdown
5V/DIV.
Figure 5 shows the response of two transmitter outputs
when exiting powerdown mode. As they activate, the two
transmitter outputs properly go to opposite RS-232 levels,
with no glitching, ringing, nor undesirable transients. Each
transmitter is loaded with 3kΩ in parallel with 2500pF. Note
that the transmitters enable only when the magnitude of the
supplies exceed approximately 3V.
T1IN
T1OUT
R1OUT
SHDN
T1
VCC = +3.3V
C1 - C4 = 0.1µF
5µs/DIV.
FIGURE 7. LOOPBACK TEST AT 120Kbps
2V/DIV.
T2
VCC = +3.3V
C1 - C4 = 0.1µF
TIME (20µs/DIV.)
FIGURE 5. TRANSMITTER OUTPUTS WHEN EXITING
POWERDOWN
6
C4
+
C2-
Power Supply Decoupling
5V/DIV.
+
C3
ISL83384E
Human Body Model (HBM) Testing
5V/DIV.
As the name implies, this test method emulates the ESD
event delivered to an IC during human handling. The tester
delivers the charge through a 1.5kΩ current limiting resistor,
making the test less severe than the IEC61000 test which
utilizes a 330Ω limiting resistor. The HBM method
determines an ICs ability to withstand the ESD transients
typically present during handling and manufacturing. Due to
the random nature of these events, each pin is tested with
respect to all other pins. The RS-232 pins on “E” family
devices can withstand HBM ESD events to ±15kV.
T1IN
T1OUT
R1OUT
VCC = +3.3V
C1 - C4 = 0.1µF
IEC16000-4-2 Testing
2µs/DIV.
FIGURE 8. LOOPBACK TEST AT 250Kbps
Interconnection with 3V and 5V Logic
The ISL83384E directly interfaces with 5V CMOS and TTL
logic families. Nevertheless, with the device at 3.3V, and the
logic supply at 5V, AC, HC, and CD4000 outputs can drive
ISL83384E inputs, but ISL83384E outputs do not reach the
minimum VIH for these logic families. See Table 3 for more
information.
TABLE 3. LOGIC FAMILY COMPATIBILITY WITH VARIOUS
SUPPLY VOLTAGES
VCC
SYSTEM
POWER-SUPPLY SUPPLY
VOLTAGE
VOLTAGE
(V)
(V)
3.3
3.3
5
5
5
3.3
COMPATIBILITY
Compatible with all CMOS
families.
Compatible with all TTL and
CMOS logic families.
Compatible with ACT and HCT
CMOS, and with TTL.
ISL83384E outputs are
incompatible with AC, HC, and
CD4000 CMOS inputs.
±15kV ESD Protection
All pins on ISL83XXX devices include ESD protection
structures, but the ISL83384E incorporates advanced
structures which allow the RS-232 pins (transmitter outputs
and receiver inputs) to survive ESD events up to ±15kV. The
RS-232 pins are particularly vulnerable to ESD damage
because they typically connect to an exposed port on the
exterior of the finished product. Simply touching the port
pins, or connecting a cable, can cause an ESD event that
might destroy unprotected ICs. These new ESD structures
protect the device whether or not it is powered up, protect
without allowing any latchup mechanism to activate, and
don’t interfere with RS-232 signals as large as ±25V.
7
The IEC61000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-232 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The lower
current limiting resistor coupled with the larger charge
storage capacitor yields a test that is much more severe than
the HBM test. The extra ESD protection built into this
device’s RS-232 pins allows the design of equipment
meeting level 4 criteria without the need for additional board
level protection on the RS-232 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc., so it is difficult to obtain
repeatable results. The “E” device RS-232 pins withstand
±15kV air-gap discharges.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±8kV. All “E” family devices survive ±8kV contact
discharges on the RS-232 pins.
ISL83384E
Typical Performance Curves
VCC = 3.3V, TA = 25oC
25
VOUT+
4.0
20
SLEW RATE (V/µs)
TRANSMITTER OUTPUT VOLTAGE (V)
6.0
2.0
1 TRANSMITTER AT 250Kbps
1 TRANSMITTER AT 30Kbps
0
-2.0
15
-SLEW
+SLEW
10
VOUT -
-4.0
-6.0
0
1000
2000
3000
4000
5
5000
0
1000
FIGURE 9. TRANSMITTER OUTPUT VOLTAGE vs LOAD
CAPACITANCE
3000
3.5
40
SUPPLY CURRENT (mA)
30
120Kbps
20
15
5000
NO LOAD
ALL OUTPUTS STATIC
3.0
250Kbps
35
25
4000
FIGURE 10. SLEW RATE vs LOAD CAPACITANCE
45
SUPPLY CURRENT (mA)
2000
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
20Kbps
10
2.5
2.0
1.5
1.0
0.5
5
0
0
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
FIGURE 11. SUPPLY CURRENT vs LOAD CAPACITANCE
WHEN TRANSMITTING DATA
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP)
GND
TRANSISTOR COUNT
338
PROCESS
Si Gate CMOS
8
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
SUPPLY VOLTAGE (V)
FIGURE 12. SUPPLY CURRENT vs SUPPLY VOLTAGE
6.0
ISL83384E
Small Outline Plastic Packages (SOIC)
M18.3 (JEDEC MS-013-AB ISSUE C)
N
18 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010) M
H
B M
INCHES
E
-B1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.4469
0.4625
11.35
11.75
3
E
0.2914
0.2992
7.40
7.60
4
e
µα
B S
0.050 BSC
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
9
-
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
α
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
1.27 BSC
H
N
NOTES:
MILLIMETERS
18
0o
18
8o
0o
7
8o
Rev. 0 12/93
ISL83384E
Shrink Small Outline Plastic Packages (SSOP)
M20.209 (JEDEC MO-150-AE ISSUE B)
N
20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
H
0.25(0.010) M
B M
INCHES
E
-B1
2
3
0.25
0.010
SEATING PLANE
-A-
SYMBOL
GAUGE
PLANE
L
A
D
-C-
α
e
B
C
0.10(0.004)
0.25(0.010) M
C A M
B S
MAX
MILLIMETERS
MIN
MAX
NOTES
A
0.068
0.078
1.73
1.99
A1
0.002
0.008’
0.05
0.21
A2
0.066
0.070’
1.68
1.78
B
0.010’
0.015
0.25
0.38
C
0.004
0.008
0.09
0.20’
D
0.278
0.289
7.07
7.33
3
E
0.205
0.212
5.20’
5.38
4
e
A2
A1
MIN
0.026 BSC
0.65 BSC
H
0.301
0.311
7.65
7.90’
L
0.025
0.037
0.63
0.95
8 deg.
0 deg.
N
α
20
0 deg.
9
6
20
7
8 deg.
NOTES:
Rev. 3 11/02
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess
of “B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
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10
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