TI1 LM12L458 12-bit sign data acquisition system with self-calibration Datasheet

LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
LM12L458 12-Bit + Sign Data Acquisition System with Self-Calibration
Check for Samples: LM12L458
FEATURES
DESCRIPTION
•
The LM12L458 is a highly integrated 3.3V Data
Acquisition System. It combines a fully-differential
self-calibrating (correcting linearity and zero errors)
13-bit (12-bit + sign) analog-to-digital converter (ADC)
and sample-and-hold (S/H) with extensive analog
functions and digital functionality. Up to 32
consecutive conversions, using two's complement
format, can be stored in an internal 32-word (16-bit
wide) FIFO data buffer. An internal 8-word RAM can
store the conversion sequence for up to eight
acquisitions through the LM12L458's eight-input
multiplexer. The LM12L458 can also operate with 8bit + sign resolution and in a supervisory “watchdog”
mode that compares an input signal against two
programmable limits. Programmable acquisition times
and conversion rates are possible through the use of
internal clock-driven timers.
1
2
•
•
•
•
•
•
•
•
•
Three Operating Modes: 12-Bit + Sign, 8-Bit +
Sign, and “Watchdog”
Single-Ended or Differential Inputs
Built-In Sample-and-Hold
Instruction RAM and Event Sequencer
8-Channel Multiplexer
32-Word Conversion FIFO
Programmable Acquisition Times and
Conversion Rates
Self-Calibration and Diagnostic Mode
8- or 16-Bit Wide Data Bus Microprocessor or
DSP Interface
CMOS Compatible I/O
APPLICATIONS
•
•
•
•
Data Logging
Process Control
Energy Management
Medical Instrumentation
KEY SPECIFICATIONS
•
•
•
•
•
•
•
•
•
•
All registers, RAM, and FIFO are directly addressable
through the high speed microprocessor interface to
either an 8-bit or 16-bit data bus. The LM12L458
includes a direct memory access (DMA) interface for
high-speed conversion data transfer.
Additional applications information can be found in
applications notes AN-906 (JAJA265), AN-947
(SNAA012), and AN-949 (SNAA013).
(fCLK = 6 MHz)
Resolution: 12-Bit + Sign or 8-Bit + Sign
Single Supply: +3 to +5.5 V
13-bit Conversion Time: 7.3 μs
9-bit Conversion Time: 3.5 μs
13-bit Through-Put Rate: 106 k Samples/s
(Min)
Comparison Time (“Watchdog” Mode): 1.8 μs
(Max)
ILE: ±1 LSB (Max)
Power Consumption: 15 mW (max)
Stand-By Mode: 5 μW (typ)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
Connection Diagram
*Pin names in ( ) apply to the obsolete LM12L454, shown for reference only.
Figure 1. Connection Diagram
Functional Diagram
Figure 2. LM12L458
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
Absolute Maximum Ratings (1) (2)
Supply Voltage (VA+ and VD+)
6.0V
−0.3V to (V+ + 0.3V)
Voltage at Input and Output Pins, except analog inputs
− 5V to (V+ + 5V)
Voltage at Analog Inputs
|(VA+) − (VD+)|
Input Current at Any Pin
300 mV
(3)
±5 mA
Package Input Current (3)
±20 mA
Power Consumption (TA = 25°C) (4)
875 mW
−65°C to +150°C
Storage Temperature
Lead Temperature, Infrared, 15 sec.
+300°C
ESD Susceptibility (5)
(1)
(2)
(3)
(4)
(5)
1.5 kV
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
All voltages are measured with respect to GND, unless otherwise specified.
When the input voltage (VIN) at any pin exceeds the power supply rails (VIN < GND or VIN > (VA+ or VD+)), the current at that pin should
be limited to 5 mA. The 20 mA maximum package input current rating allows the voltage at any four pins, with an input current of 5 mA,
to simultaneously exceed the power supply voltages.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
?JA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax - TA)/?JA or the number given in the Absolute Maximum Ratings, whichever is lower.
Human body model, 100 pF discharged through a 1.5 kO resistor.
Package Thermal Resistances
Package
θJA
44-Lead PLCC
50°C / W
Operating Ratings (1) (2)
−40°C ≤ TA ≤ 85°C
Temperature Range
Supply Voltage - VA+, VD+
+3.0V to +5.5V
|VA+ − VD+|
≤100 mV
VIN+ Input Range
GND ≤ VIN+ ≤ VA+
VIN− Input Range
GND ≤ VIN− ≤ VA+
VREF+ Input Voltage
1V ≤ VREF+ ≤ VA+
VREF− Input Voltage
0V ≤ VREF− ≤ VREF+ − 1V
VREF+ − VREF−
1V ≤ VREF ≤ VA+
VREF Common Mode Range (3)
0.1 VA+ ≤ VREFCM ≤ 0.6 VA+
TJ(MAX)
(1)
(2)
(3)
150°C
All voltages are measured with respect to GND, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
VREFCM (Reference Voltage Common Mode Range) is defined as (VREF+ + VREF-)/2.
Table 1. Reliability Information - Transistor Count
Device
Number
P-Chan MOS Transistor
12,232
N-Chan MOS Transistor
15,457
Parasitic Vertical Bipolar Junction Transistor
4
Parasitic Lateral Bipolar Junction Transistor
2
TOTAL Transistors
27,695
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
3
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
Converter Characteristics
The following specifications apply for VA+ = VD+ = +3.3V, VREF+ = +2.5V, VREF− = 0V, 12-bit + sign conversion mode, fCLK =
6.0 MHz, RS = 25Ω, source impedance for VREF+ and VREF− ≤ 25Ω, fully-differential input with fixed 1.25V common-mode
voltage, and minimum acquisition time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other
limits TA = TJ = 25°C (1) (2) (3) (4)
Symbol
Parameter
Conditions
Typical (5)
Limits (6)
Units
(7) (8)
±1/2
±1
LSB (max)
13
Bits (max)
ILE
Integral Linearity Error
After Auto-Cal
TUE
Total Unadjusted Error
After Auto-Cal (7)
Resolution with No Missing Codes
After Auto-Cal (7)
Differential Non-Linearity
After Auto-Cal
Zero Error
After Auto-Cal (9)
Positive Full-Scale Error
DNL
±1
LSB (max)
±1/4
±1
LSB (max)
After Auto-Cal
(7) (8)
±1/2
±3
LSB (max)
Negative Full-Scale Error
After Auto-Cal
(7) (8)
±1/2
±3
LSB (max)
DC Common Mode Error
See (10)
±2
±4
LSB (max)
±1/2
LSB (max)
±3/4
LSB (max)
ILE
TUE
8-Bit + Sign and “Watchdog” Mode Total
Unadjusted Error
After Auto-Zero
±1/2
8-Bit + Sign and “Watchdog” Mode
Resolution with No Missing Codes
9
8-Bit + Sign and “Watchdog” Mode
Differential Non-Linearity
±1
LSB (max)
±1/2
LSB (max)
±1/2
LSB (max)
8-Bit + Sign and “Watchdog” Mode Zero
Error
After Auto-Zero
8-Bit + Sign and “Watchdog” Full-Scale
Error
VIN+
LSB
(8)
8-Bit + Sign and “Watchdog” Mode Integral
See (7)
Linearity Error
DNL
±1
8-Bit + Sign and “Watchdog” Mode DC
Common Mode Error
±1/8
Multiplexer Channel-to-Channel Matching
±0.05
Non-Inverting Input Range
VIN−
Inverting Input Range
VIN+ − VIN−
Differential Input Voltage Range
Common Mode Input Voltage Range
Bits (max)
LSB
LSB
GND
V (min)
VA+
V (max)
GND
V (min)
VA+
V (max)
−VA+
V (min)
VA+
V (max)
GND
V (min)
VA+
V (max)
(1)
Two on-chip diodes are tied to each analog input through a series resistor, as shown below. Input voltage magnitude up to 5V above
VA+ or 5V below GND will not damage the LM12L458. However, errors in the A/D conversion can occur if these diodes are forward
biased by more than 100 mV. As an example, if VA+ is 3.0 VDC, full-scale input voltage must be =3.1 VDC to ensure accurate
conversions. See Figure 3
(2) VA+ and VD+ must be connected together to the same power supply voltage and bypassed with separate capacitors at each V+ pin to
assure conversion/comparison accuracy.
(3) Accuracy is ensured when operating at fCLK = 6 MHz.
(4) With the test condition for VREF = VREF+ - VREF-given as +2.5V, the 12-bit LSB is 305 µV and the 8-bit/“Watchdog” LSB is 4.88 mV.
(5) Typical figures are at TA = 25°C and represent most likely parametric norm.
(6) Limits are specified to AOQL (Average Output Quality Level).
(7) Positive integral linearity error is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes
through positive full-scale and zero. For negative integral linearity error the straight line passes through negative full-scale and zero.
(See Figure 10 and Figure 11).
(8) The LM12L458's self-calibration technique ensures linearity and offset errors as specified, but noise inherent in the self-calibration
process will result in a repeatability uncertainty of ±0.10 LSB.
(9) Zero error is a measure of the deviation from the mid-scale voltage (a code of zero), expressed in LSB. It is the worst-case value of the
code transitions between -1 to 0 and 0 to +1 (see Figure 12).
(10) The DC common-mode error is measured with both inputs shorted together and driven from 0V to +2.5V. The measured value is
referred to the resulting output value when the inputs are driven with a 1.25V signal.
4
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
Converter Characteristics (continued)
The following specifications apply for VA+ = VD+ = +3.3V, VREF+ = +2.5V, VREF− = 0V, 12-bit + sign conversion mode, fCLK =
6.0 MHz, RS = 25Ω, source impedance for VREF+ and VREF− ≤ 25Ω, fully-differential input with fixed 1.25V common-mode
voltage, and minimum acquisition time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other
limits TA = TJ = 25°C(1)(2)(3)(4)
Symbol
PSS
Parameter
Power Supply
Sensitivity (11)
Conditions
Typical (5)
Limits (6)
Units
Zero Error
VA+ = VD+ = +3.3V ±10%
±0.2
±1.75
LSB (max)
Full-Scale Error
VREF+ = 2.5V, VREF− = GND
±0.4
±2
LSB (max)
Linearity Error
±0.2
LSB
CREF
VREF+/VREF− Input Capacitance
85
pF
CIN
Selected Multiplexer Channel Input
Capacitance
75
pF
(11) Power Supply Sensitivity is measured after Auto-Zero and/or Auto-Calibration cycle has been completed with VA+ and VD+ at the
specified extremes.
Converter AC Characteristics
The following specifications apply for VA+ = VD+ = +3.3V, VREF+ = +2.5V, VREF− = 0V, 12-bit + sign conversion mode, fCLK =
6.0 MHz, RS = 25Ω, source impedance for VREF+ and VREF− ≤ 25Ω, fully-differential input with fixed +1.25V common-mode
voltage, and minimum acquisition time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other
limits TA = TJ = 25°C. (1) (2) (3) (4)
Symbol
Parameter
Conditions
Clock Duty Cycle
tC
tA
Conversion Time
Acquisition Time
Typical (5)
50
Limits (6)
Units
40
% (min)
60
% (max)
13-Bit Resolution, Sequencer State
S5 (Figure 31)
44 (tCLK)
44 (tCLK) + 50 ns
(max)
9-Bit Resolution, Sequencer State
S5 (Figure 31)
21 (tCLK)
21 (tCLK) + 50 ns
(max)
Sequencer State S7 (Figure 31)
Built-in minimum for 13-Bits
9 (tCLK)
9 (tCLK) + 50 ns
(max)
Built-in minimum for 9-Bits and
“Watchdog” mode
2 (tCLK)
2 (tCLK) + 50 ns
(max)
(max)
tZ
Auto-Zero Time
Sequencer State S2 (Figure 31)
76 (tCLK)
76 (tCLK) + 50 ns
tCAL
Full Calibration Time
Sequencer State S2 (Figure 31)
4944 (tCLK)
4944 (tCLK) + 50 ns
(max)
107
106
kHz (min)
11 (tCLK)
11 (tCLK) + 50 ns
(max)
Throughput Rate (7)
tWD
“Watchdog” Mode Comparison Time
tPU
Power-Up Time
10
ms
tWU
Wake-Up Time
10
ms
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Sequencer States S6, S4, and S5
(Figure 31)
Two on-chip diodes are tied to each analog input through a series resistor, as shown below. Input voltage magnitude up to 5V above
VA+ or 5V below GND will not damage the LM12L458. However, errors in the A/D conversion can occur if these diodes are forward
biased by more than 100 mV. As an example, if VA+ is 3.0 VDC, full-scale input voltage must be =3.1 VDC to ensure accurate
conversions. See Figure 3
VA+ and VD+ must be connected together to the same power supply voltage and bypassed with separate capacitors at each V+ pin to
assure conversion/comparison accuracy.
Accuracy is ensured when operating at fCLK = 6 MHz.
With the test condition for VREF = VREF+ - VREF-given as +2.5V, the 12-bit LSB is 305 µV and the 8-bit/“Watchdog” LSB is 4.88 mV.
Typical figures are at TA = 25°C and represent most likely parametric norm.
Limits are specified to AOQL (Average Output Quality Level).
The Throughput Rate is for a single instruction repeated continuously. Sequencer states 0 (1 clock cycle), 1 (1 clock cycle), 7 (9 clock
cycles) and 5 (44 clock cycles) are used (see Figure 31). One additional clock cycle is used to read the conversion result stored in the
FIFO, for a total of 56 clock cycles per conversion. The Throughput Rate is fCLK (MHz)/N, where N is the number of clock
cycles/conversion.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
5
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
DC Characteristics
The following specifications apply for VA+ = VD+ = +3.3V, VREF+ = +2.5V, VREF− = 0V, fCLK = 6.0 MHz and minimum acquisition
time unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C. (1) (2) (3)
Symbol
Parameter
Conditions
ID+
VD+ Supply Current
CS = “1”
IA+
VA+ Supply Current
CS = “1”
IST
Stand-By Supply Current
(ID+ + IA+)
Power-Down
Mode Selected
3.5
mA (max)
4.5
μA (max)
6 MHz Clock
30
(2)
(3)
(4)
(5)
6
μA (max)
0.3
μA (max)
0.1
0.3
μA (max)
0.1
0.3
μA (max)
0.1
0.3
μA (max)
VIN = +3.3V
850
1500
Ω
VIN = +1.65V
1300
2000
Ω
VIN = 0V
830
1500
Ω
VIN = +3.3V
±1.0%
±3.0%
Ω
VIN = +1.65V
±1.0%
±3.0%
Ω
VIN = 0V
±1.0%
±3.0%
Ω
OFF-Channel = 0V
ON-Channel = 0V
VA+ = +3.6V
OFF-Channel = 0V
ON-Channel = 0V
OFF-Channel = 3.6V
(1)
mA (max)
1.5
ON-Channel = 3.6V
Multiplexer
Channel-to-Channel
RON matching
1.0
2.25
OFF-Channel = 3.6V
Multiplexer ON-Resistance
Units
0.4
0.1
Multiplexer ON-Channel Leakage
VA+ = +3.6V
Current
RON
Limits (5)
Clock Stopped
ON-Channel = 3.6V
Multiplexer OFF-Channel
Leakage Current
Typical (4)
Two on-chip diodes are tied to each analog input through a series resistor, as shown below. Input voltage magnitude up to 5V above
VA+ or 5V below GND will not damage the LM12L458. However, errors in the A/D conversion can occur if these diodes are forward
biased by more than 100 mV. As an example, if VA+ is 3.0 VDC, full-scale input voltage must be =3.1 VDC to ensure accurate
conversions. See Figure 3
VA+ and VD+ must be connected together to the same power supply voltage and bypassed with separate capacitors at each V+ pin to
assure conversion/comparison accuracy.
Accuracy is ensured when operating at fCLK = 6 MHz.
Typical figures are at TA = 25°C and represent most likely parametric norm.
Limits are specified to AOQL (Average Output Quality Level).
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
Digital Characteristics
The following specifications apply for VA+ = VD+ = +3.3V, unless otherwise specified. Boldface limits apply for TA = TJ =
TMIN to TMAX; all other limits TA = TJ = 25°C. (1) (2) (3)
Symbol
Parameter
Conditions
Typical (4)
Limits (5)
Units
VIN(1)
Logical “1” Input Voltage
VA+ = VD+ = +3.6V
2.0
V (min)
VIN(0)
Logical “0” Input Voltage
VA+ = VD+ = +3.0V ALE,
Pin 22
0.7
0.6
V (max)
IIN(1)
Logical “1” Input Current
VIN = +3.3V
0.005
1.0
2.0
μA (max)
μA (max)
IIN(0)
Logical “0” Input Current
VIN = 0V
−0.005
−1.0
−2.0
μA (max)
CIN
D0–D15 Input Capacitance
VOUT(1)
Logical “1” Output Voltage
6
pF
VA+ = VD+ = 3.0V
IOUT = −360 μA
2.4
V (min)
IOUT = −10 μA
2.85
V (min)
IOUT = 1.6 mA
0.4
V (max)
IOUT = 10 μA
0.1
V (max)
VA+ = VD+ = +3.0V
VOUT(0)
Logical “0” Output Voltage
IOUT
(1)
(2)
(3)
(4)
(5)
TRI-STATE Output Leakage Current
VOUT = 0V
−0.01
−3.0
μA (max)
VOUT = +3.3V
0.01
3.0
μA (max)
Two on-chip diodes are tied to each analog input through a series resistor, as shown below. Input voltage magnitude up to 5V above
VA+ or 5V below GND will not damage the LM12L458. However, errors in the A/D conversion can occur if these diodes are forward
biased by more than 100 mV. As an example, if VA+ is 3.0 VDC, full-scale input voltage must be =3.1 VDC to ensure accurate
conversions. See Figure 3
VA+ and VD+ must be connected together to the same power supply voltage and bypassed with separate capacitors at each V+ pin to
assure conversion/comparison accuracy.
Accuracy is ensured when operating at fCLK = 6 MHz.
Typical figures are at TA = 25°C and represent most likely parametric norm.
Limits are specified to AOQL (Average Output Quality Level).
Digital Timing Characteristics
The following specifications apply for VA+ = VD+ = +3.3V, tr = tf = 3 ns, and CL = 100 pF on data I/O, INT and DMARQ lines
unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C. (1) (2) (3)
Symbol (See
Figure 28 Figure 29
Figure 30)
(1)
(2)
(3)
(4)
(5)
Parameter
Conditions
Typical (4)
Limits (5)
Units
1, 3
CS or Address Valid to ALE Low Set-Up Time
40
ns (min)
2, 4
CS or Address Valid to ALE Low Hold Time
20
ns (min)
5
ALE Pulse Width
45
ns (min)
6
RD High to Next ALE High
35
ns (min)
7
ALE Low to RD Low
20
ns (min)
8
RD Pulse Width
100
ns (min)
9
RD High to Next RD or WR Low
100
ns (min)
10
ALE Low to WR Low
20
ns (min)
11
WR Pulse Width
60
ns (min)
12
WR High to Next ALE High
75
ns (min)
13
WR High to Next RD or WR Low
140
ns (min)
Two on-chip diodes are tied to each analog input through a series resistor, as shown below. Input voltage magnitude up to 5V above
VA+ or 5V below GND will not damage the LM12L458. However, errors in the A/D conversion can occur if these diodes are forward
biased by more than 100 mV. As an example, if VA+ is 3.0 VDC, full-scale input voltage must be =3.1 VDC to ensure accurate
conversions. See Figure 3
VA+ and VD+ must be connected together to the same power supply voltage and bypassed with separate capacitors at each V+ pin to
assure conversion/comparison accuracy.
Accuracy is ensured when operating at fCLK = 6 MHz.
Typical figures are at TA = 25°C and represent most likely parametric norm.
Limits are specified to AOQL (Average Output Quality Level).
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
7
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
Digital Timing Characteristics (continued)
The following specifications apply for VA+ = VD+ = +3.3V, tr = tf = 3 ns, and CL = 100 pF on data I/O, INT and DMARQ lines
unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C. (1)(2)(3)
Symbol (See
Figure 28 Figure 29
Figure 30)
Parameter
Typical (4)
Conditions
Limits (5)
Units
14
Data Valid to WR High Set-Up Time
40
ns (min)
15
Data Valid to WR High Hold Time
30
ns (min)
16
RD Low to Data Bus Out of TRI-STATE
30
10
70
ns (min)
ns (max)
30
10
110
ns (max)
30
10
95
ns (max)
RL = 1 kΩ
ns (min)
17
RD High to TRI-STATE
18
RD Low to Data Valid (Access Time)
20
Address Valid or CS Low to RD Low
20
ns (min)
21
Address Valid or CS Low to WR Low
20
ns (min)
19
Address Invalid from RD or WR High
10
ns (min)
22
INT High from RD Low
30
10
60
ns (max)
23
DMARQ Low from RD Low
30
10
60
ns (max)
ns (min)
ns (min)
ns (min)
Figure 3.
Test Circuits and Waveforms
Figure 4. TRI-STATE Test Circuits and Waveforms
8
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
Input and Reference Range
VREF = VREF+ − VREF−
VIN = VIN+ − VIN−
GND ≤ VIN+ ≤ VA+
GND ≤ VIN− ≤ VA+
Figure 5. The General Case of Output Digital Code vs. the Operating Input Voltage Range
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
9
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
VREF+ − VREF− = 2.5V
VIN = VIN+ − VIN−
GND ≤ VIN+ ≤ VA+
GND ≤ VIN− ≤ VA+
Figure 6. Specific Case of Output Digital Code vs. the Operating Input Voltage Range for VREF = 2.5V
Figure 7. The General Case of the VREF Operating Range
10
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
Figure 8. The Specific Case of the VREF Operating Range for VA+ = 3.3V
Transfer Characteristic and Static Errors
Figure 9. Transfer Characteristic
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
11
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
Figure 10. Simplified Error Curve vs. Output Code without Auto-Calibration or Auto-Zero Cycles
Figure 11. Simplified Error Curve vs. Output Code after Auto-Calibration Cycle
Figure 12. Offset or Zero Error Voltage
12
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
Typical Performance Characteristics
The following curves apply for 12-bit + sign mode after auto-calibration with VA+ = VD+ = +3.3V, VREF+ = +2.5V, VREF− = 0V, TA
= 25°C, and fCLK = 6 MHz unless otherwise specified. The performance for 8-bit + sign and “watchdog” modes is equal to or
better than shown. (1)
(1)
Linearity Error Change
vs. Clock Frequency
Linearity Error Change
vs. Temperature
Figure 13.
Figure 14.
Linearity Error Change
vs. Reference Voltage
Linearity Error Change
vs. Supply Voltage
Figure 15.
Figure 16.
Full-Scale Error Change
vs. Clock Frequency
Full-Scale Error Change
vs. Temperature
Figure 17.
Figure 18.
With the test condition for VREF = VREF+ - VREF-given as +2.5V, the 12-bit LSB is 305 µV and the 8-bit/“Watchdog” LSB is 4.88 mV.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
13
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
The following curves apply for 12-bit + sign mode after auto-calibration with VA+ = VD+ = +3.3V, VREF+ = +2.5V, VREF− = 0V, TA
= 25°C, and fCLK = 6 MHz unless otherwise specified. The performance for 8-bit + sign and “watchdog” modes is equal to or
better than shown. (1)
14
Full-Scale Error Change
vs. Reference Voltage
Full-Scale Error
vs. Supply Voltage
Figure 19.
Figure 20.
Zero Error Change
vs. Clock Frequency
Zero Error Change
vs. Temperature
Figure 21.
Figure 22.
Zero Error Change
vs. Reference Voltage
Zero Error Change
vs. Supply Voltage
Figure 23.
Figure 24.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
Typical Performance Characteristics (continued)
The following curves apply for 12-bit + sign mode after auto-calibration with VA+ = VD+ = +3.3V, VREF+ = +2.5V, VREF− = 0V, TA
= 25°C, and fCLK = 6 MHz unless otherwise specified. The performance for 8-bit + sign and “watchdog” modes is equal to or
better than shown. (1)
Analog Supply Current
vs. Temperature
Digital Supply Current
vs. Clock Frequency
Figure 25.
Figure 26.
Digital Supply Current
vs. Temperature
Figure 27.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
15
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
Timing Diagrams
VA+ = VD+ = +3.3V, tR = tF = 3 ns, CL = 100 pF for the INT, DMARQ, D0–D15 outputs.
Figure 28. Multiplexed Data Bus
1, 3: CS or Address valid to ALE low set-up time.
11: WR pulse width
2, 4: CS or Address valid to ALE low hold time.
12: WR high to next ALE high
5: ALE pulse width
13: WR high to next WR or RD low
6: RD high to next ALE high
14: Data valid to WR high set-up time
7: ALE low to RD low
15: Data valid to WR high hold time
8: RD pulse width
16: RD low to data bus out of TRI-STATE
9: RD high to next RD or WR low
17: RD high to TRI-STATE
10: ALE low to WR low
16
18: RD low to data valid (access time)
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
Figure 29. Non-Multiplexed Data Bus (ALE = 1)
8: RD pulse width
16: RD low to data bus out of TRI-STATE
9: RD high to next RD or WR low
17: RD high to TRI-STATE
11: WR pulse width
18: RD low to data valid (access time)
13: WR high to next WR or RD low
19: Address invalid from RD or WR high (hold time)
14: Data valid to WR high set-up time
20: CS low or address valid to RD low
15: Data valid to WR high hold time
21: CS low or address valid to WR low
VA+ = VD+ = +3.3V, tR = tF = 3 ns, CL = 100 pF for the INT, DMARQ, D0–D15 outputs.
Figure 30. Interrupt and DMARQ
22: INT high from RD low
23: DMARQ low from RD low
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
17
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
PIN DESCRIPTIONS
VA+, VD+ Analog and digital supply voltage pins. The LM12L458's supply voltage operating range is +3.0V to
+5.5V. Accuracy is ensured only if VA+ and VD+ are connected to the same power supply. Each pin
should have a parallel combination of 10 μF (electrolytic or tantalum) and 0.1 μF (ceramic) bypass
capacitors connected between it and ground.
D0–D15 The internal data input/output TRI-STATE buffers are connected to these pins. These buffers are
designed to drive capacitive loads of 100 pF or less. External buffers are necessary for driving higher load
capacitances. These pins allows the user a means of instruction input and data output. With a logic high
applied to the BW pin, data lines D8–D15 are placed in a high impedance state and data lines D0–D7 are
used for instruction input and data output when the LM12L458 is connected to an 8-bit wide data bus. A
logic low on the BW pin allows the LM12L458 to exchange information over a 16-bit wide data bus.
RD
Input for the active low READ bus control signal. The data input/output TRI-STATE buffers, as selected by
the logic signal applied to the BW pin, are enabled when RD and CS are both low. This allows the
LM12L458 to transmit information onto the data bus.
WR
Input for the active low WRITE bus control signal. The data input/output TRI-STATE buffers, as selected
by the logic signal applied to the BW pin, are enabled when WR and CS are both low. This allows the
LM12L458 to receive information from the data bus.
CS
Input for the active low Chip Select control signal. A logic low should be applied to this pin only during a
READ or WRITE access to the LM12L458. The internal clocking is halted and conversion stops while Chip
Select is low. Conversion resumes when the Chip Select input signal returns high.
ALE
Address Latch Enable input. It is used in systems containing a multiplexed data bus. When ALE is
asserted high, the LM12L458 accepts information on the data bus as a valid address. A high-to-low
transition will latch the address data on A0–A4 and the logic state on the CS input. Any changes on
A0–A4 and CS while ALE is low will not affect the LM12L458. See Figure 28. When a non-multiplexed bus
is used, ALE is continuously asserted high. See Figure 29.
CLK External clock input pin. The LM12L458 operates with an input clock frequency in the range of 0.05 MHz
to 8 MHz.
A0–A4 The LM12L458's address lines. They are used to access all internal registers, Conversion FIFO, and
Instruction RAM.
SYNC Synchronization input/output. When used as an output, it is designed to drive capacitive loads of 100 pF
or less. External buffers are necessary for driving higher load capacitances. SYNC is an input if the
Configuration register's “I/O Select” bit is low. A rising edge on this pin causes the internal S/H to hold the
input signal. The next rising clock edge either starts a conversion or makes a comparison to a
programmable limit depending on which function is requested by a programming instruction. This pin will
be an output if “I/O Select” is set high. The SYNC output goes high when a conversion or a comparison
is started and low when completed. (See CONFIGURATION REGISTER). An internal reset after power is
first applied to the LM12L458 automatically sets this pin as an input.
BW
Bus Width input pin. This input allows the LM12L458 to interface directly with either an 8- or 16-bit data
bus. A logic high sets the width to 8 bits and places D8–D15 in a high impedance state. A logic low sets
the width to 16 bits.
INT
Active low interrupt output. This output is designed to drive capacitive loads of 100 pF or less. External
buffers are necessary for driving higher load capacitances. An interrupt signal is generated any time a
non-masked interrupt condition takes place. There are eight different conditions that can cause an
interrupt. Any interrupt is reset by reading the Interrupt Status register. (See INTERRUPTS)
DMARQ Active high Direct Memory Access Request output. This output is designed to drive capacitive loads of
100 pF or less. External buffers are necessary for driving higher load capacitances. It goes high whenever
the number of conversion results in the conversion FIFO equals a programmable value stored in the
Interrupt Enable register. It returns to a logic low when the FIFO is empty.
GND Ground connection. It should be connected to a low resistance and inductance analog ground return that
connects directly to the system power supply ground.
IN0–IN7 These are the eight analog inputs. A given channel is selected through the instruction RAM. Any of the
channels can be configured as an independent single-ended input. Any pair of channels, whether adjacent
18
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
or non-adjacent, can operate as a fully differential pair.
VREF− This is the negative reference input. The LM12L458 operates with 0V ≤ VREF− ≤ VREF+. This pin should be
bypassed to ground with a parallel combination of 10 μF and 0.1 μF (ceramic) capacitors.
VREF+ Positive reference input. The LM12L458 operate with 0V ≤ VREF+ ≤ VA+. This pin should be bypassed to
ground with a parallel combination of 10 μF and 0.1 μF (ceramic) capacitors.
N.C.
This is a no connect pin.
FUNCTIONAL DESCRIPTION
The LM12L458 is a multi-functional Data Acquisition System that includes a fully differential 12-bit-plus-sign selfcalibrating analog-to-digital converter (ADC) with a two's-complement output format, an 8-channel analog
multiplexer, a first-in-first-out (FIFO) register that can store 32 conversion results, and an Instruction RAM that
can store as many as eight instructions to be sequentially executed. All of this circuitry operates on only a single
+3.3V power supply.
The LM12L458 has three modes of operation:
1. 12-bit + sign with correction
2. 8-bit + sign without correction
3. 8-bit + sign comparison mode (“watchdog” mode)
The fully differential 12-bit-plus-sign ADC uses a charge redistribution topology that includes calibration
capabilities. Charge re-distribution ADCs use a capacitor ladder in place of a resistor ladder to form an internal
DAC. The DAC is used by a successive approximation register to generate intermediate voltages between the
voltages applied to VREF− and VREF+. These intermediate voltages are compared against the sampled analog
input voltage as each bit is generated. The number of intermediate voltages and comparisons equals the ADC's
resolution. The correction of each bit's accuracy is accomplished by calibrating the capacitor ladder used in the
ADC.
Two different calibration modes are available; one compensates for offset voltage, or zero error, while the other
corrects both offset error and the ADC's linearity error.
When correcting offset only, the offset error is measured once and a correction coefficient is created. During the
full calibration, the offset error is measured eight times, averaged, and a correction coefficient is created. After
completion of either calibration mode, the offset correction coefficient is stored in an internal offset correction
register.
The LM12L458's overall linearity correction is achieved by correcting the internal DAC's capacitor mismatch.
Each capacitor is compared eight times against all remaining smaller value capacitors and any errors are
averaged. A correction coefficient is then created and stored in one of the thirteen internal linearity correction
registers. An internal state machine, using patterns stored in an internal 16 x 8-bit ROM, executes each
calibration algorithm.
Once calibrated, an internal arithmetic logic unit (ALU) uses the offset correction coefficient and the 13 linearity
correction coefficients to reduce the conversion's offset error and linearity error, in the background, during the 12bit + sign conversion. The 8-bit + sign conversion and comparison modes use only the offset coefficient. The 8bit + sign mode performs a conversion in less than half the time used by the 12-bit + sign conversion mode.
The LM12L458's “watchdog” mode is used to monitor a single-ended or differential signal's amplitude. Each
sampled signal has two limits. An interrupt can be generated if the input signal is above or below either of the
two limits. This allows interrupts to be generated when analog voltage inputs are “inside the window” or,
alternatively, “outside the window”. After a “watchdog” mode interrupt, the processor can then request a
conversion on the input signal and read the signal's magnitude.
The analog input multiplexer can be configured for any combination of single-ended or fully differential operation.
Each input is referenced to ground when a multiplexer channel operates in the single-ended mode. Fully
differential analog input channels are formed by pairing any two channels together.
The LM12L458's internal S/H is designed to operate at its minimum acquisition time (1.5 μs, 12 bits) when the
source impedance, RS, is ≤ 80Ω (fCLK ≤ 6 MHz). When 80Ω < RS ≤ 5.56 kΩ, the internal S/H's acquisition time
can be increased to a maximum of 6.5 μs (12 bits, fCLK = 6 MHz). See INSTRUCTION RAM (Instruction RAM
“00”) Bits 12–15 for more information.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
19
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
Microprocessor overhead is reduced through the use of the internal conversion FIFO. Thirty-two consecutive
conversions can be completed and stored in the FIFO without any microprocessor intervention. The
microprocessor can, at any time, interrogate the FIFO and retrieve its contents. It can also wait for the LM12L458
to issue an interrupt when the FIFO is full or after any number (≤32) of conversions have been stored.
Conversion sequencing, internal timer interval, multiplexer configuration, and many other operations are
programmed and set in the Instruction RAM.
A diagnostic mode is available that allows verification of the LM12L458's operation. This mode internally
connects the voltages present at the VREF+, VREF−, and GND pins to the internal VIN+ and VIN− S/H inputs. This
mode is activated by setting the Diagnostic bit (Bit 11) in the Configuration register to a “1”. More information
concerning this mode of operation can be found in CONFIGURATION REGISTER.
Internal User-Programmable Registers
INSTRUCTION RAM
The instruction RAM holds up to eight sequentially executable instructions. Each 48-bit long instruction is divided
into three 16-bit sections. READ and WRITE operations can be issued to each 16-bit section using the
instruction's address and the 2-bit “RAM pointer” in the Configuration register. The eight instructions are located
at addresses 0000 through 0111 (A4–A1, BW = 0) when using a 16-bit wide data bus or at addresses 00000
through 01111 (A4–A0, BW = 1) when using an 8-bit wide data bus. They can be accessed and programmed in
random order.
Any Instruction RAM READ or WRITE can affect the sequencer's operation:
The Sequencer should be stopped by setting the RESET bit to a “1” or by resetting the START bit in the
Configuration Register and waiting for the current instruction to finish execution before any Instruction RAM
READ or WRITE is initiated. Bit 0 of the Configuration Register indicates the Sequencer Status. See
CONFIGURATION REGISTER for information on the Configuration Register.
A soft RESET should be issued by writing a “1” to the Configuration Register's RESET bit after any READ or
WRITE to the Instruction RAM.
The three sections in the Instruction RAM are selected by the Configuration Register's 2-bit “RAM Pointer”, bits
D8 and D9. The first 16-bit Instruction RAM section is selected with the RAM Pointer equal to “00”. This section
provides multiplexer channel selection, as well as resolution, acquisition time, etc. The second 16-bit section
holds “watchdog” limit #1, its sign, and an indicator that shows that an interrupt can be generated if the input
signal is greater or less than the programmed limit. The third 16-bit section holds “watchdog” limit #2, its sign,
and an indicator that shows that an interrupt can be generated if the input signal is greater or less than the
programmed limit.
Instruction RAM “00”
Bit 0 is the LOOP bit. It indicates the last instruction to be executed in any instruction sequence when it is set to
a “1”. The next instruction to be executed will be instruction 0.
Bit 1 is the PAUSE bit. This controls the Sequencer's operation. When the PAUSE bit is set (“1”), the Sequencer
will stop after reading the current instruction, but before executing it and the start bit, in the Configuration
register, is automatically reset to a “0”. Setting the PAUSE also causes an interrupt to be issued. The Sequencer
is restarted by placing a “1” in the Configuration register's Bit 0 (Start bit).
After the Instruction RAM has been programmed and the RESET bit is set to “1”, the Sequencer retrieves
Instruction 000, decodes it, and waits for a “1” to be placed in the Configuration's START bit. The START bit
value of “0” “overrides” the action of Instruction 000's PAUSE bit when the Sequencer is started. Once started,
the Sequencer executes Instruction 000 and retrieves, decodes, and executes each of the remaining instructions.
No PAUSE Interrupt (INT 5) is generated the first time the Sequencer executes Instruction 000 having a PAUSE
bit set to “1”. When the Sequencer encounters a LOOP bit or completes all eight instructions, Instruction 000 is
retrieved and decoded. A set PAUSE bit in Instruction 000 now halts the Sequencer before the instruction is
executed.
Bits 2–4 select which of the eight input channels (“000” to “111” for IN0–IN7) will be configured as non-inverting
inputs to the LM12L458's ADC. (See Table 4.)
20
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
Bits 5–7 select which of the seven input channels (“001” to “111” for IN1 to IN7) will be configured as inverting
inputs to the LM12L458's ADC. (See Table 4.) Fully differential operation is created by selecting two multiplexer
channels, one operating in the non-inverting mode and the other operating in the inverting mode. A code of “000”
selects ground as the inverting input for single ended operation.
Bit 8 is the SYNC bit. Setting Bit 8 to “1” causes the Sequencer to suspend operation at the end of the internal
S/H's acquisition cycle and to wait until a rising edge appears at the SYNC pin. When a rising edge appears, the
S/H acquires the input signal magnitude and the ADC performs a conversion on the clock's next rising edge.
When the SYNC pin is used as an input, the Configuration register's “I/O Select” bit (Bit 7) must be set to a “0”.
With SYNC configured as an input, it is possible to synchronize the start of a conversion to an external event.
This is useful in applications such as digital signal processing (DSP) where the exact timing of conversions is
important.
When the LM12L458 is used in the “watchdog” mode with external synchronization, two rising edges on the
SYNC input are required to initiate two comparisons. The first rising edge initiates the comparison of the selected
analog input signal with Limit #1 (found in Instruction RAM “01”) and the second rising edge initiates the
comparison of the same analog input signal with Limit #2 (found in Instruction RAM “10”).
Bit 9 is the TIMER bit. When Bit 9 is set to “1”, the Sequencer will halt until the internal 16-bit Timer counts down
to zero. During this time interval, no “watchdog” comparisons or analog-to-digital conversions will be performed.
Bit 10 selects the ADC conversion resolution. Setting Bit 10 to “1” selects 8-bit + sign and when reset to “0”
selects 12-bit + sign.
Bit 11 is the “watchdog” comparison mode enable bit. When operating in the “watchdog” comparison mode, the
selected analog input signal is compared with the programmable values stored in Limit #1 and Limit #2 (see
Instruction RAM “01” and Instruction RAM “10”). Setting Bit 11 to “1” causes two comparisons of the selected
analog input signal with the two stored limits. When Bit 11 is reset to “0”, an 8-bit + sign or 12-bit + sign
(depending on the state of Bit 10 of Instruction RAM “00”) conversion of the input signal can take place.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
21
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
Table 2. LM12L458 Memory Map for 16-Bit Wide Data Bus (1)
A4
A3
A2
A1
0
0
0
1
1
1
0
0
0
0
to
0
to
1
1
1
0
0
0
0
to
Purpose
Type
Instruction RAM (RAM
Pointer = 00)
R/W
Instruction RAM (RAM
Pointer = 01)
R/W
Instruction RAM (RAM
Pointer = 10)
R/W
D15
D14
D13
D12
D11
D10
D9
D8
Watch- dog
8/12
Timer
Sync
Don't Care
>/<
Sign
Limit #1
Don't Care
>/<
Sign
Limit #2
Acquisition Time
1
1
1
1
0
0
0
Configuration Register
R/W
1
0
0
1
Interrupt Enable Register
R/W
Number of Conversions in Conversion FIFO to
Generate INT2
1
0
1
0
Interrupt Status Register
R
Actual Number of Conversion Results in Conversion
FIFO
1
0
1
1
Timer Register
R/W
1
1
0
0
Conversion FIFO
R
1
1
0
1
Limit Status Register
R
(1)
22
Don't Care
Address or Sign
Test =
0
DIAG
D7
D6
D5
D4
D3
VIN−
D2
VIN+
D1
D0
Pause
Loop
I/O Sel
Auto
Zeroec
Chan
Mask
Stand- by
Full CAL
AutoZero
Reset
Start
Sequencer Address to
Generate INT1
INT7
Don't
Care
INT6
INT4
INT3
INT2
INT1
INT0
Address of Sequencer
Instruction Being Executed
INST7
“0”
INST5
INST4
INST3
INST2
INST1
INST0
RAM Pointer
Timer Preset High Byte
Timer Preset Low Byte
Sign
Conversion Data: LSBs
Conversion Data: MSBs
Limit #2: Status
Limit #1: Status
(BW = “0”, Test Bit = “0” and A0 = Don't Care)
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
Table 3. LM12L458 Memory Map for 8-Bit Wide Data Bus (1)
A4
A3
A2
A1
0
0
0
0
to
1
1
0
0
0
to
1
0
0
0
0
1
0
0
1
0
0
0
0
1
0
0
to
1
0
0
1
0
0
to
1
1
0
0
0
D3
VIN−
D2
VIN+
D1
D0
Pause
Loop
Watchdog
Acquisition Time
8/12
Timer
Sync
>/<
Sign
>/<
Sign
Reset
Start
Comparison Limit #1
R/W
Don't Care
R/W
Comparison Limit #2
Instruction RAM
(RAM Pointer = 10)
R/W
0
1
0
0
0
1
1
0
0
1
0
1
0
0
1
1
1
0
1
0
0
1
0
1
0
1
1
0
1
1
0
1
0
1
1
1
1
1
0
0
0
1
1
0
0
1
1
1
0
1
0
1
1
0
1
1
(1)
D4
R/W
1
1
D5
Instruction RAM
(RAM Pointer = 01)
0
1
D6
R/W
1
1
D7
Instruction RAM
(RAM Pointer = 00)
0
1
to
1
1
1
Type
R/W
1
to
1
Purpose
0
1
0
A0
R/W
Configuration
Register
R/W
R
Interrupt Status
Register
I/O Sel
Auto Zeroec
R/W
R/W
Interrupt Enable
Register
Don't Care
R
Chan Mask
Stand- by
Full Cal
Auto- Zero
DIAG
Test
=0
INT3
INT2
Don't Care
INT7
Don't Care
INT5
INT4
Number of Conversions in Conversion FIFO to Generate INT2
INST7
“0”
INST5
INST4
INST3
Actual Number of Conversions Results in Conversion FIFO
Timer
Register
R/W
Timer Preset: Low Byte
R/W
Timer Preset: High Byte
Conversion
FIFO
R
Limit Status
Register
R
Limit #1 Status
R
Limit #2 Status
R
RAM Pointer
INT1
INT0
Sequencer Address to Generate
INT1
INST2
INST1
INST0
Address of Sequencer Instruction
being Executed
Conversion Data: LSBs
Address or Sign
Sign
Conversion Data: MSBs
(BW = “1” and Test Bit = “0”)
Bits 12–15 are used to store the user-programmable acquisition time. The Sequencer keeps the internal S/H in
the acquisition mode for a fixed number of clock cycles (nine clock cycles, for 12-bit + sign conversions and two
clock cycles for 8-bit + sign conversions or “watchdog” comparisons) plus a variable number of clock cycles
equal to twice the value stored in Bits 12–15. Thus, the S/H's acquisition time is (9 + 2D) clock cycles for 12-bit +
sign conversions and (2 + 2D) clock cycles for 8-bit + sign conversions or “watchdog” comparisons, where D is
the value stored in Bits 12–15. The minimum acquisition time compensates for the typical internal multiplexer
series resistance of 2 kΩ, and any additional delay created by Bits 12–15 compensates for source resistances
greater than 80Ω. (For this acquisition time discussion, numbers in ( ) are shown for the LM12L458 operating at
6 MHz.) The necessary acquisition time is determined by the source impedance at the multiplexer input. If the
source resistance (RS) < 80Ω and the clock frequency is 6 MHz, the value stored in bits 12–15 (D) can be 0000.
If RS > 80Ω, the following equations determine the value that should be stored in bits 12–15.
D = 0.45 x RS x fCLK
(1)
for 12-bits + sign
D = 0.36 x RS x fCLK
(2)
for 8-bits + sign and “watchdog”
RS is in kΩ and fCLK is in MHz. Round the result to the next higher integer value. If D is greater than 15, it is
advisable to lower the source impedance by using an analog buffer between the signal source and the
LM12L458's multiplexer inputs.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
23
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
Instruction RAM “01”
The second Instruction RAM section is selected by placing a “01” in Bits 8 and 9 of the Configuration register.
Bits 0–7 hold “watchdog” limit #1. When Bit 11 of Instruction RAM “00” is set to a “1”, the LM12L458 performs a
“watchdog” comparison of the sampled analog input signal with the limit #1 value first, followed by a comparison
of the same sampled analog input signal with the value found in limit #2 (Instruction RAM “10”).
Bit 8 holds limit #1's sign.
Bit 9's state determines the limit condition that generates a “watchdog” interrupt. A “1” causes a voltage greater
than limit #1 to generate an interrupt, while a “0” causes a voltage less than limit #1 to generate an interrupt.
Bits 10–15 are not used.
Instruction RAM “10”
The third Instruction RAM section is selected by placing a “10” in Bits 8 and 9 of the Configuration register.
Bits 0–7 hold “watchdog” limit #2. When Bit 11 of Instruction RAM “00” is set to a “1”, the LM12L458 performs a
“watchdog” comparison of the sampled analog input signal with the limit #1 value first (Instruction RAM “01”),
followed by a comparison of the same sampled analog input signal with the value found in limit #2.
Bit 8 holds limit #2's sign.
Bit 9's state determines the limit condition that generates a “watchdog” interrupt. A “1” causes a voltage greater
than
limit #2 to generate an interrupt, while a “0” causes a voltage less than limit #2 to generate an interrupt.
Bits 10–15 are not used.
CONFIGURATION REGISTER
The Configuration register, 1000 (A4–A1, BW = 0) or 1000x (A4–A0, BW = 1) is a 16-bit control register with
read/write capability. It acts as the LM12L458's “control panel” holding global information as well as start/stop,
reset, self-calibration, and stand-by commands.
Bit 0 is the START/STOP bit. Reading Bit 0 returns an indication of the Sequencer's status. A “0” indicates that
the Sequencer is stopped and waiting to execute the next instruction. A “1” shows that the Sequencer is running.
Writing a “0” halts the Sequencer when the current instruction has finished execution. The next instruction to be
executed is pointed to by the instruction pointer found in the status register. A “1” restarts the Sequencer with the
instruction currently pointed to by the instruction pointer. (See Bits 8–10 in the Interrupt Status register.)
Bit 1 is the LM12L458's system RESET bit. Writing a “1” to Bit 1 stops the Sequencer (resetting the
Configuration register's START/STOP bit), resets the Instruction pointer to “000” (found in the Interrupt Status
register), clears the Conversion FIFO, and resets all interrupt flags. The RESET bit will return to “0” after two
clock cycles unless it is forced high by writing a “1” into the Configuration register's Standby bit. A reset signal is
internally generated when power is first applied to the part. No operation should be started until the RESET bit is
“0”.
Writing a “1” to Bit 2 initiates an auto-zero offset voltage calibration. Unlike the eight-sample auto-zero calibration
performed during the full calibration procedure, Bit 2 initiates a “short” auto-zero by sampling the offset once and
creating a correction coefficient (full calibration averages eight samples of the converter offset voltage when
creating a correction coefficient). If the Sequencer is running when Bit 2 is set to “1”, an auto-zero starts
immediately after the conclusion of the currently running instruction. Bit 2 is reset automatically to a “0” and an
interrupt flag (Bit 3, in the Interrupt Status register) is set at the end of the auto-zero (76 clock cycles). After
completion of an auto-zero calibration, the Sequencer fetches the next instruction as pointed to by the Instruction
RAM's pointer and resumes execution. If the Sequencer is stopped, an auto-zero is performed immediately at the
time requested.
24
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
Writing a “1” to Bit 3 initiates a complete calibration process that includes a “long” auto-zero offset voltage
correction (this calibration averages eight samples of the comparator offset voltage when creating a correction
coefficient) followed by an ADC linearity calibration. This complete calibration is started after the currently
running instruction is completed if the Sequencer is running when Bit 3 is set to “1”. Bit 3 is reset automatically to
a “0” and an interrupt flag (Bit 4, in the Interrupt Status register) will be generated at the end of the calibration
procedure (4944 clock cycles). After completion of a full auto-zero and linearity calibration, the Sequencer
fetches the next instruction as pointed to by the Instruction RAM's pointer and resumes execution. If the
Sequencer is stopped, a full calibration is performed immediately at the time requested.
Bit 4 is the Standby bit. Writing a “1” to Bit 4 immediately places the LM12L458 in Standby mode. Normal
operation returns when Bit 4 is reset to a “0”. The Standby command (“1”) disconnects the external clock from
the internal circuitry, decreases the LM12L458's internal analog circuitry power supply current, and preserves all
internal RAM contents. After writing a “0” to the Standby bit, the LM12L458 returns to an operating state identical
to that caused by exercising the RESET bit. A Standby completion interrupt is issued after a power-up
completion delay that allows the analog circuitry to settle. The Sequencer should be restarted only after the
Standby completion is issued. The Instruction RAM can still be accessed through read and write operations while
the LM12L458 are in Standby Mode.
Bit 5 is the Channel Address Mask. If Bit 5 is set to a “1”, Bits 13–15 in the conversion FIFO will be equal to the
sign bit (Bit 12) of the conversion data. Resetting Bit 5 to a “0” causes conversion data Bits 13 through 15 to hold
the instruction pointer value of the instruction to which the conversion data belongs.
Bit 6 is used to select a “short” auto-zero correction for every conversion. The Sequencer automatically inserts
an auto-zero before every conversion or “watchdog” comparison if Bit 6 is set to “1”. No automatic correction will
be performed if Bit 6 is reset to “0”.
The LM12L458's offset voltage, after calibration, has a typical drift of 0.1 LSB over a temperature range of −40°C
to +85°C. This small drift is less than the variability of the change in offset that can occur when using the autozero correction with each conversion. This variability is the result of using only one sample of the offset voltage to
create a correction value. This variability decreases when using the full calibration mode because eight samples
of the offset voltage are taken, averaged, and used to create a correction value.
Bit 7 is used to program the SYNC pin (29) to operate as either an input or an output. The SYNC pin becomes
an output when Bit 7 is a “1” and an input when Bit 7 is a “0”. With SYNC programmed as an input, the rising
edge of any logic signal applied to pin 29 will start a conversion or “watchdog” comparison. Programmed as an
output, the logic level at pin 29 will go high at the start of a conversion or “watchdog” comparison and remain
high until either have finished. See Instruction RAM “00”, Bit 8.
Bits 8 and 9 form the RAM Pointer that is used to select each of a 48-bit instruction's three 16-bit sections during
read or write actions. A “00” selects Instruction RAM section one, “01” selects section two, and “10” selects
section three.
Bit 10 activates the Test mode that is used only during production testing. Leave this bit reset to “0”.
Bit 11 is the Diagnostic bit and is available only in the LM12L458. It can be activated by setting it to a “1” (the
Test bit must be reset to a “0”). The Diagnostic mode, along with a correctly chosen instruction, allows
verification that the LM12L458's ADC is performing correctly. When activated, the inverting and non-inverting
inputs are connected as shown in Table 4. As an example, an instruction with “001” for both VIN+ and VIN− while
using the Diagnostic mode typically results in a full-scale output.
INTERRUPTS
The LM12L458 has eight possible interrupts, all with the same priority. Any of these interrupts will cause a
hardware interrupt to appear on the INT pin (31) if they are not masked (by the Interrupt Enable register). The
Interrupt Status register is then read to determine which of the eight interrupts has been issued.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
25
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
Table 4. LM12L458 Input Multiplexer
Channel Configuration Showing Normal
Mode and Diagnostic Mode
Channel Selection Data
Normal Mode
Diagnostic Mode
VIN+
VIN−
000
IN0
GND
001
IN1
010
IN2
011
VIN+
VIN−
IN1
VREF+
VREF−
IN2
IN2
IN2
IN3
IN3
IN3
IN3
100
IN4
IN4
IN4
IN4
101
IN5
IN5
IN5
IN5
110
IN6
IN6
IN6
IN6
111
IN7
IN7
IN7
IN7
The Interrupt Status register, 1010 (A4–A1, BW = 0) or 1010x (A4–A0, BW = 1) must be cleared by reading it
after writing to the Interrupt Enable register. This removes any spurious interrupts on the INT pin generated
during an Interrupt Enable register access.
Interrupt 0 is generated whenever the analog input voltage on a selected multiplexer channel crosses a limit
while the LM12L458 are operating in the “watchdog” comparison mode. Two sequential comparisons are made
when the LM12L458 are executing a “watchdog” instruction. Depending on the logic state of Bit 9 in the
Instruction RAM's second and third sections, an interrupt will be generated either when the input signal's
magnitude is greater than or less than the programmable limits. (See the Instruction RAM, Bit 9 description.) The
Limit Status register will indicate which programmed limit, #1 or #2 and which instruction was executing when the
limit was crossed.
Interrupt 1 is generated when the Sequencer reaches the instruction counter value specified in the Interrupt
Enable register's bits 8–10. This flag appears before the instruction's execution.
Interrupt 2 is activated when the Conversion FIFO holds a number of conversions equal to the programmable
value stored in the Interrupt Enable register's Bits 11–15. This value ranges from 0001 to 1111, representing 1 to
31 conversions stored in the FIFO. A user-programmed value of 0000 has no meaning. See Other Registers and
Functions for more FIFO information.
The completion of the short, single-sampled auto-zero calibration generates Interrupt 3.
The completion of a full auto-zero and linearity self-calibration generates Interrupt 4.
Interrupt 5 is generated when the Sequencer encounters an instruction that has its Pause bit (Bit 1 in Instruction
RAM “00”) set to “1”.
Interrupt 7 is issued after a short delay (10 ms typ) while the LM12L458 returns from Standby mode to active
operation using the Configuration register's Bit 4. This short delay allows the internal analog circuitry to settle
sufficiently, ensuring accurate conversion results.
INTERRUPT ENABLE REGISTER
The Interrupt Enable register at address location 1001 (A4–A1, BW = 0) or 1001x (A4–A0, BW = 1) has
READ/WRITE capability. An individual interrupt's ability to produce an external interrupt at pin 31 (INT) is
accomplished by placing a “1” in the appropriate bit location. Any of the internal interrupt-producing operations
will set their corresponding bits to “1” in the Interrupt Status register regardless of the state of the associated bit
in the Interrupt Enable register. See Section 2.3 for more information about each of the eight internal interrupts.
Bit 0 enables an external interrupt when an internal “watchdog” comparison limit interrupt has taken place.
Bit 1 enables an external interrupt when the Sequencer has reached the address stored in Bits 8–10 of the
Interrupt Enable register.
Bit 2 enables an external interrupt when the Conversion FIFO's limit, stored in Bits 11–15 of the Interrupt Enable
register, has been reached.
Bit 3 enables an external interrupt when the single-sampled auto-zero calibration has been completed.
Bit 4 enables an external interrupt when a full auto-zero and linearity self-calibration has been completed.
26
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
Bit 5 enables an external interrupt when an internal Pause interrupt has been generated.
Bit 6 is a “Don't Care”.
Bit 7 enables an external interrupt when the LM12L458 return from power-down to active mode.
Bits 8–10 form the storage location of the user-programmable value against which the Sequencer's address is
compared. When the Sequencer reaches an address that is equal to the value stored in Bits 8–10, an internal
interrupt is generated and appears in Bit 1 of the Interrupt Status register. If Bit 1 of the Interrupt Enable register
is set to “1”, an external interrupt will appear at pin 31 (INT).
The value stored in bits 8–10 ranges from 000 to 111, representing 0 to 7 instructions stored in the Instruction
RAM. After the Instruction RAM has been programmed and the RESET bit is set to “1”, the Sequencer is started
by placing a “1” in the Configuration register's START bit. Setting the INT 1 trigger value to 000 does not
generate an INT 1 the first time the Sequencer retrieves and decodes Instruction 000. The Sequencer
generates INT 1 (by placing a “1” in the Interrupt Status register's Bit 1) the second time and after the
Sequencer encounters Instruction 000. It is important to remember that the Sequencer continues to operate even
if an Instruction interrupt (INT 1) is internally or externally generated. The only mechanisms that stop the
Sequencer are an instruction with the PAUSE bit set to “1” (halts before instruction execution), placing a “0” in
the Configuration register's START bit, or placing a “1” in the Configuration register's RESET bit.
Bits 11–15 hold the number of conversions that must be stored in the Conversion FIFO in order to generate an
internal interrupt. This internal interrupt appears in Bit 2 of the Interrupt Status register. If Bit 2 of the Interrupt
Enable register is set to “1”, an external interrupt will appear at pin 31 (INT).
Other Registers and Functions
INTERRUPT STATUS REGISTER
This read-only register is located at address 1010 (A4–A1, BW = 0) or 1010x (A4–A0, BW = 1). The
corresponding flag in the Interrupt Status register goes high (“1”) any time that an interrupt condition takes place,
whether an interrupt is enabled or disabled in the Interrupt Enable register. Any of the active (“1”) Interrupt Status
register flags are reset to “0” whenever this register is read or a device reset is issued (see Bit 1 in the
Configuration Register).
Bit 0 is set to “1” when a “watchdog” comparison limit interrupt has taken place.
Bit 1 is set to “1” when the Sequencer has reached the address stored in Bits 8–10 of the Interrupt Enable
register.
Bit 2 is set to “1” when the Conversion FIFO's limit, stored in Bits 11–15 of the Interrupt Enable register, has
been reached.
Bit 3 is set to “1” when the single-sampled auto-zero has been completed.
Bit 4 is set to “1” when an auto-zero and full linearity self-calibration has been completed.
Bit 5 is set to “1” when a Pause interrupt has been generated.
Bit 6 is a “Don't Care”.
Bit 7 is set to “1” when the LM12L458 return from power-down to active mode.
Bits 8–10 hold the Sequencer's actual instruction address while it is running.
Bits 11–15 hold the actual number of conversions stored in the Conversion FIFO while the Sequencer is running.
LIMIT STATUS REGISTER
The read-only register is located at address 1101 (A4–A1, BW = 0) or 1101x (A4–A0, BW = 1). This register is
used in tandem with the Limit #1 and Limit #2 registers in the Instruction RAM. Whenever a given instruction's
input voltage exceeds the limit set in its corresponding Limit register (#1 or #2), a bit, corresponding to the
instruction number, is set in the Limit Status register. Any of the active (“1”) Limit Status flags are reset to “0”
whenever this register is read or a device reset is issued (see Bit 1 in the Configuration register). This register
holds the status of limits #1 and #2 for each of the eight instructions.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
27
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
Bits 0–7 show the Limit #1 status. Each bit will be set high (“1”) when the corresponding instruction's input
voltage exceeds the threshold stored in the instruction's Limit #1 register. When, for example, instruction 3 is a
“watchdog” operation (Bit 11 is set high) and the input for instruction 3 meets the magnitude and/or polarity data
stored in instruction 3's Limit #1 register, Bit 3 in the Limit Status register will be set to a “1”.
Bits 8–15 show the Limit #2 status. Each bit will be set high (“1”) when the corresponding instruction's input
voltage exceeds the threshold stored in the instruction's Limit #2 register. When, for example, the input to
instruction 6 meets the value stored in instruction 6's Limit #2 register, Bit 14 in the Limit Status register will be
set to a “1”.
TIMER
The LM12L458 have an on-board 16-bit timer that includes a 5-bit pre-scaler. It uses the clock signal applied to
pin 23 as its input. It can generate time intervals of 0 through 221 clock cycles in steps of 25. This time interval
can be used to delay the execution of instructions. It can also be used to slow the conversion rate when
converting slowly changing signals. This can reduce the amount of redundant data stored in the FIFO and
retrieved by the controller.
The user-defined timing value used by the Timer is stored in the 16-bit READ/WRITE Timer register at location
1011 (A4–A1, BW = 0) or 1011x (A4–A0, BW = 1) and is pre-loaded automatically. Bits 0–7 hold the preset
value's low byte and Bits 8–15 hold the high byte. The Timer is activated by the Sequencer only if the current
instruction's Bit 9 is set (“1”). If the equivalent decimal value “N” (0 ≤ N ≤ 216 − 1) is written inside the 16-bit Timer
register and the Timer is enabled by setting an instruction's bit 9 to a “1”, the Sequencer will delay the same
instruction's execution by halting at state 3 (S3), as shown in Figure 31, for 32 × N + 2 clock cycles.
DMA
The DMA works in tandem with Interrupt 2. An active DMA Request on pin 32 (DMARQ) requires that the FIFO
interrupt be enabled. The voltage on the DMARQ pin goes high when the number of conversions in the FIFO
equals the 5-bit value stored in the Interrupt Enable register (bits 11–15). The voltage on the INT pin goes low at
the same time as the voltage on the DMARQ pin goes high. The voltage on the DMARQ pin goes low when the
FIFO is emptied. The Interrupt Status register must be read to clear the FIFO interrupt flag in order to enable the
next DMA request.
DMA operation is optimized through the use of the 16-bit data bus connection (a logic “0” applied to the BW pin).
Using this bus width allows DMA controllers that have single address Read/Write capability to easily unload the
FIFO. Using DMA on an 8-bit data bus is more difficult. Two read operations (low byte, high byte) are needed to
retrieve each conversion result from the FIFO. Therefore, the DMA controller must be able to repeatedly access
two constant addresses when transferring data from the LM12L458 to the host system.
FIFO
The result of each conversion stored in an internal read-only FIFO (First-In, First-Out) register. It is located at
1100 (A4–A1, BW = 0) or 1100x (A4–A0, BW = 1). This register has 32 16-bit wide locations. Each location holds
13-bit data. Bits 0–3 hold the four LSB's in the 12 bits + sign mode or “1110” in the 8 bits + sign mode. Bits 4–11
hold the eight MSB's and Bit 12 holds the sign bit. Bits 13–15 can hold either the sign bit, extending the register's
two's complement data format to a full sixteen bits or the instruction address that generated the conversion and
the resulting data. These modes are selected according to the logic state of the Configuration register's Bit 5.
The FIFO status should be read in the Interrupt Status register (Bits 11–15) to determine the number of
conversion results that are held in the FIFO before retrieving them. This will help prevent conversion data
corruption that may take place if the number of reads are greater than the number of conversion results
contained in the FIFO. Trying to read the FIFO when it is empty may corrupt new data being written into the
FIFO. Writing more than 32 conversion data into the FIFO by the ADC results in loss of the first conversion data.
Therefore, to prevent data loss, it is recommended that the LM12L458's interrupt capability be used to inform the
system controller that the FIFO is full.
The lower portion (A0 = 0) of the data word (Bits 0–7) should be read first followed by a read of the upper portion
(A0 = 1) when using the 8-bit bus width (BW = 1). Reading the upper portion first causes the data to shift down,
which results in loss of the lower byte.
Bits 0–12 hold 12-bit + sign conversion data. Bits 0–3 will be 1110 (LSB) when using 8-bit plus sign resolution.
28
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
Bits 13–15 hold either the instruction responsible for the associated conversion data or the sign bit. Either mode
is selected with Bit 5 in the Configuration register.
Using the FIFO's full depth is achieved as follows. Set the value of the Interrupt Enable registers's Bits 11–15 to
1111 and the Interrupt Enable register's Bit 2 to a “1”. This generates an external interrupt when the 31st
conversion is stored in the FIFO. This gives the host processor a chance to send a “0” to the LM12L458's Start
bit (Configuration register) and halt the ADC before it completes the 32nd conversion. The Sequencer halts after
the current (32) conversion is completed. The conversion data is then transferred to the FIFO and occupies the
32nd location. FIFO overflow is avoided if the Sequencer is halted before the start of the 32nd conversion by
placing a “0” in the Start bit (Configuration register). It is important to remember that the Sequencer continues to
operate even if a FIFO interrupt (INT 2) is internally or externally generated. The only mechanisms that stop
the Sequencer are an instruction with the PAUSE bit set to “1” (halts before instruction execution), placing a “0”
in the Configuration register's START bit, or placing a “1” in the Configuration register's RESET bit.
Sequencer
The Sequencer uses a 3-bit counter (Instruction Pointer, or IP, in Figure 4) to retrieve the programmable
conversion instructions stored in the Instruction RAM. The 3-bit counter is reset to 000 during chip reset or if the
current executed instruction has its Loop bit (Bit 1 in any Instruction RAM “00”) set high (“1”). It increments at the
end of the currently executed instruction and points to the next instruction. It will continue to increment up to 111
unless an instruction's Loop bit is set. If this bit is set, the counter resets to “000” and execution begins again with
the first instruction. If all instructions have their Loop bit reset to “0”, the Sequencer will execute all eight
instructions continuously. Therefore, it is important to realize that if less than eight instructions are programmed,
the Loop bit on the last instruction must be set. Leaving this bit reset to “0” allows the Sequencer to execute
“unprogrammed” instructions, the results of which may be unpredictable.
The Sequencer's Instruction Pointer value is readable at any time and is found in the Status register at Bits 8–10.
The Sequencer can go through eight states during instruction execution:
State 0: The current instruction's first 16 bits are read from the Instruction RAM “00”. This state is one clock
cycle long.
State 1: Checks the state of the Calibration and Start bits. This is the “rest” state whenever the Sequencer is
stopped using the reset, a Pause command, or the Start bit is reset low (“0”). When the Start bit is set to a “1”,
this state is one clock cycle long.
State 2: Perform calibration. If bit 2 or bit 6 of the Configuration register is set to a “1”, state 2 is 76 clock
cycles long. If the Configuration register's bit 3 is set to a “1”, state 2 is 4944 clock cycles long.
State 3: Run the internal 16-bit Timer. The number of clock cycles for this state varies according to the value
stored in the Timer register. The number of clock cycles is found by using the expression below
32T + 2
where
•
0 ≤ T ≤ 216 −1
(3)
State 7: Run the acquisition delay and read Limit #1's value if needed. The number of clock cycles for 12-bit +
sign mode varies according to
9 + 2D
where
•
D is the user-programmable 4-bit value stored in bits 12–15 of Instruction RAM “00” and is limited to 0 ≤ D ≤
15
(4)
The number of clock cycles for 8-bit + sign or “watchdog” mode varies according to
2 + 2D
where
•
D is the user-programmable 4-bit value stored in bits 12–15 of Instruction RAM “00” and is limited to 0 ≤ D ≤
15
(5)
State 6: Perform first comparison. This state is 5 clock cycles long.
State 4: Read Limit #2. This state is 1 clock cycle long.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
29
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
State 5: Perform a conversion or second comparison. This state takes 44 clock cycles when using the 12-bit +
sign mode or 21 clock cycles when using the 8-bit + sign mode. The “watchdog” mode takes 5 clock cycles.
Figure 31. Sequencer Logic Flow Chart (IP = Instruction Pointer)
30
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
Analog Considerations
REFERENCE VOLTAGE
The difference in the voltages applied to the VREF+ and VREF− defines the analog input voltage span (the
difference between the voltages applied between two multiplexer inputs or the voltage applied to one of the
multiplexer inputs and analog ground), over which 4095 positive and 4096 negative codes exist. The voltage
sources driving VREF+ or VREF− must have very low output impedance and noise.
The ADC can be used in either ratiometric or absolute reference applications. In ratiometric systems, the analog
input voltage is proportional to the voltage used for the ADC's reference voltage. When this voltage is the system
power supply, the VREF+ pin is connected to VA+ and VREF− is connected to GND. This technique relaxes the
system reference stability requirements because the analog input voltage and the ADC reference voltage move
together. This maintains the same output code for given input conditions.
For absolute accuracy, where the analog input voltage varies between very specific voltage limits, a time and
temperature stable voltage source can be connected to the reference inputs. Typically, the reference voltage's
magnitude will require an initial adjustment to null reference voltage induced full-scale errors.
INPUT RANGE
The LM12L458's fully differential ADC and reference voltage inputs generate a two's-complement output that is
found by using the equation below.
(6)
Round up to the next integer value between −4096 to 4095 for 12-bit resolution and between −256 to 255 for 8bit resolution if the result of the above equation is not a whole number. As an example, VREF+ = 2.5V, VREF− = 1V,
VIN+ = 1.5V and VIN− = GND. The 12-bit + sign output code is positive full-scale, or 0,1111,1111,1111. If VREF+ =
3.3V, VREF− = 1V, VIN+ = 3V, and VIN− = GND, the 12-bit + sign output code is 0,1100,0000,0000.
INPUT CURRENT
A charging current flows into or out of (depending on the input voltage polarity) the analog input pins, IN0–IN7 at
the start of the analog input acquisition time (tACQ). This current's peak value will depend on the actual input
voltage applied. This charging current causes voltage spikes at the inputs. This voltage spikes will not corrupt the
conversion results.
INPUT SOURCE RESISTANCE
For low impedance voltage sources (<80Ω for 6 MHz operation) the input charging current will decay, before the
end of the S/H's acquisition time, to a value that will not introduce any conversion errors. For higher source
impedances, the S/H's acquisition time can be increased. As an example, operating with a 6 MHz clock
frequency and maximum acquisition time, the LM12L458's analog inputs can handle source impedance as high
as 5.56 kΩ. Refer to Section 2.1, Instruction RAM “00”, Bits 12–15 for further information.
INPUT BYPASS CAPACITANCE
External capacitors (0.01 μF to 0.1 μF) can be connected between the analog input pins, IN0–IN7, and analog
ground to filter any noise caused by inductive pickup associated with long input leads. It will not degrade the
conversion accuracy.
NOISE
The leads to each of the analog multiplexer input pins should be kept as short as possible. This will minimize
input noise and clock frequency coupling that can cause conversion errors. Input filtering can be used to reduce
the effects of the noise sources.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
31
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
POWER SUPPLIES
Noise spikes on the VA+ and VD+ supply lines can cause conversion errors; the comparator will respond to the
noise. The ADC is especially sensitive to any power supply spikes that occur during the auto-zero or linearity
correction. Low inductance tantalum capacitors of 10 μF or greater paralleled with 0.1 μF monolithic ceramic
capacitors are recommended for supply bypassing. Separate bypass capacitors should be used for the VA+ and
VD+ supplies and placed as close as possible to these pins.
GROUNDING
The LM12L458's nominal performance can be maximized through proper grounding techniques. These include
the use of a single ground plane and meticulously separating analog and digital areas of the board. The use of
separate analog and digital digital planes within the same board area generally provides best performance. All
components that handle digital signals should be placed within the digital area of the board, as defined by the
digital power plane, while all analog components should be placed in the analog area of the board. Such
placement and the routing of analog and digital signal lines within their own respective board areas greatly
reduces the occurrence of ground loops and noise. This will also minimize EMI/RFI radiation and susceptibility.
It is recommended that stray capacitance between the analog inputs (IN0–IN7, VREF+, and VREF−) be reduced by
increasing the clearance (+1/16th inch) between the analog signal and reference pins and the ground plane.
CLOCK SIGNAL CONSIDERATIONS
The LM12L458's performance is optimized by routing the analog input/output and reference signal conductors
(pins 34–44) as far as possible from the conductor that carries the clock signal to pin 23.
Avoid overshoot and undershoot on the clock line by treating this line as a transmission line (use proper
termination techniques). Failure to do so can result in erratic operation. Generally, a series 30Ω to 50Ω resistor in
the clock line, located as close to the clock source as possible, will prevent most problems. The clock source
should drive ONLY the LM12L458 clock pin.
Common Application Problems
Driving the analog inputs with op-amp(s) powered from supplies other than the supply used for the
LM12L458. This practice allows for the possibility of the amplifier output (LM12L458 input) to reach potentials
outside of the 0V to VA+ range. This could happen in normal operation if the amplifier use supply voltages
outside of the range of the LM12L458 supply rails. This could also happen upon power up if the amplifier supply
or supplies ramp up faster than the supply of the LM12L458. If any pin experiences a potential more than 100
mV below ground or above the supply voltage, even on a fast transient basis, the result could be erratic
operation, missing codes, one channel interacting with one or more of the others, skipping channels or a
complete malfunction, depending upon how far the input is driven beyond the supply rails.
Not performing a full calibration at power up. This can result in missing codes. The device needs to have a
full calibration run and completed after power up and BEFORE attempting to perform even a single conversion or
watchdog operation. The only way to recover if this is violated is to interrupt the power to the device.
Not waiting for the calibration process to complete before trying to write to the device. Once a calibration
is requested, the ONLY read of the LM12L458 should be if the Interrupt Status Register to check for a completed
calibration. Attempting a write or any other read during calibration would cause a corruption of the calibration
process, resulting in missing codes. The only way to recover would be to interrupt the power.
Improper termination of digital lines. Improper termination can result in energy reflections that build up to
cause overshoot that goes above the supply potential and undershoot that goes below ground. It is never good
to drive a device beyond the supply rails, unless the device is specifically designed to handle this situation, but
the LM12L458 is more sensitive to this condition that most devices. Again, if any pin experiences a potential
more than 100 mV below ground or above the supply voltage, even on a fast transient basis, the result could be
erratic operation, missing codes, or a complete malfunction, depending upon how far the input is driven beyond
the supply rails. The clock input is the most sensitive digital one. Generally, a 50Ω series resistor, located very
close to the signal source, will keep digital lines "clean".
32
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
LM12L458
www.ti.com
SNAS085B – JULY 1999 – REVISED MARCH 2013
Excessive output capacitance on the digital lines. The current required to charge the capacitance on the
digital outputs can cause noise on the supply bus within the LM12L458, causing internal supply "bounce" even
when the external supply pin is pretty stable. The current required to discharge the output capacitance can cause
die ground "bounce". Either of these can cause noise to be induced at the analog inputs, resulting in conversion
errors.
Output capacitance should be limited as much as possible. A series 100Ω resistor in each digital output line,
located very close to the output pin, will limit the charge and discharge current, minimizing the extent of the
conversion errors.
Improper CS decoding. If address decoder is used, care must be exercised to ensure that no "runt" (very
narrow) pulse is produced on the CS line when trying to address another device or memory. Even subnanosecond spikes on the CS line can cause the chip to be reprogrammed in accordance with what happens to
be on the data lines at the time. The result is unexpected operation. The worst case result is that the device is
put into the "Test" mode and the on-board EEPROM that corrects linearity is corrupted. If this happens, the only
recourse is to replace the device.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
33
LM12L458
SNAS085B – JULY 1999 – REVISED MARCH 2013
www.ti.com
REVISION HISTORY
Changes from Revision A (March 2013) to Revision B
•
34
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 33
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM12L458
PACKAGE OPTION ADDENDUM
www.ti.com
30-Jul-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM12L458CIV
LIFEBUY
PLCC
FN
44
25
TBD
Call TI
Call TI
-40 to 85
LM12L458CIV
LM12L458CIV/NOPB
LIFEBUY
PLCC
FN
44
25
Green (RoHS
& no Sb/Br)
CU SN
Level-3-245C-168 HR
-40 to 85
LM12L458CIV
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
30-Jul-2016
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPLC004A – OCTOBER 1994
FN (S-PQCC-J**)
PLASTIC J-LEADED CHIP CARRIER
20 PIN SHOWN
Seating Plane
0.004 (0,10)
0.180 (4,57) MAX
0.120 (3,05)
0.090 (2,29)
D
D1
0.020 (0,51) MIN
3
1
19
0.032 (0,81)
0.026 (0,66)
4
E
18
D2 / E2
E1
D2 / E2
8
14
0.021 (0,53)
0.013 (0,33)
0.007 (0,18) M
0.050 (1,27)
9
13
0.008 (0,20) NOM
D/E
D2 / E2
D1 / E1
NO. OF
PINS
**
MIN
MAX
MIN
MAX
MIN
MAX
20
0.385 (9,78)
0.395 (10,03)
0.350 (8,89)
0.356 (9,04)
0.141 (3,58)
0.169 (4,29)
28
0.485 (12,32)
0.495 (12,57)
0.450 (11,43)
0.456 (11,58)
0.191 (4,85)
0.219 (5,56)
44
0.685 (17,40)
0.695 (17,65)
0.650 (16,51)
0.656 (16,66)
0.291 (7,39)
0.319 (8,10)
52
0.785 (19,94)
0.795 (20,19)
0.750 (19,05)
0.756 (19,20)
0.341 (8,66)
0.369 (9,37)
68
0.985 (25,02)
0.995 (25,27)
0.950 (24,13)
0.958 (24,33)
0.441 (11,20)
0.469 (11,91)
84
1.185 (30,10)
1.195 (30,35)
1.150 (29,21)
1.158 (29,41)
0.541 (13,74)
0.569 (14,45)
4040005 / B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated