FEATURES High efficiency: 94% @ 5.0Vin, 3.3V/10A out Small size and low profile: 17.8x15.0x7.8mm (0.70”x0.59”x0.31”) Output voltage adjustment: 0.9V~3.3V Monotonic startup into normal and pre-biased loads Input UVLO, output OCP Remote ON/OFF Output short circuit protection Fixed frequency operation Copper pad to provide excellent thermal performance ISO 9001, TL 9000, ISO 14001, QS9000, OHSAS18001 certified manufacturing facility UL/cUL 60950 (US & Canada) Recognized, and TUV (EN60950) Certified CE mark meets 73/23/EEC and 93/68/EEC directives Delphi Series IPM, Non-Isolated, Integrated Point-of-Load Power Modules: 3V~5.5V input, 0.8~3.3V and 10A Output Current The Delphi Series IPM04S non-isolated, fully integrated Point-of-Load (POL) power modules, are the latest offerings from a OPTIONS SMD or SIP package world leader in power supply technology and manufacturing ― Delta Electronics, Inc. This product family provides up to 10A of output current or 33W of output power in an industry standard, compact, IC-like, molded package. It is highly integrated and does not require external components to provide the point-of-load function. A copper pad on the back of the module, in close contact with the internal heat dissipation components, provides excellent thermal performance. The assembly process of the modules is fully automated with no manual assembly involved. These converters possess outstanding electrical and thermal performance, as well as extremely high reliability under highly stressful operating conditions. IPM04S operate from a 3V~5.5V source and provide a programmable output voltage of 0.8V~3.3V. The IPM product family is available in both a SMD or SIP package. IPM family is also available for input 8V~14V, please refer to IPM12S datasheet for details. DATASHEET IPM04S0A0R/S10_10142013 APPLICATIONS Telecom/DataCom Wireless Networks Optical Network Equipment Server and Data Storage Industrial/Test Equipment TECHNICAL SPECIFICATIONS TA = 25°C, airflow rate = 300 LFM, Vin = 5.0Vdc, nominal Vout unless otherwise noted. PARAMETER NOTES and CONDITIONS IPM04S0A0R/S10FA Min. ABSOLUTE MAXIMUM RATINGS Input Voltage (Continuous) Operating Temperature Storage Temperature INPUT CHARACTERISTICS Operating Input Voltage Input Under-Voltage Lockout Turn-On Voltage Threshold Turn-Off Voltage Threshold Maximum Input Current No-Load Input Current Off Converter Input Current Input Reflected-Ripple Current Input Voltage Ripple Rejection OUTPUT CHARACTERISTICS Output Voltage Set Point Output Voltage Adjustable Range Output Voltage Regulation Over Line Over Load Over Temperature Total Output Voltage Range Output Voltage Ripple and Noise Peak-to-Peak RMS Output Current Range Output Voltage Over-shoot at Start-up Output DC Current-Limit Inception DYNAMIC CHARACTERISTICS Dynamic Load Response Positive Step Change in Output Current Negative Step Change in Output Current Setting Time to 10% of Peak Devitation Turn-On Transient Start-Up Time, From On/Off Control Start-Up Time, From Input Output Voltage Rise Time Maximum Output Startup Capacitive Load EFFICIENCY Vo=0.9V Vo=1.2V Vo=1.5V Vo=1.8V Vo=2.5V Vo=3.3V FEATURE CHARACTERISTICS Switching Frequency ON/OFF Control, (Logic High-Module ON) Logic High Logic Low ON/OFF Current Leakage Current GENERAL SPECIFICATIONS MTBF Weight Typ. Max. Units 6 +116 +125 Vdc °C °C Refer to figure 33 for measuring point 0 -40 -55 Vo≤ Vin-0.6 3.0 3.3/5.0 5.5 V 2.6 2.2 2.9 1.9 V V A mA mA mAp-p dB Vin=Vin,min to Vin,max, Io=Io,max 3 100 TBD P-P 1µH inductor, 5Hz to 20MHz 120 Hz Vin=5.0V, Io=Io,max, Ta=25℃ Vin=Vin,min to Vin,max Io=Io,min to Io,max Ta=Ta,min to Ta,max Over sample load, line and temperature 5Hz to 20MHz bandwidth Full Load, 1µF ceramic, 10µF tantalum Full Load, 1µF ceramic, 10µF tantalum 9.0 150 10 150 - 2.5 0.8 + 2.5 3.3 % Vo,set V -3.0 10 15 15 +3.0 mV mV mV % Vo,set 100 15 10 3 mVp-p mV A % Vo,set % Io 130 130 25 165 165 50 mVpk mVpk µs 12 12 5 20 20 7 1000 5000 ms ms ms µF µF 50 10 0 Vin=3.0V to 5.5V, Io=0A to 10A, Ta=25℃ 0 220 10µF Tan & 1µF Ceramic load cap, 0.5A/µs 50% Io, max to 100% Io, max 100% Io, max to 50% Io, max Io=Io.max Time for Vo to rise from 10% to 90% of Vo,set, Full load; ESR ≧1mΩ Full load; ESR ≧10mΩ 5 5 3 Vin=5.0V, Io=Io,max, Ta=25℃ Vin=5.0V, Io=Io,max, Ta=25℃ Vin=5.0V, Io=Io,max, Ta=25℃ Vin=5.0V, Io=Io,max, Ta=25℃ Vin=5.0V, Io=Io,max, Ta=25℃ Vin=5.0V, Io=Io,max, Ta=25℃ Module On Module Off Ion/off at Von/off=0 Logic High, Von/off=5V Io=80% Io,max, Ta=25℃ 81.0 85.0 88.0 90.0 92.5 94.0 % % % % % % 300 kHz 2.2 -0.2 0.25 13.3 6 Vin,max 0.8 1 50 V V mA µA M hours grams DS_ IPM04S0A0R/S10_10142013 2 ELECTRICAL CHARACTERISTICS CURVES 95 EFFICIENCY(%) EFFICIENCY(%) 90 80 Vin=5.0V Vin=4.0V Vin=3.3V 85 Vin=5.0V Vin=4.0V Vin=3.3V 75 70 1 2 3 4 5 6 7 8 9 1 10 2 3 4 Figure 1: Converter efficiency vs. output current (0.90V output voltage) 7 8 9 10 Figure 2: Converter efficiency vs. output current (1.2V output voltage) 95 EFFICIENCY(%) 95 EFFICIENCY(%) 6 LOAD (A) LOAD (A) 85 Vin=5.0V Vin=4.0V Vin=3.3V 75 85 Vin=5.0V Vin=4.0V Vin=3.3V 75 1 2 3 4 5 6 7 8 9 10 1 2 3 4 LOAD (A) 5 6 7 8 9 10 LOAD (A) Figure 3: Converter efficiency vs. output current (1.5V output voltage) Figure 4: Converter efficiency vs. output current (1.8V output voltage) 95 EFFICIENCY(%) 95 EFFICIENCY(%) 5 Vin=5.0V Vin=4.0V Vin=3.3V 85 75 Vin=5.5V Vin=5.0V Vin=4.0V 85 75 1 2 3 4 5 6 7 8 9 LOAD (A) Figure 5: Converter efficiency vs. output current (2.5V 0utput voltage) 10 1 2 3 4 5 6 7 8 9 10 LOAD (A) Figure 6: Converter efficiency vs. output current (3.3V output voltage) DS_ IPM04S0A0R/S10_10142013 3 ELECTRICAL CHARACTERISTICS CURVES Figure 7: Output ripple & noise at 5.0Vin, 0.9V/10A out Figure 8: Output ripple & noise at 5.0Vin, 1.2V/10A out Figure 9: Output ripple & noise at 5.0Vin, 1.5V/10A out Figure 10: Output ripple & noise at 5.0Vin, 1.8V/10A out Figure 11: Output ripple & noise at 5.0Vin, 2.5V/10A out Figure 12: Output ripple & noise at 5.0Vin, 3.3V/10A out DS_ IPM04S0A0R/S10_10142013 4 ELECTRICAL CHARACTERISTICS CURVES Figure 13: Power on waveform at 5.0vin, 0.9V/10A out with application of Vin Figure 14: Power on waveform at 5.0vin, 3.3V/10A out with application of Vin Figure 15: Power off waveform at 5.0vin, 0.9V/10A out with application of Vin Figure 16: Power off waveform 5.0vin, 3.3V/10A out with application of Vin Figure 17: Remote turn on delay time at 5.0vin, 0.9V/10A out Figure 18: Remote turn on delay time at 5.0vin, 3.3V/10A out DS_ IPM04S0A0R/S10_10142013 5 ELECTRICAL CHARACTERISTICS CURVES Figure 19: Turn on delay at 5.0vin, 0.9V/10A out with application of Vin Figure 21: Typical transient response to step load change at 0.5A/μS from 0% to 50% of Io, max at 5.0Vin, 2.5V out (measurement with a 1uF ceramic and a 10μF tantalum Figure 20: Turn on delay at 5.0vin, 3.3V/10A out with application of Vin Figure 22: Typical transient response to step load change at 0.5A/μS from 50% to 0% of Io, max at 5.0Vin, 2.5V out (measurement with a 1uF ceramic and a 10μF tantalu) DS_ IPM04S0A0R/S10_10142013 6 TEST CONFIGURATIONS DESIGN CONSIDERATIONS Input Source Impedance L VI(+) 2 100uF Tantalum BATTERY VI(-) Note: Input reflected-ripple current is measured with a simulated source inductance. Current is measured at the input of the module. Figure 23: Input reflected-ripple current test setup To maintain low-noise and ripple at the input voltage, it is critical to use low ESR capacitors at the input to the module. Figure 26 shows the input ripple voltage (mVp-p) for various output models using 2x100 uF low ESR tantalum capacitors (KEMET P/N:T491D107M, 100uF/16V or equivalent) or 2x22 uF very low ESR ceramic capacitors (TDK P/N:C3225X7S1C226MT, 22uF/16V or equivalent). The input capacitance should be able to handle an AC ripple current of at least: Irms Iout Vout Vout 1 Vin Vin Arms Vo SCOPE Resistive Load GND Note: Use a 10μF tantalum and 1μF capacitor. Scope measurement should be made using a BNC connector. Figure 24: Peak-peak output noise and startup transient measurement test setup 300 Input Ripple Voltage (mVp-p) 1uF 10uF tantalum ceramic 250 200 150 100 Tantalum Ceramic 50 0 0 1 2 3 4 Output Voltage (Vdc) VI Vo GND Figure 25: Output voltage and efficiency measurement test setup Note: All measurements are taken at the module terminals. When the module is not soldered (via socket), place Kelvin connections at module terminals to avoid measurement errors due to contact resistance. ( Figure 26: Input ripple voltage for various output models, Io = 10A (Cin = 2x100uF tantalum capacitors or 2x22uF ceramic capacitors at the input) The power module should be connected to a low ac-impedance input source. Highly inductive source impedances can affect the stability of the module. An input capacitance must be placed close to the modules input pins to filter ripple current and ensure module stability in the presence of inductive traces that supply the input voltage to the module. Vo Io ) 100 % Vi Ii DS_ IPM04S0A0R/S10_10142013 7 DESIGN CONSIDERATIONS FEATURES DESCRIPTIONS Safety Considerations Over-Current Protection For safety-agency approval the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standards. To provide protection in an output over load fault condition, the unit is equipped with internal over-current protection. When the over-current protection is triggered, the unit enters hiccup mode. The units operate normally once the fault condition is removed. For the converter output to be considered meeting the requirements of safety extra-low voltage (SELV), the input must meet SELV requirements. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a maximum 10A time-delay fuse in the ungrounded lead. Remote On/Off The IPM series power modules have an On/Off control pin for output voltage remote On/Off operation. The On/Off pin is an open collector/drain logic input signal that is referenced to ground. When On/Off control pin is not used, leave the pin unconnected. Pre-Bias Startup Capability The IPM would perform the monotonic startup into the pre-bias loads; so as to avoid a system voltage drop occur upon application. In complex digital systems an external voltage can sometimes be presented at the output of the module during power on. This voltage may be feedback through a multi-supply logic component, such as FPGA or ASIC. Another way might be via a clamp diode as part of a power up sequencing implementation. The remote on/off pin is internally connected to +Vin through an internal pull-up resistor. Figure 27 shows the circuit configuration for applying the remote on/off pin. The module will execute a soft start ON when the transistor Q1 is in the off state. The typical rise for this remote on/off pin at the output voltage of 0.9V and 3.3V are shown in Figure 17 and 18. Vo Vin IPM On/Off RL Q1 GND Figure 27: Remote on/off implementation DS_ IPM04S0A0R/S10_10142013 8 FEATURES DESCRIPTIONS (CON.) Output Voltage Programming The output voltage of IPM can be programmed to any voltage between 0.9Vdc and 3.3Vdc by connecting one resistor (shown as Rtrim in Figure 28, 29) between the TRIM and GND pins of the module to trim up (0.9V ~ 3.3V) and between the Trim and +Output to trim down (0.8V ~ 0.9V). Without this external resistor, the output voltage of the module is 0.9 Vdc. To calculate the value of the resistor Rtrim for a particular output voltage Vo, please use the following equation: For example, to program the output voltage of a IPM module to 3.3 Vdc, Vtrim is calculated as follows Vtrim = 0.7168 – 0.0187 x 3.3 Vtrim = 0.6551V Trim up Rtrim = 7.0 Vadj. –0.9 - 0.187 (KΩ ) 2.0 0.9 – Vadj. - 10.187 (KΩ ) Trim Down Rtrim = Figure 28: Trim up Circuit configuration for programming output voltage using an external resistor Rtrim is the external resistor in KΩ Vout is the desired output voltage For example: to program the output voltage of the IPM module to 3.3Vdc, Rtrim is calculated as follows: Vout Rtrim Load Rtrim = 7.0 3.3 –0.9 Trim - 0.187 (KΩ ) GND Rtrim = 2.729 KΩ Figure 29: Trim down Circuit configuration for programming output voltage using an external resistor IPM can also be programmed by applying a voltage between the TRIM and GND pins (Figure 30). The following equation can be used to determine the value of Vtrim needed for a desired output voltage Vo: Vtrim = 0.7168 – 0.0187Vo Vtrim is the external voltage in V Vo is the desired output voltage Figure 30: Circuit configuration for programming output voltage using external voltage source DS_ IPM04S0A0R/S10_10142013 9 FEATURE DESCRIPTIONS (CON.) Table 1 provides Rtrim values required for some common output voltages, while Table 2 provides value of external voltage source, Vtrim, for the same common output voltages. By using a 0.5% tolerance resistor, set point tolerance of ±2.5% can be achieved as specified in the electrical specification. Table 1 VO (V) 0.9 1.2 1.5 1.8 2.5 3.3 Rtrim (Ω) Open 23.146K 11.479K 7.590K 4.188K 2.729K Table 2 VO (V) 0.9 1.2 1.5 1.8 2.5 3.3 Vtrim (V) 0.7000 0.6943 0.6887 0.6831 0.6700 0.6551 The amount of power delivered by the module is the voltage at the output terminals multiplied by the output current. When using the trim feature, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module must not exceed the maximum rated power (Vo.set x Io.max ≤ P max). Voltage Margining Output voltage margining can be implemented in the IPM modules by connecting a resistor, R margin-up, from the Trim pin to the ground pin for margining-up the output voltage and by connecting a resistor, R margin-down, from the Trim pin to the output pin for margining-down. Figure 31 shows the circuit configuration for output voltage margining. If unused, leave the trim pin unconnected. Vo Vin IPM Rmargin-down Q1 On/Off Trim Rmargin-up Rtrim Q2 GND Figure 31: Circuit configuration for output voltage margining DS_ IPM04S0A0R/S10_10142013 10 THERMAL CONSIDERATIONS THERMAL CURVES Thermal management is an important part of the system design. To ensure proper, reliable operation, sufficient cooling of the power module is needed over the entire temperature range of the module. Convection cooling is usually the dominant mode of heat transfer. Hence, the choice of equipment to characterize the thermal performance of the power module is a wind tunnel. Thermal Testing Setup Delta’s DC/DC power modules are characterized in heated vertical wind tunnels that simulate the thermal environments encountered in most electronics equipment. This type of equipment commonly uses vertically mounted circuit cards in cabinet racks in which the power modules are mounted. The following figure shows the wind tunnel characterization setup. The power module is mounted on a test PWB and is vertically positioned within the wind tunnel. The height of this fan duct is constantly kept at 25.4mm (1’’). Figure 33: Temperature measurement location * The allowed maximum hot spot temperature is defined at 116 ℃. Output Current(A) IPM04S (Standard) Output Current vs. Ambient Temperature and Air Velocity @ Vin=5V, Vout = 3.3V (Either Orientation) 12 10 8 Natural Convection Thermal Derating 6 100LFM Heat can be removed by increasing airflow over the module. To enhance system reliability, the power module should always be operated below the maximum operating temperature. If the temperature exceeds the maximum module temperature, reliability of the unit may be affected. PWB FACING PWB 4 200LFM 2 0 40 45 50 55 60 65 70 75 80 85 Ambient Temperature (℃) Figure 34: Output current vs. ambient temperature and air velocity @ Vin=5V, Vo=3.3V(either orientation) MODULE Output Current(A) IPM04S (Standard) Output Current vs. Ambient Temperature and Air Velocity @ Vin=5V, Vout = 1.8V (Either Orientation) 12 10 AIR VELOCITY AND AMBIENT TEMPERATURE MEASURED BELOW THE MODULE 8 50.8 (2.0”) Natural Convection 6 100LFM AIR FLOW 4 200LFM 12.7 (0.5”) 25.4 (1.0”) 2 0 40 45 50 55 60 65 70 75 Figure 32: Wind tunnel test setup figure 80 85 Ambient Temperature (℃) Figure 35: Output current vs. ambient temperature and air velocity @ Vin=5V, Vo=1.8V(either orientation) DS_ IPM04S0A0R/S10_10142013 11 THERMAL CURVES (CON.) Output Current(A) IPM04S (Standard) Output Current vs. Ambient Temperature and Air Velocity @ Vin=5V, Vout = 0.9V (Either Orientation) Output Current(A) 12 12 10 10 8 IPM04S (Standard) Output Current vs. Ambient Temperature and Air Velocity @ Vin=3.3V, Vout = 0.9V (Either Orientation) 8 Natural Convection Natural Convection 6 6 100LFM 100LFM 4 4 2 2 0 0 40 45 50 55 60 65 70 75 80 85 Ambient Temperature (℃) Figure 36: Output current vs. ambient temperature and air velocity @ Vin=5V, Vo=0.9V(Either Orientation) Output Current(A) 40 45 50 55 60 65 70 75 80 85 Ambient Temperature (℃) Figure 39: Output current vs. ambient temperature and air velocity @ Vin=3.3V, Vo=0.9V(Either Orientation) IPM04S (Standard) Output Current vs. Ambient Temperature and Air Velocity @ Vin=3.3V, Vout = 2.5V (Either Orientation) 12 10 8 Natural Convection 6 100LFM 4 2 0 40 45 50 55 60 65 70 75 80 85 Ambient Temperature (℃) Figure 37: Output current vs. ambient temperature and air velocity @ Vin=3.3V, Vo=2.5V(Either Orientation) Output Current(A) IPM04S (Standard) Output Current vs. Ambient Temperature and Air Velocity @ Vin=3.3V, Vout = 1.5V (Either Orientation) 12 10 8 Natural Convection 6 100LFM 4 2 0 40 45 50 55 60 65 70 75 80 85 Ambient Temperature (℃) Figure 38: Output current vs. ambient temperature and air velocity @ Vin=3.3V, Vo=1.5V(Either Orientation) DS_ IPM04S0A0R/S10_10142013 12 SURFACE- MOUNT TAPE & REEL PICK AND PLACE LOCATION All dimensions are in millimeters (inches) All dimensions are in millimeters (inches) LEAD FREE PROCESS RECOMMEND TEMP. PROFILE Temp. 20 ~ 40sec. Peak Temp. 240 ~ 245 0 C 217 0 C Ramp down max. 6.0 0 C/sec 200 0 C 150 0 C Preheat time 60 ~ 180 sec. Time 60 ~ 150 sec. Above 217 0 C Ramp up max. 3.0 0 C/sec 25 0 C Time Note: All temperature refers to topside of the package, measured on the package body surface. DS_ IPM04S0A0R/S10_10142013 13 MECHANICAL DRAWING SMD PACKAGE SIP PACKAGE 1 2 3 4 5 RECOMMEND PWB PAD LAYOUT RECOMMEND PWB HOLE LAYOUT Note: The copper pad is recommended to connect to the ground. 7 6 1 2 3 4 5 1 2 3 4 5 Note: All dimension are in millimeters (inches) standard dimension tolerance is ± 0.10(0.004”) DS_ IPM04S0A0R/S10_10142013 14 PART NUMBERING SYSTEM IPM 04 S 0A0 R 10 Product Family Input Voltage Number of Outputs Output Voltage Package Output Current S - Single 0A0 - programmable output R - SIP S - SMD 08 - 8A 10 - 10A Integrated POL 04 - 3V ~ 5.5V Module 12 - 8V ~ 14V F A Option Code F- RoHS 6/6 A - Standard Functions (Lead Free) MODEL LIST Model Name Efficiency (Typical @ full load) Packaging Input Voltage Output Voltage Output Current IPM12S0A0R08FA SIP 8V ~ 14V 0.8V ~ 5V 8A IPM12S0A0S08FA SMD 8V ~ 14V 0.8V ~ 5V 8A 93% IPM04S0A0R10FA SIP 3V ~ 5.5V 0.8V ~ 3.3V 10A 94% IPM04S0A0S10FA SMD 3V ~ 5.5V 0.8V ~ 3.3V 10A 94% 93% CONTACT: www.deltaww.com/dcdc USA: Telephone: East Coast: 978-656-3993 West Coast: 510-668-5100 Fax: (978) 656 3964 Email: [email protected] Europe: Phone: +31-20-655-0967 Fax: +31-20-655-0999 Email: [email protected] Asia & the rest of world: Telephone: +886 3 4526107 ext 6220~6224 Fax: +886 3 4513485 Email: [email protected] WARRANTY Delta offers a two (2) year limited warranty. Complete warranty information is listed on our web site or is available upon request from Delta. Information furnished by Delta is believed to be accurate and reliable. However, no responsibility is assumed by Delta for its use, nor for any infringements of patents or other rights of third parties, which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Delta. Delta reserves the right to revise these specifications at any time, without notice. DS_ IPM04S0A0R/S10_10142013 15