BSP52T1, BSP52T3 Preferred Devices NPN Small−Signal Darlington Transistor This NPN small signal Darlington transistor is designed for use in switching applications, such as print hammer, relay, solenoid and lamp drivers. The device is housed in the SOT-223 package, which is designed for medium power surface mount applications. Features • The SOT-223 Package can be soldered using wave or reflow. The • • • formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die Available in 12 mm Tape and Reel Use BSP52T1 to order the 7 inch/1000 unit reel PNP Complement is BSP62T1 Pb−Free Packages are Available http://onsemi.com MEDIUM POWER NPN SILICON SURFACE MOUNT DARLINGTON TRANSISTOR COLLECTOR 2,4 BASE 1 MAXIMUM RATINGS (TC = 25°C unless otherwise noted) Rating Symbol Max Unit Collector-Emitter Voltage VCES 80 Vdc Collector-Base Voltage VCBO 90 Vdc Emitter-Base Voltage VEBO 5.0 Vdc Collector Current IC 1.0 Adc Total Power Dissipation (Note 1) @ TA = 25°C Derate above 25°C PD 0.8 6.4 W mW/°C Total Power Dissipation (Note 2) @ TA = 25°C Derate above 25°C PD 1.25 10 W mW/°C −65 to 150 °C Operating and Storage Temperature Range TJ, Tstg Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic EMITTER 3 4 1 2 MARKING DIAGRAM AYW AS3G G 3 SOT−223 CASE 318E STYLE 1 A = Assembly Location Y = Year W = Work Week AS3 = Specific Device Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Package Shipping † BSP52T1 SOT−223 1000/Tape & Reel Device Symbol Value Unit Thermal Resistance (Note 1) Junction-to-Ambient RqJA 156 °C/W BSP52T1G SOT−223 (Pb−Free) 1000/Tape & Reel Thermal Resistance (Note 2) Junction-to-Ambient RqJA 100 °C/W BSP52T3 SOT−223 4000/Tape & Reel BSP52T3G SOT−223 (Pb−Free) 4000/Tape & Reel Maximum Temperature for Soldering Purposes Time in Solder Bath TL °C Sec 260 10 1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum recommended footprint. 2. Device mounted on a FR-4 glass epoxy printed circuit board using 1 cm2 pad. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. © Semiconductor Components Industries, LLC, 2005 September, 2005 − Rev. 5 1 Publication Order Number: BSP52T1/D BSP52T1, BSP52T3 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristics Symbol Min Max 90 − 5.0 − − 10 − 10 1000 2000 − − − 1.3 − 1.9 Unit OFF CHARACTERISTICS Collector-Base Breakdown Voltage (IC = 100 mAdc, IE = 0) V(BR)CBO Emitter-Base Breakdown Voltage (IE = 10 mAdc, IC = 0) V(BR)EBO Collector-Emitter Cutoff Current (VCE = 80 Vdc, VBE = 0) ICES Emitter-Base Cutoff Current (VEB = 4.0 Vdc, IC = 0) IEBO Vdc Vdc mAdc mAdc ON CHARACTERISTICS (Note 3) DC Current Gain (IC = 150 mAdc, VCE = 10 Vdc) (IC = 500 mAdc, VCE = 10 Vdc) hFE Collector-Emitter Saturation Voltage (IC = 500 mAdc, IB = 0.5 mAdc) VCE(sat) Base-Emitter Saturation Voltage (IC = 500 mAdc, IB = 0.5 mAdc) VBE(sat) 3. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0% http://onsemi.com 2 − Vdc Vdc BSP52T1, BSP52T3 PACKAGE DIMENSIONS SOT−223 CASE 318E−04 ISSUE L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. D b1 4 HE 1 2 3 DIM A A1 b b1 c D E e e1 L1 HE E b e1 e 0.08 (0003) C q A A1 MIN 1.50 0.02 0.60 2.90 0.24 6.30 3.30 2.20 0.85 1.50 6.70 0° q STYLE 1: PIN 1. 2. 3. 4. L1 MILLIMETERS NOM MAX 1.63 1.75 0.06 0.10 0.75 0.89 3.06 3.20 0.29 0.35 6.50 6.70 3.50 3.70 2.30 2.40 0.94 1.05 1.75 2.00 7.00 7.30 10° − BASE COLLECTOR EMITTER COLLECTOR SOLDERING FOOTPRINT* 3.8 0.15 2.0 0.079 2.3 0.091 2.3 0.091 6.3 0.248 2.0 0.079 1.5 0.059 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 3 MIN 0.060 0.001 0.024 0.115 0.009 0.249 0.130 0.087 0.033 0.060 0.264 0° INCHES NOM 0.064 0.002 0.030 0.121 0.012 0.256 0.138 0.091 0.037 0.069 0.276 − MAX 0.068 0.004 0.035 0.126 0.014 0.263 0.145 0.094 0.041 0.078 0.287 10° BSP52T1, BSP52T3 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 4 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. BSP52T1/D