Material Content Data Sheet Sales Product Name IPP80N06S2L-07 MA# MA000275675 Package PG-TO220-3-1 Issued 29. August 2013 Weight* 2037.64 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7.124 0.35 1.407 0.07 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.35 3496 3496 690 0.422 0.02 1404.801 68.96 69.05 689426 207 690323 7.231 0.35 0.35 3549 3549 8.850 0.43 4343 97.355 4.78 483.823 23.74 28.95 237443 289564 21.462 1.05 1.05 10533 10533 0.244 0.01 0.001 0.00 0.123 0.01 0.098 0.00 4.701 0.23 47778 120 0.01 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 120 48 0.24 Important Remarks: 1. 0 60 2307 2415 1000000