CLARE CPC1988J Isoplusâ ¢-264 power relay Datasheet

CPC1988
ISOPLUS™-264 Power Relay
Parameter
Blocking Voltage
Load Current, TA=25ºC
With 5°C/W Heat Sink
No Heat Sink
On-resistance
RθJC
Rating
1000
2.25
0.9
2.5
0.3
Description
Units
VP
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new
family of high power solid state relays.
Arms
As part of this family, the CPC1988 single pole
normally open (1-Form-A) solid state power relay is
rated for up to 2.25Arms continuous load current with a
5ºC/W heat sink.
Ω
°C/W
Features
•
•
•
•
•
•
•
•
•
•
100% Solid State
Compact ISOPLUS-264 Power Package
Low Thermal Resistance (0.3°C/W)
2.25Arms Load Current with 5°C/W Heat Sink
Low Drive Power Requirements
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Arc-Free With No Snubbing Circuits
2500Vrms Input/Output Isolation
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
•
•
•
•
•
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Energy Meters
• Transportation Equipment
• Aerospace/Defense
Pin Configuration
The CPC1988 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The output is constructed with efficient
MOSFET switches and photovoltaic die that use
Clare’s patented OptoMOS architecture while the
input, a highly efficient GaAlAs infrared LED provides
the optically coupled control. The combination of
low on-resistance and high load current handling
capability makes this relay suitable for a variety of
high performance switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS allows solid state relays to achieve the highest
load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper
Bond (DCB) substrate instead of the traditional
copper leadframe. The DCB ceramic, the same
substrate used in high power modules, not only
provides 2500Vrms isolation but also very low thermal
resistance (0.3 °C/W).
Approvals
• UL recognized component: File # E69938
• Certified to: UL 508
Ordering Information
Part Number
CPC1988J
Description
ISOPLUS-264 (25/tube)
Switching Characteristics of
Normally Open (Form A) Devices
CONTROL
ILOAD
RoHS
2002/95/EC
10%+
e3
DS-CPC1988-R02
+
90%
TON
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TOFF
1
CPC1988
Absolute Maximum Ratings
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Isolation Voltage Input to Output
Operational Temperature
Storage Temperature
Ratings
1000
5
100
1
150
2500
-40 to +85
-40 to +125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Units
VP
V
mA
A
mW
Vrms
°C
°C
Electrical absolute maximum ratings are at 25°C
Electrical Characteristics
Parameter
Output Characteristics
Load Current 1
Peak
Continuous
Continuous
Continuous
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current 3
Input Dropout Current
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance Input to Output
1
2
3
Conditions
TA=25°C
Symbol
t ≤ 10ms
No Heat Sink
TC=25ºC
TC=99ºC
IL = 0.9A, IF=10mA
VL=1000V
IF=20mA, VL=10V
V=25V, f=1MHz
TA=25°C
IL=0.9A
IF=5mA
VR=5V
TA=25°C
-
Min
Typ
Max
Units
-
-
IL(99)
RON
ILEAK
-
1.78
-
10
0.9
9.4
1.05
2.5
1
TON
TOFF
COUT
-
6
0.11
540
20
5
-
pF
IF
IF
VF
IR
0.6
0.9
-
1.2
-
10
1.4
10
mA
mA
V
µA
CI/O
-
1
-
pF
IL
AP
Arms
Ω
µA
ms
Higher load currents possible with proper heat sinking.
Measurement taken within 1 second of on time.
For applications requiring high temperature operation (greater than 60oC) an LED drive current of 20mA is recommended.
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CPC1988
Thermal Characteristics
Parameter
Thermal Resistance (junction to case)
Thermal Resistance (junction to ambient)
Junction Temperature (operation)
Conditions
Free air
-
Symbol
RθJC
RθJA
TJ
Min
-40
Typ
33
-
Max
0.3
100
Units
°C/W
°C/W
°C
Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal
interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate
junction-to-ambient thermal resistance of 12.5°C/W.
Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
RθCA =
(TJ - TA) IL(99)2
IL2
•
RθJC
- RθJC
TJ = Junction Temperature (°C), TJ ≤ 100°C *
TA = Ambient Temperature (°C)
IL(99) = Load Current with Case Temperature @ 99°C (Arms)
IL = Desired Operating Load Current (Arms), IL ≤ IL(MAX)
RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.3°C/W
RθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
* Elevated junction temperature reduces semiconductor lifetime.
R02
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3
CPC1988
PERFORMANCE DATA*
20
25
Device Count (N)
Device Count (N)
25
15
10
5
CPC1988
Typical On-Resistance Distribution
(N=50, TA=25ºC, IL=0.9A, IF=10mA)
35
15
10
5
25
20
15
10
5
0
0
0
LED Forward Voltage (V)
On-Resistance (Ω)
1080 1090 1100 1110
Blocking Voltage (VP)
CPC1988
Typical Turn-On Time
(N=50, TA=25ºC, IL=0.5A, IF=10mA)
CPC1988
Typical Turn-Off Time
(N=50, TA=25ºC, IL=0.5A, IF=10mA)
CPC1988
Maximum Load Current
vs. Temperature with Heat Sink
(IF=20mA)
1.3250
30
CPC1988
Typical Blocking Voltage Distribution
(TA=25C)
30
20
Device Count (N)
CPC1988
Typical LED Forward Voltage Drop
(N=50, TA=25ºC, IF=10mA)
1.3275
1.3300
1.3325
1.72
1.3350
25
1.74
1.76
1.78
1.80
1070
1.82
6
1120
1ºC/W
20
15
10
Load Current (Arms)
Device Count (N)
Device Count (N)
25
20
15
10
5
5
6
7
8
Turn-On (ms)
9
0.08
10
0.09
0.010
0.008
0.006
0.004
0.002
80
100
1120
1100
1080
1060
1040
1000
-40
IF = 20mA
0.06
0.04
IF = 10mA
0.02
0
-20
0
20
40
60
Temperature (ºC)
80
-20
0
20
40
60
Temperature (ºC)
80
100
Free Air
1
0
20
40
60
Temperature (ºC)
100
1.6
IF = 50mA
1.2
IF = 20mA
IF = 10mA
1.0
0.8
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
100
20
18
16
14
12
10
8
6
4
2
0
IF = 10mA
IF = 20mA
-20
0
20
40
60
Temperature (ºC)
80
100
CPC1988
Typical Turn-On vs. LED Forward Current
(IL=0.5A)
1.8
1.4
80
CPC1988
Typical Turn-On vs. Temperature
(IL=0.5A)
-40
CPC1988
Typical LED Forward Voltage Drop
vs. Temperature
0.10
0.08
2
0.13
Turn-On (ms)
Turn-Off (ms)
0.12
1020
20
40
60
Temperature (ºC)
0.12
-40
0.11
1140
CPC1988
Typical Turn-Off vs. Temperature
(IL=0.5A)
0.14
0.10
Turn-On (ms)
Blocking Voltage (VP)
1160
LED Forward Voltage Drop (V)
Leakage (µA)
1180
0.012
0
5ºC/W
10ºC/W
CPC1988
Typical Blocking Voltage
vs. Temperature
0.014
-20
3
Turn-Off (ms)
CPC1988
Typical Leakage vs. Temperature
at Maximum Rated Voltage
(Measured Across Pins 1 & 2)
0
-40
4
0
0
0
5
30
27
24
21
18
15
12
9
6
3
0
0
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R02
CPC1988
PERFORMANCE DATA*
CPC1988
Typical Turn-Off vs. LED Forward Current
(IL=0.5A)
6.0
0.14
9.0
0.08
0.06
0.04
0.02
5.0
LED Current (mA)
On-Resistance (Ω)
Turn-Off (ms)
0.10
4.5
4.0
3.5
3.0
2.5
7.0
5.0
3.0
2.0
1.5
0
0
5
10
15
20
25
30
35
40
45
-40
50
-20
0
20
40
60
LED Forward Current (mA)
Temperature (ºC)
CPC1988
Typical Load Current vs. Load Voltage
(TA=25ºC, IF=10mA)
CPC1988
Energy Rating Curve
(Free Air, No Heat Sink)
80
100
1.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
12
10
Load Current (AP)
Load Current (A)
CPC1988
Typical IF for Switch Operation
vs. Temperature
(IL=0.5A)
5.5
0.12
2.5
2.0
1.5
1.0
0.5
0
-0.5
-1.0
-1.5
-2.0
-2.5
CPC1988
Typical On-Resistance vs. Temperature
(IL=max rated)
-6
-4
0
-2
2
Load Voltage (V)
4
6
8
6
4
2
0
10µs 100µs 1ms 10ms 100ms
1s
10s 100s
Time
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R02
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5
CPC1988
MANUFACTURING INFORMATION
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
e3
RoHS
2002/95/EC
MECHANICAL DIMENSIONS
ISOPLUS-264
0.190 MIN - 0.205 MAX
(4.83 MIN - 5.21 MAX)
0.046 MIN - 0.055 MAX
(1.17 MIN - 1.40 MAX)
0.770 MIN - 0.799 MAX
(19.56 MIN - 20.29 MAX)
0.210 MIN - 0.235 MAX
(5.33 MIN - 5.97 MAX)
0.668 MIN - 0.690 MAX
(16.97 MIN - 17.53 MAX)
0.065 MIN - 0.080 MAX
(1.65 MIN - 2.03 MAX)
0.100 MIN - 0.180 MAX
(2.54 MIN - 4.57 MAX)
1.020 MIN - 1.040 MAX
(25.91 MIN - 26.42 MAX)
0.490 MIN - 0.513 MAX
(12.54 MIN - 13.03 MAX)
0.801 MIN - 0.821 MAX
(20.34 MIN - 20.85 MAX)
0.100 MIN - 0.130 MAX
(2.54 MIN - 3.03 MAX)
1
2
3
4
0.080 MIN - 0.102 MAX
(2.03 MIN - 2.59 MAX)
0.780 MIN - 0.820 MAX
(19.81 MIN - 20.83 MAX)
0.300 BSC
(7.62) BSC
0.150 BSC
(3.81 BSC)
0.020 MIN - 0.029 MAX
(0.51 MIN - 0.74 MAX)
0.058 MIN - 0.068 MAX
(1.47 MIN - 1.73 MAX)
0.102 MIN - 0.118 MAX
(2.59 MIN - 3.00 MAX)
0.045 MIN - 0.055 MAX
(1.14 MIN - 1.40 MAX)
DIMENSIONS:
INCHES
(MM)
NOTE: Bottom heatsink meets 2500Vrms isolation to the pins.
Dimensions
inches
(mm)
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications
and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of
Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability,
fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1988-R02
©Copyright 2007, Clare, Inc.
OptoMOS® is a registered trademark of Clare, Inc.
ISOPLUS™-264 is a trademark of IXYS Corporation
All rights reserved. Printed in USA.
3/22/07
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