LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED SMD Pb Lead-Free Parts LG-195HY/HRF-CT-0808 DATA SHEET DOC. NO : QW0905-LG-195HY/HRF-CT-0808 REV: A DATE : 10 - Aug. - 2012 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/12 PART NO. LG-195HY/HRF-CT-0808 Features: 1. Package in 8.0mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with infrared and vapor phase reflow solder process. Descriptions: 1. The LG-195 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc. Applications: 1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use. Device Selection Guide: PART NO LG-195HY/HRF-CT-0808 MATERIAL COLOR Emitted AlGaInP Yellow AlGaInP Red Lens Water Clear LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/12 PART NO. LG-195HY/HRF-CT-0808 Package Dimensions 2 1.5 Soldering Terminal 0.55 1 0.25 0.18 0.4 Die2 Die1 1.6 1.1 0.4 RESIN 4 0.6 PCB 0.85 3 2 1 _ _ HRF HY + + 4 3 Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 2.2 0.9 1.5 0.5 Note : The tolerances unless mentioned is ±0.1mm,Angle ±0.5. Unit=mm. 0.6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/12 PART NO. LG-195HY/HRF-CT-0808 Absolute Maximum Ratings at Ta=25℃ Parameter Ratings Symbol HY HRF UNIT Power Dissipation PD 75 72 mW Peak Forward Current Duty 1/10@10KHz IFP 60 90 mA Forward Current IF 30 30 mA Reverse Current @5V Ir 10 μA Electrostatic Discharge ESD 2000 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Typical Electrical & Optical Characteristics (Ta=25℃) Items Luminous Intensity Dominant Wavelength Spectral Line Half-Width Forward Voltage Viewing Angle Symbol Iv λD △λ VF 2θ 1/2 Min. Typ. Max. UNIT HY 50 80 ---- HRF 32 50 ---- HY ---- 595 ---- HRF ---- 630 ---- HY ---- 15 ---- HRF ---- 20 ---- HY 1.7 ---- 2.6 HRF 1.5 ---- 2.4 HY ---- 130 ---- HRF ---- 130 ---- Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. CONDITION mcd IF=20mA nm IF=20mA nm IF=20mA V IF=20mA deg IF=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/12 PART NO. LG-195HY/HRF-CT-0808 Luminous Intensity Classification BIN CODE HY P Q R S BIN CODE HRF N P Q R Iv(mcd) at 20mA Min. Max. 50 80 125 200 80 125 200 320 Iv(mcd) at 20mA Min. Max. 32 50 80 125 50 80 125 200 Dominant Wavelength Classification BIN CODE HY 17 18 19 20 BIN CODE HRF 29 30 31 32 λD(nm) at 20mA Min. Max. 589 592 595 598 592 595 598 600 λD(nm) at 20mA Min. Max. 624 627 630 633 627 630 633 636 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/12 PART NO. LG-195HY/HRF-CT-0808 Typical Electro-Optical Characteristics Curve HY CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.5 1.0 2.0 2.5 3.0 1.0 10 Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 100 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA 100 650 Fig.6 Directive Radiation 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/12 PART NO. LG-195HY/HRF-CT-0808 Typical Electro-Optical Characteristics Curve HRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 3.0 2.5 2.0 1.5 1.0 0.5 0 1.0 1.5 2.5 2.0 3.0 10 1.0 Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Voltage vs. Temperature 3.0 Relative Intensity@20mA Normalize@25℃ Forward Voltage@20mA Normalize @25℃ 1.2 1.1 1.0 0.9 0.8 -40 -20 -0 20 40 60 80 100 Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1000 Forward Current(mA) Forward Voltage(V) 1.0 0.5 0 100 550 600 650 Wavelength (nm) 700 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Fig.6 Directive Radiation 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/12 PART NO. LG-195HY/HRF-CT-0808 Carrier Tape Dimensions 4.0±0.2 0.23 2.0 1.75 3.5±0.2 8.0±0.3 1.75 5.3 0.7 1.65 4.0±0.2 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. ‧ Packing Specifications Label Aluminum Moist-Proof bag Label Part No. Description Quantity/Reel LG-195HY/HRF-CT-0808 8.0mm tape,7"reel 4000 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/12 PART NO. LG-195HY/HRF-CT-0808 Label Explanation LIGITEK ELECTRONICS CO., LTD. Pb PART : LG-195HY/HRF-CT-0808 LOT : GS1-080168 QTY(PCS): 4000 VF:1.7-2.6 BIN/HUE : Q/18-P/30 VF:1.5-2.4 BIN : Luminous Intensity HUE : Dominant Wavelength VF : Forward Voltage Reel Dimensions 0.2 0.4 0.8 178±1.5 60±1.0 0.8 0.6 0.2 0.4 0.6 2.0±0.5 9.0±1.0 ψ13.5±1.0 12.0±1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 9/12 PART NO. LG-195HY/HRF-CT-0808 Box Explanation 1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm L W H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-195HY/HRF-CT-0808 Page 10/12 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280℃ 3 sec one time only. 2. Wave Solder Soldering heat Max. 260 ℃ 245±5℃ within 5 sec 120 ~ 150℃ Preheat 120 ~ 180 sec 3 PB-Free Reflow Solder 1~5°C/sec 1~5°C/sec Preheat 180~200°C 260°C MaX. 10sec.Max 6°C/sec Above 220°C 60 sec.Max. 120 sec.Max. Note: 1.Reflow soldering should not be done more than two times. 2.When soldering,do not put stress on the LEDs during heating. 3.After soldering,do not warp the circuit board. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 11/12 PART NO. LG-195HY/HRF-CT-0808 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year at ＜30℃ and ＜90% relative humidity(RH) (from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%, they should be treated at 60 ℃±5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forward current should not be allowed to change by more than 40% of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 12/12 PART NO. LG-195HY/HRF-CT-0808 Reliability Test: Classification Test Item Test Condition Reference Standard Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 High Temperature High Humidity Storage Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=1000hrs¡Ó2hrs Endurance Test Thermal Shock Test Solderability Test Environmental Test Temperature Cycling IR Reflow 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧95% of the dipped surface 1.105℃ ~ 25℃ ~ -55℃ ~ 25℃ 30mins 5mins 30mins 5mins 2.10 Cyeles 1.T=260°C Max. 10sec.Max. 2. 6 Min MIL-STD-202F:103B JIS C 7021: B-11 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 MIL-STD-750D:2031.2 J-STD-020