AD ADG812 0.5 cmos 1.65 v to 3.6 v quad spst switch Datasheet

<0.5 Ω CMOS 1.65 V to 3.6 V
Quad SPST Switches
ADG811/ADG812/ADG813
FUNCTIONAL BLOCK DIAGRAMS
0.5 Ω typ on resistance
0.8 Ω max on resistance at 125°C
1.65 V to 3.6 V operation
Automotive temperature range: –40°C to +125°C
High current carrying capability: 300 mA continuous
Rail-to-rail switching operation
Fast switching times: <25 ns
Typical power consumption < 0.1 µW
S1
IN1
S1
IN1
D1
D1
S2
IN2
D1
S2
IN2
S2
IN2
D2
D2
ADG811
D2
ADG812
S3
IN3
ADG813
S3
IN3
S3
IN3
D3
APPLICATIONS
S1
IN1
D3
S4
D3
S4
IN4
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG811, ADG812, and ADG813 are low voltage CMOS
devices containing four independently selectable switches.
These switches offer ultralow on resistance of less than 0.8 Ω
over the full temperature range. The digital inputs can handle
1.8 V logic with a 2.7 V to 3.6 V supply.
1.
<0.8 Ω over full temperature range of –40°C to +125°C.
2.
Single 1.65 V to 3.6 V operation.
3.
Operational with 1.8 V CMOS logic.
4.
High current handling capability (300 mA continuous
current at 3.3 V).
5.
Low THD+N (0.02% typ).
These devices contain four independent single-pole/singlethrow (SPST) switches. The ADG811 and ADG812 differ only
in that the digital control logic is inverted. The ADG811
switches are turned on with a logic low on the appropriate
control input, while a logic high is required to turn on the
switches of the ADG812. The ADG813 contains two switches
whose digital control logic is similar to the ADG811, while the
logic is inverted on the other two switches.
IN4
S4
Cellular phones
MP3 players
Power routing
Battery-powered systems
PCMCIA cards
Modems
Audio and video signal routing
Communications systems
IN4
D4
D4
SWITCHES SHOWN FOR A LOGIC 1 INPUT
Figure 1.
Each switch conducts equally well in both directions when on
and has an input signal range that extends to the supplies. The
ADG813 exhibits break-before-make switching action.
The ADG811, ADG812, and ADG813 are fully specified for
3.3 V, 2.5 V, and 1.8 V supply operation. They are available in a
16-lead TSSOP package.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.326.8703
© 2004 Analog Devices, Inc. All rights reserved.
D4
04306-A-001
FEATURES
ADG811/ADG812/ADG813
TABLE OF CONTENTS
ADG811/ADG812/ADG813—Specifications .............................. 3
Typical Performance Characteristics ..............................................8
Absolute Maximum Ratings............................................................ 6
Test Circuits..................................................................................... 11
ESD Caution.................................................................................. 6
Outline Dimensions ....................................................................... 13
Pin Configuration and Function Descriptions............................. 7
Ordering Guide .......................................................................... 13
REVISION HISTORY
5/04—Data Sheet Changed from Rev. 0 to Rev. A
Updated Format..............................................................Universal
Updated Package Choices..............................................Universal
11/03—Revision 0: Initial Version
Rev. A | Page 2 of 16
ADG811/ADG812/ADG813
ADG811/ADG812/ADG813—SPECIFICATIONS
Table 1. VDD = 2.7 V to 3.6 V, GND = 0 V, unless otherwise noted1
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On Resistance Match between
Channels (∆RON)
On Resistance Flatness (RFLAT(ON))
LEAKAGE CURRENTS
Source Off Leakage IS (OFF)
Drain Off Leakage ID (OFF)
Channel On Leakage ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
+25°C
0.5
0.65
0.04
–40°C to +85°C
–40°C to +125°C
Unit
0 V to VDD
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
0.75
0.8
0.075
0.08
0.15
0.16
0.1
±0.2
±1
±0.2
±1
±0.2
±1
±8
±80
±8
±80
±15
±90
2
0.8
0.005
±0.1
CIN, Digital Input Capacitance
DYNAMIC CHARACTERISTICS2
tON
6
V min
V max
µA typ
µA max
pF typ
30
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
Off Isolation
–67
dB typ
Channel-to-Channel Crosstalk
–90
dB typ
Total Harmonic Distortion (THD + N)
0.02
%
–0.05
90
30
35
60
dB typ
MHz typ
pF typ
pF typ
pF typ
0.003
µA typ
µA max
tOFF
Break-Before-Make Time Delay (tBBM)
(ADG813 only)
Charge Injection
Insertion Loss
–3 dB Bandwidth
CS (OFF)
CD (OFF)
CD, CS (ON)
POWER REQUIREMENTS
IDD
21
25
4
5
17
nA typ
nA max
nA typ
nA max
nA typ
nA max
26
28
6
7
5
1.0
4
1
Temperature range for the Y version is –40°C to +125°C.
Guaranteed by design, not subject to production test.
2
Rev. A | Page 3 of 16
Test Conditions/Comments
VDD = 2.7 V, VS = 0 V to VDD, IS = 10 mA;
Figure 18
VDD = 2.7 V, VS = 0.5 V, IS = 10 mA
VDD = 2.7 V, VS = 0 V to VDD, IS = 10 mA
VDD = 3.6 V
VS = 0.6 V/3.3 V, VD = 3.3 V/0.6 V;
Figure 19
VS = 0.6 V/3.3 V, VD = 3.3 V/0.6 V;
Figure 19
VS = VD = 0.6 V or 3.3 V; Figure 20
VIN = VINL or VINH
RL = 50 Ω, CL = 35 pF
VS = 1.5 V/0 V; Figure 21
RL = 50 Ω, CL = 35 pF
VS = 1.5 V; Figure 21
RL = 50 Ω, CL = 35 pF
VS1 = VS2 = 1.5 V; Figure 22
VS = 1.5 V, RS = 0 Ω, CL = 1 nF;
Figure 23
RL = 50 Ω, CL = 5 pF, f = 100 kHz;
Figure 24
RL = 50 Ω, CL = 5 pF, f = 100 kHz;
Figure 26
RL = 32 Ω, f = 20 Hz to 20 kHz,
VS = 2 V p-p
RL = 50 Ω, CL = 5 pF, f = 100 kHz
RL = 50 Ω, CL = 5 pF; Figure 25
VDD = 3.6 V
Digital inputs = 0 V or 3.6 V
ADG811/ADG812/ADG813
Table 2. VDD = 2.5 V ± 0.2 V, GND = 0 V, unless otherwise noted1
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On Resistance Match between
Channels (∆RON)
On Resistance Flatness (RFLAT(ON))
LEAKAGE CURRENTS
Source Off Leakage IS (OFF)
Drain Off Leakage ID (OFF)
Channel On Leakage ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
+25°C
0.65
0.72
0.04
–40°C to +85°C
–40°C to +125°C
Unit
0 V to VDD
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
0.8
0.88
0.08
0.085
0.23
0.24
0.16
±0.2
±1
±0.2
±1
±0.2
±1
±6
±35
±6
±35
±11
±70
1.7
0.7
0.005
±0.1
CIN, Digital Input Capacitance
DYNAMIC CHARACTERISTICS2
tON
6
25
Off Isolation
–67
dB typ
Channel-to-Channel Crosstalk
–90
dB typ
Total Harmonic Distortion (THD + N)
0.022
%
–0.06
90
32
37
60
dB typ
MHz typ
pF typ
pF typ
pF typ
0.003
µA typ
µA max
Break-Before-Make Time Delay (tBBM)
(ADG813 only)
Charge Injection
Insertion Loss
–3 dB Bandwidth
CS (OFF)
CD (OFF)
CD, CS (ON)
POWER REQUIREMENTS
IDD
29
30
7
8
5
1.0
1
2
V min
V max
µA typ
µA max
pF typ
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
tOFF
22
27
4
6
18
nA typ
nA max
nA typ
nA max
nA typ
nA max
4
Temperature range for the Y version is –40°C to +125°C.
Guaranteed by design, not subject to production test.
Rev. A | Page 4 of 16
Test Conditions/Comments
VDD = 2.3 V, VS = 0 V to VDD, IS = 10 mA;
Figure 18
VDD = 2.3 V; VS = 0.55 V, IS = 10 mA
VDD = 2.3 V; VS = 0 V to VDD, IS = 10 mA
VDD = 2.7 V
VS = 0.6 V/2.4 V, VD = 2.4 V/0.6 V;
Figure 19
VS = 0.6 V/2.4 V, VD = 2.4 V/0.6 V;
Figure 19
VS = VD = 0.6 V or 2.4 V; Figure 20
VIN = VINL or VINH
RL = 50 Ω, CL = 35 pF
VS = 1.5 V/ 0 V; Figure 21
RL = 50 Ω, CL = 35 pF
VS = 1.5 V; Figure 21
RL = 50 Ω, CL = 35 pF
VS1 = VS2 = 1.5 V; Figure 22
VS = 1.25 V, RS = 0 Ω, CL = 1 nF;
Figure 23
RL = 50 Ω, CL = 5 pF, f = 100 kHz;
Figure 24
RL = 50 Ω, CL = 5 pF, f = 100 kHz;
Figure 26
RL = 32 Ω, f = 20 Hz to 20 kHz,
VS = 1.5 V p-p
RL = 50 Ω, CL = 5 pF, f = 100 kHz
RL = 50 Ω, CL = 5 pF; Figure 25
VDD = 2.7 V
Digital inputs = 0 V or 2.7 V
ADG811/ADG812/ADG813
Table 3. VDD = 1.65 V to 1.95 V, GND = 0 V, unless otherwise noted1
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On Resistance Match between
Channels (∆RON)
LEAKAGE CURRENTS
Source Off Leakage IS (OFF)
Drain Off Leakage ID (OFF)
Channel On Leakage ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
+25°C
1
1.4
2.5
0.1
±0.2
±1
±0.2
±1
±0.2
±1
–40°C to +85°C
2.2
4
–40°C to +125°C
Unit
Test Conditions/Comments
0 V to VDD
V
Ω typ
Ω max
Ω max
Ω typ
VDD = 1.8 V, VS = 0 V to VDD, IS = 10 mA;
Figure 18
VDD = 1.65 V, VS = 0 V to VDD, IS = 10 mA
VDD = 1.65 V, VS = 0.7 V, IS = 10 mA
2.2
4
±5
±30
±5
±30
±9
±60
0.65VDD
0.35VDD
0.005
±0.1
CIN, Digital Input Capacitance
DYNAMIC CHARACTERISTICS2
tON
6
V min
V max
µA typ
µA max
pF typ
15
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
Off Isolation
–67
dB typ
Channel-to-Channel Crosstalk
–90
dB typ
Total Harmonic Distortion (THD + N)
0.14
%
–0.08
90
32
38
60
dB typ
MHz typ
pF typ
pF typ
pF typ
0.003
µA typ
µA max
tOFF
Break-Before-Make Time Delay (tBBM)
(ADG813 only)
Charge Injection
Insertion Loss
–3 dB Bandwidth
CS (OFF)
CD (OFF)
CD, CS (ON)
POWER REQUIREMENTS
IDD
27
35
6
8
20
nA typ
nA max
nA typ
nA max
nA typ
nA max
36
37
9
10
5
1.0
4
1
Temperature range for the Y version is –40°C to +125°C.
Guaranteed by design, not subject to production test.
2
Rev. A | Page 5 of 16
VDD = 1.95 V
VS = 0.6 V/1.65 V, VD = 1.65 V/0.6 V;
Figure 19
VS = 0.6 V/1.65 V, VD = 1.65 V/0.6 V;
Figure 19
VS = VD = 0.6 V or 1.65 V; Figure 20
VIN = VINL or VINH
RL = 50 Ω, CL = 35 pF
VS = 1.5 V/ 0 V; Figure 21
RL = 50 Ω, CL = 35 pF
VS = 1.5 V; Figure 21
RL = 50 Ω, CL = 35 pF
VS1 = VS2 = 1 V; Figure 22
VS = 1 V, RS = 0 Ω, CL = 1 nF;
Figure 23
RL = 50 Ω, CL = 5 pF, f = 100 kHz;
Figure 24
RL = 50 Ω, CL = 5 pF, f = 100 kHz;
Figure 26
RL = 32 Ω, f = 20 Hz to 20 kHz,
VS = 1.2 V p-p
RL = 50 Ω, CL = 5 pF, f = 100 kHz
RL = 50 Ω, CL = 5 pF; Figure 25
VDD = 1.95 V
Digital inputs = 0 V or 1.95 V
ADG811/ADG812/ADG813
ABSOLUTE MAXIMUM RATINGS
Table 4. TA = 25°C, unless otherwise noted
Table 5. ADG811/ADG812 Truth Table
Parameter
VDD to GND
Analog Inputs1
Digital Inputs1
ADG811 IN
0
1
Peak Current, S or D
3.3 V Operation
2.5 V Operation
1.8 V Operation
Continuous Current, S or D
3.3 V Operation
2.5 V Operation
1.8 V Operation
Operating Temperature Range
Automotive (Y Version)
Storage Temperature Range
Junction Temperature
TSSOP Package
θJA Thermal Impedance
θJC Thermal Impedance
IR Reflow, Peak Temperature
<20 sec
Rating
–0.3 V to +4.6 V
–0.3 V to VDD + 0.3 V
GND – 0.3 V to 4.6 V or 10 mA,
whichever occurs first
(Pulsed at 1 ms,
10% Duty Cycle Max)
500 mA
460 mA
420 mA
ADG812 IN
1
0
Table 6. ADG813 Truth Table
Logic
0
1
Switch 1, Switch 4
Off
On
300 mA
275 mA
250 mA
–40°C to +125°C
–65°C to +150°C
150°C
150°C/W
27°C/W
235°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability. Only one absolute maximum rating may be
applied at any one time.
1
Switch Condition
On
Off
Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. A | Page 6 of 16
Switch 2, Switch 3
On
Off
ADG811/ADG812/ADG813
IN1 1
16
IN2
D1 2
15
D2
14
S2
13
VDD
12
NC
11
S3
D4 7
10
D3
IN4 8
9
IN3
S1 3
NC 4
GND 5
S4 6
ADG811/
ADG812/
ADG813
TOP VIEW
(Not to Scale)
NC = NO CONNECT
04306-A-002
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 2.
Table 7. Terminology
Term
VDD
IDD
GND
S
D
IN
VD, VS
RON
RFLAT (ON)
∆RON
IS (OFF)
ID (OFF)
ID, IS (ON)
VINL
VINH
IINL (IINH)
CS (OFF)
CD (OFF)
CD, CS (ON)
CIN
tON
tOFF
tBBM
Charge Injection
Off Isolation
Crosstalk
–3 dB Bandwidth
On Response
Insertion Loss
THD + N
Definition
Most positive power supply potential.
Positive supply current.
Ground (0 V) reference.
Source terminal. May be an input or output.
Drain terminal. May be an input or output.
Logic control input.
Analog voltage on Terminals D, S.
Ohmic resistance between D and S.
Flatness is defined as the difference between the maximum and minimum value of on resistance as measured over the
specified analog signal range.
On resistance match between any two channels, i.e., RON max – RON min.
Source leakage current with the switch off.
Drain leakage current with the switch off.
Channel leakage current with the switch on.
Maximum input voltage for Logic 0.
Minimum input voltage for Logic 1.
Input current of the digital input.
Off switch source capacitance. Measured with reference to ground.
Off switch drain capacitance. Measured with reference to ground.
On switch capacitance. Measured with reference to ground.
Digital input capacitance.
Delay time between the 50% and the 90% points of the digital input and switch on condition.
Delay time between the 50% and the 90% points of the digital input and switch off condition.
On or off time measured between the 80% points of both switches, when switching from one to another.
A measure of the glitch impulse transferred from the digital input to the analog output during on-to-off switching.
A measure of unwanted signal coupling through an off switch.
A measure of unwanted signal that is coupled through from one channel to another as a result of parasitic capacitance.
The frequency at which the output is attenuated by 3 dB.
The frequency response of the on switch.
The loss due to the on resistance of the switch.
The ratio of the harmonic amplitudes plus noise of a signal to the fundamental.
Rev. A | Page 7 of 16
ADG811/ADG812/ADG813
TYPICAL PERFORMANCE CHARACTERISTICS
0.60
1.2
VDD = 3.3V
TA = 25°C
0.55
VDD = 3V
1.0
VDD = 2.7V
ON RESISTANCE (Ω)
ON RESISTANCE (Ω)
0.50
0.45
0.40
VDD = 3.3V
VDD = 3.6V
0.35
0.8
+125°C
+85°C
0.6
0.4
+25°C
0.30
–40°C
0.2
0.25
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VD, VS (V)
0
Figure 3. On Resistance vs. VD (VS), VDD = 2.7 V to 3.6 V
0
1.0
1.5
2.0
2.5
3.0
VD, VS (V)
Figure 6. On Resistance vs. VD (VS) for Different Temperatures, VDD = 3.3 V
0.8
1.2
TA = 25°C
VDD = 2.5V
0.7
1.0
VDD = 2.3V
ON RESISTANCE (Ω)
ON RESISTANCE (Ω)
0.5
04306-A-006
0
04306-A-003
0.20
0.6
0.5
VDD = 2.5V
VDD = 2.7V
0.4
+125°C
0.8
+85°C
0.6
+25°C
0.4
–40°C
0.3
0
0.5
1.0
1.5
2.0
0
04306-A-004
0.2
2.5
VD, VS (V)
Figure 4. On Resistance vs. VD (VS), VDD = 2.5 V ± 0.2 V
0
1.0
1.5
2.0
2.5
VD, VS (V)
Figure 7. On Resistance vs. VD (VS) for Different Temperatures, VDD = 2.5 V
1.8
1.4
TA = 25°C
–40°C
VDD = 1.8V
1.6
1.2
VDD = 1.65V
+25°C
+125°C
ON RESISTANCE (Ω)
1.4
1.2
VDD = 1.8V
1.0
0.8
0.6
1.0
0.8
0.6
+85°C
0.4
VDD = 1.95V
0.2
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
VD, VS (V)
Figure 5. On Resistance vs. VD (VS), VDD = 1.8 V ± 0.15 V
2.0
0
0
0.2
0.4
0.6
0.8
1.0
VD, VS (V)
1.2
1.4
1.6
1.8
04306-A-008
0.2
0.4
04306-A-005
ON RESISTANCE (Ω)
0.5
04306-A-007
0.2
Figure 8. On Resistance vs. VD (VS) for Different Temperatures, VDD = 1.8 V
Rev. A | Page 8 of 16
ADG811/ADG812/ADG813
10
120
VDD = 3.3V
0
TA = 25°C
100
IS (OFF)
–10
–20
80
QINJ (pC)
CURRENT (nA)
ID (OFF)
–30
ID, IS (ON)
–40
–50
VCC = 3.6V
60
40
VCC = 2.5V
–60
20
–70
20
40
60
80
100
120
140
TEMPERATURE (°C)
04306-A-009
0
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
VS (V)
Figure 9. Leakage Currents vs. Temperature, VDD = 3.3 V
04306-A-012
VCC = 1.8V
–80
Figure 12. Charge Injection vs. Source Voltage
10
35
VDD = 2.5V
0
30
ID (OFF)
25
–10
IS (OFF)
TIME (ns)
CURRENT (nA)
VCC = 1.8V
tON
–20
ID, IS (ON)
–30
VCC = 2.5V
20
VCC = 3V
15
10
–40
VDD = 2.5V
VDD = 1.8V
tOFF
–50
5
–60
0
–40
20
40
60
80
100
120
140
TEMPERATURE (°C)
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
Figure 10. Leakage Currents vs. Temperature, VDD = 2.5 V
04306-A-013
0
04306-A-010
VCC = 3V
Figure 13. tON/tOFF Times vs. Temperature
0
1
VDD = 1.8V
ID (OFF)
0
–10
–1
ATTENUATION (dB)
IS (OFF)
–30
ID, IS (ON)
–40
–3
TA = 25°C
VCC = 3.3V/2.5V/1.8V
–4
–5
–6
–7
–8
–50
0
20
40
60
80
100
120
140
TEMPERATURE (°C)
Figure 11. Leakage Currents vs. Temperature, VDD = 1.8 V
–10
0.01
0.1
1
10
FREQUENCY (MHz)
Figure 14. Bandwidth
Rev. A | Page 9 of 16
100
1000
04306-A-014
–9
–60
04306-A-011
LEAKAGE (nA)
–2
–20
ADG811/ADG812/ADG813
0
0.08
VDD = 2.5V
TA = 25°C
32Ω LOAD
1.5V p-p
–10
TA = 25°C
0.06
VCC = 3.3V/2.5V/1.8V
–30
THD+N (%)
ATTENUATION (dB)
–20
–40
–50
0.05
–60
0.04
–70
0.1
1
10
100
1000
FREQUENCY (MHz)
Figure 15. Crosstalk vs. Frequency
–10
–40
–50
–60
–70
–80
–90
0.1
1
10
100
FREQUENCY (MHz)
1000
04306-A-016
ATTENUATION (dB)
TA = 25°C
VCC = 3.3V/2.5V/1.8V
–30
–100
0.01
20
50
100
200
500
1k
2k
5k
FREQUENCY (Hz)
Figure 17. Total Harmonic Distortion
0
–20
0.02
Figure 16. Off Isolation vs. Frequency
Rev. A | Page 10 of 16
10k
20k
04306-A-017
–90
0.01
04306-A-015
–80
ADG811/ADG812/ADG813
TEST CIRCUITS
IDS
V1
RON = V1/IDS
S
D
ID (OFF)
A
VS
VD
Figure 18. On Resistance
ID (ON)
S
NC
D
A
VD
Figure 19. Off Leakage
Figure 20. On Leakage
VDD
0.1µF
ADG811
VIN
VDD
S
VOUT
D
RL
VS
IN
50%
50%
50%
VIN
ADG812
CL
35pF
50Ω
50%
90%
90%
04306-A-021
VOUT
GND
tON
tOFF
Figure 21. Switching Times
VDD
0.1µF
VDD
S2
D2
RL2
50Ω
IN1, IN2
VIN
50%
VOUT1
VOUT2
RL1
50Ω
VIN
CL1
35pF
50%
0V
VOUT
80%
CL2
35pF
GND
80%
tBBM
tBBM
Figure 22. Break-Before-Make Time Delay, tBBM (ADG813)
VDD
SW ON
VDD
RS
VS
S
SW OFF
VIN
D
VOUT
CL
1nF
IN
VOUT
∆VOUT
QINJ = CL × ∆VOUT
GND
Figure 23. Charge Injection
Rev. A | Page 11 of 16
04306-A-022
VS2
D1
04306-A-023
VS1
S1
04306-A-020
A
04306-A-019
VS
IS (OFF)
D
04306-A-018
S
ADG811/ADG812/ADG813
VDD
0.1µF
NETWORK
ANALYZER
VDD
50Ω
S
50Ω
VS
D
RL
50Ω
OFF ISOLATION = 20 LOG
04306-A-024
GND
VDD
VOUT
VS
Figure 24. Off Isolation
VDD
0.1µF
NETWORK
ANALYZER
VDD
50Ω
S
VS
D
GND
INSERTION LOSS = 20 LOG
VDD
04306-A-025
RL
50Ω
VOUT WITH SWITCH
VOUT WITHOUT SWITCH
Figure 25. Bandwidth
VDD
0.1µF
NETWORK
ANALYZER
VOUT
VDD
S1
RL
50Ω
S2
D
50Ω
RL
50Ω
VS
CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG
VOUT
VS
Figure 26. Channel-to-Channel Crosstalk
Rev. A | Page 12 of 16
04306-A-026
GND
ADG811/ADG812/ADG813
OUTLINE DIMENSIONS
5.10
5.00
4.90
16
9
4.50
4.40
4.30
6.40
BSC
1
8
PIN 1
1.20
MAX
0.15
0.05
0.20
0.09
0.30
0.19
0.65
BSC
COPLANARITY
0.10
SEATING
PLANE
8°
0°
0.75
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153AB
Figure 27. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADG811YRU
ADG811YRU-REEL
ADG811YRU-REEL7
AADG812YRU
ADG812YRU-REEL
ADG812YRU-REEL7
ADG813YRU
ADG813YRU-REEL
ADG813YRU-REEL7
Temperature Range
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
Package Description
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Rev. A | Page 13 of 16
Package Option
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
ADG811/ADG812/ADG813
NOTES
Rev. A | Page 14 of 16
ADG811/ADG812/ADG813
NOTES
Rev. A | Page 15 of 16
ADG811/ADG812/ADG813
NOTES
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C04306–0–5/04(A)
Rev. A | Page 16 of 16