Vicor B048T040M20 Bcm bus converter Datasheet

B048F040T20
B048F040M20
V•I
BCMTM
Bus Converter
• 48 V to 4 V V•I ChipTM Converter
• Typical efficiency 94%
• 200 Watt (300 Watt for 1 ms)
• 125°C operation (TJ)
• High density – 169 A/in3
• <1 µs transient response
• Small footprint – 40
A/in2
• Low weight – 0.5 oz (15 g)
©
• 3.5 million hours MTBF
• No output filtering required
• ZVS / ZCS isolated Sine
Amplitude Converter
Product Description
Vin = 38 - 55 V
Vout = 3.17 - 4.58 V
Iout = 50 A
K = 1/12
Rout = 3.6 mΩ max
Absolute Maximum Ratings
The V•I Chip Bus Converter Module is a high efficiency
(>94%), narrow input range Sine Amplitude Converter
(SAC) operating from a 38 to 55 Vdc primary bus to
deliver an isolated 3.17 V to 4.58 V secondary. The BCM
may be used to power non-isolated POL converters or as
an independent 3.17 – 4.58 V source. Due to the fast
response time and low noise of the BCM, the need for
limited life aluminum electrolytic or tantalum capacitors
at the load is reduced—or eliminated—resulting in
savings of board area, materials and total system cost.
The BCM achieves a current density of 169 A/in3 in a
V•I Chip package compatible with standard pick-andplace and surface mount assembly process. The V•I Chip
package provides flexible thermal management through
its low junction-to-board and junction-to-case thermal
resistance. Owing to its high conversion efficiency and
safe operating temperature range, the BCM does not
require a discrete heat sink in typical applications. Low
junction-to-case and junction-to-lead thermal
impedances assure low junction temperatures and long
life in the harshest environments.
Parameter
+In to -In
Values
Unit
-1.0 to 60
Vdc
Notes
+In to -In
100
Vdc
PC to -In
-0.3 to 7.0
Vdc
+Out to -Out
-0.5 to 12
Vdc
2,250
Vdc
58
A
Continuous
75.0
A
For 1 ms
Isolation voltage
Output current
Peak output current
For 100 ms
Input to output
Output power
200
W
Continuous
Peak output power
300
W
For 1 ms
225
°C
During reflow MSL 5
-40 to 125
°C
T-Grade
Case temperature
Operating junction temperature
(1)
Storage temperature
-55 to 125
°C
M-Grade
-40 to 125
°C
T-Grade
-65 to 125
°C
M-Grade
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
Part Numbering
B
048
Bus Converter
Module
F
800-735-6200
T
Output Voltage
Designator
(=VOUT x10)
Input Voltage
Designator
Configuration
F = J-lead
T = Through hole
vicorpower.com
040
V•I Chip Bus Converter Module
20
Output Power
Designator
(=POUT /10)
Product Grade Temperatures (°C)
Grade
Storage
Operating (TJ)
T
-40 to125
-40 to125
M
-65 to 125
-55 to 125
B048F040T20
Rev. 2.5
Page 1 of 12
Specifications
V•I Chip Bus Converter Module
Input (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Input voltage range
Input dV/dt
Input undervoltage turn-on
Input undervoltage turn-off
Input overvoltage turn-on
Input overvoltage turn-off
Input quiescent current
Inrush current overshoot
Input current
Input reflected ripple current
No load power dissipation
Internal input capacitance
Internal input inductance
Recommended external input capacitance
Min
Typ
Max
Unit
38
48
55
1
37.4
Vdc
V/µs
Vdc
Vdc
Vdc
Vdc
mA
A
Adc
mA p-p
W
µF
nH
µF
32.6
55.0
59.0
2.9
3.7
4.6
114
3.9
1.9
5
47
4.8
Note
PC low
Using test circuit in Figure 20; See Figure 1
Using test circuit in Figure 20; See Figure 4
200 nH maximum source inductance; See Figure 20
Input Waveforms
Figure 1 — Inrush transient current at full load and 48 Vin with PC enabled
Figure 2 — Output voltage turn-on waveform with PC enabled at full load
and 48 Vin
Figure 3 — Output voltage turn-on waveform with input turn-on at full
load and 48 Vin
Figure 4 — Input reflected ripple current at full load and 48 Vin
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V•I Chip Bus Converter Module
B048F040T20
Rev. 2.5
Page 2 of 12
Specifications
(continued)
V•I Chip Bus Converter Module
Output (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Min
Typ
3.17
2.99
0
0
0
Output voltage
Output power
Rated DC current
Peak repetitive power
Current share accuracy
Efficiency
Half load
Full load
Internal output inductance
Internal output capacitance
Load capacitance
Output overvoltage setpoint
Output ripple voltage
No external bypass
47 µF bypass capacitor
Short circuit protection set point
Average short circuit current
Effective switching frequency
Line regulation
K
Load regulation
ROUT
Transient response
Voltage overshoot
Response time
Recovery time
Output overshoot
Input turn-on
PC enable
Output turn-on delay
From application of power
From release of PC pin
5
93.8
93.5
Max
Unit
Note
4.58
4.42
200
172
58
Vdc
Vdc
W
W
Adc
300
W
10
%
No load
Full load
44 - 55 VIN
38 - 55 VIN
POUT ≤ 200 W
Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
See Parallel Operation on Page 10
94.8
94.5
1.1
255
9,100
4.6
216
8
305
59.8
2.40
0.77
2.55
2.70
0.0825
1/12
0.0842
2.8
3.6
%
%
nH
µF
µF
Vdc
See Figure 5
See Figure 5
Effective value
Module will shut down
mVp-p
mVp-p
Adc
A
MHz
See Figures 7 and 9
See Figure 8
Module will shut down
Fixed, 1.3 MHz per phase
VOUT = K•VIN at no load
mΩ
110
200
1
mV
ns
µs
100% load step; See Figures 10 and 11
See Figures 10 and 11
See Figures 10 and 11
0
0
mV
mV
No output filter; See Figure 3
No output filter; See Figure 2
215
75
ms
ms
No output filter; See Figure 3
No output filter
Output Waveforms
Efficiency vs. Output Power
Power Dissipation
96
14
Power Dissipation (W)
Efficiency (%)
94
92
90
88
86
84
82
12
10
8
6
4
2
0
20
40
60
80
100
120
140
160
180
200
0
20
40
80
100
120
140
160
180
200
Output Power (W)
Output Power (W)
Figure 5 — Efficiency vs. output power
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60
Figure 6 — Power dissipation as a function of output power
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V•I Chip Bus Converter Module
B048F040T20
Rev. 2.5
Page 3 of 12
Specifications
(continued)
V•I Chip Bus Converter Module
Figure 8 — Output voltage ripple at full load and 48 Vin with 47 µF ceramic
external bypass capacitor and 20 nH of distribution inductance.
Figure 7 — Output voltage ripple at full load and 48 Vin without any
external bypass capacitor.
Ripple vs. Output Power
Output Ripple (mVpk-pk)
220
200
180
160
140
120
100
80
0
20
40
60
80
100
120
140
160
180
200
Output Power (W)
Figure 9 — Output voltage ripple vs. output power at 48 Vin without any
external bypass capacitor.
Figure 10 — 0 -50 A load step with 100 µF input capacitor and no
output capacitor.
Figure 11 — 50- 0 A load step with 100 µF input capacitor and no
output capacitor.
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V•I Chip Bus Converter Module
B048F040T20
Rev. 2.5
Page 4 of 12
Specifications
(continued)
V•I Chip Bus Converter Module
General
Parameter
Min
MTBF
MIL-HDBK-217F
Isolation specifications
Voltage
Capacitance
Resistance
Typ
Max
Unit
Note
3.5
Mhrs
25°C, GB
3,000
Vdc
pF
MΩ
Input to output
Input to output
Input to output
UL /CSA 60950-1, EN 60950-1
Low voltage directive
2,250
10
cTÜVus
CE Mark
RoHS
Agency approvals
Mechanical
Weight
Dimensions
Length
Width
Height
Thermal
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance (RθJC)
Junction-to-board thermal impedance (RθJB)
See Mechanical Drawings, Figures 15 – 18
0.53/15
oz /g
1.28/ 32,5
0.87 / 22
0.265 / 6,73
in / mm
in / mm
in / mm
125
130
9.3
1.1
2.1
135
°C
Ws /°C
°C / W
°C / W
Junction temperature
Auxiliary Pins (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Min
Typ
Max
5.2
Unit
Note
Primary control (PC)
DC voltage
4.8
5.0
Module disable voltage
2.4
2.5
Module enable voltage
Current limit
2.4
Vdc
Vdc
2.5
2.6
Vdc
2.5
2.9
mA
Enable delay time
75
ms
Disable delay time
30
µs
See Figure 12, time from PC low to output low
Figure 13 — PC signal during fault
Figure 12 — VOUT at full load vs. PC disable
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Source only
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V•I Chip Bus Converter Module
B048F040T20
Rev. 2.5
Page 5 of 12
Pin / Control Functions
V•I Chip Bus Converter Module
+In / -In – DC Voltage Input Ports
The V•I Chip input voltage range should not be exceeded. An internal
under / over voltage lockout function prevents operation outside of the
normal operating input range. The BCM turns on within an input
voltage window bounded by the “Input under-voltage turn-on” and
“Input over-voltage turn-off” levels, as specified. The V•I Chip may be
protected against accidental application of a reverse input voltage by
the addition of a rectifier in series with the positive input, or a reverse
rectifier in shunt with the positive input located on the load side of the
input fuse.
The connection of the V•I Chip to its power source should be
implemented with minimal distribution inductance. If the interconnect
inductance exceeds 100 nH, the input should be bypassed with a RC
damper to retain low source impedance and stable operation. With an
interconnect inductance of 200 nH, the RC damper may be 47 µF in
series with 0.3Ω. A single electrolytic or equivalent low-Q capacitor may
be used in place of the series RC bypass.
PC – Primary Control
The Primary Control port is a multifunction node that provides the
following functions:
Enable / Disable – If the PC port is left floating, the BCM output is
enabled. Once this port is pulled lower than 2.4 Vdc with respect
to –In, the output is disabled. This action can be realized by
employing a relay, opto-coupler, or open collector transistor. Refer
to Figures 1-3, 12 and 13 for the typical enable / disable
characteristics. This port should not be toggled at a rate higher
than 1 Hz. The PC port should also not be driven by or pulled up to
an external voltage source.
4
3
2
+Out
B
B
C
C
D
D
+In
E
E
-Out
1
A
A
F
G
H
TM
H
J
RSV
J
K
PC
K
+Out
-Out
L
L
M
M
N
N
P
P
R
R
-In
T
T
Bottom View
Signal
Name
+In
–In
TM
RSV
PC
+Out
–Out
Designation
A1-E1, A2-E2
L1-T1, L2-T2
H1, H2
J1, J2
K1, K2
A3-D3, A4-D4,
J3-M3, J4-M4
E3-H3, E4-H4,
N3-T3, N4-T4
Primary Auxiliary Supply – The PC port can source up to 2.4 mA at
5.0 Vdc. The PC port should never be used to sink current.
Alarm – The BCM contains circuitry that monitors output overload,
input over voltage or under voltage, and internal junction
temperatures. In response to an abnormal condition in any of the
monitored parameters, the PC port will toggle. Refer to Figure 13
for PC alarm characteristics.
Figure 14 — BCM pin configuration
TM and RSV – Reserved for factory use.
+Out / -Out – DC Voltage Output Ports
Two sets of contacts are provided for the +Out port. They must be
connected in parallel with low interconnect resistance. Similarly, two
sets of contacts are provided for the –Out port. They must be
connected in parallel with low interconnect resistance. Within the
specified operating range, the average output voltage is defined by the
Level 1 DC behavioral model of Figure 21. The current source capability
of the BCM is rated in the specifications section of this document.
The low output impedance of the BCM reduces or eliminates the need
for limited life aluminum electrolytic or tantalum capacitors at the input
of POL converters.
Total load capacitance at the output of the BCM should not exceed the
specified maximum. Owing to the wide bandwidth and low output
impedance of the BCM, low frequency bypass capacitance and
significant energy storage may be more densely and efficiently provided
by adding capacitance at the input of the BCM.
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V•I Chip Bus Converter Module
B048F040T20
Rev. 2.5
Page 6 of 12
Mechanical Drawings
V•I Chip Bus Converter Module
BOTTOM VIEW
TOP VIEW ( COMPONENT SIDE )
NOTES:
mm
1. DIMENSIONS ARE inch .
2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. PRODUCT MARKING ON TOP SURFACE
DXF and PDF files are available on vicorpower.com
Figure 15 — BCM J-Lead mechanical outline; Onboard mounting
RECOMMENDED LAND PATTERN
( COMPONENT SIDE SH OWN )
NOTES:
mm
1. DIMENSIONS ARE inch .
2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. PRODUCT MARKING ON TOP SURFACE
DXF and PDF files are available on vicorpower.com
Figure 16 — BCM PCB land layout information
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V•I Chip Bus Converter Module
B048F040T20
Rev. 2.5
Page 7 of 12
Mechanical Drawings (continued)
V•I Chip Bus Converter Module
TOP VIEW ( COMPONENT SIDE )
BOTTOM VIEW
NOTES:
(mm)
1. DIMENSIONS ARE inch .
2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE:
X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005]
3. RoHS COMPLIANT PER CST-0001 LATEST REVISION
DXF and PDF files are available on vicorpower.com
Figure 17 — BCM through-hole mechanical outline
NOTES:
(mm)
1. DIMENSIONS ARE inch .
2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE:
X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005]
RECOMMENDED HOLE PATTERN
( COMPONENT SIDE SHOWN )
3. RoHS COMPLIANT PER CST-0001 LATEST REVISION
DXF and PDF files are available on vicorpower.com
Figure 18 — BCM through-hole PCB layout information
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V•I Chip Bus Converter Module
B048F040T20
Rev. 2.5
Page 8 of 12
Configuration Options
V•I Chip Bus Converter Module
2.95±0.07
ø
(2) PL
[0.116±0.003]
NON-PLATED
THROUGH HOLE
SEE NOTE 1.
NOTES:
1. MAINTAIN 3.5/[0.138] DIA. KEEP OUT ZONE FREE OF
COPPER. ALL PCB LAYERS.
2. MINIMUM RECOMMENDED PITCH IS 39.50/[1.555].
THIS PROVIDES 7.00/[0.276] COMPONENT EDGE-TO-EDGE SPACING.
AND 0.50/[0.020] CLEARANCE BETWEEN VICOR HEAT SINKS.
(4.37)
0.172
(11.37)
0.448
3. V•I CHIP LAND PATTERN SHOWN FOR REFERENCE ONLY;
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN TO PUSH-PIN
HOLES WILL BE THE SAME FOR ALL FULL SIZE V•I CHIPS.
(mm)
4. DIMENSION ARE inch .
(36.50)
1.437
(18.25)
0.719
DOTTED LINE
INDICATES VIC
POSITION
SEE NOTE 3
(7.00)
0.276
(2.510)
0.099
(31.48)
1.240
(39.50)
1.555
SEE NOTE 2.
HEAT SINK PUSH-PIN HOLE PATTERN
( TOP SIDE SHOWN )
SEE NOTE 3
Figure 19 — Hole location for push pin heat sink relative to V•I Chip
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V•I Chip Bus Converter Module
B048F040T20
Rev. 2.5
Page 9 of 12
Application Note
V•I Chip Bus Converter Module
Parallel Operation
The BCM will inherently current share when operated in an array. Arrays
may be used for higher power or redundancy in an application.
Current sharing accuracy is maximized when the source and load
impedance presented to each BCM within an array are equal. The
recommended method to achieve matched impedances is to dedicate
common copper planes within the PCB to deliver and return the current
to the array, rather than rely upon traces of varying lengths. In typical
applications the current being delivered to the load is larger than that
sourced from the input, allowing traces to be utilized on the input side
if necessary. The use of dedicated power planes is, however, preferable.
The BCM power train and control architecture allow bi-directional
power transfer, including reverse power processing from the BCM
output to its input. Reverse power transfer is enabled if the BCM input
is within its operating range and the BCM is otherwise enabled. The
BCM’s ability to process power in reverse improves the BCM transient
response to an output load dump.
Input Impedance Recommendations
To take full advantage of the BCM capabilities, the impedance
presented to its input terminals must be low from DC to approximately
5 MHz. The source should exhibit low inductance (less than 100 nH)
and should have a critically damped response. If the interconnect
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800-735-6200
inductance exceeds 100 nH, the BCM input pins should be bypassed
with an RC damper (e.g., 47 µF in series with 0.3 ohm) to retain low
source impedance and stable operations. Given the wide bandwidth of
the BCM, the source response is generally the limiting factor in the
overall system response.
Anomalies in the response of the source will appear at the output of
the BCM multiplied by its K factor. The DC resistance of the source
should be kept as low as possible to minimize voltage deviations. This is
especially important if the BCM is operated near low or high line as the
over/under voltage detection circuitry could be activated.
Input Fuse Recommendations
V•I Chips are not internally fused in order to provide flexibility in
configuring power systems. However, input line fusing of V•I Chips
must always be incorporated within the power system. A fast acting
fuse should be placed in series with the +In port.
Application Notes
For BCM and V•I Chip application notes on soldering, thermal
management, board layout, and system design click on the link below:
http://www.vicorpower.com/technical_library/application_information/chips/
V•I Chip Bus Converter Module
B048F040T20
Rev. 2.5
Page 10 of 12
Application Note (continued)
V•I Chip Bus Converter Module
Input reflected ripple
measurement point
F1
6A
Fuse
+Out
+In
+
Enable/Disable Switch
-Out
C1
47 µF
TM
RSV
PC
R2
2 kΩ
electrolytic
SW1
D1
-In
K
Ro
Source inductance should be no more than 200 nH. If source inductance is
greater than 200 nH, additional bypass capacitance may be required.
R3
10 mΩ
BCM
Load
C3
47 µF
+Out
Notes:
R3 may be ESR of C3 or a separate damping resistor.
–
-Out
C3 should be placed close to the load.
D1 power good indicator will dim when a module fault is detected.
Figure 20 — BCM test circuit
V•I Chip Bus Converter Level 1 DC Behavioral Model for 48 V to 4 V, 200 W
ROUT
IOUT
+
+
2.8 mΩ
1/12 • Iout
VIN
V•I
+
+
–
IQ
81 mA
1/12 • Vin
VOUT
–
K
–
–
©
Figure 21 — This model characterizes the DC operation of the V•I Chip bus converter, including the converter transfer function and its losses. The model enables
estimates or simulations of output voltage as a function of input voltage and output load, as well as total converter power dissipation or heat generation.
V•I Chip Bus Converter Level 2 Transient Behavioral Model for 48 V to 4 V, 200 W
0.23 nH
ROUT
IOUT
L IN = 5 nH
+
2.8 mΩ
RCIN
1.3 mΩ
CIN
VIN
Lout
V• I
1/12 • Iout
+
+
–
1.9 µF
IQ
81 mA
RCOUT
0.96 mΩ
1.1 nH
+
0.7 mΩ
1/12 • Vin
COUT
255 µF
VOUT
–
K
–
–
©
Figure 22 — This model characterizes the AC operation of the V•I Chip bus converter including response to output load or input voltage transients or steady state
modulations. The model enables estimates or simulations of input and output voltages under transient conditions, including response to a stepped load with or
without external filtering elements.
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V•I Chip Bus Converter Module
B048F040T20
Rev. 2.5
Page 11 of 12
Warranty
Vicor products are guaranteed for two years from date of shipment against defects in material or workmanship when in
normal use and service. This warranty does not extend to products subjected to misuse, accident, or improper
application or maintenance. Vicor shall not be liable for collateral or consequential damage. This warranty is extended
to the original purchaser only.
EXCEPT FOR THE FOREGOING EXPRESS WARRANTY, VICOR MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING,
BUT NOT LIMITED TO, THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
Vicor will repair or replace defective products in accordance with its own best judgement. For service under this
warranty, the buyer must contact Vicor to obtain a Return Material Authorization (RMA) number and shipping
instructions. Products returned without prior authorization will be returned to the buyer. The buyer will pay all charges
incurred in returning the product to the factory. Vicor will pay all reshipment charges if the product was defective within
the terms of this warranty.
Information published by Vicor has been carefully checked and is believed to be accurate; however, no responsibility is
assumed for inaccuracies. Vicor reserves the right to make changes to any products without further notice to improve
reliability, function, or design. Vicor does not assume any liability arising out of the application or use of any product or
circuit; neither does it convey any license under its patent rights nor the rights of others. Vicor general policy does not
recommend the use of its components in life support applications wherein a failure or malfunction may directly threaten
life or injury. Per Vicor Terms and Conditions of Sale, the user of Vicor components in life support applications assumes
all risks of such use and indemnifies Vicor against all damages.
Vicor’s comprehensive line of power solutions includes high density AC-DC
and DC-DC modules and accessory components, fully configurable AC-DC
and DC-DC power supplies, and complete custom power systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for
its use. Vicor components are not designed to be used in applications, such as life support systems, wherein a failure or
malfunction could result in injury or death. All sales are subject to Vicor’s Terms and Conditions of Sale, which are
available upon request.
Specifications are subject to change without notice.
Intellectual Property Notice
Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent
applications) relating to the products described in this data sheet. Interested parties should contact Vicor's
Intellectual Property Department.
The products described on this data sheet are protected by the following U.S. Patents Numbers:
5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917;
7,166,898; 7,187,263; 7,361,844; D496,906; D505,114; D506,438; D509,472 and for use under 6,975,098 and
6,984,965
Vicor Corporation
25 Frontage Road
Andover, MA, USA 01810
Tel: 800-735-6200
Fax: 978-475-6715
email
Customer Service: [email protected]
Technical Support: [email protected]
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V•I Chip Bus Converter Module
B048F040T20
Rev. 2.5
9/09