SEMICONDUCTOR TECHNICAL DATA The MC10E/100E104 is a quint 2-input AND/NAND gate. The function output F is the OR of all five AND gate outputs, while F is the NOR. The Q outputs need not be terminated if only the F outputs are to be used. • • • • 600ps Max. Propagation Delay OR/NOR Function Outputs QUINT 2-INPUT AND/NAND GATE Extended 100E VEE Range of – 4.2V to – 5.46V 75kΩ Input Pulldown Resistors Pinout: 28-Lead PLCC (Top View) D3a D4b D4a NC VCCO F F 25 24 23 22 21 20 19 D3b 26 18 Q4 D2a 27 17 Q4 D2b 28 16 VCC VEE 1 15 Q3 D1a 2 14 Q3 D1b 3 13 Q2 D0a 4 12 Q2 FN SUFFIX PLASTIC PACKAGE CASE 776-02 F LOGIC DIAGRAM 5 6 D0b VCCO 7 8 9 10 11 Q0 Q0 Q1 Q1 VCCO * All VCC and VCCO pins are tied together on the die. PIN NAMES Pin D0a – D4b Q0 – Q4 Q0 – Q4 F F D0a Q0 D0b Q0 D1a Q1 D1b Q1 D2a Q2 D2b Q2 D3a Q3 D3b Q3 D4a Q4 D4b Q4 Function Data Inputs AND Outputs NAND Outputs OR Output NOR Output FUNCTION OUTPUTS F= F (D0a • D0b) + (D1a • D1b) + (D2a • D2b) + (D3a • D3b) + (D4a • D4b) 12/93 Motorola, Inc. 1996 2–1 REV 2 MC10E104 MC100E104 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic IIH Input HIGH Current IEE Power Supply Current 10E 100E min typ 25°C max min typ 85°C max 200 min typ 200 max Unit 200 µA Condition mA 38 38 46 46 38 38 46 46 38 44 46 53 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic tPLH tPHL Propagation Delay to Output D to Q D to F tSKEW Within-Device Skew D to Q tr tf Rise/Fall Times 20 - 80% Q F 25°C 85°C min typ max min typ max min typ max 225 500 385 725 600 1000 225 500 385 725 600 1000 225 500 385 725 600 1000 Unit Condition ps ps 75 75 75 1 ps 275 300 425 475 700 700 275 300 425 475 700 700 275 300 425 475 700 700 1. Within-device skew is defined as identical transitions on similar paths through a device. MOTOROLA 2–2 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E104 MC100E104 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). ECLinPS and ECLinPS Lite DL140 — Rev 4 T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — MOTOROLA MC10E104 MC100E104 Motorola reserves the right to make changes without further notice to any products herein. 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