ON MC10E104 Quint 2-input and/nand gate Datasheet

SEMICONDUCTOR TECHNICAL DATA
The MC10E/100E104 is a quint 2-input AND/NAND gate. The function
output F is the OR of all five AND gate outputs, while F is the NOR. The Q
outputs need not be terminated if only the F outputs are to be used.
•
•
•
•
600ps Max. Propagation Delay
OR/NOR Function Outputs
QUINT 2-INPUT
AND/NAND GATE
Extended 100E VEE Range of – 4.2V to – 5.46V
75kΩ Input Pulldown Resistors
Pinout: 28-Lead PLCC (Top View)
D3a
D4b
D4a
NC
VCCO
F
F
25
24
23
22
21
20
19
D3b
26
18
Q4
D2a
27
17
Q4
D2b
28
16
VCC
VEE
1
15
Q3
D1a
2
14
Q3
D1b
3
13
Q2
D0a
4
12
Q2
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
F
LOGIC DIAGRAM
5
6
D0b VCCO
7
8
9
10
11
Q0
Q0
Q1
Q1
VCCO
* All VCC and VCCO pins are tied together on the die.
PIN NAMES
Pin
D0a – D4b
Q0 – Q4
Q0 – Q4
F
F
D0a
Q0
D0b
Q0
D1a
Q1
D1b
Q1
D2a
Q2
D2b
Q2
D3a
Q3
D3b
Q3
D4a
Q4
D4b
Q4
Function
Data Inputs
AND Outputs
NAND Outputs
OR Output
NOR Output
FUNCTION OUTPUTS
F=
F
(D0a • D0b) + (D1a • D1b) + (D2a • D2b) +
(D3a • D3b) + (D4a • D4b)
12/93
 Motorola, Inc. 1996
2–1
REV 2
MC10E104 MC100E104
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0°C
Symbol
Characteristic
IIH
Input HIGH Current
IEE
Power Supply Current
10E
100E
min
typ
25°C
max
min
typ
85°C
max
200
min
typ
200
max
Unit
200
µA
Condition
mA
38
38
46
46
38
38
46
46
38
44
46
53
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0°C
Symbol
Characteristic
tPLH
tPHL
Propagation Delay to Output
D to Q
D to F
tSKEW
Within-Device Skew
D to Q
tr
tf
Rise/Fall Times
20 - 80%
Q
F
25°C
85°C
min
typ
max
min
typ
max
min
typ
max
225
500
385
725
600
1000
225
500
385
725
600
1000
225
500
385
725
600
1000
Unit
Condition
ps
ps
75
75
75
1
ps
275
300
425
475
700
700
275
300
425
475
700
700
275
300
425
475
700
700
1. Within-device skew is defined as identical transitions on similar paths through a device.
MOTOROLA
2–2
ECLinPS and ECLinPS Lite
DL140 — Rev 4
MC10E104 MC100E104
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180)
B
Y BRK
-N-
T L –M
M
U
0.007 (0.180)
X
G1
M
S
N
T L –M
S
S
N
S
D
Z
-L-
-M-
D
W
28
V
1
C
A
0.007 (0.180)
M
R
0.007 (0.180)
M
T L –M
S
T L –M
S
N
S
N
S
H
S
N
S
0.007 (0.180)
M
T L –M
N
S
S
0.004 (0.100)
G
J
-T-
K
SEATING
PLANE
F
VIEW S
G1
T L –M
S
N
0.007 (0.180)
M
T L –M
S
N
S
VIEW S
S
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
ECLinPS and ECLinPS Lite
DL140 — Rev 4
T L –M
K1
E
S
S
VIEW D-D
Z
0.010 (0.250)
0.010 (0.250)
2–3
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485 0.495
0.485 0.495
0.165 0.180
0.090 0.110
0.013 0.019
0.050 BSC
0.026 0.032
0.020
—
0.025
—
0.450 0.456
0.450 0.456
0.042 0.048
0.042 0.048
0.042 0.056
—
0.020
2°
10°
0.410 0.430
0.040
—
MILLIMETERS
MIN
MAX
12.32 12.57
12.32 12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
—
0.64
—
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
—
0.50
2°
10°
10.42 10.92
1.02
—
MOTOROLA
MC10E104 MC100E104
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2–4
*MC10E104/D*
MC10E104/D
ECLinPS and ECLinPS Lite
DL140 — Rev 4
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