MOTOROLA MC74LVX138M Low-voltage cmo Datasheet

SEMICONDUCTOR TECHNICAL DATA
!
! ! "!
LVX
The MC74LVX138 is an advanced high speed CMOS 3–to–8 line
decoder. The inputs tolerate voltages up to 7V, allowing the interface of
5V systems to 3V systems.
When the device is enabled, three Binary Select inputs (A0 – A2)
determine which one of the outputs (O0 – O7) will go Low. When enable
input E3 is held Low or either E2 or E1 is held High, decoding function is
inhibited and all outputs go high. E3, E2, and E1 inputs are provided to
ease cascade connection and for use as an address decoder for memory
systems.
•
•
•
•
•
•
•
•
LOW–VOLTAGE CMOS
High Speed: tPD = 5.5ns (Typ) at VCC = 3.3V
Low Power Dissipation: ICC = 4µA (Max) at TA = 25°C
D SUFFIX
16–LEAD SOIC PACKAGE
CASE 751B–05
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Low Noise: VOLP = 0.5V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300mA
ESD Performance: HBM > 2000V; Machine Model > 200V
VCC
16
O0
O1
O2
O3
O4
O5
O6
15
14
13
12
11
10
9
DT SUFFIX
16–LEAD TSSOP PACKAGE
CASE 948F–01
M SUFFIX
16–LEAD SOIC EIAJ PACKAGE
CASE 966–01
1
2
3
4
5
6
7
A0
A1
A2
E1
E2
E3
O7
8
GND
Figure 1. 16–Lead Pinout (Top View)
PIN NAMES
Pins
Function
A0–A2
E1–E2
E3
O0–O7
Address Inputs
Enable Inputs
Enable Input
Outputs
6/97
 Motorola, Inc. 1997
1
REV 0
MC74LVX138
15
O0
14
A0
O1
1
13
O2
12
SELECT
INPUTS
A1
O3
2
11
O4
10
A2
O5
3
9
O6
7
E1
ENABLE
INPUTS
E2
E3
DATA
OUTPUTS
O7
4
5
6
Figure 2. Logic Diagram
INPUTS
OUTPUTS
E1
E2
E3
A0
A1
A2
O0
O1
O2
O3
O4
O5
O6
O7
H
X
X
X
H
X
X
X
L
X
X
X
X
X
X
X
X
X
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
H
H
H
H
L
H
L
H
L
L
H
H
L
L
L
L
L
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
H
H
H
H
L
H
L
H
L
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H = High Voltage Level; L = Low Voltage Level; X = High or Low Voltage Level and Transitions Are Acceptable; For ICC reasons, DO NOT FLOAT
Inputs
A0
A1
A2
‘04
A3
A4
H
123
A0 A1 A2
E
O0 O1 O2 O3 O4 O5 O6 O7
123
A0 A1 A2
123
E
A0 A1 A2
O0 O1 O2 O3 O4 O5 O6 O7
E
O0 O1 O2 O3 O4 O5 O6 O7
O0
123
A0 A1 A2
E
O0 O1 O2 O3 O4 O5 O6 O7
O31
Figure 3. Expansion to 1–of–32 Decoding
MOTOROLA
2
LCX DATA
BR1339 — REV 3
MC74LVX138
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MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
–0.5 to +7.0
V
Vin
DC Input Voltage
–0.5 to +7.0
V
Vout
DC Output Voltage
–0.5 to VCC +0.5
V
IIK
Input Diode Current
–20
mA
IOK
Output Diode Current
±20
mA
Iout
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±75
mA
PD
Power Dissipation
180
mW
Tstg
Storage Temperature
–65 to +150
_C
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is
not implied.
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RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage
2.0
3.6
V
Vin
DC Input Voltage
0
5.5
V
Vout
DC Output Voltage
0
VCC
V
TA
Operating Temperature, All Package Types
–40
+85
_C
∆t/∆V
Input Rise and Fall Time
0
100
ns/V
DC ELECTRICAL CHARACTERISTICS
S b l
Symbol
P
Parameter
T
Test
C
Conditions
di i
Min
1.5
2.0
2.4
VIH
High–Level Input Voltage
2.0
3.0
3.6
VIL
Low–Level Input Voltage
2.0
3.0
3.6
VOH
High–Level Output Voltage
(Vin = VIH or VIL)
IOH = –50µA
IOH = –50µA
IOH = –4mA
2.0
3.0
3.0
VOL
Low–Level Output Voltage
(Vin = VIH or VIL)
IOL = 50µA
IOL = 50µA
IOL = 4mA
2.0
3.0
3.0
Iin
Input Leakage Current
Vin = 5.5V or GND
ICC
Quiescent Supply Current
Vin = VCC or GND
LCX DATA
BR1339 — REV 3
TA = 25°C
VCC
V
Typ
TA = – 40 to 85°C
Max
Min
1.5
2.0
2.4
0.5
0.8
0.8
1.9
2.9
2.58
Max
2.0
3.0
V
0.5
0.8
0.8
1.9
2.9
2.48
V
V
0.1
0.1
0.36
0.1
0.1
0.44
V
3.6
±0.1
±1.0
µA
3.6
4.0
40.0
µA
3
0.0
0.0
U i
Unit
MOTOROLA
MC74LVX138
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AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0ns)
TA = 25°C
S b l
Symbol
tPLH,
tPHL
tPLH,
tPHL
tPLH,
tPHL
tOSHL
tOSLH
P
Parameter
Propagation Delay
Input to Output
Propagation Delay
E3 to O
Propagation Delay
E1 or E2 to O
Output–to–Output Skew
(Note 1.)
T
Test
C
Conditions
di i
Min
TA = – 40 to 85°C
Typ
Max
Min
Max
U i
Unit
ns
VCC = 2.7V
CL = 15pF
CL = 50pF
7.1
9.6
13.8
17.3
1.0
1.0
16.5
20.0
VCC = 3.3 ± 0.3V
CL = 15pF
CL = 50pF
5.5
8.0
8.8
12.3
1.0
1.0
10.5
14.0
VCC = 2.7V
CL = 15pF
CL = 50pF
8.7
11.2
16.3
19.8
1.0
1.0
19.5
23.0
VCC = 3.3 ± 0.3V
CL = 15pF
CL = 50pF
6.8
9.3
10.6
14.1
1.0
1.0
12.5
16.0
VCC = 2.7V
CL = 15pF
CL = 50pF
8.8
11.3
16.0
19.5
1.0
1.0
18.5
22.0
VCC = 3.3 ± 0.3V
CL = 15pF
CL = 50pF
6.9
9.4
10.4
13.9
1.0
1.0
11.5
15.0
VCC = 2.7V
VCC = 3.3 ±0.3V
CL = 50pF
CL = 50pF
2.5
2.5
2.5
2.5
ns
ns
ns
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter
guaranteed by design.
CAPACITIVE CHARACTERISTICS
TA = 25°C
S b l
Symbol
P
Parameter
Min
TA = – 40 to 85°C
Typ
Max
10
Cin
Input Capacitance
4
CPD
Power Dissipation Capacitance (Note 2.)
34
Min
Max
U i
Unit
10
pF
pF
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC . CPD is used to determine the no–load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
NOISE CHARACTERISTICS (Input tr = tf = 3.0ns, CL = 50pF, VCC = 3.3V, Measured in SOIC Package)
TA = 25°C
S b l
Symbol
Ch
i i
Characteristic
Typ
Max
U i
Unit
VOLP
Quiet Output Maximum Dynamic VOL
0.5
V
VOLV
Quiet Output Minimum Dynamic VOL
–0.5
V
VIHD
Minimum High Level Dynamic Input Voltage
2.0
V
VILD
Maximum Low Level Dynamic Input Voltage
0.8
V
MOTOROLA
4
LCX DATA
BR1339 — REV 3
MC74LVX138
SWITCHING WAVEFORMS
VALID
A
VALID
VCC
50%
O
50%
GND
GND
tPLH
VCC
E3
tPLH
tPHL
tPHL
50% VCC
50% VCC
O
Figure 4.
Figure 5.
VCC
E2 or E1
50%
GND
tPHL
O
tPLH
50% VCC
Figure 6.
TEST CIRCUIT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
CL*
* Includes all probe and jig capacitance
Figure 7. Test Circuit
LCX DATA
BR1339 — REV 3
5
MOTOROLA
MC74LVX138
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A
–
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B
–
1
P 8 PL
0.25 (0.010)
8
M
B
M
G
K
DIM
A
B
C
D
F
G
J
K
M
P
R
F
R X 45°
C
–T
SEATING
–
J
M
PLANE
D 16 PL
0.25 (0.010)
M
T
B
S
A
S
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 966–01
ISSUE O
16
LE
9
Q1
M_
E HE
L
8
1
DETAIL P
Z
D
e
VIEW P
A
c
A1
b
0.13 (0.005)
MOTOROLA
M
0.10 (0.004)
6
MILLIMETERS
MIN
MAX
9.80 10.00
4.00
3.80
1.75
1.35
0.49
0.35
1.25
0.40
1.27 BSC
0.25
0.19
0.25
0.10
7°
0°
6.20
5.80
0.50
0.25
INCHES
MIN
MAX
0.386 0.393
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0°
7°
0.229 0.244
0.010 0.019
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--0.78
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.031
LCX DATA
BR1339 — REV 3
MC74LVX138
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F–01
ISSUE O
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
ÇÇÇ
ÉÉ
ÇÇÇ
ÉÉ
ÇÇÇ
K
K1
2X
L/2
16
9
J1
B
–U–
L
SECTION N–N
J
PIN 1
IDENT.
8
1
N
0.25 (0.010)
0.15 (0.006) T U
S
A
–V–
M
N
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
F
DETAIL E
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
DETAIL E
H
D
G
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.007
0.011
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
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– US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
INTERNET: http://motorola.com/sps
◊
LCX DATA
BR1339 — REV 3
7
MC74LVX138/D
MOTOROLA
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