TI MPC507APG4 Single-ended 16-channel/differential 8-channel cmos analog multiplexer Datasheet

MP
MP
C50
C50
MPC506A
MPC507A
6
7
SBFS018A – JANUARY 1988 – REVISED OCTOBER 2003
Single-Ended 16-Channel/Differential 8-Channel
CMOS ANALOG MULTIPLEXERS
FEATURES
FUNCTIONAL DIAGRAMS
● ANALOG OVERVOLTAGE PROTECTION: 70VPP
● NO CHANNEL INTERACTION DURING
OVERVOLTAGE
1kΩ
In 1
Out
● BREAK-BEFORE-MAKE SWITCHING
1kΩ
● ANALOG SIGNAL RANGE: ±15V
In 2
● STANDBY POWER: 7.5mW typ
Decoder/
Driver
1kΩ
In 16
● TRUE SECOND SOURCE
DESCRIPTION
Overvoltage
Clamp and
Signal
Isolation
The MPC506A is a 16-channel single-ended analog multiplexer, and the MPC507A is an 8-channel differential multiplexer.
The MPC506A and MPC507A multiplexers have input overvoltage protection. Analog input voltages may exceed either
power supply voltage without damaging the device or disturbing the signal path of other channels. The protection
circuitry assures that signal fidelity is maintained even under
fault conditions that would destroy other multiplexers. Analog
inputs can withstand 70VPP signal levels and standard ESD
tests. Signal sources are protected from short circuits should
multiplexer power loss occur; each input presents a 1kΩ
resistance under this condition. Digital inputs can also sustain continuous faults up to 4V greater than either supply
voltage.
5V
Ref
Level
Shift
(1) (1)
NOTE: (1) Digital
Input Protection.
MPC506A
(1) (1)
(1)
VREF A0 A1 A2 A3 EN
1kΩ
In 1A
Out A
1kΩ
In 8A
1kΩ
In 1B
Out B
1kΩ
Decoder/
Driver
In 8B
These features make the MPC506A and MPC507A ideal for
use in systems where the analog signals originate from
external equipment or separately powered sources.
The MPC506A and MPC507A are fabricated with BurrBrown’s dielectrically isolated CMOS technology. The multiplexers are available in plastic DIP and plastic SOIC packages. Temperature range is –40/+85°C.
Overvoltage
Clamp and
Signal
Isolation
NOTE: (1) Digital
Input Protection.
MPC507A
5V
Ref
Level
Shift
(1) (1)
(1)
VREF A0 A1 A2
(1)
EN
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright © 1988-2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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ELECTRICAL CHARACTERISTICS
Supplies = +15V, –15V; VREF (Pin 13) = Open; VAH (Logic Level High) = +4.0V; VAL (Logic Level Low) = +0.8V unless otherwise specified.
MPC506A/MPC507A
PARAMETER
ANALOG CHANNEL CHARACTERISTICS
VS, Analog Signal Range
RON, On Resistance(1)
IS (OFF), Off Input Leakage Current
ID (OFF), Off Output Leakage Current
MPC506A
MPC507A
ID (OFF) with Input Overvoltage Applied(2)
ID (ON), On Channel Leakage Current
MPC506A
MPC507A
IDIFF Differential Off Output Leakage Current
(MPC507A Only)
DIGITAL INPUT CHARACTERISTICS
VAL, Input Low Threshold
VAH, Input High Threshold(3)
VAL, MOS Drive(4)
VAH, MOS Drive(4)
IA, Input Leakage Current (High or Low)(5)
SWITCHING CHARACTERISTICS
tA, Access Time
tOPEN, Break-Before-Make Delay
tON (EN), Enable Delay (ON)
tOFF (EN), Enable Delay (OFF)
Settling Time (0.1%)
(0.01%)
"OFF Isolation"(6)
CS (OFF), Channel Input Capacitance
CD (OFF), Channel Output Capacitance: MPC506A
MPC507A
CA, Digital Input Capacitance
CDS, (OFF), Input to Output Capacitance
POWER REQUIREMENTS
PD, Power Dissipation
I+, Current Pin 1(7)
I–, Current Pin 27(7)
TEMP
MIN
Full
+25°C
Full
+25°C
Full
+25°C
Full
Full
+25°C
+25°C
Full
Full
–15
TYP
1.3
1.5
0.5
MAX
UNITS
+15
1.5
1.8
10
10
V
kΩ
kΩ
nA
nA
nA
nA
nA
µA
nA
nA
nA
10
nA
0.8
V
V
V
V
µA
10
0.2
5
5
2
2
Full
Full
Full
+25°C
+25°C
Full
4.0
0.8
6.0
1.0
+25°C
Full
+25°C
+25°C
Full
+25°C
Full
+25°C
+25°C
+25°C
+25°C
+25°C
+25°C
25°C
+25°C
µs
µs
ns
ns
ns
ns
ns
µs
µs
dB
pF
pF
pF
pF
pF
0.3
0.6
25
80
200
500
250
500
50
Full
Full
Full
1.2
3.5
68
5
50
25
5
0.1
7.5
0.7
5
mW
mA
µA
1.5
20
NOTES: (1) VOUT = ±10V, IOUT = –100µA. (2) Analog overvoltage = ±33V. (3) To drive from DTL/TTL circuits. 1kΩ pull-up resistors to +5.0V supply are recommended.
(4) VREF = +10V. (5) Digital input leakage is primarily due to the clamp diodes. Typical leakage is less than 1nA at 25°C. (6) VEN = 0.8V, RL = 1kΩ,
CL = 15pF, VS = 7Vrms, f = 100kHz. Worst-case isolation occurs on channel 8 due to proximity of the output pins. (7) VEN, VA = 0V or 4.0V.
2
MPC506A, MPC507A
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PIN CONFIGURATION
Top View
Top View
+VSUPPLY
1
28 Out A
Out B
2
27
26 In 8
NC
3
26 In 8A
4
25 In 7
In 8B
4
25 In 7A
In 15
5
24 In 6
In 7B
5
24 In 6A
In 14
6
23 In 5
In 6B
6
23 In 5A
In 13
7
22 In 4
In 5B
7
22 In 4A
In 12
8
21 In 3
In 4B
8
21 In 3A
In 11
9
20 In 2
In 3B
9
20 In 2A
In 10 10
19 In 1
In 2B 10
19 In 1A
18 Enable
In 1B 11
18 Enable
+VSUPPLY
1
28 Out
NC
2
27
NC
3
In 16
In 9 11
–VSUPPLY
–VSUPPLY
Ground 12
17 Address A0
Ground 12
17 Address A0
VREF 13
16 Address A1
VREF 13
16 Address A1
Address A3 14
15 Address A2
NC 14
15 Address A2
MPC507A (Plastic)
MPC506A (Plastic)
TRUTH TABLES
MPC506A
MPC507A
A3
A2
A1
A0
EN
"ON"
CHANNEL
X
L
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
X
L
L
L
L
H
H
H
H
L
L
L
L
H
H
H
H
X
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
H
X
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
None
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
"ON"
CHANNEL
MPC506A, MPC507A
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A2
A1
A0
EN
PAIR
X
L
L
L
L
H
H
H
H
X
L
L
H
H
L
L
H
H
X
L
H
L
H
L
H
L
H
L
H
H
H
H
H
H
H
H
None
1
2
3
4
5
6
7
8
3
ABSOLUTE MAXIMUM RATINGS(1)
PACKAGE/ORDERING INFORMATION
Voltage between supply pins ............................................................... 44V
VREF to ground, V+ to ground ............................................................... 22V
V– to ground ........................................................................................ 25V
Digital input overvoltage:
VEN, VA: VSUPPLY (+) ............................................................................ +4V
VSUPPLY (–) ............................................................................ –4V
or 20mA, whichever occurs first.
Analog input overvoltage:
VS: VSUPPLY (+) .................................................................................. +20V
VSUPPLY (–) .................................................................................. –20V
Continuous current, S or D ............................................................... 20mA
Peak current, S or D
(pulsed at 1ms, 10% duty cycle max) ............................................ 40mA
Power dissipation* ............................................................................. 2.0W
Operating temperature range ........................................... –40°C to +85°C
Storage temperature range ............................................. –65°C to +150°C
For the most current package and ordering information, see
the Package Option Addendum located at the end of this
data sheet.
*Derate 20.0mW/°C above TA = 70
NOTE: (1) Absolute maximum ratings are limiting values, applied individually, beyond which the serviceability of the circuit may be impaired. Functional operation under any of these conditions is not necessarily implied.
TYPICAL PERFORMANCE CURVES
TA = +25°C unless otherwise noted.
SETTLING TIME vs
SOURCE RESISTANCE FOR 20V STEP CHANGE
CROSSTALK vs SIGNAL FREQUENCY
1
Crosstalk (% of Off Channel Signal)
1k
Settling Time (µs)
100
To ±0.01%
10
To ±0.1%
1
0.1
0.01
0.1
Rs = 100kΩ
Rs = 10kΩ
0.01
Rs = 1kΩ
Rs = 100Ω
0.001
0.0001
0.1
10
1
1
100
10
1k
100
10k
Signal Frequency (Hz)
Source Resistance (kΩ)
COMBINED CMR vs
FREQUENCY MPC507A AND INA110
Common-Mode Rejection (dB)
120
G = 500
100
G = 100
80
G = 10
60
40
20
0
1
10
100
1k
10k
Frequency (Hz)
4
MPC506A, MPC507A
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DISCUSSION OF
SPECIFICATIONS
DC CHARACTERISTICS
Input Offset Voltage
The static or dc transfer accuracy of transmitting the multiplexer input voltage to the output depends on the channel
ON resistance (RON), the load impedance, the source impedance, the load bias current and the multiplexer leakage
current.
Bias current generates an input OFFSET voltage as a result
of the IR drop across the multiplexer ON resistance and
source resistance. A load bias current of 10nA will generate
an offset voltage of 20µV if a 1kΩ source is used. In general,
for the MPC506A, the OFFSET voltage at the output is
determined by:
Single-Ended Multiplexer Static Accuracy
The major contributors to static transfer accuracy for singleended multiplexers are:
Source resistance loading error
Multiplexer ON resistance error
dc offset error caused by both load bias current and
multiplexer leakage current.
Resistive Loading Errors
The source and load impedances will determine the input
resistive loading errors. To minimize these errors:
• Keep loading impedance as high as possible. This minimizes the resistive loading effects of the source resistance
and multiplexer ON resistance. As a guideline, load
impedance of 108Ω or greater will keep resistive loading
errors to 0.002% or less for 1000Ω source impedances. A
106Ω load impedance will increase source loading error
to 0.2% or more.
• Use sources with impedances as low as possible. A
1000Ω source resistance will present less than 0.001%
loading error and 10kΩ source resistance will increase
source loading error to 0.01% with a 108 load impedance.
Input resistive loading errors are determined by the following relationship (see Figure 1).
where IB = Bias current of device multiplexer is driving
IL = Multiplexer leakage current
RON = Multiplexer ON resistance
RS = Source resistance
Differential Multiplexer Static Accuracy
Static accuracy errors in a differential multiplexer are difficult to control, especially when it is used for multiplexing
low-level signals with full-scale ranges of 10mV to 100mV.
The matching properties of the multiplexer, source and
output load play a very important part in determining the
transfer accuracy of the multiplexer. The source impedance
unbalance, common-mode impedance, load bias current
mismatch, load differential impedance mismatch, and common-mode impedance of the load all contribute errors to the
multiplexer. The multiplexer ON resistance mismatch, leakage current mismatch and ON resistance also contribute to
differential errors.
Referring to Figure 2, the effects of these errors can be
minimized by following the general guidelines described in
this section, especially for low-level multiplexing applications.
IBIAS
RON
RS1
VOFFSET = (IB + IL) (RON + RS)
RS1A
RON1A
IBIAS A
VM
VS1
RS16
ROFF
Cd/2
Measured
Voltage
IL
RCM
VS1
ZL
RCM1
VS16
Rd/2
IL
RCM
RS1B
RON1B
IBIAS B
ZL
CCM
Cd/2
Rd/2
RS8A
ROFF8A
RS8B
ROFF8B
FIGURE 1. MPC506A Static Accuracy Equivalent Circuit.
VS8
Source and Multiplexer Resistive Loading Error
∈(RS + RON ) =
RCM8
RS + RON
× 100
RS + RON + RL
where RS = source resistance
RL = load resistance
RON = multiplexer ON resistance
FIGURE 2. MPC507A Static Accuracy Equivalent Circuit.
MPC506A, MPC507A
SBFS018A
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5
Load (Output Device) Characteristics
• Use devices with very low bias current. Generally, FET
input amplifiers should be used for low-level signals less
than 50mV FSR. Low bias current bipolar input amplifiers are acceptable for signal ranges higher than 50mV
FSR. Bias current matching will determine the input
offset.
• The system dc common-mode rejection (CMR) can never
be better than the combined CMR of the multiplexer and
driven load. System CMR will be less than the device
which has the lower CMR figure.
• Load impedances, differential and common-mode, should
be 1010Ω or higher.
SOURCE CHARACTERISTICS
see that the amplitude of the switching transients seen at the
source and load decrease proportionally as the capacitance
of the load and source increase. The trade-off for reduced
switching transient amplitude is increased settling time. In
effect, the amplitude of the transients seen at the source and
load are:
dVL = (i/C) dt
where i = C (dV/dt) of the CMOS FET switches
C = load or source capacitance
The source must then redistribute this charge, and the effect
of source resistance on settling time is shown in the Typical
Performance Curves. This graph shows the settling time for
a 20V step change on the input. The settling time for smaller
step changes on the input will be less than that shown in the
curve.
• The source impedance unbalance will produce offset,
common-mode and channel-to-channel gain-scatter errors. Use sources which do not have large impedance
unbalances if at all possible.
• Keep source impedances as low as possible to minimize
resistive loading errors.
• Minimize ground loops. If signal lines are shielded,
ground all shields to a common point at the system analog
common.
RSA
Node A
CSA
RCMS
Source
CSB
CCMS
RSB
CdA
RdA
ZCM
MPC507A Load
Channel
RdB
Node B
CdB
If the MPC507A is used for multiplexing high-level signals
of 1V to 10V full-scale ranges, the foregoing precautions
should still be taken, but the parameters are not as critical as
for low-level signal applications.
DYNAMIC CHARACTERISTICS
Settling Time
The gate-to-source and gate-to-drain capacitance of the
CMOS FET switches, the RC time constants of the source
and the load determine the settling time of the multiplexer.
Governed by the charge transfer relation i = C (dV/dt), the
charge currents transferred to both load and source by the
analog switches are determined by the amplitude and rise
time of the signal driving the CMOS FET switches and the
gate-to-drain and gate-to-source junction capacitances as
shown in Figures 3 and 4. Using this relationship, one can
MPC506A Channel
Source
RS
CS
CL
Switching Time
This is the time required for the CMOS FET to turn ON
after a new digital code has been applied to the Channel
Address inputs. It is measured from the 50 percent point of
the address input signal to the 90 percent point of the analog
signal seen at the output for a 10V signal change between
channels.
Crosstalk
Load
Node A
FIGURE 4. Settling and Common-Mode Effects—
MPC507A
RL
Crosstalk is the amount of signal feedthrough from the
seven (MPC507A) or 15 (MPC506A) OFF channels appearing at the multiplexer output. Crosstalk is caused by the
voltage divider effect of the OFF channel, OFF resistance
and junction capacitances in series with the RON and RS
impedances of the ON channel. Crosstalk is measured with
a 20Vp-p 1000Hz sine wave applied to all off channels. The
crosstalk for these multiplexers is shown in the Typical
Performance Curves.
FIGURE 3. Settling Time Effects—MPC506A.
6
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Factors which will degrade multiplexer and system DC
CMR are:
Common-Mode Rejection (MPC507A Only)
The matching properties of the load, multiplexer and source
affect the common-mode rejection (CMR) capability of a
differentially multiplexed system. CMR is the ability of the
multiplexer and input amplifier to reject signals that are
common to both inputs, and to pass on only the signal
difference to the output. For the MPC507A, protection is
provided for common-mode signals of ±20V above the
power supply voltages with no damage to the analog switches.
• Amplifier bias current and differential impedance mismatch
• Load impedance mismatch
• Multiplexer impedance and leakage current mismatch
• Load and source common-mode impedance
AC CMR roll-off is determined by the amount of commonmode capacitances (absolute and mismatch) from each
signal line to ground. Larger capacitances will limit CMR
at higher frequencies; thus, if good CMR is desired at
higher frequencies, the common-mode capacitances and
unbalance of signal lines and multiplexer to amplifier wiring
must be minimized. Use twisted-shielded pair signal lines
wherever possible.
The CMR of the MPC507A and Burr-Brown's INA110
instrumentation amplifier (G = 100) is 110dB at DC to 10Hz
with a 6dB/octave roll-off to 70dB at 1000Hz. This measurement of CMR is shown in the Typical Performance Curves
and is made with a Burr-Brown INA110 instrumentation
amplifier connected for gains of 500, 100, and 10.
SWITCHING WAVEFORMS
Typical at +25°C, unless otherwise noted.
BREAK-BEFORE-MAKE DELAY (tOPEN)
MPC506A1
VAM 4.0V
Address Drive VA
(VA)
0V
50Ω
Output
50%
A3
A2
A1
A0
In 1
In 2 Thru In 15
1 On
In 16
VOUT
En
50%
VA Input
2V/Div
+5V
GND
+4.0V
Out
16 On
Output
0.5V/Div
12.5pF
1kΩ
tOPEN
100ns/Div
NOTE: (1) Similar connection for MPC507A.
ENABLE DELAY (tON (EN), tOFF (EN))
Enable Drive
MPC506A1
VAM = 4.0V
A3
A2
A1
A0
50%
0V
Output
90%
90%
tON(EN)
VA
En
In 1
+10V
In 2 Thru In 16
GND
Out
1 On
12.5pF
1kΩ
50Ω
tOFF(EN)
In 1 Thru
In 16 Off
Output
2V/Div
NOTE: (1) Similar connection for MPC507A.
100ns/Div
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7
PERFORMANCE CHARACTERISTICS AND TEST CIRCUITS
TA = +25°C, VS = ±15V, VAM = +4V, VAL = 0.8V and VREF = Open, unless otherwise noted.
ON RESISTANCE vs INPUT SIGNAL, SUPPLY VOLTAGE
100µA
RON = V2/100µA
V2
In
Out
VIN
NORMALIZED ON RESISTANCE
vs SUPPLY VOLTAGE
ON RESISTANCE vs
ANALOG INPUT VOLTAGE
1.6
1.4
Normalized On Resistance
(Referred to Value at ±15V)
On Resistance (kΩ)
1.2
TA = +25°C
1.1
1.0
TA = –55°C
0.9
±125°C > T A > –55°C
VIN = +5V
1.5
TA = +125°C
1.3
0.8
1.4
1.3
1.2
1.1
1.0
0.9
0.7
0.8
0.6
–10
–8
–6
–4
–2
0
2
4
6
8
±5
10
±6
±7
±8
±9
±10 ±11 ±12 ±13 ±14 ±15
Supply Voltage (V)
Analog Input (V)
ANALOG INPUT OVERVOLTAGE CHARACTERISTICS
7
21
A
A
+VIN
18
6
15
5
Analog Input
Current (IIN)
12
4
3
9
6
2
Output Off
Leakage Current
IO (Off)
3
0
+12
+15
+18
+21
+24
+27
+30
+33
1
Output Off Leakage Current (nA)
IO (Off)
IIN
Analog Input Current (mA)
Positive Input Overvoltage
0
+36
Analog Input Overvoltage (V)
21
A
−V IN
A
4
15
Analog Input
Current (IIN)
12
2
9
6
Output Off
Leakage Current
IO (Off)
3
Output Off Leakage Current (µA)
IO (Off)
IIN
Analog Input Current (mA)
Negative Input Overvoltage
18
0
0
−12
−15
−18
−21
−24
−27
−30
−33
−36
Analog Input Overvoltage (V)
8
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PERFORMANCE CHARACTERISTICS AND TEST CIRCUITS (CONT)
TA = +25°C, VS = ±15V, VAM = +4V, VAL = 0.8V and VREF = Open, unless otherwise noted.
LEAKAGE CURRENT vs TEMPERATURE
En
+0.8V
Out
Out
A
±10V
ID (Off)
±
10V
A0
A
En
A1
ID (On)
±10V
10V
±
+4.0V
Leakage Current
100nA
Out
IS (Off)
A
±10V
En
+0.8V
10V
Off Output
Current
ID (Off)
10nA
On Leakage
Current ID (On)
1nA
Off Input
Leakage Current
IS (Off)
±
100pA
NOTE: (1) Two measurements per channel: +10V/–10V and –10V/+10V.
(Two measurements per device for ID (Off): +10V/–10V and –10V/+10V).
10pA
25
50
75
100
125
Temperature (°C)
ON-CHANNEL CURRENT vs VOLTAGE
±14
–55°C
A
±V IN
Switch Current (mA)
±12
+25°C
+125°C
±10
±8
±6
±4
±2
0
0
±2
±4
±6
±8
±10
±12
±14
±16
VIN –Voltage Across Switch (V)
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9
PERFORMANCE CHARACTERISTICS AND TEST CIRCUITS (CONT)
TA = +25°C, VS = ±15V, VAM = +4V, VAL = 0.8V and VREF = Open, unless otherwise noted.
SUPPLY CURRENT vs TOGGLE FREQUENCY
+15V/+10V
8
MPC506A(1) +V
A3
In 1
A2
A In 2 Thru In 15
VA
Supply Current (mA)
A +ISUPPLY
±10V/±5V
1
50Ω
A0
±10V/±5V
In 16
–V Out
En GND
+4V
10MΩ
6
4
VS = ±15V
2
VS = ±10V
14pF
A –ISUPPLY
0
100
1k
10k
100k
1M
10M
–15V/–10V
Toggle Frequency (Hz)
NOTE: (1) Similar connection for MPC507A.
ACCESS TIME vs LOGIC LEVEL (High)
1000
+15V
VA
50Ω
+4V
900
+V
In 1
In 2 Thru
In 15
MPC
506A(1) In 16
En GND
–10V
+10V
Access Time (ns)
A3
A2
A1
A0
VREF
Probe
–V Out
10MΩ
14pF
–15V
800
VREF = Open for logic high levels ≤ 6V
VREF = Logic high for logic high levels > 6V
700
600
500
400
300
3
NOTE: (1) Similar connection for MPC507A.
4
5
6
7
8
9
10
11
12
13
14
15
Logic Level High (V)
ACCESS TIME WAVEFORM
VAH
4.0V
Address
Drive (VA)
1/2VAH
VA Input
2V/Div
0V
10V
90%
Output A
5V/Div
10V
tA
200ns/Div
10
MPC506A, MPC507A
www.ti.com
SBFS018A
INSTALLATION AND
OPERATING INSTRUCTIONS
16 Analog Inputs
21
22
23
24
25
Multiplexer
Output
Direct
6-Bit
To
Binary Group
Counter
2
A 3 A2 A1 A0
Buffered
OPA602
1/4 OPA404
Single vs Multitiered Channel Expansion
In addition to reducing programming complexity, two-tier
configuration offers the added advantages over single-node
expansion of reduced OFF channel current leakage (reduced
OFFSET), better CMR, and a more reliable configuration if
a channel should fail ON in the single-node configuration,
data cannot be taken from any channel, whereas only one
channel group is failed (8 or 16) in the multitiered configuration.
In 1
In 2
In 3
28
MPC506A
In 16
Out
En
18
A 0 A1 A 2 A3
Multiplexer
Output
+V
In 1
Out
Direct
28
MPC506A
To
Group
3
Group 4
18
Enable
MPC506A
Group 4
Out
49-64 28
Two-Tier Expansion
Using an 8 x 8 two-tier structure for expansion to 64
channels, the programming is simplified. The 6-bit counter
output does not require a 1-of-8 decoder. The 3LSBs of the
counter drive the A0, A1 and A2 inputs of the eight first-tier
multiplexers and the 3MSBs of the counter are applied to the
A0, A1, and A2 inputs of the second-tier multiplexer.
16 Analog Inputs (Ch1 to 16)
20
Single-Node Expansion
The 64 x 1 configuration is simply eight (MPC507A) units
tied to a single node. Programming is accomplished with a
6-bit counter, using the 3LSBs of the counter to control
Channel Address inputs A0, A1, A2 and the 3MSBs of the
counter to drive a 1-of-8 decoder. The 1-of-8 decoder then
is used to drive the ENABLE inputs (pin 18) of the MPC507A
multiplexers.
Settling time to 0.01% for RS 100Ω
—Two MPC506A units in parallel 10µs
—Four MPC507A units in parallel 12µs
16 Analog Inputs (Ch241 to 256)
In 1
In 2 MPC
Out
In 3 506A 28
Group 1
Ch1-16
Group 1
In 16
18
Enable
A3 A 2 A 1 A 0
1 of 4
Decoder
16 Analog Inputs
The ENABLE input, pin 18, is included for expansion of
the number of channels on a single node as illustrated in
Figure 5. With ENABLE line at a logic 1, the channel is
selected by the 3-bit (MPC507A or 4-bit MPC506A) Channel Select Address (shown in the Truth Tables). If ENABLE
is at logic 0, all channels are turned OFF, even if the Channel
Address Lines are active. If the ENABLE line is not to be
used, simply tie it to +V supply.
If the +15V and/or –15V supply voltage is absent or shorted
to ground, the MPC507A and MPC506A multiplexers will
not be damaged; however, some signal feedthrough to the
output will occur. Total package power dissipation must not
be exceeded.
For best settling speed, the input wiring and interconnections between multiplexer output and driven devices should
be kept as short as possible. When driving the digital inputs
from TTL, open collector output with pull up resistors are
recommended (see Typical Performance Curves, Access
Time).
To preserve common-mode rejection of the MPC507A, use
twisted-shielded pair wire for signal lines and inter-tier
connections and/or multiplexer output lines. This will help
common-mode capacitance balance and reduce stray signal
pickup. If shields are used, all shields should be connected
as close as possible to system analog common or to the
common-mode guard driver.
Differential Multiplexer (MPC507A)
Single or multitiered configurations can be used to expand
multiplexer channel capacity up to 64 channels using a
64 x 1 or an 8 x 8 configuration.
En
18
In 1
In 2
In 3
In 16
A 0 A1 A2 A3
+V
Buffered
OPA602
1/4 OPA404
Out
18
MPC506A
En
28
+V
In 16
A 0 A1 A2 A3
FIGURE 5. 64-Channel, Single-Tier Expansion.
CHANNEL EXPANSION
Single-Ended Multiplexer (MPC506A)
Up to 64 channels (four multiplexers) can be connected to a
single node, or up to 256 channels using 17 MPC506A
multiplexers on a two-tiered structure as shown in Figures 5
and 6.
Settling Time to
0.01% is 20µs
with RS = 100Ω
FIGURE 6. Channel Expansion up to 256 Channels Using
16x16 Two-Tiered Expansion
MPC506A, MPC507A
SBFS018A
4LSBs
4MSBs
8-Bit Channel
Address Generator
www.ti.com
11
PACKAGE OPTION ADDENDUM
www.ti.com
12-Mar-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
(3)
Top-Side Markings
(4)
MPC506AP
ACTIVE
PDIP
NTD
28
13
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
MPC506AP
MPC506APG4
ACTIVE
PDIP
NTD
28
13
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
MPC506AP
MPC506AU
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MPC506AU/1K
ACTIVE
SOIC
DW
28
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MPC506AU
MPC506AU/1KG4
ACTIVE
SOIC
DW
28
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MPC506AU
MPC506AUG4
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
MPC506AU
MPC507AP
ACTIVE
PDIP
NTD
28
13
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
MPC507AP
MPC507APG4
ACTIVE
PDIP
NTD
28
13
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
MPC507AP
MPC507AU
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
MPC507AU
MPC507AU/1K
ACTIVE
SOIC
DW
28
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
MPC507AU
MPC507AU/1KG4
ACTIVE
SOIC
DW
28
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
MPC507AU
MPC507AUG4
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
MPC507AU
-40 to 85
MPC506AU
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-Mar-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
MPC506AU/1K
SOIC
DW
28
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
MPC507AU/1K
SOIC
DW
28
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MPC506AU/1K
SOIC
DW
28
1000
367.0
367.0
55.0
MPC507AU/1K
SOIC
DW
28
1000
367.0
367.0
55.0
Pack Materials-Page 2
MECHANICAL DATA
MPDI056 – APRIL 2001
NTD (R-PDIP-T28)
PLASTIC DUAL-IN-LINE
D
1.565 (39,75)
1.380 (35,05)
28
15
0.580 (14,73)
0.485 (12,32)
1
D
14
Index
Area
H
0.015 (0,38)
MIN C
0.070 (1,78)
Base
Plane
0.030 (0,76)
0.250 (6,35)
MAX
C
E
0.195 (4,95)
0.125 (3,18)
0.625 (15,88)
0.600 (15,24)
–C–
E
Seating
Plane
0.005 (0,13)
MIN 4 PL
D
Full Lead
0.100 (2,54)
0.200 (5,08)
0.115 (2,92)
0.022 (0,56)
0.014 (0,36)
0.010 (0,25) M C
0.600 (15,26)
C
0.015 (0,38)
0.008 (0,20)
0.060 (1,52)
F
0.000 (0,00)
0.700 (17,78)
MAX
F
4202496/A 03/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Dimensions are measured with the package
seated in JEDEC seating plane gauge GS-3.
D. Dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 (0,25).
E. Dimensions measured with the leads constrained to be
perpendicular to Datum C.
F. Dimensions are measured at the lead tips with the
leads unconstrained.
G. Pointed or rounded lead tips are preferred to ease
insertion.
H. Maximum dimension does not include dambar
protrusions. Dambar protrusions shall not exceed
0.010 (0,25).
POST OFFICE BOX 655303
I. Distance between leads including dambar protrusions
to be 0.005 (0,13) minumum.
J. A visual index feature must be located within the
cross-hatched area.
K. For automatic insertion, any raised irregularity on the
top surface (step, mesa, etc.) shall be symmetrical
about the lateral and longitudinal package centerlines.
L. Controlling dimension in inches.
M. Falls within JEDEC MS-011-AB.
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