LM27 www.ti.com SNIS124D – AUGUST 2002 – REVISED JULY 2013 LM27 SOT-23, ±3°C Accurate, 120°C-150°C Factory Preset Thermostat Check for Samples: LM27 FEATURES DESCRIPTION • The LM27 is a precision, single digital-output, lowpower thermostat comprised of an internal reference, DAC, temperature sensor and comparator. Utilizing factory programming, it can be manufactured with different trip points as well as different digital output functionality. The trip point (TOS) can be preset at the factory to any temperature in the range of +120°C to +150°C in 1°C increments. The LM27 has one digital output (OS/OS/US/US), one digital input (HYST) and one analog output (VTEMP). The digital output stage can be preset as either open-drain or push-pull. In addition, it can be factory programmed to be active HIGH or LOW. The digital output can be factory programmed to indicate an over temperature shutdown event (OS or OS) or an under temperature shutdown event (US or US). When preset as an overtemperature shutdown (OS) it will go LOW to indicate that the die temperature is over the internally preset TOS and go HIGH when the temperature goes below (TOS–THYST). Similarly, when preprogrammed as an undertemperature shutdown (US) it will go HIGH to indicate that the temperature is below TUS and go LOW when the temperature is above (TUS+THYST). The typical hysteresis, THYST, can be set to 2°C or 10°C and is controlled by the state of the HYST pin. A VTEMP analog output provides a voltage that is proportional to temperature and has a −10.7mV/°C output slope. 1 2 • • • • • • • Internal Comparator with Pin Selectable 2°C or 10°C Hysteresis No External Components Required Open-drain or Push-pull Digital Output; Supports CMOS Logic Levels Internal Temperature Sensor with VTEMP Output Pin VTEMP Output Allows After-assembly System Testing Internal Voltage Reference and DAC for Trippoint Setting Currently Available in 5-pin SOT-23 Plastic Package Excellent Power Supply Noise Rejection APPLICATIONS • • • • • • • Microprocessor Thermal Management Appliances Portable Battery Powered Systems Fan Control Industrial Process Control HVAC Systems Electronic System Protection KEY SPECIFICATIONS • • • • Power Supply Voltage 2.7V to 5.5V Power Supply Current 40μA (Max), 15μA (Typ) Hysteresis Temperature 2°C or 10°C (Typ) Temperature Trip Point Accuracy ±3°C (Max) Currently, there are several standard parts available, see Table 1. For other part options, contact a Texas Instruments Distributor or Sales Representative for information on minimum order qualification. The LM27 is currently available in a 5-lead SOT-23 package. Simplified Block Diagram and Connection Diagram LM27CIM5-2HJ (140°C Trip-Point) TOS HYST OS HYST REF GND TEMP SENSOR TOS- THYST Temp. of Leads + OS VTEMP LM27-2HJ V+=2.7V to 5.5V HYST=GND for 10oC Hysteresis HYST=V+ for 2oC Hysteresis VTEMP=(-3.552x10-6x(T-30)2)+(-10.69576x10-3x(T-30))+1.8386V 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2002–2013, Texas Instruments Incorporated LM27 SNIS124D – AUGUST 2002 – REVISED JULY 2013 www.ti.com Table 1. Summary Table of Trip Point and Output Function Capabilities of Released Parts (1) Orderable Device Trip Point Temperature (°C) Digital Output Function LM27CIM5-ZHJ 120 Active-Low, Open-Drain, OS output LM27CIM5-1HJ 130 Active-Low, Open-Drain, OS output LM27CIM5-2HJ 140 Active-Low, Open-Drain, OS output (1) Other device options have not been released to market, contact Texas Instruments for volume and other requirements for release. Connection Diagram HYST GND VTEMP 1 2 5 OS, OS, US or US LM27 3 4 V+ PIN DESCRIPTIONS (1) Pin Number Pin Name 1 HYST Hysteresis control, digital input Function GND for 10°C or V+ for 2°C Connection 2 GND Ground, connected to the back side of the die through lead frame. System GND 3 VTEMP Analog output voltage proportional to temperature Leave floating or connect to a high impedance node. 4 V+ Supply input 2.7V to 5.5V with a 0.1µF bypass capacitor. For PSRR information see NOISE CONSIDERATIONS. 5 (1) OS Overtemperature Shutdown open-drain Controller interrupt, system or power supply shutdown; active low thermostat digital output pull-up resistor ≥ 10kΩ OS Overtemperature Shutdown totem-pull active high thermostat digital output Controller interrupt, system or power supply shutdown US Undertemperature Shutdown opendrain active low thermostat digital output System or power supply shutdown; pull-up resistor ≥ 10kΩ US Undertemperature Shutdown totempull active high thermostat digital output System or power supply shutdown Pin 5 functionality and trip point setting are programmed during LM27 manufacture. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LM27 LM27 www.ti.com SNIS124D – AUGUST 2002 – REVISED JULY 2013 Absolute Maximum Ratings (1) Input Voltage 6.0V Input Current at any pin (2) 5mA Package Input Current (2) 20mA Package Dissipation at TA = 25°C (3) Soldering Information (4) 500mW Vapor Phase (60 seconds) SOT23 Package (1) (2) (3) (4) (5) 220°C −65°C to + 150°C Storage Temperature ESD Susceptibility (5) 215°C Infrared (15 seconds) Human Body Model 2500V Machine Model 250V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5mA. The 20mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5mA each. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD = (TJmax–TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJmax = 150°C. For this device the typical thermal resistance (θJA) of the different package types when board mounted refer to Table 2 See http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices. The human body model is a 100pF capacitor discharge through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin. Table 2. Package Type θJA SOT23-5, DBV 250°C/W Operating Ratings (1) TMIN ≤ TA ≤ TMAX Specified Temperature Range −40°C ≤ TA ≤ +150°C LM27CIM Positive Supply Voltage (V+) +2.7V to +5.5V Maximum VOUT (1) +5.5V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LM27 3 LM27 SNIS124D – AUGUST 2002 – REVISED JULY 2013 www.ti.com LM27 Electrical Characteristics The following specifications apply for V+ = 2.7VDC to 5.5VDC, and VTEMP load current = 0µA unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C unless otherwise specified. Parameter Symbol Conditions Typical (1) LM27CIM Limits (2) Units (Limits) ±3 °C (max) Temperature Sensor Trip Point Accuracy (Includes VREF, DAC, Comparator Offset, and Temperature Sensitivity errors) +120°C<TA<+150°C Trip Point Hysteresis HYST = GND 10 HYST = V+ 2 °C −10.82 mV/°C VTEMP Output Temperature Sensitivity −30°C ≤ TA ≤ 150°C, 2.7V ≤ V+ ≤ 5.5V ±3 °C (max) VO = (−3.552×10−6×(T−30)2+ −55°C ≤ TA ≤ 150°C, 4.5V ≤ (−10.695×10−3×(T−30))+ 1.8386V (1) V+ ≤ 5.5V ±3 °C (max) ±2.5 °C (max) 0.7 mV (max) VTEMP Temperature Sensitivity Error to Equation: TA = 25°C Source ≤ 1 μA VTEMP Load Regulation 0.070 Sink ≤ 40 μA +2.7V ≤ V+ ≤ +5.5V, −30°C ≤ TA ≤ +120°C VTEMP Line Regulation IS °C Supply Current mV −0.2 15 mV/V 22 40 µA (max) µA (max) Digital Output and Input (1) (2) (3) (4) 4 IOUT(“1”) Logical “1” Output Leakage Current (3) V+ = +5.0V VOUT(“0”) Logical “0” Output Voltage IOUT = +1.2mA and V+≥2.7V; IOUT = +3.2mA and V+≥4.5V (4) VOUT(“1”) Logical “1” Push-Pull Output Voltage 0.001 1 µA (max) 0.4 V (max) ISOURCE = 500µA, V+ ≥ 2.7V 0.8 × V+ V (min) ISOURCE = 800µA, V+≥4.5V V+ − 1.5 V (min) + VIH HYST Input Logical ”1“ Threshold Voltage 0.8 × V V (min) VIL HYST Input Logical ”0“ Threshold Voltage 0.2 × V+ V (max) Typicals are at TJ = TA = 25°C and represent most likely parametric norm. Limits are ensured to AOQL (Average Outgoing Quality Level). The 1µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the current for every 15°C increase in temperature. For example, the 1nA typical current at 25°C would increase to 16nA at 85°C. Care should be taken to include the effects of self heating when setting the maximum output load current. The power dissipation of the LM27 would increase by 1.28mW when IOUT=3.2mA and VOUT=0.4V. With a thermal resistance of 250°C/W, this power dissipation would cause an increase in the die temperature of about 0.32°C due to self heating. Self heating is not included in the trip point accuracy specification. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LM27 LM27 www.ti.com SNIS124D – AUGUST 2002 – REVISED JULY 2013 Part Number Template The series of digits labeled xyz in the part number LM27CIM-xyz, describe the set point value and the function of the output as follows: The place holders xy describe the set point temperature as shown in the following table. x (10x) y (1x) Temperature (°C) - H 0 - J 1 - K 2 - L 3 - N 4 - P 5 - R 6 - S 7 - T 8 - V 9 Z - 12 1 - 13 2 - 14 3 - 15 The value of z describes the assignment/function of the output as shown in the following table: Active-Low/High Open-Drain/ PushPull OS/US 0 0 0 J Active-Low, Open-Drain, OS output 0 0 1 K Active-Low, Open-Drain, US output 1 1 0 L Active-High, Push-Pull, OS output 1 1 1 N Active-High, Push-Pull, US output Value of z Digital Output Function For example: • the part number LM27CIM5-2SJ has TOS = 147°C, and programmed as an active-low open-drain overtemperature shutdown output. • the part number LM27CIM5-ZLN has TUS = 123°C, and programmed as an active-high, push-pull undertemperature shutdown output. Active-high open-drain and active-low push-pull options are available, please contact Texas Instruments for more information. Note: Currently, there are several standard parts available, see Table 1. For other part options, contact a Texas Instruments Distributor or Sales Representative for information on minimum order qualification Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LM27 5 LM27 SNIS124D – AUGUST 2002 – REVISED JULY 2013 www.ti.com FUNCTIONAL DESCRIPTION LM27 OPTIONS — Output Pin Options Block Diagrams HYST HYST OS US HYST HYST REF REF + GND TEMP SENSOR - GND TEMP SENSOR - VTEMP V+ VTEMP V+ LM27__K LM27__J Figure 1. LM27-_ _J V+ HYST + Figure 2. LM27-_ _K OS V+ HYST HYST REF REF + GND TEMP SENSOR US HYST - GND TEMP SENSOR - VTEMP V+ + VTEMP LM27__L V+ LM27__N Figure 3. LM27-_ _L Figure 4. LM27-_ _N The LM27 can be factory programmed to have a trip point anywhere in-between 120°C to 150°C. Applications Hints AFTER-ASSEMBLY PCB TESTING The LM27's VTEMP output allows after-assembly PCB testing by following a simple test procedure. Simply measuring the VTEMP output voltage will verify that the LM27 has been assembled properly and that its temperature sensing circuitry is functional. The VTEMP output has very weak drive capability that can be overdriven by 1.5mA. Therefore, one can simply force the VTEMP voltage to cause the digital output to change state, thereby verifying that the comparator and output circuitry function after assembly. Here is a sample test procedure that can be used to test the LM27CIM5X-2HJ which has a 140°C trip point. 1. Turn on V+ and measure VTEMP. Then calculate the temperature reading of the LM27 using the equation: VO = (−3.552×10−6×(T−30)2) + (−10.69576×10−3×(T−30)) + 1.8386V (2) or T = -1475.49 + 2.2668 x 106 + 1.8386 - VTEMP 3.552 x 10-6 (3) 2. Verify that the temperature measured in step one is within (±3°C + error of reference temperature sensor) of the ambient/board temperature. The ambient/board temperature (reference temperature) should be measured using an extremely accurate calibrated temperature sensor, which is in close proximity to and mounted on the same PCB as the LM27 perhaps even touching the GND lead of the LM27 if possible. The LM27 will sence the board temperature not the ambient temperature (see MOUNTING CONSIDERATIONS) 3. (a) Observe that OS is high. (b) Drive VTEMP to ground. (c) Observe that OS is now low. (d) Release the VTEMP pin. (e) Observe that OS is now high. 4. (a) Observe that OS is high. (b) Drive VTEMP voltage down gradually. (c) When OS goes low, note the VTEMP voltage. (d) VTEMPTrig = VTEMP at OS trigger (HIGH->LOW) (e) Calculate Ttrig using Equation 3. 6 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LM27 LM27 www.ti.com SNIS124D – AUGUST 2002 – REVISED JULY 2013 5. (a) Gradually raise VTEMP until OS goes HIGH. Note VTEMP. (b) Calculate THYST using Equation 3. VTEMP LOADING The VTEMP output has very weak drive capability (1 µA source, 40 µA sink). So care should be taken when attaching circuitry to this pin. Capacitive loading may cause the VTEMP output to oscillate. Simply adding a resistor in series as shown in Figure 6 will prevent oscillations from occurring. To determine the value of the resistor follow the guidelines given in Table 3. The same value resistor will work for either placement of the resistor. If an additional capacitive load is placed directly on the LM27 output, rather than across CLOAD, it should be at least a factor of 10 smaller than CLOAD. Table 3. Resistive compensation for capacitive loading of VTEMP CLOAD R (Ω) ≤100pF 0 1nF 8200 10nF 3000 100nF 1000 ≥1µF 430 Resistor placement for capacitive loading compensation of VTEMP Heavy Capacitive Load, Cable/Wiring HYST OS/OS/US/ US GND LM27 VTEMP V+ CLOAD 0.1PF R Figure 5. R in series with capacitor Heavy Capacitive Load, Cable/Wiring HYST R OS/OS/US/ US GND LM27 VTEMP V+ CLOAD 0.1Pf Figure 6. R in series with signal path NOISE CONSIDERATIONS The LM27 has excellent power supply noise rejection. Listed below is a variety of signals used to test the LM27 power supply rejection. False triggering of the output was not observed when these signals where coupled into the V+ pin of the LM27. • square wave 400kHz, 1Vp-p • square wave 2kHz, 200mVp-p • sine wave 100Hz to 1MHz, 200mVp-p Testing was done while maintaining the temperature of the LM27 one degree centigrade way from the trip point with the output not activated. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LM27 7 LM27 SNIS124D – AUGUST 2002 – REVISED JULY 2013 www.ti.com MOUNTING CONSIDERATIONS The LM27 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM27 is sensing will be within about +0.06°C of the surface temperature to which the LM27's leads are attached to. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature measured would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity, the backside of the LM27 die is directly attached to the GND pin (pin 2). The temperatures of the lands and traces to the other leads of the LM27 will also affect the temperature that is being sensed. Alternatively, the LM27 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM27 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM27 or its connections. The junction to ambient thermal resistance (θJA) is the parameter used to calculate the rise of a part's junction temperature due to its power dissipation. For the LM27 the equation used to calculate the rise in the die junction temperature is as follows: TJ = TA + 4JA(V+IQ + (V+ - VTEMP)IL_TEMP + VDOIDO) (4) + where TA is the ambient temperature, V is the power supply voltage, IQ is the quiescent current, IL_TEMP is the load current on the VTEMP output, VDO is the voltage on the digital output, and IDO is the load current on the digital output. Since the LM27's junction temperature is the actual temperature being measured, care should be taken to minimize the load current that the LM27 is required to drive. The tables shown in Table 4 summarize the thermal resistance for different conditions and the rise in die temperature of the LM27 without any loading on VTEMP and a 10k pull-up resistor on an open-drain digital output with a 5.5V power supply. Table 4. Thermal resistance (θJA) and temperature rise due to self heating (TJ−TA) SOT23-5 no heat sink SOT23-5 small heat sink θJA (°C/W) TJ−TA (°C) θJA (°C/W) TJ−TA (°C) Still Air 250 0.11 TBD TBD Moving Air TBD TBD TBD TBD Typical Applications System Fan Sanyo Denki 109R0612T4H12 12V HYST OS GND LM27 VTEMP V+ +5V 10k 0.1PF The fan's control pin has internal pull-up. The 10k pull-down sets a slow fan speed. When the output of the LM27 goes low, the fan will speed up. Figure 7. Two Speed Fan Speed Control 8 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LM27 LM27 www.ti.com SNIS124D – AUGUST 2002 – REVISED JULY 2013 5V HYST OS GND LM27 VTEMP V+ NDS356P R1 (100k) 0.1 1N4001 5V 5V Fan MC05J3 Comair-Rotron Figure 8. Fan High Side Drive 12V 1N4001 Vout TOYO USTF802512HW HYST OS GND LM27 VTEMP V+ R1 (10k) 2N2222 0.1 5V Figure 9. Fan Low Side Drive 5V THERMALLY COUPLED +28V 8: HYST IC2 OS GND LM27 VTEMP V+ + - NDS356P 100k IC1 -28V LM3886 20k 1k 3.3PF 47k Audio Input 1N4001 5V 0.1PF 5V Fan MC05J3 Comair-Rotron 10PF Figure 10. Audio Power Amplifier Thermal Protection 5V HYST OS GND LM27 VTEMP V+ Heater Supply R1 (10k) Heater 0.1 5V Figure 11. Simple Thermostat Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LM27 9 LM27 SNIS124D – AUGUST 2002 – REVISED JULY 2013 www.ti.com REVISION HISTORY Changes from Revision B (March 2013) to Revision C • 10 Page Deleted layout of National Data Sheet to TI format .............................................................................................................. 9 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LM27 PACKAGE OPTION ADDENDUM www.ti.com 26-Jul-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM27-2PL MDA ACTIVE DIESALE Y 0 7000 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 85 LM27CIM5-1HJ/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 120 to 150 T1HJ LM27CIM5-2HJ/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 120 to 150 T2HJ LM27CIM5-ZHJ/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 120 to 150 TZHJ LM27CIM5X-1HJ/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM T1HJ LM27CIM5X-2HJ/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM T2HJ LM27CIM5X-ZHJ/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM TZHJ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 26-Jul-2016 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LM27CIM5-1HJ/NOPB SOT-23 DBV 5 1000 178.0 8.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 LM27CIM5-2HJ/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM27CIM5-ZHJ/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM27CIM5X-1HJ/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM27CIM5X-2HJ/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM27CIM5X-ZHJ/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM27CIM5-1HJ/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM27CIM5-2HJ/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM27CIM5-ZHJ/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM27CIM5X-1HJ/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM27CIM5X-2HJ/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM27CIM5X-ZHJ/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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