CDCVF857 www.ti.com SCAS047F – MARCH 2003 – REVISED MAY 2007 2.5-V PHASE-LOCKED-LOOP CLOCK DRIVER FEATURES • • • • • • • • • • • • • • DESCRIPTION Spread-Spectrum Clock Compatible Operating Frequency: 60 MHz to 220 MHz Low Jitter (Cycle-Cycle): ±35 ps Low Static Phase Offset: ±50 ps Low Jitter (Period): ±30 ps 1-to-10 Differential Clock Distribution (SSTL2) Best in Class for VOX = VDD/2 ±0.1 V Operates From Dual 2.6-V or 2.5-V Supplies Available in a 40-Pin MLF Package, 48-Pin TSSOP Package, 56-Ball MicroStar Junior™ BGA Package Consumes < 100-µA Quiescent Current External Feedback Pins (FBIN, FBIN) Are Used to Synchronize the Outputs to the Input Clocks Meets/Exceeds JEDEC Standard (JESD82-1) For DDRI-200/266/333 Specification Meets/Exceeds Proposed DDRI-400 Specification (JESD82-1A) Enters Low-Power Mode When No CLK Input Signal Is Applied or PWRDWN Is Low The CDCVF857 is a high-performance, low-skew, low-jitter, zero-delay buffer that distributes a differential clock input pair (CLK, CLK) to 10 differential pairs of clock outputs (Y[0:9], Y[0:9]) and one differential pair of feedback clock outputs (FBOUT, FBOUT). The clock outputs are controlled by the clock inputs (CLK, CLK), the feedback clocks (FBIN, FBIN), and the analog power input (AVDD). When PWRDWN is high, the outputs switch in phase and frequency with CLK. When PWRDWN is low, all outputs are disabled to a high-impedance state (3-state) and the PLL is shut down (low-power mode). The device also enters this low-power mode when the input frequency falls below a suggested detection frequency that is below 20 MHz (typical 10 MHz). An input frequency detection circuit detects the low frequency condition and, after applying a >20-MHz input signal, this detection circuit turns the PLL on and enables the outputs. When AVDD is strapped low, the PLL is turned off and bypassed for test purposes. The CDCVF857 is also able to track spread spectrum clocking for reduced EMI. Because the CDCVF857 is based on PLL circuitry, it requires a stabilization time to achieve phase-lock of the PLL. This stabilization time is required following power up. The CDCVF857 is characterized for both commercial and industrial temperature ranges. APPLICATIONS • • DDR Memory Modules (DDR400/333/266/200) Zero-Delay Fan-Out Buffer A A AVAILABLE OPTIONS TA TSSOP (DGG) –40°C to 85°C CDCVF857DGG –40°C to 85°C (1) 40-Pin MLF 56-Ball BGA (1) CDCVF857RTB CDCVF857GQL CDCVF857RHA CDCVF857ZQL Maximum load recommended is 12 pf for 200 MHz. At 12-pf load, maximum TA allowed is 70°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. MicroStar Junior is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2007, Texas Instruments Incorporated CDCVF857 www.ti.com SCAS047F – MARCH 2003 – REVISED MAY 2007 FUNCTION TABLE (Select Functions) INPUTS OUTPUTS AVDD PWRDWN CLK CLK Y[0:9] Y[0:9] FBOUT FBOUT GND H L H L H L H Bypassed/off GND H H L H L H L Bypassed/off X L L H Z Z Z Z Off X L H L Z Z Z Z Off 2.5 V (nom) H L H L H L H On 2.5 V (nom) H H L H L H L On 2.5 V (nom) X <20 MHz <20 MHz Z Z Z Z Off DGG PACKAGE (TOP VIEW) VDDQ 4 45 VDDQ Y1 5 44 Y6 Y1 6 43 Y6 GND 7 42 GND GND 8 41 GND Y2 9 40 Y7 CLK 5 Y2 10 39 Y7 CLK 6 VDDQ GND CLK 14 35 FBIN VDDQ 15 34 VDDQ 16 33 FBOUT 17 32 FBOUT GND 18 31 GND Y3 19 30 Y8 Y3 20 29 Y8 VDDQ 21 28 VDDQ Y4 22 27 Y9 Y4 23 26 Y9 GND 24 25 GND PWRDWN 26 FBIN 25 FBIN 7 24 VDDQ AVDD 8 23 VDDQ AGND 9 22 FBOUT 10 21 11 12 13 14 15 16 17 18 19 20 FBOUT GND GND Y3 AVDD AGND VDDQ 27 Y8 FBIN 28 4 Y8 PWRDWN 36 3 Y9 37 13 Y2 VDDQ VDDQ 12 CLK Y7 Y9 VDDQ 29 Y4 VDDQ 2 Y4 38 Y7 Y2 Y3 11 40 39 38 37 36 35 34 33 32 31 30 1 VDDQ VDDQ Y6 Y5 Y6 46 VDDQ 3 Y5 Y5 Y0 GND Y5 47 Y0 48 2 Y0 1 Y0 VDDQ GND Y1 Y1 RHA/RTB PACKAGE (TOP VIEW) P0053-01 P0052-01 2 PLL Submit Documentation Feedback CDCVF857 www.ti.com SCAS047F – MARCH 2003 – REVISED MAY 2007 MicroStar Junior™ 1 3 2 Y5 Y5 GND VDDQ GND VDDQ Y0 Y0 MicroStar Junior™ BGA (GQL/ZQL) PACKAGE (TOP VIEW) 5 4 6 A AGND GND Y3 Y3 NC D NC NC E GND GND Y7 Y7 NB PWRDWN VDDQ FBIN FBIN F NB NB G NC NC H NC NC VDDQ FBOUT FBOUT GND J Y8 Y8 K Y9 VDDQ AVDD NC Y9 CLK CLK C VDDQ GND VDDQ VDDQ Y6 VDDQ GND Y2 Y2 Y6 Y4 GND GND B Y4 Y1 Y1 NB = No Ball NC = No Connection P0054-01 Submit Documentation Feedback 3 CDCVF857 www.ti.com SCAS047F – MARCH 2003 – REVISED MAY 2007 FUNCTIONAL BLOCK DIAGRAM 3 2 PWRDWN AVDD 5 37 16 Power Down and Test Logic 6 10 9 20 19 22 23 46 47 CLK CLK FBIN FBIN 13 14 36 44 43 PLL 39 35 40 29 30 27 26 32 33 Y0 Y0 Y1 Y1 Y2 Y2 Y3 Y3 Y4 Y4 Y5 Y5 Y6 Y6 Y7 Y7 Y8 Y8 Y9 Y9 FBOUT FBOUT B0196-01 4 Submit Documentation Feedback CDCVF857 www.ti.com SCAS047F – MARCH 2003 – REVISED MAY 2007 Table 1. TERMINAL FUNCTIONS TERMINAL I/O DGG RHA/RTB AGND 17 9 H1 – Ground for 2.5-V analog supply AVDD 16 8 G2 – 2.5-V analog supply CLK, CLK 13, 14 5, 6 F1, F2 I Differential clock input FBIN, FBIN 35, 36 25, 26 F5, F6 I Feedback differential clock input FBOUT, FBOUT 32, 33 21, 22 H6, G5 O Feedback differential clock output 1, 7, 8, 18, 24, 25, 31, 41, 42, 48 1, 10 A3, A4, C1, C2, C5, C6, H2, H5, K3, K4 – Ground GND PWRDWN GQL/ZQL DESCRIPTION NAME 37 27 E6 I Output enable for Y and Y 4, 11, 12, 15, 21, 28, 34, 38, 45 4, 7, 13, 18, 23, 24, 28, 33, 38 B3, B4, E1, E2, E5, G1, G6, J3, J4 – 2.5-V supply Y0, Y0 3, 2 37, 36 A1, A2 O Y1, Y1 5, 6 39, 40 B2, B1 O VDDQ Y2, Y2 10, 9 3, 2 D1, D2 O Y3, Y3 20, 19 12,11 J2, J1 O Y4, Y4 22, 23 14, 15 K1, K2 O Y5, Y5 46, 47 34, 35 A6, A5 O Y6, Y6 44, 43 32, 31 B5, B6 O Y7, Y7 39, 40 29, 30 D6, D5 O Y8, Y8 29, 30 19, 20 J5, J6 O Y9, Y9 27, 26 17, 16 K6, K5 O Buffered output copies of input clock, CLK, CLK ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VDDQ, AVDD Supply voltage range VI Input voltage range (2) (3) VO Output voltage range (2) (3) IIK Input clamp current VI < 0 or VI > VDDQ ±50 mA IOK Output clamp current VO < 0 or VO > VDDQ ±50 mA IO Continuous output current VO = 0 to VDDQ IDDC Continuous current to GND or VDDQ Tstg Storage temperature range (1) (2) (3) 0.5 V to 3.6 V –0.5 V to VDDQ + 0.5 V –0.5 V to VDDQ + 0.5 V ±50 mA ±100 mA –65°C to 150°C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. This value is limited to 3.6 V maximum. THERMAL CHARACTERISTICS RθJA for TSSOP (DGG) Package (1) (1) (2) RθJA for MLF (RHA/RTB) Package RθJA for BGA (GQL/ZQL) Package (2) Airflow Low K High K Airflow With 4 Thermal Vias Airflow High K 0 ft/min 89.1°C/W 70°C/W 0 ft/min 44.7°C/W 0 ft/min 132.2°C/W 150 ft/min 78.5°C/W 65.3°C/W 150 ft/min 150 ft/min 126.4°C/W The package thermal impedance is calculated in accordance with JESD 51. Connecting the NC-balls (C3, C4, D3, D4, G3, G4, H3, H4) to a ground plane improves the θJA to 114.8°C/W (0 airflow). Submit Documentation Feedback 5 CDCVF857 www.ti.com SCAS047F – MARCH 2003 – REVISED MAY 2007 RECOMMENDED OPERATING CONDITIONS MIN VDDQ Supply voltage PC1600 – PC3200 AVDD VIL Low-level input voltage VIH High-level input voltage DC input signal voltage NOM MAX 2.3 2.7 VDDQ – 0.12 2.7 CLK, CLK, FBIN, FBIN VDDQ/2 – 0.18 PWRDWN –0.3 CLK, CLK, FBIN, FBIN VDDQ/2 + 0.18 PWRDWN (1) (2) 0.7 1.7 VDDQ + 0.3 –0.3 VDDQ + 0.3 DC CLK, FBIN 0.36 VDDQ + 0.6 AC CLK, FBIN 0.7 VDDQ + 0.6 VDDQ/2 – 0.2 VDDQ/2 + 0.2 UNIT V V V V VID Differential input signal voltage VIX Input differential pair cross voltage IOH High-level output current –12 IOL Low-level output current 12 mA SR Input slew rate 1 4 V/ns TA Operating free-air temperature –40 85 °C (1) (2) (3) (4) (3) (4) V V mA The unused inputs must be held high or low to prevent them from floating. The dc input signal voltage specifies the allowable dc execution of the differential input. The differential input signal voltage specifies the differential voltage |VTR – VCP| required for switching, where VTR is the true input level and VCP is the complementary input level. The differential cross-point voltage tracks variations of VCC and is the voltage at which the differential signals must cross. ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK TEST CONDITIONS Input voltage, all inputs VDDQ = min to max, IOH = –1 mA High-level output voltage VOL Low-level output voltage VOD Output voltage swing VOX Output differential cross-voltage (3) II Input current IOZ High-impedance-state output VDDQ = 2.7 V, VO = VDDQ or GND current IDDPD Power-down current on VDDQ CLK and CLK = 0 MHz; PWRDWN = + AVDD Low; Σ of IDD and AIDD AIDD Supply current on AVDD CI Input capacitance VDDQ = 2.3 V, IOH = –12 mA (3) 6 MAX UNIT –1.2 V V 1.7 VDDQ = min to max, IOL = 1 mA 0.1 VDDQ = 2.3 V, IOL = 12 mA 0.6 Differential outputs are terminated with 120 Ω, CL = 14 pF (see Figure 3) 1.1 VDDQ/2 – 0.1 VDDQ/2 VDDQ = 2.7 V, VI = 0 V to 2.7 V 20 V VDDQ/2 + 0.1 V ±10 µA ±10 µA 100 µA 6 8 fO = 200 MHz 8 10 2.5 3.5 fO = 170 MHz 120 140 fO = 200 MHz 125 150 Differential outputs fO = 170 MHz terminated with 120 Ω, CL fO = 200 MHz = 0 pF 220 270 230 280 Differential outputs fO = 170 MHz terminated with 120 Ω, CL fO = 200 MHz = 14 pF 280 330 300 350 VDDQ = 2.5 V, VI = VDDQ or GND 2 V VDDQ – 0.4 fO = 170 MHz Without load (1) (2) (1) VDDQ – 0.1 (2) Dynamic current on VDDQ TYP VDDQ = 2.3 V, II = –18 mA VOH IDD MIN mA pF mA All typical values are at nominal VDDQ. The differential output signal voltage specifies the differential voltage |VTR – VCP|, where VTR is the true output level and VCP is the complementary output level. The differential cross-point voltage tracks variations of VDDQ and is the voltage at which the differential signals must cross. Submit Documentation Feedback CDCVF857 www.ti.com SCAS047F – MARCH 2003 – REVISED MAY 2007 ELECTRICAL CHARACTERISTICS (continued) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT ∆C Part-to-part input capacitance variation VDDQ = 2.5 V, VI = VDDQ or GND 1 pF CI(∆) Input capacitance difference between CLK and CLK, FBIN, and FBIN VDDQ = 2.5 V, VI = VDDQ or GND 0.25 pF TIMING REQUIREMENTS over recommended ranges of supply voltage and operating free-air temperature PARAMETER fCLK MIN MAX Operating clock frequency 60 220 Application clock frequency 90 220 40% 60% Input clock duty cycle Stabilization time (PLL mode) (1) Stabilization time (bypass mode) (1) (2) (2) UNIT MHz 10 µs 30 ns The time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal. For phase lock to be obtained, a fixed-frequency, fixed-phase reference signal must be present at CLK and VDD must be applied. Until phase lock is obtained, the specifications for propagation delay, skew, and jitter parameters given in the switching characteristics table are not applicable. This parameter does not apply for input modulation under SSC application. A recovery time is required when the device goes from power-down mode into bypass mode (AVDD at GND). SWITCHING CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) Low-to-high level propagation delay time Test mode/CLK to any output 3.5 tPHL (1) High-to-low level propagation delay time Test mode/CLK to any output 3.5 tPLH ns –65 65 133/167/200 MHz (PC2100/2700/3200) –30 30 100 MHz (PC1600) –50 50 133/167/200 MHz (PC2100/2700/3200) –35 35 –100 100 –75 75 Jitter (period), see Figure 7 tjit(cc) (2) Jitter (cycle-to-cycle), see Figure 4 tjit(hper) (2) Half-period jitter, see Figure 8 tslr(o) Output clock slew rate, see Figure 9 Load: 120 Ω, 14 pF t(φ) Static phase offset, see Figure 5 100/133/167/200 MHz tsk(o) Output skew, see Figure 6 Load: 120 Ω, 14 pF; 100/133/167/200 MHz 100 MHz (PC1600) 133/167/200 MHz (PC2100/2700/3200) UNIT ns 100 MHz (PC1600) tjit(per) (2) (1) (2) MAX ps ps ps 1 2 V/ns –50 50 ps 40 ps Refers to the transition of the noninverting output. This parameter is assured by design but cannot be 100% production tested. Submit Documentation Feedback 7 CDCVF857 www.ti.com SCAS047F – MARCH 2003 – REVISED MAY 2007 PARAMETER MEASUREMENT INFORMATION VDD VYx R = 60 W R = 60 W VDD/2 VYx CDCVF857 GND S0229-01 Figure 1. IBIS Model Output Load VDD/2 C = 14 pF R = 10 W Z = 60 W –VDD/2 Scope Z = 50 W R = 50 W V(TT) Z = 60 W R = 10 W Z = 50 W C = 14 pF CDCVF857 –VDD/2 R = 50 W V(TT) –VDD/2 V(TT) = GND S0230-01 Figure 2. Output Load Test Circuit 8 Submit Documentation Feedback CDCVF857 www.ti.com SCAS047F – MARCH 2003 – REVISED MAY 2007 PARAMETER MEASUREMENT INFORMATION (continued) VDD C = 14 pF Probe GND Z = 60 W C = 1 pF R = 120 W R = 1 MW V(TT) Z = 60 W C = 1 pF C = 14 pF CDCVF857 R = 1 MW V(TT) GND GND V(TT) = GND S0231-01 Figure 3. Output Load Test Circuit for Crossing Point Yx, FBOUT Yx, FBOUT tc(n) tc(n +1) tjit(cc) = tc(n) – tc(n+1) T0174-01 Figure 4. Cycle-to-Cycle Jitter CLK CLK FBIN FBIN t(f)n t(f)n+1 t(f) = S n=N t(f)n 1 N (N > 1000 Samples) T0175-01 Figure 5. Phase Offset Submit Documentation Feedback 9 CDCVF857 www.ti.com SCAS047F – MARCH 2003 – REVISED MAY 2007 PARAMETER MEASUREMENT INFORMATION (continued) Yx Yx Yx, FBOUT Yx, FBOUT tsk(o) T0176-01 Figure 6. Output Skew Yx, FBOUT Yx, FBOUT tc(n) Yx, FBOUT Yx, FBOUT 1 f0 1 f0 tjit(per) = tc(n) – f0 = Average Input Frequency Measured at CLK/CLK T0177-01 Figure 7. Period Jitter Yx, FBOUT Yx, FBOUT t(hper_n) t(hper_n+1) 1 f0 n = Any Half Cycle tjit(hper) = t(hper_n) – 1 2´f0 f0 = Average Input Frequency Measured at CLK/CLK T0178-01 Figure 8. Half-Period Jitter 10 Submit Documentation Feedback CDCVF857 www.ti.com SCAS047F – MARCH 2003 – REVISED MAY 2007 PARAMETER MEASUREMENT INFORMATION (continued) VOH, VIH 80% Clock Inputs and Outputs 80% 20% 20% VOL, VIL tr tslr(I/O) = tf V80% – V20% tslf(I/O) = tr V80% – V20% tf T0179-01 Figure 9. Input and Output Slew Rates (2) Card Via Bead 0603 AVDD VDDQ 4.7 mF 1206 0.1 mF 0603 GND Card Via (1) 2200 pF 0603 PLL AGND S0232-01 (1) Place the 2200-pF capacitor close to the PLL. (2) Recommended bead: Fair-Rite P/N 2506036017Y0 or equilvalent (0.8 Ω dc maximum, 600 Ω at 100 MHz). NOTE: Use a wide trace for the PLL analog power and ground. Connect PLL and capacitors to AGND trace and connect trace to one GND via (farthest from the PLL). Figure 10. Recommended AVDD Filtering Submit Documentation Feedback 11 PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CDCVF857DGG ACTIVE TSSOP DGG 48 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 CDCVF857 CDCVF857DGGG4 ACTIVE TSSOP DGG 48 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 CDCVF857 CDCVF857DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 CDCVF857 CDCVF857DGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 CDCVF857 CDCVF857RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CKVF857 CDCVF857RHARG4 ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CKVF857 CDCVF857RHAT ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CKVF857 CDCVF857RHATG4 ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CKVF857 CDCVF857ZQLR ACTIVE BGA MICROSTAR JUNIOR ZQL 56 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 CDCVF857 HPA00126DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 CDCVF857 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CDCVF857DGGR TSSOP DGG 48 2000 330.0 24.4 8.6 13.0 1.8 12.0 24.0 Q1 CDCVF857RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.1 12.0 16.0 Q2 CDCVF857RHAT VQFN RHA 40 250 180.0 16.4 6.3 6.3 1.1 12.0 16.0 Q2 ZQL 56 1000 330.0 16.4 4.8 7.3 1.5 8.0 16.0 Q1 CDCVF857ZQLR BGA MI CROSTA R JUNI OR Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CDCVF857DGGR TSSOP DGG 48 2000 367.0 367.0 45.0 CDCVF857RHAR VQFN RHA 40 2500 367.0 367.0 38.0 CDCVF857RHAT VQFN RHA 40 250 210.0 185.0 35.0 CDCVF857ZQLR BGA MICROSTAR JUNIOR ZQL 56 1000 336.6 336.6 28.6 Pack Materials-Page 2 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OUTLINE ZQL0056A JRBGA - 1 mm max height SCALE 2.100 PLASTIC BALL GRID ARRAY 4.6 4.4 B A BALL A1 CORNER 7.1 6.9 1 MAX C SEATING PLANE 0.35 TYP 0.15 BALL TYP 0.1 C 3.25 TYP (0.625) TYP SYMM K (0.575) TYP J H G 5.85 TYP SYMM F E D C 56X NOTE 3 B A 0.65 TYP BALL A1 CORNER 1 2 3 4 5 0.45 0.35 0.15 0.08 C B A C 6 0.65 TYP 4219711/B 01/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. No metal in this area, indicates orientation. www.ti.com EXAMPLE BOARD LAYOUT ZQL0056A JRBGA - 1 mm max height PLASTIC BALL GRID ARRAY (0.65) TYP 56X ( 0.33) 2 1 3 4 5 6 A (0.65) TYP B C D E SYMM F G H J K SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING 0.05 MAX METAL UNDER SOLDER MASK 0.05 MIN EXPOSED METAL ( 0.33) METAL ( 0.33) SOLDER MASK OPENING EXPOSED METAL SOLDER MASK DEFINED NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE 4219711/B 01/2017 NOTES: (continued) 4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99). www.ti.com EXAMPLE STENCIL DESIGN ZQL0056A JRBGA - 1 mm max height PLASTIC BALL GRID ARRAY 56X ( 0.33) (0.65) TYP 1 2 3 4 5 6 A (0.65) TYP B C D E SYMM F G H J K SYMM SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4219711/B 01/2017 NOTES: (continued) 5. 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