BRIGHT BL-PDG-GRS-C10 Z-bend domiled surface mount led. Datasheet

AMERICAN BRIGHT OPTOELECTRONICS CORP.
Z-BEND DOMILED Gap BL-PDx-GRS Series
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Feature:
1. Surface mount LED.
2. 120° viewing angle.
3. Small package outline (LxWxH) of 3.2 x 2.8 x 1.8 mm.
4. Qualified according to JEDEC moisture sensitivity Level 2.
5. Compatible to both IR reflow soldering and TTW soldering.
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Package Dimension:
Recommended Solder Pad
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
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Z-BEND DOMILED Gap BL-PDx-GRS Series
Optical Characteristics:
Part Number
Chip Technology /
Color
BL-PDR-GRS-C10
GaP /
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BIN L1
BIN L2
BIN M1
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BIN M2
Red, 625 nm
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•
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BIN L1
BIN L2
BIN M1
• BIN M2
BL-PDY-GRS-C10
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•
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BIN L1
BIN L2
BIN M1
BIN M2
GaP /
Orange, 605 nm
GaP /
Yellow, 587 nm
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BIN L1
BIN L2
BIN M1
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BIN M2
BL-PDG-GRS-C20
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•
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BIN M1
BIN M2
BIN N1
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BIN N2
11.2 … 14.0
14.0 … 18.0
18.0 … 22.4
22.4 … 28.5
11.2 … 28.5
11.2 … 14.0
14.0 … 18.0
18.0 … 22.4
22.4 … 28.5
28.5 … 35.5
35.5 … 45.0
45.0 … 56.0
56.0 … 71.5
BIN M1
BIN M2
BIN N1
BIN N2
BL-PDG-GRS-C10
11.2 … 28.5
28.5 … 71.5
BL-PDY-GRS-C20
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11.2 … 14.0
14.0 … 18.0
18.0 … 22.4
22.4 … 28.5
28.5 … 35.5
35.5 … 45.0
45.0 … 56.0
56.0 … 71.5
BIN M1
BIN M2
BIN N1
• BIN N2
BL-PDO-GRS-C10
11.2 … 28.5
28.5 … 71.5
BL-PDR-GRS-C20
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Luminous Intensity @ If = 20mA
Iv ( mcd )
GaP /
Green, 570 nm
11.2 … 28.5
11.2 … 14.0
14.0 … 18.0
18.0 … 22.4
22.4 … 28.5
18.0 … 45.0
18.0 … 22.4
22.4 … 28.5
28.5 … 35.5
35.5 … 45.0
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
Z-BEND DOMILED Gap BL-PDx-GRS Series
Forward voltage
Chip Type
@ If=20 mA.
2.2 V (typ.); 2.6 V (max)
Viewing angle
@ VR = 5V, (max)
at 50% Iv
GaP
Reverse current, IR
100 µA
120°
NOTE:
1. Other luminous intensity groups are also available upon request.
2. Luminous intensity is measured with an accuracy of ±11%.
3. Wavelength binning is carried for all units as per the wavelength-binning table. Only one
wavelength group is allowed for each reel.
4. An optional Vf binning is also available upon request. Binning scheme is as per following table.
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Absolute Maximum Ratings:
Parameter
Maximum Value
DC forward current.
30
mA
Peak pulse current; (tp ≤ 10 µs, Duty cycle = 0.005)
500
mA
Reverse voltage.
5
V
100
°C
Operating temperature.
-40 … +100
°C
Storage temperature.
-40 … +100
°C
LED junction temperature.
Power dissipation ( at room temperature )
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Unit
75
mW
Vf Binning:
Vf Bin @ 20mA
Forward voltage (V)
01
1.55 … 1.85
02
1.85 … 2.15
03
2.15 … 2.45
04
2.45 … 2.60
Forward voltage, Vf is measured with an accuracy of ±0.1 V.
V.1 Page: 3 of 6
AMERICAN BRIGHT OPTOELECTRONICS CORP.
Z-BEND DOMILED Gap BL-PDx-GRS Series
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Wavelength Grouping:
Color
Group
Wavelength distribution (nm)
BL-PDR; Red
Full
620 – 635
BL-PDO; Orange
Full
600 – 612
W
600 - 603
X
603 - 606
Y
606 - 609
Z
609 - 612
Full
582 – 594
W
582 – 585
X
585 – 588
Y
588 - 591
Z
591 - 594
Full
564.5 – 576.5
W
564.5 – 567.5
X
567.5 – 570.5
Y
570.5 – 573.5
Z
573.5 – 576.5
BL-PDY; Yellow
BL-PDG; Green
Wavelength is measured with an accuracy of ±1 nm.
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Typical electro-optical characteristics curves:
Fig. 1 Relative luminous intensity vs. forward current.
Fig. 2 Forward current vs. forward voltage.
Forward Current vs. Forward Voltage
2.2
40
2
Forward Current (mA)
Relative intensity. Normalized at 20 mA.
Intensity vs. DC Forw ard Current
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
35
30
25
GaP
20
15
10
5
0.2
0
0
0
10
20
30
40
FORW ARD CURRENT (m A)
50
60
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
Forward Voltage (V)
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2.6
AMERICAN BRIGHT OPTOELECTRONICS CORP.
Z-BEND DOMILED Gap BL-PDx-GRS Series
Fig. 3 Radiation pattern.
30°
20°
10°
Fig. 4 Maximum forward current vs. temperature.
0°
1.0
35
30
40°
0.8
50°
0.6
60°
0.4
Forward Current, If
25
20
15
10
70°
0.2
80°
90°
5
0
0
Fig. 5 Recommended IR-reflow Soldering Profile
0
10
20
30
40
50
60
70
80
Ambient Temperature
Fig. 6 Recommended TTW Soldering Profile
V.1 Page: 5 of 6
90
100
AMERICAN BRIGHT OPTOELECTRONICS CORP.
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Z-BEND DOMILED Gap BL-PDx-GRS Series
Taping And Orientation
Reels come in quantity of 8000 units or 2000 units.
Reel diameters are 330 mm and 180 mm respectively.
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