NEW High-Speed(10+Gbps) BGA Mezzanine Connectors IT3 Series ■Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended, and power through one package and being stackable from 15 – 40mm, IT3 can solve your interface needs for both current and future generations. ■Mechanical features ● Unique 3-piece structure for flexibility ● Stacking heights from 15 to 40mm (*15mmH is 2-piece) ● Staggered 1.5mm ∞ 1.75mm ball grid array ● Number of Contacts: 100, 200, &300 signals + 90% additional grounds ● Differential, single-ended, and power ● Low mating/extracting forces ● Wide misalignment tolerances for multiple connector use ● Both of SnPb and Pb-free are available Interposer Signal Ground Signal / Ground Configuration ● Excellent reflow solderability ■Signal integrity features ● Insertion loss to Crosstalk Ratio (ICR) 0 ICR IEEE spec 50 -10 40 RL (dB) ● Return Loss 60 ICR (dB) The ICR performance meets the extrapolated IEEE 802.3ap specification for 6.25Gbps with fully-populated pin assignment, and 10+Gbps with skipped pin assignment. 30 -20 -30 20 The differential return loss meets the extrapolated IEEE 802.3ap specification up to 12GHz. -40 10 0 0 5 10 15 20 -50 RL IEEE Spec 0 5 Frequency (GHz) 10 15 20 Frequency (GHz) ■Stacking height variations Stacking Height Contact Position 100 200 300 17mm * 20mm 22mm * 25mm 26mm 28mm 30mm 32mm * * 38mm 40mm * : Under planning 2010.02 1 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Product Specifications Rating Current Rating: 1.0A / pin (note 1) Voltage Rating: 50Vrms Storage Temperature Range: -10˚C to +60˚C Item Specification 1. Insulation Resistance 1000Mø min. 2. Withstanding Voltage No flashover or insulation breakdown 50mø max. (height 15-24mm) (note 2) 3. Contact Resistance 55mø max. (height 25-32mm) 60mø max. (height 33-40mm) 1) No electrical discontinuity of 1µs or more 4. Vibration 2) No damage, crack, or loose part 1) Contact resistance change: 20mø or less 5. Cyclic Temperature 2) Insulation resistance: 100Mø min. and Humidity 3) No damage, crack or loose part 6. Durability 1) Contact resistance change: 20mø or less (Mating/Un-mating) 2) No damage, crack or loose part Operating Temperature Range: -55˚C to +85˚C Operating Humidity Range: For relative humidity, 90% max (no condensation is permitted) Conditions 100V DC 150V duty for 60 seconds (2mA max leak) 100mA Frequency: 20 to 500Hz; power spectrum density: 0.02G2/Hz Overall rms G: 3.1 Grms; for 15 minutes in three directions 25˚C, 80% RH: 60 min dwell time, 30 min ramp time 65˚C, 50% RH: 60 min dwell time under 24 cycles 100 cycles Note1: Refer to IT3 derating curves on test report TR636E-20041 for power application. Note2: The value of contact resistance includes 2 contact points and the bulk resistance. ■Material Information ●Receptacle Component Housing Locator Material LCP LCP Contact Copper Alloy Solder Ball Tray Pick Up Cap Pick Up Tape Tin-Lead (SnPb) Tin (Pb-Free) Polystyrene Stainless steel Paper (Nomex) Finish & Remarks Black , UL 94V-0 Black , UL 94V-0 Contact Area : Gold (0.76 µm) over Nickel (1.5 µm) Mounting Area : Gold (0.03 µm) over Nickel (1.5 µm) Other : Nickel (1.5 µm) Sn(63)-Pb(37) Sn(96.5)-Ag(3)-Cu(0.5) Black 300pos 100pos and 200pos ●Interposer Component Guide (Mounting Side) Guide (Detachable/Mating Side) Blade Contact Ground Shield Tray 2 Material PBT LCP PBT LCP Copper Alloy Copper Alloy Polypropylene Finish & Remarks Black , UL 94V-0 Gray , UL 94V-0 Gray , UL 94V-0 Black , UL 94V-0 Contact Area : Gold (0.76 µm) over Nickel (1.5 µm) Other : Nickel (1.5 µm) ---------- IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Ordering Information ●Receptacle IT 3 ** - *** S - BGA ** (**) 1 2 3 4 5 6 7 ●Interposer IT 3 ** - *** P - ** H ** (**) 1 2 1 Series name : IT3 2 Receptacle Type D : Mating Receptacle D* : Mating Receptacle ( Customized ) M : Mounting Receptacle M* : Mounting Receptacle ( Coustomized ) Interposer Type Blank: Standard ** : Customized 3 Contact Positions : 100, 180*, 200, 300 *180 pos. is 2 columns depopulated version for higher voltage proof. 4 Connector type S : Receptacle P : Interposer 3 4 8 6 9 5 BGA : Ball Grid Array 6 Package Specification Blank : Standard ** : Customized 7 Material and Plating Specification of Receptacle (37) : Pb-free Solder Sn(96.5)-Ag(3.0)-Cu(0.5) Contact Area : Au(0.76µm)+Ni(1.5µm) (57) : Eutectic Solder Sn(63)-Pb(37) Contact Area : Au(0.76µm)+Ni(1.5µm) 8 Stacking Height (mm) 17, 20, 22, 25, 26, 28, 30, 32, 38, 40 9 Plating Specification of Interposer (03) : Contact Area : Au(0.76µm)+Ni(1.5µm) 3 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Signal Integrity ●Pin assignment For the fully-populated pin assignment, adjacent pins are grouped into differential pairs as shown in the figures below. In the following data, one victim pair and eight aggressor pairs are included. 7 8 9 16 17 18 4 5 6 13 14 15 1 2 3 10 11 12 Mating receptacle side Mounting receptacle side Ground Signal Victim pair Aggressor pair ●Impedance profile at 60ps rise time (20-80%) 115 115 110 110 110 105 100 Z (Ohm) 115 Z (Ohm) Z (Ohm) The impedance profiles (of connector only) for the center pair are shown below. The IT3 receptacles are designed with higher impedance to offset the via’s low impedance. 105 100 100 S11 95 0 200 400 600 Time (ps) 800 1000 105 S11 95 0 200 400 600 Time (ps) 800 1000 S11 95 0 25mm Height 17mm Height 400 600 Time (ps) 32mm Height ●Differential propagation delay 4 200 Stacking Height (mm) 17 25 32 Delay (ps) 101.05 146.69 188.48 800 1000 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ●Differential Insertion Loss The differential insertion loss is less than -2dB up to 12GHz. 0 0 -1 -2 -2 -2 -3 -3 -3 -4 -4 -4 -5 S (dB) -1 S (dB) S (dB) 0 -1 -5 -5 -6 -6 -6 -7 -7 -7 -8 -8 -8 -9 -9 -9 S514 -10 0 5 10 15 S514 -10 20 0 5 10 15 S514 -10 20 0 5 25mm Height 17mm Height 10 15 20 32mm Height ●Differential Return Loss The connector-only differential return loss for the center pair meets the extrapolated IEEE 802.3ap spec up to 12GHz. (The attenuation of PCB traces in the channel will give an even larger margin.) 0 0 -10 -10 -20 -20 -20 -30 -40 -50 5 10 15 -30 -40 RL IEEE Spec 0 RL (dB) -10 RL (dB) RL (dB) 0 -50 20 -40 RL IEEE Spec 0 5 Frequency (GHz) 10 15 -30 -50 20 RL IEEE Spec 0 5 Frequency (GHz) 25mm Height 17mm Height 10 15 20 Frequency (GHz) 32mm Height ●Differential Near-End Crosstalk (NEXT) The near-end crosstalk at the center pair from surrounding 8 aggressors is shown below. The NEXT is not as critical because TX and RX can be grouped into separate wafers. 0 0 -10 S51 S52 S53 S54 S56 S57 S58 S59 Sum -30 -40 -50 -60 0 5 10 15 Frequency (GHz) 17mm Height S51 S52 S53 S54 S56 S57 S58 S59 Sum -20 S (dB) S (dB) -20 -10 -30 -40 -50 20 -60 0 5 10 15 Frequency (GHz) 25mm Height S51 S52 S53 S54 S56 S57 S58 S59 Sum -20 S (dB) -10 0 -30 -40 -50 20 -60 0 5 10 15 20 Frequency (GHz) 32mm Height 5 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ●Differential Far-End Crosstalk (FEXT) Low far-end crosstalk at the center pair from surrounding 8 aggressors is observed. Even lower crosstalk can be achieved by skipping pins. 0 0 -10 S141 S142 S143 S144 S146 S147 S148 S149 Sum -30 -40 -50 -60 0 5 10 15 S141 S142 S143 S144 S146 S147 S148 S149 Sum -20 S (dB) S (dB) -20 -10 -30 -40 -50 20 -60 0 5 Frequency (GHz) 10 15 S141 S142 S143 S144 S146 S147 S148 S149 Sum -20 S (dB) -10 0 -30 -40 -50 20 -60 0 5 Frequency (GHz) 25mm Height 17mm Height 10 15 20 Frequency (GHz) 32mm Height ●Insertion-Loss-to-Crosstalk-Ratio (ICR) for FEXT The insertion-loss-to-crosstalk-ratio (ICR) for 8-aggressor FEXT meets the extrapolated IEEE 802.3ap specification up to 12GHz. 60 60 ICR IEEE spec 50 50 40 ICR (dB) 30 30 30 20 20 20 10 10 10 0 0 5 10 15 Frequency (GHz) 17mm Height 20 0 ICR IEEE spec 50 40 ICR (dB) ICR (dB) 40 6 60 ICR IEEE spec 0 5 10 15 Frequency (GHz) 25mm Height 20 0 0 5 10 15 Frequency (GHz) 32mm Height 20 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Receptacle 6.0 19.2 A Shown: 200 position mating receptacle, IT3M-200S-BGA * Contact Positions 100 (100 signals/90 grounds) 180 (180 signals/162 grounds) 200 (200 signals/180 grounds) 300 (300 signals/270 grounds) Type Mating Receptacle Mounting Receptacle Mating Receptacle Mounting Receptacle Mating Receptacle Mounting Receptacle Mating Receptacle Mounting Receptacle Solder Ball Material Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Part Number IT3D-100S-BGA(37) IT3D-100S-BGA(57) IT3M-100S-BGA(37) IT3M-100S-BGA(57) IT3D2-180S-BGA(37) IT3D2-180S-BGA(57) IT3M2-180S-BGA(37) IT3M2-180S-BGA(57) IT3D-200S-BGA(37) IT3D-200S-BGA(57) IT3M-200S-BGA(37) IT3M-200S-BGA(57) IT3D-300S-BGA(37) IT3D-300S-BGA(57) IT3M-200S-BGA(37) IT3M-200S-BGA(57) CL No. 636-0013-1-37 636-0013-1-57 636-0014-4-37 636-0014-4-57 636-0011-6-37 636-0011-6-57 636-0012-9-37 636-0012-9-57 636-0003-8-37 636-0003-8-57 636-0004-0-37 636-0004-0-57 636-0007-9-37 636-0007-9-57 636-0008-1-37 636-0008-1-57 Unit: mm A 21.0 38.5 56.0 7 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Interposer 21±0.5 A±0.5 B±0.5 Mating Side Spacer height : D±0.127 Spacer Spacer IT3**-300P-25H(**) IT3M*-300S-BGA(**) Mother board Mating Side (1.0 with spacers) 1.4±0.3 (Contact wipe) IT3D*-300S-BGA(**) Daughter card 0.9±0.3 Contact wipe Mated connector height : C±0.25 Mounting Side Mounting Side Mating Cross Section(FREE) Mating condition with spacers Mating condition without spacers * Unit: mm Height (mm) 17 20 22 25 26 8 Part Number CL No. A IT3-200P-17H(03) IT3-300P-17H(03) IT3-100P-20H(03) IT3-200P-20H(03) IT3-300P-20H(03) IT3-200P-22H(03) IT3-300P-22H(03) IT3-100P-25H(03) IT3M2-180P-25H(03) IT3-200P-25H(03) IT3-300P-25H(03) IT3-100P-26H(03) IT3-200P-26H(03) IT3-300P-26H(03) 636-0100-4-03 636-0130-5-03 636-0223-4-03 636-0224-7-03 636-0225-0-03 636-0209-3-03 636-0210-2-03 636-0150-2-03 636-0157-1-03 636-0155-6-03 636-0160-6-03 636-0165-0-03 636-0110-8-03 636-0135-9-03 41.5 59.0 24.0 41.5 59.0 41.5 59.0 24.0 41.5 41.5 59.0 24.0 41.5 59.0 B C D Height (mm) 15.8 16.6 17.0 28 18.8 19.6 20.0 30 20.8 21.6 22.0 32 23.8 24.6 25.0 24.8 25.6 26.0 38 40 Part Number CL No. A IT3-100P-28H(03) IT3M2-180P-28H(03) IT3-200P-28H(03) IT3-300P-28H(03) IT3-200P-30H(03) IT3-300P-30H(03) IT3-200P-32H(03) IT3-300P-32H(03) IT3-100P-38H(03) IT3-200P-38H(03) IT3-300P-38H(03) IT3-100P-40H(03) IT3-200P-40H(03) IT3-300P-40H(03) 636-0170-0-03 636-0107-3-03 636-0105-8-03 636-0140-9-03 636-0180-3-03 636-0185-7-03 636-0115-1-03 636-0145-2-03 636-0200-9-03 636-0195-0-03 636-0190-7-03 636-0230-0-03 636-0227-5-03 636-0175-3-03 24.0 41.5 41.5 59.0 41.5 59.0 41.5 59.0 24.0 41.5 59.0 24.0 41.5 59.0 B C D 26.8 27.6 28.0 28.8 29.6 30.0 30.8 31.6 32.0 36.8 37.6 38.0 38.8 39.6 40.0 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors 29.2 Minimum clearance for sensitive devices 27.2 Minimum clearance for all devices Row A C E G J L N R U W B D F H K M P T V 13.5 Signal Ground 0.75 Column No.1 No.n 1.5 ■PCB footprint (mounting foot pattern) 0.875 1.75 0.875 Signal Pad Ground Pad A B Minimum clearance for all devices C Minimum clearance for sensitive devices 29.2 Minimum clearance for sensitive devices 27.2 Minimum clearance for all devices Row W U R N L J G E C A V T P M K H F D B 13.5 Signal Ground 0.75 Column No.1 No.n 1.5 Mounting Receptacle – IT3M 0.875 1.75 0.875 Signal Pad Ground Pad A B Minimum clearance for all devices C Minimum clearance for sensitive devices Mating Receptacle – IT3D * Dimension (mm) A B C 100 15.75 28.10 30.10 180 / 200 33.25 45.60 47.50 Unit: mm 300 50.75 63.10 65.10 9 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Spacers Spacers are required to support the PWB’s and protect the BGA solder joints. Stacking Height Spacers Suggested spacer style is shown below: Spacer, male-male, M3 thread The recommended spacer height corresponds to the interposer stacking height as shown in the chart below: Stacking Height 17 mm 20 mm 22 mm 25 mm 26 mm 28 mm 30 mm 32 mm 38 mm 40 mm Recommended Spacer Height 17 +/-0.127 mm 20 +/-0.127 mm 22 +/-0.127 mm 25 +/-0.127 mm 26 +/-0.127 mm 28 +/-0.127 mm 30 +/-0.127 mm 32 +/-0.127 mm 38 +/-0.127 mm 40 +/-0.127 mm 1050mm 1050mm Two spacers located diagonally are minimally required. Some applications may require 4 spacers. Spacers should be located 10 – 50 mm from the corners of the receptacles to prevent excessive mechanical loading on the interconnections. If assembly will be subjected to vibration, spacers should be located to prevent resonance, and additional spacers may be required. Recommended Spacer Location 10 Ø3.5 Non plated through hole IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Interposer installation Position interposer directly over mounting receptacle, aligning the polarity chamfers. If positioned properly, the interposer should slide easily onto the mounting receptacle. Place installation cap onto interposer and push straight down to engage the locking latches: Manual Installation *Installation caps are available upon request for manual operation Press firmly on installation cap only, not on wafers or interposer body Locking Latch Always support PWB from underside to prevent flexing ■Daughter card installation After the interposer is mounted, install spacers onto motherboard. To install mating receptacle, align the spacer holes in the daughter card with the threads on the spacers. The spacers help align the mating receptacle with the interposer. If positioned correctly, the mating receptacle will slip down into the interposer. Push directly down on the assembly to lock the mating receptacle in place. Install nuts onto the spacer threads. Tighten nuts to specified torque. 11 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Daughter card removal To remove a daughter card, first remove the nuts from the reinforcing spacers, then lift the daughter card straight off the interposers, as shown right. ■Interposer removal Interposer Removal 1) Hold the Interposer Assembly on the walls without locking latches Locking Latch 2) Gently rotate one side of the Interposer Assembly laterally 10° maximum 10°MAX Caution: do not rotate more than 10 degrees 3) While gently rotating, pull up on other side of the Interposer Assembly 12 4) The Interposer Assembly is removed, and the Mounting Receptacle is ready to accept another Interposer Assembly. IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Assembly reflow soldering profile Parameters Eutectic (SnPb) Pb-Free Preheat Ramp Rate 2 - 3ç/sec 2 - 3ç/sec Soak Time 0 - 120 sec 0 - 120 sec Soak Temperature 140 - 180ç 160 - 215ç Peak Reflow Temperature 205 - 225ç 230 - 250ç Time Above Liquidus (TAL) 30 - 90 sec 45 - 120 sec Cooling Rate >6ç/sec >6ç/sec Maximum Package Body Temperature (T) 240ç 260ç 10ç 10ç 5 sec 5 sec Maximum Delta T between Body and PWB at Liquidus Package Body Exposure Limit at Maximum Temperature Comment Other components may limit ramp rate to 2ç/sec Soak requirements determined by board design, oven capability, and paste activation requirements Caution - "oversoaking" may exhaust flux and affect soldering Cooler peak temperatures may require longer TAL's Shorter TAL's may require higher peak temperatures Faster cooling rates produce finer grain structures and smoother joint appearances Open body design allows for low delta T between package and solder joint Standard practice is easy to achieve with open body design Adjust profile if maximum exposure limit is approached or exceeded Max Body Temp 260 225 MaxPeak Temp 250 205 Min Peak Temp 183 Melting Point Reflow ｡ SnAgCu Temperatures ( C) 240 230 217 Soak Min Soak Temp nal) (optio Pr eh ea t 140 21 160 ol Co ｡ SnPb Temperatures( C) Reflow Profile Time, typically 3 to 7 minutes total 21 Different solder pastes have different thermal performance characteristics. Consult with paste manufacturer for optimum profile settings. Check thermal exposure limits of PWB laminate if processing with Pb-free solder. 13 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Mating self alignment * Unit: mm +/-0.8 X-direction +/-0.6 Y-direction ■Mating tolerance Due to its 3-piece design, the IT3 connector system can accept mating tolerances of up to ±0.3mm tolerance in the X-axis and up to ±0.2mm in the Y-axis. +/-0.3 X-direction 14 +/-0.2 Y-direction IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Packaging information Please order per box with its Minimum Order Quantity (MOQ) of connectors contained. The number for each configuration is shown below. ●Receptacles µm IT 3** - ***S - BGA(57)...SnPb / Au0.76µ µm IT 3** - ***S - BGA(37)...Pb-Free / Au0.76µ (1) (2) Unit: pcs (2) (1) M D M* D* 100S 180S 200S 300S 120 120 ------------------- 72 72 48 48 ------------------- 72 72 ------------------- ------------------- This is also a packaging quantity, therefore please multiply integrally based on this MOQ quantity when you place more. Ex.) 240pcs of IT3M-300S-BGA(57) (= 5 of vacuum packed boxes) Dry package and deoxidizer Box Cushion materials Three trays + One empty tray as lid Bundle 15 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Packaging information ●Interposers µm IT 3 - ***P - **H(03)...Au0.76µ (3) (4) Unit: pcs (3) (4) 17H 20H 22H 25H 26H 28H 30H 32H 38H 40H 100P 180P 200P 300P ---------- ---------------------------- 80 80 80 80 80 40 40 40 40 40 60 60 60 60 60 30 30 30 30 30 100 ---------- 100 100 50 ------------------- 50 50 80 ---------- 40 ------------------------------------- This is also a packaging quantity, therefore please multiply integrally based on this MOQ quantity when you place more. Ex.) 240pcs of IT3M-300S-BGA(57) (= 5 of vacuum packed boxes) Box Cushion materials One or two trays (depending on height) +One empty tray as lid 16 Bundle IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Tray information Chamfer (Connector Column1) X3 31 31 31 31 31 31 31 31 Y3 18 32.8 32.8 135.9±0.5 32.8 18.75 31 Tape (3.8) 315±0.5 JEDEC Tray for IT3M 100 Position Receptacles Chamfer (Connector Column1) X3 51.7 51.7 51.7 51.7 28.25 Y3 32.8 32.8 135.9±0.5 32.8 18.75 51.7 Tape (3.8) 315±0.5 JEDEC Tray for IT3M 200 Position Receptacles X3 77.6 77.6 Chamfer (Connector Column1) 41.1 Y3 (3.8) 32.8 32.8 135.9±0.5 32.8 18.75 77.6 315±0.5 Cap JEDEC Tray for IT3M 300 Position Receptacles 17 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Tray information (con’t) X3 31 31 31 31 31 31 31 31 Chamfer (Connector Column1) 18 Y3 32.8 32.8 135.9±0.5 32.8 18.75 31 (3.8) Tape 315±0.5 JEDEC Tray for IT3D 100 Position Receptacles X3 51.7 51.7 51.7 51.7 51.7 Chamfer (Connector Column1) 28.25 32.8 32.8 135.9±0.5 32.8 18.75 Y3 Tape (3.8) 315±0.5 JEDEC Tray for IT3D 200 Position Receptacles X3 77.6 77.6 41.1 Y3 32.8 32.8 135.9±0.5 32.8 18.75 77.6 Chamfer (Connector Column1) (3.8) 315±0.5 JEDEC Tray for IT3D 300 Position Receptacles 18 Cap IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors NOTES : 19 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors USA: HIROSE ELECTRIC (U.S.A.), INC. North California Office 20400 Stevens Creek Blvd., Ste 250, Cupertino, CA 95014 Phone : 1-408-253-9640 Fax : 1-408-253-9641 http://www.hiroseusa.com USA: HIROSE ELECTRIC (U.S.A.), INC. Dallas Office 1701 N. Greenville Ave. Ste 817, Richardson, TX 75081 Phone : 1-469-330-9200 Fax : 1-469-330-9205 http://www.hiroseusa.com USA: USA: HIROSE ELECTRIC (U.S.A.), INC. New York Office HIROSE ELECTRIC (U.S.A.), INC. Chicago Office 2777 Finley Road, Suite 19 Downers Grove, 510 Broadhollow Road, Suite 305, Melville, NY 11747 IL 60515 Phone : 1-516-249-5259 Phone : 1-630-916-1455 http://www.hiroseusa.com Fax : 1-630-916-1451 http://www.hiroseusa.com USA: HIROSE ELECTRIC (U.S.A.), INC. Detroit Office (Automotive) 37650 Professional Center Drive, Suite 120A, Livonia, MI 48154 Phone : 1-734-542-9963 Fax : 1-734-542-9964 http://www.hiroseusa.com USA: HIROSE ELECTRIC (U.S.A.), INC. Headquarters 2688 Westhills Court, Simi Valley, CA 93065-6235 Phone : 1-805-522-7958 Fax : 1-805-522-3217 http://www.hiroseusa.com GERMANY: HIROSE ELECTRIC GmbH Herzog-Carl-Strasse 4 D-73760 Ostfildern (Scharnhauser Park) Phone : 49-711-4560-02-1 Fax : 49-711-4560-02-299 http://www.hirose.de FINLAND: HIROSE ELECTRIC EUROPE B.V. FINLAND OFFICE Teknobulevardi 3-5 01530 VANTAA Phone : 358-46-712-2178 Fax : 358-46-712-2179 http://www.hiroseeurope.com CHINA: UNITED KINGDOM: HIROSE ELECTRIC UK LTD. HIROSE ELECTRIC CO., LTD. BEIJING REPRESENTATIVE OFFICE First Floor, St Andrews House, Caldecotte Lake A1205, Ocean International Center, Building 56# East 4th Business Park, Milton Keynes MK7 8LE Ring Middle Road, Chao Yang District, Beijing, 100025 Phone : 44-1908-369060 Phone : 86-10-5165-9332 Fax : 44-1908-369078 Fax : 86-10-5908-1381 http://www.hirose.co.uk http://www.hirose-china.com.cn CHINA: HIROSE ELECTRIC (SHANGHAI) CO., LTD. 1501-02, Cross Tower Building, 318 Fuzhou Road, Huang Pu District, Shanghai 200001 Phone : 86-21-6391-3355 Fax : 86-21-6391-3335 http://www.hirose-china.com.cn CHINA: HIROSE ELECTRIC CO., LTD. SHENZHEN OFFICE Room 1902-05, Office Tower Shun Hing Square, Di Wang Commercial Centre 5002, ShenNanDong Road, ShenZhen City, Guangdong Province, 518008 Phone : 86-755-8207-0851 Fax : 86-755-8207-0873 http://www.hirose-china.com.cn HONG KONG: HIROSE ELECTRIC HONGKONG TRADING CO., LTD. Unit 1102 A&B, Energy Plaza, 92 Granville Road, Tsim Sha Tsui East, Kowloon Phone : 852-2803-5338 Fax : 852-2591-6560 http://www.hirose-hongkong.com.hk TAIWAN: HIROSE ELECTRIC TAIWAN CO., LTD. No.28 Lane 247 Sec. 2, Yen Ping N, Rd. Taipei Phone : 886-2-2557-7351,7352 Fax : 886-2-2552-9851 http://www.hirose-taiwan.com.tw SINGAPORE: HIROSE ELECTRIC CO., LTD. Singapore Branch 10 Anson Road #26-16 International Plaza 079903 Phone : 65-6324-6113 Fax : 65-6324-6123 http://www.hirose-singapore.com.sg KOREA: HIROSE KOREA CO., LTD. 1261-10, Jeoungwhang-Dong, Shihung-City, Kyunggi-Do 429-450 Phone : 82-31-496-7000,7124 Fax : 82-31-496-7100 http://www.hirose.co.kr ® 20 THE NETHERLANDS: HIROSE ELECTRIC EUROPE B.V. Hogehillweg #8 1101 CC Amsterdam Z-O Phone : 31-20-6557490 Fax : 31-20-6557469 http://www.hiroseeurope.com 5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN PHONE: 81-3-3491-5300, FAX: 81-3-3495-5230 http://www.hirose.com http://www.hirose-connectors.com The contents of this catalog are current as of date of 02/2010. Contents are subject to change without notice for the purpose of improvements.