SCLS034F − DECEMBER 1982 − REVISED NOVEMBER 2004 D D D Wide Operating Voltage Range of 2 V to 6 V Outputs Can Drive Up To 10 LSTTL Loads Low Power Consumption, 20-µA Max ICC Typical tpd = 14 ns ±4-mA Output Drive at 5 V Low Input Current of 1 µA Max Operation From Very Slow Input Transitions Temperature-Compensated Threshold Levels High Noise Immunity Same Pinouts as ’HC00 SN54HC132 . . . J OR W PACKAGE SN74HC132 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW) 1A 1B 1Y 2A 2B 2Y GND 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4B 4A 4Y 3B 3A 3Y SN54HC132 . . . FK PACKAGE (TOP VIEW) 1B 1A NC VCC 4B D D D D D D D description/ordering information Each circuit functions as a NAND gate, but because of the Schmitt action, it has different input threshold levels for positive- and negative-going signals. The ’HC132 devices perform the Boolean function Y = A • B or Y = A + B in positive logic. 1Y NC 2A NC 2B 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 4A NC 4Y NC 3B 2Y GND NC 3Y 3A These circuits are temperature compensated and can be triggered from the slowest of input ramps and still give clean jitter-free output signals. 4 NC − No internal connection ORDERING INFORMATION PACKAGE† TA PDIP − N SN74HC132N Tube of 50 SN74HC132D Reel of 2500 SN74HC132DR Reel of 250 SN74HC132DT SOP − NS Reel of 2000 SN74HC132NSR HC132 SSOP − DB Reel of 2000 SN74HC132DBR HC132 Tube of 90 SN74HC132PW Reel of 2000 SN74HC132PWR Reel of 250 SN74HC132PWT CDIP − J Tube of 25 SNJ54HC132J SNJ54HC132J CFP − W Tube of 150 SNJ54HC132W SNJ54HC132W LCCC − FK Tube of 55 SNJ54HC132FK TSSOP − PW −55°C −55 C to 125 125°C C TOP-SIDE MARKING Tube of 25 SOIC − D −40°C −40 C to 85 85°C C ORDERABLE PART NUMBER SN74HC132N HC132 HC132 SNJ54HC132FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($% %$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- )!,'&$% &")+#$ $ 34 #++ )#!#"($(!% #!( $(%$(, '+(%% $.(!0%( $(,- #++ $.(! )!,'&$% )!,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCLS034F − DECEMBER 1982 − REVISED NOVEMBER 2004 FUNCTION TABLE (each gate) INPUTS A B OUTPUT Y H H L L X H X L H logic diagram (positive logic) A Y B absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54HC132 MIN VCC VI Supply voltage 2 Input voltage 0 VO TA Output voltage Operating free-air temperature NOM 5 SN74HC132 MAX MIN NOM 5 6 2 0 0 VCC VCC −55 125 MAX UNIT 6 V V 0 VCC VCC −40 85 °C V NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS034F − DECEMBER 1982 − REVISED NOVEMBER 2004 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VT+ VT− MAX SN74HC132 MIN MAX 2V 0.7 1.2 1.5 0.7 1.5 0.7 1.5 4.5 V 1.55 2.5 3.15 1.55 3.15 1.55 3.15 6V 2.1 3.3 4.2 2.1 4.2 2.1 4.2 2V 0.3 0.6 1 0.3 1 0.3 1 4.5 V 0.9 1.6 2.45 0.9 2.45 0.9 2.45 6V 1.2 2 3.2 1.2 3.2 1.2 3.2 UNIT V V 0.6 1.2 0.2 1.2 0.2 1.2 0.4 0.9 2.1 0.4 2.1 0.4 2.1 6V 0.5 1.3 2.5 0.5 2.5 0.5 2.5 2V 1.9 1.998 1.9 1.9 IOH = −20 µA 4.5 V 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 IOH = −4 mA IOH = −5.2 mA 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 5.34 2V 0.002 0.1 0.1 0.1 IOL = 20 µA 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 6V ±0.1 ±100 ±1000 ±1000 nA 2 40 20 µA 10 10 10 pF IOL = 4 mA IOL = 5.2 mA VI = VCC or 0 VI = VCC or 0, MIN 0.2 VI = VIH or VIL II ICC SN54HC132 2V VI = VIH or VIL VOL TA = 25°C TYP MAX 4.5 V VT+ − VT− VOH MIN IO = 0 6V Ci 2 V to 6 V 3 V V V switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) TA = 25°C MIN TYP MAX SN54HC132 SN74HC132 PARAMETER FROM (INPUT) TO (OUTPUT) VCC 2V 60 120 186 156 tpd A or B Y 4.5 V 18 25 37 31 6V 14 21 32 27 2V 28 75 110 95 4.5 V 8 15 22 19 6V 6 13 19 16 tt Any MIN MAX MIN MAX UNIT ns ns operating characteristics, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per gate POST OFFICE BOX 655303 No load • DALLAS, TEXAS 75265 TYP 20 UNIT pF 3 SCLS034F − DECEMBER 1982 − REVISED NOVEMBER 2004 PARAMETER MEASUREMENT INFORMATION From Output Under Test Test Point Input VCC 50% 50% 0V CL = 50 pF (see Note A) tPLH In-Phase Output LOAD CIRCUIT 50% 10% tPHL 90% 90% tr Input 50% 10% 90% 90% tr VCC 50% 10% 0 V tPHL Out-of-Phase Output 90% tf VOH 50% 10% VOL tf tPLH 50% 10% tf 50% 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time, with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-89845022A ACTIVE LCCC FK 20 1 TBD 5962-8984502CA ACTIVE CDIP J 14 1 TBD Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type 5962-8984502DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type 5962-8984502VCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type 5962-8984502VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type N / A for Pkg Type SN54HC132J ACTIVE CDIP J 14 1 TBD A42 SNPB SN74HC132D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU SN74HC132DBLE OBSOLETE SSOP DB 14 SN74HC132DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132DT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132DTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC132NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC132NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132PWLE OBSOLETE TSSOP PW 14 SN74HC132PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132PWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC132PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD TBD Addendum-Page 1 Call TI Call TI Level-1-260C-UNLIM Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SNJ54HC132FK ACTIVE LCCC FK 20 1 TBD SNJ54HC132J ACTIVE CDIP J 14 1 TBD SNJ54HC132W ACTIVE CFP W 14 1 SNV54HC132J ACTIVE CDIP J 14 SNV54HC132W ACTIVE CFP W 14 Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type TBD A42 N / A for Pkg Type TBD Call TI Call TI TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Mailing Address: Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2006, Texas Instruments Incorporated