FSTD3306 2-Bit Low-Power Bus Switch with Level Shifting Features Description The FSTD3306 is a 2-bit ultra high-speed CMOS FET bus switch with enhanced level-shifting circuitry and TTL-compatible active LOW control inputs. The low on resistance of the switch allows inputs to be connected to outputs with minimal propagation delay and without generating additional ground bounce noise. The device is organized as a 2-bit switch with independent busenable ( BE ) controls. When BE is LOW, the switch is ON and Port A is connected to Port B. When BE is HIGH, the switch is OPEN and a high-impedance state exists between the two ports. Reduced voltage drive to the gate of the FET switch permits nominal level shifting of 5V to 3V through the switch. Control inputs tolerate voltages up to 5.5V independent of VCC. Typical 3Ω switch resistance at 5.0V VCC, VIN = 0V Level shift facilitates 5V to 3.3V interfacing Minimal propagation delay through the switch Power down high impedance input/output Zero bounce in flow-through mode TTL compatible active LOW control inputs Control inputs are over-voltage tolerant Ordering Information Part Number Top Mark Package Operating PbTemperature Packing Method Free Range FSTD3306MTCX FD3306 8-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Yes -40 to +85°C Tape & Reel FSTD3306MTC Yes -40 to +85°C Tube Yes -40 to +85°C 5000 units on Reel FD3306 8-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide FSTD3306L8X TD 8-Lead MicroPak™ Logic Diagram Figure 1. © 2001 Fairchild Semiconductor Corporation FSTD3306 Rev. 1.2.2 • 8/9/06 Logical Connections for the FSTD3306 www.fairchildsemi.com FSTD3306 2-Bit Low-Power Bus Switch with Level Shifting August 2006 VCC BE1 1 1A 2 1B 3 8 4 7 BE2 6 2B 5 2A GND Figure 2. TSSOP Pin Outs (Top View) Figure 3. Pin Definitions Pin Description A Bus A switch I/O B Bus B switch I/O BE Bus enable input MicroPak Pin Outs (Top View) FSTD3306 2-Bit Low-Power Bus Switch with Level Shifting Connections Diagram Function Table Bus Enable Input ( BE ) Function LOW Logic Level B connected to A HIGH Logic Level Disconnected © 2001 Fairchild Semiconductor Corporation FSTD3306 Rev. 1.2.2 • 8/9/06 www.fairchildsemi.com 2 The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum ratings. The “Recommended Operating Conditions” table defines the conditions for actual device operation. Symbol Parameter VCC Supply Voltage VS DC Switch Voltage Condition (1) VIN DC Output Voltage IIK DC Input Diode Current IOUT DC Output Sink Current ICC/IGND DC VCC or Ground Current TSTG Storage Temperature Range Min. Max Unit - 0.5 + 7.0 V - 0.5 + 7.0 V - 0.5 + 7.0 V VIN < 0V Typ. - 50 mA 128 mA ± 100 mA - 65 +150 °C TJ Junction Temperature under Bias + 150 °C TL Junction Lead Temperature (Soldering, 10 Seconds) + 260 °C PD Power Dissipation at +85°C 250 mW Notes: 1. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. Recommended Operating Conditions(2) Symbol Parameter VCC Supply Voltage VIN VIN Condition Min. Typ. Max Unit 4.5 5.5 V Control Input Voltage 0.0 5.5 V Switch Input Voltage 0.0 5.5 V VOUT Switch Output Voltage 0.0 5.5 V TA Operating Temperature - 40 + 85 °C tr, tf Input Rise and Fall Time ΘJA Thermal Resistance Control Input 0 5 ns/V Switch I/O 0 DC ns/V 250 FSTD3306 2-Bit Low-Power Bus Switch with Level Shifting Absolute Maximum Ratings °C/W Notes: 2. Unused logic inputs must be held HIGH or LOW. They may not float. © 2001 Fairchild Semiconductor Corporation FSTD3306 Rev. 1.2.2 • 8/9/06 www.fairchildsemi.com 3 Ambient temperature (TA) is -40°C to +85° unless otherwise specified. Symbol VIK Parameters Conditions HIGH-Level Input Voltage 4.5-5.5 VIL LOW-Level Input Voltage 4.5-5.5 IIN IOFF RON ICC Typ. Max. -1.2 VIH VOH Min. 4.5 IIN = - 18 mA Clamp Diode Voltage VCC (V) 2.0 Unit V V 0.8 (3) 4.5-5.5 V V HIGH-Level Output Voltage VIN = VCC Input Leakage Current 0 ≤ VIN ≤ 5.5V 5.5 ±1.0 µA Power OFF Leakage Current 0 ≤ A, B ≤ VCC 5.5 ±1.0 µA VIN = 0V, IIN = 64mA 4.5 3 7 Ω VIN = 0V, IIN = 30mA 4.5 3 7 Ω VIN = 2.4V, IIN = 15mA 4.5 15 50 Ω VIN = VCC or GND, IOUT = 0 5.5 1.1 1.5 mA 10 µA 2.5 mA (4) Switch On Resistance BE 1 = BE 2 = GND Quiescent Supply Current VIN = VCC or GND, IOUT = 0 5.5 BE 1 = BE 2 = VCC ΔICC VIN = 3.4V, IO = 0, one control input only, (5) Increase in ICC per Input 5.5 1 other BE = VCC Notes: 3. For typical DC characteristics, see Figures 7-9. 4. Measured by the voltage drop between A and B pins at the indicated current through the switch. On resistance is determined by the lower of the voltages on the two (A or B) pins. 5. Increase per TTL-driven input (VIN = 3.4V, control input only). A and B pins do not contribute to ICC. FSTD3306 2-Bit Low-Power Bus Switch with Level Shifting DC Electrical Characteristics AC Electrical Characteristics Ambient temperature (TA) is -40°C to +85° and CL = 50pF, RU = RD = 500Ω unless otherwise specified. Symbol Parameter Conditions tPHL, tPLH Propagation Delay Bus-to-Bus tPZL, tPZH tPLZ, tPHZ (6) VCC (V) Min. Typ. Max. Unit 0.25 ns VI = OPEN 4.5 - 5.5 Output Enable Time VI = 7V for tPZL, VI = 0V for tPZH 4.5 - 5.5 1.0 3.5 5.8 ns Output Disable Time VI = 7V for tPLZ, VI = 0V for tPHZ 4.5 - 5.5 0.8 3.5 4.8 ns Notes: 6. This parameter is guaranteed. The bus switch contributes no propagation delay other than the RC delay of the typical on resistance of the switch and the 50pF load capacitance when driven by an ideal voltage source (zero output impedance). The specified limit is calculated on this basis. Capacitance Symbol CIN Parameter Control Pin Input Capacitance Conditions Typ. VCC = 0V 2.5 pF pF pF CI/O (OFF) Port OFF Capacitance VCC = 5.0V = BE 6 CI/O (ON) Port ON Capacitance VCC = 5.0V, BE = 0V 12 © 2001 Fairchild Semiconductor Corporation FSTD3306 Rev. 1.2.2 • 8/9/06 Unit www.fairchildsemi.com 4 Figure 4. AC Test Circuit. Input driven by 50Ω source-terminated in 50Ω. CL includes load and stray capacitance. Input PRR = 1.0 MHz; TW = 500ns. © 2001 Fairchild Semiconductor Corporation FSTD3306 Rev. 1.2.2 • 8/9/06 Figure 5. AC Waveform Figure 6. AC Waveform FSTD3306 2-Bit Low-Power Bus Switch with Level Shifting AC Loading and Waveforms www.fairchildsemi.com 5 Figure 7. Typical High-Level Output Voltage vs. Supply Voltage (TA = -40°C, VIN = VCC) Figure 8. Typical High-Level Output Voltage vs. Supply Voltage (TA = 25°C, VIN = VCC) Figure 9. Typical High-Level Output Voltage vs. Supply Voltage (TA = 85°C, VIN = VCC) © 2001 Fairchild Semiconductor Corporation FSTD3306 Rev. 1.2.2 • 8/9/06 FSTD3306 2-Bit Low-Power Bus Switch with Level Shifting DC Characteristics www.fairchildsemi.com 6 Tape Format MicroPak Package Designator Tape Section Number Cavities Cavity Status Cover Tape Status L8X Leader (Start End) Carrier Trailer (Hub End) 125 (typ.) 5000 75 (typ.) Empty Filled Empty Sealed Sealed Sealed Tape Dimensions Dimensions are in millimeters unless otherwise noted. © 2001 Fairchild Semiconductor Corporation FSTD3306 Rev. 1.2.2 • 8/9/06 FSTD3306 2-Bit Low-Power Bus Switch with Level Shifting Tape and Reel Specifications www.fairchildsemi.com 7 Tape Size A B C D N W1 W2 W23 8mm 7.0 (177.8) 0.059 (1.50) 0.512 (13.00) 0.795 (20.20) 2.165 (55.00) .0331 +0.059 / -0.000 (8.40 +1.50 / -0.00) 0.567 (14.40) W1 +0.078 / -0.039 (W1 +2.00 / -1.00) © 2001 Fairchild Semiconductor Corporation FSTD3306 Rev. 1.2.2 • 8/9/06 FSTD3306 2-Bit Low-Power Bus Switch with Level Shifting Reel Dimensions www.fairchildsemi.com 8 FSTD3306 2-Bit Low-Power Bus Switch with Level Shifting Physical Dimensions Dimensions are in millimeters unless otherwise noted. Figure 10. © 2001 Fairchild Semiconductor Corporation FSTD3306 Rev. 1.2.2 • 8/9/06 8-Lead MicroPak, 1.6mm-wide Package www.fairchildsemi.com 9 FSTD3306 2-Bit Low-Power Bus Switch with Level Shifting Physical Dimensions Dimensions are in millimeters unless otherwise noted. Figure 11. 8-Lead Thin Shrink Small Outline (TSSOP), JEDEC MO-153, 4.4mm-wide Package © 2001 Fairchild Semiconductor Corporation FSTD3306 Rev. 1.2.2 • 8/9/06 www.fairchildsemi.com 10 ACEx™ ActiveArray™ Bottomless™ Build it Now™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™ 2 E CMOS™ EnSigna™ FACT™ FACT Quiet Series™ ® FAST FASTr™ FPS™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ 2 I C™ i-Lo™ ImpliedDisconnect™ IntelliMAX™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ ® OPTOLOGIC OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ ® PowerTrench ® QFET QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ ScalarPump™ μSerDes™ ® SILENT SWITCHER SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TCM™ TinyBoost™ TinyBuck™ ® TinyLogic TINYOPTO™ TinyPower™ TinyPWM™ TruTranslation™ UHC™ ® UltraFET UniFET™ VCX™ Wire™ Across the board. Around the world.™ Programmable Active Droop™ ® The Power Franchise DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. FSTD3306 2-Bit Low-Power Bus Switch with Level Shifting TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Definition Preliminary First Production This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I20 © 2001 Fairchild Semiconductor Corporation FSTD3306 Rev. 1.2.2 • 8/9/06 www.fairchildsemi.com 11