ON MSC2295-BT1G Npn rf amplifier transistors surface mount Datasheet

MSC2295−BT1,
MSC2295−CT1
Preferred Device
NPN RF Amplifier
Transistors Surface Mount
Features
http://onsemi.com
• Pb−Free Packages are Available
COLLECTOR
3
MAXIMUM RATINGS (TA = 25°C)
Symbol
Value
Unit
Collector−Base Voltage
Rating
V(BR)CBO
30
Vdc
Collector−Emitter Voltage
V(BR)CEO
20
Vdc
Emitter−Base Voltage
V(BR)EBO
5.0
Vdc
IC
30
mAdc
Symbol
Max
Unit
Power Dissipation
PD
200
mW
Junction Temperature
TJ
150
°C
Storage Temperature
Tstg
−55 to +150
°C
Collector Current − Continuous
2
BASE
1
EMITTER
THERMAL CHARACTERISTICS
Characteristic
3
2
1
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
MARKING DIAGRAM
Vx M G
G
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic
Symbol
Collector−Base Cutoff Current
(VCB = 10 Vdc, IE = 0)
ICBO
DC Current Gain (Note 1)
(VCB = 10 Vdc, IC = −1.0 mAdc)
MSC2295−BT1
MSC2295−CT1
hFE
Collector−Gain — Bandwidth Product
(VCB = 10 Vdc, IE = −1.0 mAdc)
Reverse Transistor Capacitance
(VCE = 10 Vdc,
IC = 1.0 mAdc, f = 10.7 MHz)
SC−59
CASE 318D
Min
Max
−
0.1
Unit
mAdc
−
70
110
140
220
150
−
fT
MHz
Vx
= Device Code
x= B or C
M = Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Cre
pF
−
1.5
1. Pulse Test: Pulse Width ≤ 300 ms, D.C. ≤ 2%.
Shipping †
Device
Package
MSC2295−BT1
SC−59
3000/Tape & Reel
SC−59
(Pb−Free)
3000/Tape & Reel
SC−59
3000/Tape & Reel
SC−59
(Pb−Free)
3000/Tape & Reel
MSC2295−BT1G
MSC2295−CT1
MSC2295−CT1G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
January, 2006 − Rev. 4
1
Publication Order Number:
MSC2295−BT1/D
MSC2295−BT1, MSC2295−CT1
PACKAGE DIMENSIONS
SC−59
CASE 318D−04
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
D
3
HE
2
DIM
A
A1
b
c
D
E
e
L
HE
E
1
b
e
MIN
1.00
0.01
0.35
0.09
2.70
1.30
1.70
0.20
2.50
MILLIMETERS
NOM
MAX
1.15
1.30
0.06
0.10
0.43
0.50
0.14
0.18
2.90
3.10
1.50
1.70
1.90
2.10
0.40
0.60
2.80
3.00
MIN
0.039
0.001
0.014
0.003
0.106
0.051
0.067
0.008
0.099
INCHES
NOM
0.045
0.002
0.017
0.005
0.114
0.059
0.075
0.016
0.110
MAX
0.051
0.004
0.020
0.007
0.122
0.067
0.083
0.024
0.118
C
A
L
A1
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.4
0.094
1.0
0.039
0.8
0.031
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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2
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MSC2295−BT1/D
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