Material Content Data Sheet Sales Product Name IPP80N06S2-09 MA# MA000275616 Package PG-TO220-3-1 Issued 29. August 2013 Weight* 2036.67 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 5.888 0.29 0.816 0.04 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.29 2891 2891 401 0.245 0.01 815.335 40.04 40.09 400326 120 400848 5.477 0.27 0.27 2689 2689 8.891 0.44 4365 97.801 4.80 486.040 23.86 29.10 238644 291029 21.462 1.05 1.05 10538 10538 0.244 0.01 0.001 0.00 0.106 0.01 0.085 0.00 4.049 0.20 0.177 0.01 0.590 0.03 589.466 28.94 48020 120 0.01 1 42 0.21 1988 2. 3. 290 28.98 289426 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2082 87 Important Remarks: 1. 120 52 289803 1000000