MMSZxxxET1G Series, SZMMSZxxxET1G Series Zener Voltage Regulators 500 mW SOD−123 Surface Mount Three complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style. http://onsemi.com Specification Features 500 mW Rating on FR−4 or FR−5 Board Wide Zener Reverse Voltage Range − 2.4 V to 56 V Package Designed for Optimal Automated Board Assembly Small Package Size for High Density Applications ESD Rating of Class 3 (> 16 kV) per Human Body Model Peak Power − 225 W (8 X 20 ms) AEC−Q101 Qualified and PPAP Capable SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements Pb−Free Packages are Available* SOD−123 CASE 425 STYLE 1 1 Cathode 2 Anode MARKING DIAGRAM Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 1 xxx MG G 260C for 10 Seconds POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V−0 xxx = Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) MAXIMUM RATINGS Rating Symbol Peak Power Dissipation @ 20 ms (Note 1) @ TL 25C Ppk Total Power Dissipation on FR−5 Board, (Note 2) @ TL = 75C Derated above 75C PD Max Unit W 225 500 6.7 mW mW/C Thermal Resistance, Junction−to−Ambient (Note 3) RqJA 340 C/W Thermal Resistance, Junction−to−Lead (Note 3) RqJL 150 C/W TJ, Tstg −55 to +150 Junction and Storage Temperature Range C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Nonrepetitive current pulse per Figure 11 2. FR−5 = 3.5 X 1.5 inches, using the ON minimum recommended footprint 3. Thermal Resistance measurement obtained via infrared Scan Method ORDERING INFORMATION Package Shipping† MMSZxxxET1G SOD−123 (Pb−Free) 3,000 / Tape & Reel SZMMSZxxxET1G SOD−123 (Pb−Free) 3,000 / Tape & Reel MMSZxxxET3G SOD−123 (Pb−Free) 10,000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 January, 2012 − Rev. 7 1 Publication Order Number: MMSZ2V4ET1/D MMSZxxxET1G Series, SZMMSZxxxET1G Series ELECTRICAL CHARACTERISTICS (TA = 25C unless I otherwise noted, VF = 0.95 V Max. @ IF = 10 mA) Symbol IF Parameter VZ Reverse Zener Voltage @ IZT IZT Reverse Current ZZT Maximum Zener Impedance @ IZT IR Reverse Leakage Current @ VR VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF VZ VR V IR VF IZT Zener Voltage Regulator ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA) VZ1 (V) (Notes 4 and 5) ZZT1 (Note 6) VZ2 (V) (Notes 4 and 5) @ IZT1 = 5 mA ZZT2 (Note 6) Max Reverse Leakage Current @ IZT2 = 1 mA IR @ VR Device Marking Min Nom Max W Min Max W mA V MMSZ2V4ET1G MMSZ2V7ET1G MMSZ3V0ET1G MMSZ3V3ET1G MMSZ3V6ET1G CL1 CL2 CL3 CL4 CL5 2.28 2.57 2.85 3.14 3.42 2.4 2.7 3.0 3.3 3.6 2.52 2.84 3.15 3.47 3.78 100 100 95 95 90 1.7 1.9 2.1 2.3 2.7 2.1 2.4 2.7 2.9 3.3 600 600 600 600 600 50 20 10 5 5 1 1 1 1 1 MMSZ3V9ET1G MMSZ4V3ET1G MMSZ4V7ET1G MMSZ5V1ET1G CL6 CL7 CL8 CL9 3.71 4.09 4.47 4.85 3.9 4.3 4.7 5.1 4.10 4.52 4.94 5.36 90 90 80 60 2.9 3.3 3.7 4.2 3.5 4.0 4.7 5.3 600 600 500 480 3 3 3 2 1 1 2 2 MMSZ5V6ET1G CM1 5.32 5.6 5.88 40 4.8 6.0 400 1 2 MMSZ6V2ET1G CM2 5.89 6.2 6.51 10 5.6 6.6 150 3 4 MMSZ6V8ET1G MMSZ7V5ET1G MMSZ8V2ET1G MMSZ9V1ET1G CM3 CM4 CM5 CM6 6.46 7.13 7.79 8.65 6.8 7.5 8.2 9.1 7.14 7.88 8.61 9.56 15 15 15 15 6.3 6.9 7.6 8.4 7.2 7.9 8.7 9.6 80 80 80 100 2 1 0.7 0.5 4 5 5 6 MMSZ10ET1G MMSZ11ET1G MMSZ12ET1G MMSZ13ET1G MMSZ15ET1G CM7 CM8 CM9 CN1 CN2 9.50 10.45 11.40 12.35 14.25 10 11 12 13 15 10.50 11.55 12.60 13.65 15.75 20 20 25 30 30 9.3 10.2 11.2 12.3 13.7 10.6 11.6 12.7 14.0 15.5 150 150 150 170 200 0.2 0.1 0.1 0.1 0.05 7 8 8 8 10.5 MMSZ16ET1G MMSZ18ET1G CN3 CN4 15.20 17.10 16 18 16.80 18.90 40 45 15.2 16.7 17.0 19.0 200 225 0.05 0.05 11.2 12.6 MMSZ20ET1G MMSZ22ET1G MMSZ24ET1G CN5 CN6 CN7 19.00 20.90 22.80 20 22 24 21.00 23.10 25.20 55 55 70 18.7 20.7 22.7 21.1 23.2 25.5 225 250 250 0.05 0.05 0.05 14 15.4 16.8 Device* 4. The type numbers shown have a standard tolerance of 5% on the nominal Zener Voltage. 5. Tolerance and Voltage Designation: Zener Voltage (VZ) is measured with the Zener Current applied for PW = 1 ms. 6. ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for IZ(AC) = 0.1 IZ(DC), with the AC frequency = 1 kHz. Devices listed in bold, italic are ON Semiconductor Preferred devices. Preferred devices are recommended choices for future use and best overall value. *Include SZ-prefix devices where applicable. http://onsemi.com 2 MMSZxxxET1G Series, SZMMSZxxxET1G Series ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA) VZ1 (V) (Notes 7 and 8) ZZT1 (Note 9) @ IZT1 = 2 mA VZ2 (V) (Notes 7 and 8) ZZT2 (Note 9) Max Reverse Leakage Current @ IZT2 = 0.1 mA @ IZT2 = 0.5 mA IR @ VR Device Marking Min Nom Max W Min Max W mA V MMSZ27ET1G MMSZ30ET1G MMSZ33ET1G MMSZ36ET1G MMSZ39ET1G CN8 CN9 CP1 CP2 CP3 25.65 28.50 31.35 34.20 37.05 27 30 33 36 39 28.35 31.50 34.65 37.80 40.95 80 80 80 90 130 25 27.8 30.8 33.8 36.7 28.9 32 35 38 41 300 300 325 350 350 0.05 0.05 0.05 0.05 0.05 18.9 21 23.1 25.2 27.3 MMSZ43ET1G MMSZ47ET1G MMSZ51ET1G MMSZ56ET1G CP4 CP5 CP6 CP7 40.85 44.65 48.45 53.20 43 47 51 56 45.15 49.35 53.55 58.80 150 170 180 200 39.7 43.7 47.6 51.5 46 50 54 60 375 375 400 425 0.05 0.05 0.05 0.05 30.1 32.9 35.7 39.2 Device* 7. The type numbers shown have a standard tolerance of 5% on the nominal Zener Voltage. 8. Tolerance and Voltage Designation: Zener Voltage (VZ) is measured with the Zener Current applied for PW = 1 ms. 9. ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for IZ(AC) = 0.1 IZ(DC), with the AC frequency = 1 kHz. Devices listed in bold, italic are ON Semiconductor Preferred devices. Preferred devices are recommended choices for future use and best overall value. *Include SZ-prefix devices where applicable. http://onsemi.com 3 MMSZxxxET1G Series, SZMMSZxxxET1G Series 8 100 7 TYPICAL TC VALUES FOR MMSZxxxT1G SERIES, SZMMSZxxxT1G SERIES 6 5 4 10 VZ, TEMPERATURE COEFFICIENT (mV/C) VZ, TEMPERATURE COEFFICIENT (mV/C) TYPICAL CHARACTERISTICS VZ @ IZT 3 2 1 0 −1 −2 1−3 2 3 4 5 6 7 8 9 10 VZ, NOMINAL ZENER VOLTAGE (V) 11 TYPICAL TC VALUES FOR MMSZxxxT1G SERIES, SZMMSZxxxT1G SERIES VZ @ IZT 12 10 100 VZ, NOMINAL ZENER VOLTAGE (V) Figure 1. Temperature Coefficients (Temperature Range − 55C to +150C) Figure 2. Temperature Coefficients (Temperature Range − 55C to +150C) 1000 Ppk, PEAK SURGE POWER (WATTS) P D, POWER DISSIPATION (WATTS) 1.2 1.0 PD versus TL 0.8 0.6 100 PD versus TA 0.4 0.2 0 0 25 50 75 100 T, TEMPERATURE (C) RECTANGULAR WAVEFORM, TA = 25C 125 10 1 150 0.1 Figure 3. Steady State Power Derating 1000 1000 IZ = 1 mA TJ = 25C IZ(AC) = 0.1 IZ(DC) f = 1 kHz IF, FORWARD CURRENT (mA) Z ZT, DYNAMIC IMPEDANCE ( ) 10 100 PW, PULSE WIDTH (ms) Figure 4. Maximum Nonrepetitive Surge Power 1000 100 75 V (MMSZ5267BT1G) 91 V (MMSZ5270BT1G) 100 5 mA 20 mA 10 1 1 1 10 VZ, NOMINAL ZENER VOLTAGE 100 10 150C 1 0.4 Figure 5. Effect of Zener Voltage on Zener Impedance 0.5 25C 0C 75C 0.6 0.7 0.8 0.9 1.0 VF, FORWARD VOLTAGE (V) Figure 6. Typical Forward Voltage http://onsemi.com 4 1.1 1.2 MMSZxxxET1G Series, SZMMSZxxxET1G Series TYPICAL CHARACTERISTICS 1000 1000 C, CAPACITANCE (pF) 0 V BIAS 1 V BIAS I R , LEAKAGE CURRENT ( A) TA = 25C 100 BIAS AT 50% OF VZ NOM 10 1 1 10 VZ, NOMINAL ZENER VOLTAGE (V) 100 100 10 1 +150C 0.1 0.01 0.001 + 25C 0.0001 −55C 0.00001 0 10 Figure 7. Typical Capacitance 100 I Z , ZENER CURRENT (mA) 10 1 TA = 25C 10 1 0.1 0.1 0.01 80 Figure 8. Typical Leakage Current TA = 25C 0 2 4 6 8 VZ, ZENER VOLTAGE (V) 0.01 12 10 10 100 50 70 VZ, ZENER VOLTAGE (V) PEAK VALUE IRSM @ 8 ms tr 90 30 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms 80 70 60 50 HALF VALUE IRSM/2 @ 20 ms 40 30 tP 20 10 0 0 20 90 Figure 10. Zener Voltage versus Zener Current (12 V to 91 V) Figure 9. Zener Voltage versus Zener Current (VZ Up to 12 V) % OF PEAK PULSE CURRENT I Z , ZENER CURRENT (mA) 100 20 30 40 50 60 70 VZ, NOMINAL ZENER VOLTAGE (V) 40 60 t, TIME (ms) Figure 11. 8 20 ms Pulse Waveform http://onsemi.com 5 80 90 MMSZxxxET1G Series, SZMMSZxxxET1G Series PACKAGE DIMENSIONS SOD−123 CASE 425−04 ISSUE G D ÂÂÂÂ ÂÂÂÂ A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A1 1 HE DIM A A1 b c D E HE L q E 2 MIN 0.037 0.000 0.020 --0.055 0.100 0.140 0.010 0 INCHES NOM 0.046 0.002 0.024 --0.063 0.106 0.145 ----- MAX 0.053 0.004 0.028 0.006 0.071 0.112 0.152 --10 STYLE 1: PIN 1. CATHODE 2. ANODE q L b MILLIMETERS MIN NOM MAX 0.94 1.17 1.35 0.00 0.05 0.10 0.51 0.61 0.71 ----0.15 1.60 1.40 1.80 2.54 2.69 2.84 3.56 3.68 3.86 ----0.25 --10 0 C SOLDERING FOOTPRINT* ÉÉ ÉÉ ÉÉ 0.91 0.036 2.36 0.093 4.19 0.165 ÉÉ ÉÉ ÉÉ SCALE 10:1 1.22 0.048 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 6 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MMSZ2V4ET1/D